Cutting mechanism and cutting device

Abstract

The utility model provides a cutting mechanism and a cutting device, the cutting mechanism comprises four cutting units, each cutting unit comprises a plurality of groups of cutting wheel trains and a cutting line; the cutting lines are annular and are distributed in line grooves of cutting wheels of the multiple sets of cutting wheel trains, the cutting lines are guided and bent into multiple cutting line segments through the multiple sets of cutting wheel trains, and the multiple cutting line segments form a cutting face; the cutting surfaces of the four cutting units are staggered and are projected into a # shape along the cutting direction; by the adoption of the technology, the winding mode is simple, winding consumed time is short, the needed cutting line is short, cutting line consumables are reduced, the bending angle of the cutting line is small, and the service life of the annular cutting line is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of cutting brittle and hard materials, in particular to a cutting mechanism and a cutting device. Background Art

[0002] Current technology often uses diamond wire for squaring hard materials such as stone and silicon crystals. Squaring involves cutting hard materials into square columns, with the finished product consisting of four sides. Existing cutting mechanisms typically consist of multiple cutting wheels, each with a closed-end circular cutting wire wound through grooves within the wheels. The wheels rotate to drive the diamond wire in linear motion. Using a circular cutting wire around the cutting wheel offers advantages over using a long, open cutting wire around the wheel, such as reduced cutting error and a smoother cut surface. It also uses less cutting wire, simplifies winding, and reduces wire change time.

[0003] The existing cutting mechanism usually adopts one or two circular cutting wires, each of which needs to be guided by a guide wheel group and a cutting wheel group, which increases the bending angle of the circular cutting wire and causes the circular cutting wire to work at a large bending angle for a long time, thereby reducing the service life of the circular cutting wire. In addition, the winding method of the circular cutting wire on the guide wheel group and the cutting wheel group is complicated, and the winding takes a long time. At the same time, due to the excessive complexity of the winding, a longer circular cutting wire is required, which is not conducive to reducing the cost of the circular cutting wire. Utility Model Content

[0004] To this end, it is necessary to provide a cutting mechanism and a cutting device to solve the problems of complex winding method of the circular cutting wire, the circular cutting wire being at a large bending angle for a long time, and the large amount of consumables of the circular cutting wire.

[0005] To achieve the above-mentioned purpose, the present invention provides a cutting mechanism comprising four cutting units, each of which comprises a plurality of cutting gear trains located in four directions and a cutting line;

[0006] The cutting line is annular and arranged in the wire grooves of the cutting wheels of the multiple cutting wheel trains. The cutting line is guided and bent into multiple cutting line segments by the multiple cutting wheel trains, and a cutting surface is formed by the multiple cutting line segments.

[0007] The cutting surfaces of the four cutting units are staggered and projected into a tic-tac-toe shape along the cutting direction.

[0008] Furthermore, the cutting surfaces of two opposite cutting units among the four cutting units are parallel, and the cutting line segments corresponding to the cutting surfaces on both sides of the cutting direction are arranged at the same height.

[0009] Furthermore, a spacing is left between the cutting surfaces of two staggered cutting units among the four cutting units along the cutting line segments on both sides of the cutting direction.

[0010] Furthermore, the cutting line segments of the two cutting surfaces of one of the two opposite cutting units on both sides of the cutting direction are located between the cutting line segments of the cutting surfaces of the other two opposite cutting units on both sides of the cutting direction.

[0011] Furthermore, the wheel surfaces of the cutting wheels of the multiple groups of cutting wheel trains in each cutting unit are arranged in parallel.

[0012] Furthermore, the diameters and numbers of the cutting wheels of the multiple cutting wheel trains of each cutting unit are consistent.

[0013] Furthermore, the corresponding cutting wheels of the cutting wheel train on both sides of the cutting surface of each cutting unit in the cutting direction are flush in height in the cutting direction.

[0014] Furthermore, one of the four cutting units is respectively arranged on the opposite sides of a pair of first support panels, an opening is provided in the middle of the first support panel, and one of the multiple groups of cutting wheels of the two cutting units is arranged in four directions of the outer periphery of the opening of the first support panel, and the other two cutting units are respectively arranged on the opposite sides of a pair of second support panels, and the second support panels are passed through the opening.

[0015] A cutting device comprising a cutting mechanism, a driving mechanism and a clamping mechanism, wherein the cutting mechanism is the cutting mechanism described above;

[0016] The clamping mechanism is used to clamp the single crystal silicon rod, and the clamping mechanism is located in the middle of the cutting line segments of the four cutting units projected into a well shape along the cutting direction; the driving mechanism is used to drive the cutting mechanism to move along the clamping mechanism to cut the single crystal silicon rod.

[0017] Different from the existing technology, the above technical solution mainly includes four cutting units; each cutting unit includes multiple sets of cutting wheel trains and a cutting line located in four directions; the cutting lines are connected end to end into a closed ring and arranged in multiple sets of cutting wheel trains; the cutting line forms a cutting surface under the guidance of multiple sets of cutting wheel trains. The winding method is simple, the winding time is short, the required cutting line is short, the cutting line consumables are reduced, and the bending angle of the cutting line is small, which increases the service life of the ring cutting line; the four cutting surfaces formed by the other four cutting units are staggered, and one cutting surface is used to cut one side of the brittle and hard material, so that the four cutting surfaces cut the four sides of the brittle and hard material, that is, the four cutting units cut the four sides of the brittle and hard material, and only a single operation is required, so the squaring of the cut brittle and hard material can be completed, and the squaring efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the structure of the cutting unit of the embodiment;

[0019] Figure 2A front view of a cutting mechanism according to an embodiment;

[0020] Figure 3 A top view of a cutting mechanism according to an embodiment;

[0021] Figure 4 Schematic diagram of the structure of the cutting unit of the embodiment;

[0022] Figure 5 is a schematic structural diagram of adjacent cutting units of an embodiment;

[0023] Figure 6 Schematic diagram of the structure of a cutting mechanism of an embodiment.

[0024] Description of reference numerals:

[0025] 10. Cutting wheel train;

[0026] 101, cutting wheel;

[0027] 20. Cutting line;

[0028] 201, cutting line segment;

[0029] 30. Cutting surface;

[0030] 40. First support panel;

[0031] 401. Open your mouth;

[0032] 50. Second support panel;

[0033] 60. Driving wheel drive mechanism;

[0034] x, cutting direction;

[0035] a. Cutting direction projection surface. DETAILED DESCRIPTION

[0036] In order to explain the technical content, structural features, achieved objectives and effects of the technical solution in detail, the following is a detailed description in conjunction with specific embodiments and accompanying drawings.

[0037] References to "embodiments" herein mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0038] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0039] In the description of this application, the term "and / or" is used to describe a logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and both A and B exist. In addition, the character " / " in this document generally indicates that the objects before and after are in a logical "or" relationship.

[0040] In this application, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, priority or sequence relationship between these entities or operations.

[0041] Without further limitations, in this application, the words "include", "comprise", "have" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those defined elements, but also other elements not explicitly listed, or elements inherent to such process, method or product.

[0042] Consistent with the understanding in the Patent Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceed" are understood to exclude the number itself; expressions such as "above," "below," and "within" are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this manner, such as "multiple groups" and "multiple times," unless otherwise clearly and specifically limited.

[0043] In the description of the embodiments of the present application, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be understood as a limitation on the embodiments of the present application.

[0044] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms "installed", "connected", "connected", "fixed", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art of the present application, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0045] See also Figures 1-6 As shown, the present invention provides a cutting mechanism for cutting brittle and hard materials. It mainly includes four cutting units; each cutting unit includes multiple cutting wheel trains 10 and a cutting line 20; the cutting line 20 is connected end to end into a closed loop and arranged on the multiple cutting wheel trains 10; the cutting line 20 forms a cutting surface 30 under the guidance of the multiple cutting wheel trains 10. Its winding method is simple, the winding time is short, the required cutting line 20 is short, and the consumables of the cutting line 20 are reduced. The bending angle of the cutting line 20 is small, which increases the service life of the circular cutting line 20; the four cutting surfaces 30 formed by the four cutting units are staggered, and one cutting surface 30 is used to cut one side of the brittle and hard material, so that the four cutting surfaces 30 cut the four sides of the brittle and hard material, that is, the four cutting units cut the four sides of the brittle and hard material, and only a single operation is required, so that the squaring of the cut brittle and hard material can be completed, and the squaring efficiency is high.

[0046] The above-mentioned cutting mechanism is used for cutting brittle and hard materials. These materials can include semiconductor materials such as metals, ferrites, and ceramics. The cutting surface is smooth, material loss is minimized, and crystal deformation or defects are avoided. These materials can include gemstones and precious materials such as single crystal silicon, sapphire, silicon carbide, optical crystals, magnetic materials, and most non-ferrous metals. They can also include stone and concrete. The following uses single crystal silicon rods as an example for illustration.

[0047] See also Figure 1-Figure 3 As shown, the following is an embodiment of a cutting mechanism provided by the present invention, which includes four cutting units, each of which includes multiple sets of cutting wheel trains 10 and a cutting line 20;

[0048] The cutting line 20 is annular and arranged in the wire groove of the cutting wheels 101 of the multiple cutting gear trains 10. The cutting line 20 is guided and bent into multiple cutting line segments 201 by the multiple cutting gear trains 10, and the multiple cutting line segments 201 form a cutting surface 30.

[0049] The cutting surfaces 30 of the four cutting units are staggered and projected into a tic-tac-toe shape along the cutting direction x.

[0050] The above-mentioned cutting wire 20 is used to cut the single crystal silicon rod, which can be a diamond cutting wire 20; the above-mentioned cutting wheel system 10 includes a cutting wheel 101, and the circumferential surface of each cutting wheel 101 has a concave wire groove along the axial direction, which is in a circular ring shape and is used to lay the cutting wire 20; multiple groups of cutting wheel systems 10 located in four directions guide the cutting wire 20 to form a quadrilateral cutting surface 30, so that the formed cutting surface 30 cuts the side of the single crystal silicon rod along the cutting direction x, and at the same time plays a pulling and tensioning role on the laid cutting wire 20. The number and diameter of the cutting wheels 101 in the cutting wheel system 10 are not limited here, and can be set according to actual needs. It should be noted here that in the same cutting unit, the number and diameter of the cutting wheels 101 of multiple groups of cutting wheel systems 10 are not limited, the number of cutting wheels 101 can be inconsistent or consistent, and the diameter of the cutting wheels 101 can be inconsistent or consistent.

[0051] In actual use, the two cutting units need to drive their respective cutting lines 20 to move linearly, and at the same time, they need to drive the entire width-adjustable cutting mechanism to move relative to the single crystal silicon rod along the cutting direction x (the axial direction of the single crystal silicon rod) to cut the single crystal silicon rod.

[0052] Since the single crystal silicon rod is cut into a square cylinder during the squaring operation, the cutting surfaces 30 of two opposing cutting units among the four cutting units need to be parallel. To this end, in a further embodiment, the cutting surfaces 30 are arranged parallel to the corresponding cutting segments 201 on both sides of the cutting direction x. This can be achieved by having the cutting wheels 101 of the multiple cutting wheel trains 10 of the opposing cutting units have the same diameter and number, and the cutting wheels 101 of the multiple cutting wheel trains 10 are arranged in a one-to-one correspondence. Alternatively, the cutting wheels 101 of the multiple cutting wheel trains 10 of the opposing cutting units have different diameters and numbers, but the cutting surfaces 30 formed by the multiple cutting wheel trains 10 pulling the annular cutting lines 20 are parallel to the cutting segments 201 on both sides of the cutting direction x. The cutting surfaces 30 of the two opposing cutting units can be flush or offset in height with the corresponding cutting segments 201 on both sides of the cutting direction x. Preferably, the cutting surfaces 30 are arranged flush in height with the corresponding cutting segments 201 on both sides of the cutting direction x. This ensures consistent cutting depth across all sections of the single crystal silicon ingot during the cutting process, reduces unevenness in the cut surface of the single crystal silicon ingot caused by uneven force, and avoids the accumulation of cutting errors due to height inconsistencies, thereby improving overall cutting accuracy. In practical applications, the corresponding cutting wheels 101 of the two cutting wheel trains 10 on one side of the cutting surface 30 of each cutting unit in the cutting direction x can be aligned in the cutting direction x.

[0053] The four cutting surfaces 30 formed by the four cutting units are staggered, projecting in a cross-shaped pattern along the cutting direction x. This allows the cutting mechanism to square a single single crystal silicon rod in a single operation. The staggered positions of the four cutting surfaces 30 formed by the four cutting units along the cutting direction x can be varied.

[0054] Taking the spacing between the cutting segments 201 on both sides of the cutting direction x formed by the four cutting units as an example, the following embodiments are provided. In some embodiments, the cutting segments 30 of two staggered cutting units among the four cutting units are arranged to abut against each other along the cutting segments 201 on both sides of the cutting direction x. In some implementations, the cutting segments 30 of two staggered cutting units among the four cutting units are spaced apart along the cutting segments 201 on both sides of the cutting direction x, that is, the two staggered cutting units are at different positions in the cutting direction x, so as to avoid the cutting segments 30 of the two staggered cutting units from interfering with each other along the cutting segments 201 on both sides of the cutting direction x. When performing the squaring operation, the cutting mechanism moves relative to the single crystal silicon rod along the axial direction of the single crystal silicon rod, and the two staggered cutting units cut the single crystal silicon rod in turn. When the single crystal silicon rod completely passes through the two cutting units, the squaring operation of the single single crystal silicon rod is completed.

[0055] Taking the spatial position of the four cutting surfaces 30 formed by four cutting units along the cutting line segments 201 on both sides of the cutting direction x as an example, the following embodiment is provided. In some embodiments, for two of the four cutting units that are staggered, the cutting lines 20 of one of the cutting units along the cutting direction x are both located above the cutting lines 20 of the other cutting unit along the cutting direction x. In some embodiments, for two of the four cutting units that are staggered, the cutting lines 20 of one of the cutting units along the cutting direction x are located between the cutting lines 20 of the other cutting unit along the cutting direction x. In a preferred embodiment, when the cutting line segments 201 of the two cutting surfaces 30 of the two relative cutting units on both sides of the cutting direction x are flush, the cutting line segments 201 of the two cutting surfaces 30 of the two relative cutting units on both sides of the cutting direction x are located between the cutting line segments 201 of the cutting surfaces 30 of the other two relative cutting units on both sides of the cutting direction x. This embodiment is described in detail below to further illustrate the present invention.

[0056] See also Figure 3-Figure 6As shown, in actual application, one relative two cutting units among the four cutting units can be respectively arranged on the opposite sides of a pair of first support panels 40, and an opening 401 is provided in the middle of the first support panel 40. One relative multiple groups of the cutting wheel trains 10 of the two cutting units are arranged in four directions of the periphery of the opening 401 of the first support panel 40, and the other relative two cutting units are respectively arranged on the opposite sides of the second support panel 50, and the second support panel 50 is passed through the opening 401.

[0057] The above-mentioned opening 401 can extend toward one side of the first support panel 40 so that the first support panel 40 is concave. The concave design allows the other pair of cutting units (located on the second support panel 50) to be arranged more compactly within the opening 401 of the first support panel 40, effectively utilizing vertical and horizontal space and reducing the overall footprint of the cutting mechanism. At the same time, it makes it easier to install the second support panel 50, making the cutting units on the second support panel 50 easier to access and operate. When maintenance, replacement of the cutting wheel 101, or parameter adjustment is required, the maintenance difficulty and time cost are reduced. In practice, the shape of the first support panel 40 can be the same as that of the second support panel 50.

[0058] Of course, by adjusting the distance between the two opposing cutting units, the distance between the two opposing cutting surfaces 30 can be flexibly adjusted to cut single crystal silicon rods with different side lengths. This can also be achieved by adjusting the distance between the two opposing cutting units. The relative movement of the two opposing cutting units can be in one of two states: one in which one cutting unit is inactive and the other moves toward or away from the first cutting unit; and two in which both cutting units are movable and move toward or away from each other. Although not shown in the figure, it is understood that each cutting unit can be provided with at least one drive unit that drives the two opposing cutting units toward or away from each other. In this embodiment, the drive unit can be a drive device such as a pneumatic cylinder, a hydraulic cylinder, an oil cylinder, or a motor. For example, if the drive unit is a one-way telescopic cylinder, two drive units can be provided, with the output end of one drive unit connected to the first support panel 40 (second support panel 50). When the two opposing cutting units use one cutting unit to move relative to the other to adjust the distance between the cutting surfaces 30, only one of the first support panels 40 needs to be connected to the drive unit.

[0059] The multiple sets of cutting wheel trains 10 in each cutting unit are arranged with the wire grooves of the cutting wheels 101 facing each other. The wire grooves of the cutting wheels 101 of the two sets of cutting wheel trains 10 correspond to each other in spatial position and face each other. The angle of the wheel surface of the cutting wheel 101 of the cutting wheel train 10 can be flipped from -60° to 60° (with reference to the cutting direction projection plane a). In order to prevent the cutting line 20 from detaching from the cutting wheel 101 of the cutting wheel train 10 as much as possible during the cutting operation, the wheel surfaces of the multiple sets of cutting wheel trains 10 in each cutting unit are preferably arranged in parallel. Although not shown in the figure, it is understood that the cutting wheel train 10 can also include a tensioning wheel for tensioning the cutting line 20 to provide additional support for the cutting line 20.

[0060] However, when performing the cutting operation, it is necessary to apply traction to make the cutting line 20 move linearly. Therefore, the cutting unit also includes a driving wheel driving mechanism 60. The driving wheel can be part or all of the cutting wheels 101 of the above-mentioned cutting wheel system 10. The driving wheel driving mechanism 60 is connected to the driving wheel for driving the driving wheel to rotate; the driving wheel is responsible for driving the cutting line 20 to move linearly. Under the rotation drive of the driving wheel, the cutting line 20 can move linearly.

[0061] The driving wheel driving mechanism 60 is connected to the rotating shaft of the driving wheel to drive the driving wheel to rotate. Specifically, the driving wheel is fixed with a rotating shaft. The driving wheel driving mechanism 60 includes a motor, which can be a servo motor. The motor is connected to the rotating shaft of the driving wheel, which can be connected through gear transmission or coaxially through a coupling. The motor can drive the driving wheel to rotate through the rotating shaft.

[0062] In a further embodiment, the cutting unit may further include a tensioning mechanism, wherein the tensioning wheel may be the cutting wheel 101 of the cutting wheel train 10, and the tensioning mechanism is connected to the tensioning wheel in a transmission manner, and is used to drive the tensioning wheel to move to tension the cutting line 20. The tensioning mechanism may be a servo motor, a pneumatic cylinder, an oil cylinder, or a weight group. Taking a servo motor as an example, the tensioning mechanism may be an eccentric tensioning motor, and the tensioning wheel may be rotatably mounted on the eccentric shaft of the eccentric tensioning motor. Taking a weight group as an example, the tensioning mechanism includes a tensioning arm and a weight. The middle portion of the tensioning arm is hinged, and the tensioning wheel and the weight are respectively arranged at the two ends of the tensioning arm. The tensioning wheel is axially provided with a rotating shaft, and the rotating shaft is rotatably mounted on the end of the tensioning arm through a bearing.

[0063] The utility model also provides a cutting device, which includes a cutting mechanism, a driving mechanism and a clamping mechanism, wherein the cutting mechanism is the cutting mechanism described above;

[0064] The clamping mechanism is used to clamp the single crystal silicon rod and is located in the middle of the cutting line segments 201 of the four cutting units projected into a tic-tac-toe shape along the cutting direction x; the driving mechanism is used to drive the cutting mechanism to move along the clamping mechanism to cut the single crystal silicon rod.

[0065] It should be noted that although the above embodiments have been described herein, this does not limit the scope of patent protection of the present utility model. Therefore, based on the innovative concept of the present utility model, changes and modifications to the embodiments described herein, or equivalent structural or process transformations made using the contents of the present utility model specification and drawings, and direct or indirect application of the above technical solutions to other related technical fields are all included in the scope of protection of the present utility model patent.

Claims

1. A cutting mechanism, characterized in that: It includes four cutting units, each of which includes multiple cutting wheel trains and a cutting line; The cutting line is annular and arranged in the wire grooves of the cutting wheels of the multiple cutting wheel trains. The cutting line is guided and bent into multiple cutting line segments by the multiple cutting wheel trains, and a cutting surface is formed by the multiple cutting line segments. The cutting surfaces of the four cutting units are staggered and projected into a tic-tac-toe shape along the cutting direction.

2. The cutting mechanism according to claim 1, characterized in that: The cutting surfaces of two opposite cutting units among the four cutting units are parallel, and the cutting line segments corresponding to the cutting surfaces on both sides of the cutting direction are arranged at the same height.

3. The cutting mechanism according to claim 1, characterized in that: The cutting surfaces of two staggered cutting units among the four cutting units are spaced apart along the cutting line segments on both sides of the cutting direction.

4. The cutting mechanism according to claim 1, characterized in that: The cutting line segments of the two cutting surfaces of one of the two opposite cutting units on both sides of the cutting direction are located between the cutting line segments of the cutting surfaces of the other two opposite cutting units on both sides of the cutting direction.

5. The cutting mechanism according to claim 1, characterized in that: The wheel surfaces of the cutting wheels of the multiple groups of cutting wheel trains in each cutting unit are arranged in parallel.

6. The cutting mechanism according to claim 1, characterized in that: The diameter and number of the cutting wheels of the multiple cutting wheel trains of each cutting unit are consistent.

7. The cutting mechanism according to claim 1, characterized in that: The corresponding cutting wheels of the cutting wheel train on both sides of the cutting surface of each cutting unit in the cutting direction are flush in height in the cutting direction.

8. The cutting mechanism according to claim 1, characterized in that: Among the four cutting units, one relative to the two cutting units is respectively arranged on the opposite surfaces of a pair of first support panels, an opening is provided in the middle of the first support panel, and one relative to the multiple groups of cutting wheels of the two cutting units are arranged in four directions of the outer periphery of the opening of the first support panel, and the other relative to the two cutting units is respectively arranged on the opposite surfaces of a pair of second support panels, and the second support panels are passed through the opening.

9. A cutting device, characterized in that: It comprises a cutting mechanism, a driving mechanism and a clamping mechanism, wherein the cutting mechanism is the cutting mechanism according to any one of claims 1 to 8; The clamping mechanism is used to clamp the single crystal silicon rod, and the clamping mechanism is located in the middle of the cutting line segments of the four cutting units projected into a well shape along the cutting direction; the driving mechanism is used to drive the cutting mechanism to move along the clamping mechanism to cut the single crystal silicon rod.

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