Silicon wafer cutting lining plate heating and curing device

Abstract

The utility model discloses a silicon wafer cutting lining plate heating and curing device, which relates to the technical field of silicon wafer cutting lining plate processing equipment and comprises a base component, a heating component is mounted on the base component, and a sliding component is mounted on one side of the base component. Through the arrangement of the base assembly, the sliding assembly and the heating assembly, the multiple lining plates can be placed in the multiple installation plates, meanwhile, the multiple installation plates surround the outer side of the curing lamp, in the working process, one curing lamp can be used for conducting thermocuring on the multiple lining plates, the thermocuring effects of the multiple lining plates are the same, and the curing effect is good. Product performance difference is not caused, the thermocuring efficiency is greatly improved, and the quality of the lining plate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cutting lining plate processing equipment, in particular to a silicon wafer cutting lining plate heating and curing device. Background Art

[0002] Silicon is a semiconductor material and its own electrical conductivity is not very good. Its resistivity can be precisely controlled by adding appropriate dopants. Before manufacturing semiconductors, the melted silicon ingots need to be cut into silicon wafers. During the cutting process, the silicon ingots are placed on the liner. The liner production requires raw material mixing, extrusion molding, thermal curing and cutting sanding. The thermal curing equipment heats and cures the extruded liner, which can improve the performance of the liner.

[0003] However, the existing silicon wafer cutting liner heating and curing device can only perform thermal curing of one liner at a time when in use, has low thermal curing efficiency, and requires a large amount of electricity, which increases the cost.

[0004] Therefore, it is necessary to invent a silicon wafer cutting liner heating and curing device to solve the above problems. Summary of the Invention

[0005] The purpose of the utility model is to provide a device for heating and curing a silicon wafer cutting liner to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon wafer cutting liner heating and curing device, comprising a base assembly, a heating assembly mounted on the base assembly, and a sliding assembly mounted on one side of the base assembly;

[0007] The base assembly includes a base, a heating cylinder is fixedly provided on one side of the top of the base, a heating groove is provided inside the heating cylinder, and a sliding groove is provided on the other side of the top of the base;

[0008] The sliding assembly includes a movable plate, and the bottom end of the movable plate is integrally formed with a sliding plate adapted to the slide groove;

[0009] The heating component includes a circular plate and a supporting plate, and one side of the supporting plate is fixedly connected to the middle part of the inner wall of the heating groove close to the sliding component.

[0010] Preferably, a plurality of straight grooves distributed in a circular array are provided on an edge of one side of the heating cylinder close to the sliding assembly, and a through groove is provided through the inner wall of the straight groove close to the heating groove.

[0011] Preferably, a limit rod is symmetrically fixed inside the slide groove, and the limit rod movably passes through the sliding plate. A circular groove that is compatible with the circular plate is opened through the middle of the side of the heating tube away from the sliding component, and an extension groove is symmetrically opened at the opening of the circular groove on the side away from the sliding component.

[0012] Preferably, a mounting plate corresponding to and matching the multiple straight grooves is fixedly provided on one side edge of the movable plate close to the heating tube, and one end of the mounting plate extends to the inside of the corresponding straight groove; a slot corresponding to the multiple mounting plates is penetrated through the one side edge of the movable plate away from the heating tube, and one side of the slot extends to the inside of the mounting plate close to one end of the heating tube.

[0013] Preferably, a plurality of connection grooves distributed at equal intervals are formed through both sides of the mounting plate, and a first handle is fixedly provided at the middle of a side of the movable plate away from the heating cylinder.

[0014] Preferably, an extension plate adapted to the extension slot is symmetrically and integrally formed at the front end of the outer side wall of the circular plate, and a threaded knob is installed on the extension plate.

[0015] Preferably, a second handle is fixedly provided on the front side of the circular plate, and a curing light is installed on the back side of the circular plate, with one end of the curing light extending into the interior of the supporting plate.

[0016] Technical effects and advantages of this utility model:

[0017] The utility model is provided with a base assembly, a sliding assembly and a heating assembly, so that multiple lining plates can be placed inside the multiple mounting plates, and the multiple mounting plates surround the outer side of the curing lamp. During operation, one curing lamp can be used to thermally cure multiple lining plates, and the thermal curing effects of the multiple lining plates are the same, which will not cause differences in product performance, greatly improving the efficiency of thermal curing and the quality of the lining plates; at the same time, the detachable setting of the heating assembly can be used to unscrew the threaded knob to pull out the circular plate and the curing lamp from the base assembly, which is convenient for maintenance or replacement of the curing lamp and reduces the maintenance workload of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall side three-dimensional structure of the utility model.

[0019] Figure 2 It is a schematic diagram of the overall three-dimensional structure of another side surface of the utility model.

[0020] Figure 3 It is a side structural diagram of the base assembly of the present invention.

[0021] Figure 4 This is a schematic cross-sectional structural diagram of the base assembly of the present invention.

[0022] Figure 5 This is another side structural diagram of the base assembly of the present invention.

[0023] Figure 6 This is a schematic structural diagram of the sliding assembly of the present utility model.

[0024] Figure 7 This is a schematic structural diagram of the heating component of the present invention.

[0025] In the figure: 1. Base assembly; 2. Sliding assembly; 3. Heating assembly; 101. Base; 102. Heating tube; 103. Heating slot; 104. Straight slot; 105. Through slot; 106. Slide slot; 107. Limit rod; 108. Round slot; 109. Extension slot; 201. Movable plate; 202. Mounting plate; 203. Slot; 204. Connecting slot; 205. Sliding plate; 206. First handle; 301. Round plate; 302. Support plate; 303. Curing lamp; 304. Extension plate; 305. Threaded knob; 306. Second handle. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The utility model provides Figure 1-7 The device for heating and curing a silicon wafer cutting liner shown includes a base assembly 1 , a heating assembly 3 is mounted on the base assembly 1 , and a sliding assembly 2 is mounted on one side of the base assembly 1 .

[0028] Furthermore, the base assembly 1 includes a base 101, and a heating tube 102 is fixedly provided on one side of the top of the base 101. The cross section of the heating tube 102 is a regular polygon, which is determined according to the number of the plurality of mounting plates 202. In this way, the distance between the lining plates inside the plurality of mounting plates 202 and the curing lamp 303 is the same, and the heating efficiency of the plurality of lining plates is the same, which is convenient for temperature control. A heating groove 103 is provided inside the heating tube 102, and a slide groove 106 is provided on the other side of the top of the base 101. The heating tube 102 is close to the curing lamp 303. A plurality of straight grooves 104 arranged in a circular array are provided on one edge of the sliding assembly 2, and a through groove 105 is provided through the inner wall of the straight groove 104 on the side close to the heating groove 103. A limit rod 107 is symmetrically fixedly provided inside the sliding groove 106, and the limit rod 107 movably passes through the sliding plate 205. A circular groove 108 is provided through the middle of the side of the heating cylinder 102 away from the sliding assembly 2, which is adapted to the circular plate 301. An extension groove 109 is symmetrically provided at the opening of the circular groove 108 on the side away from the sliding assembly 2.

[0029] The sliding assembly 2 includes a movable plate 201, and the bottom end of the movable plate 201 is integrally formed with a sliding plate 205 adapted to the slide groove 106. The movable plate 201 is fixedly provided with a mounting plate 202 corresponding to and adapted to the multiple straight grooves 104 on one side edge near the base 101, and one end of the mounting plate 202 extends to the inside of the corresponding straight groove 104. The movable plate 201 is provided with a slot 203 corresponding to the multiple mounting plates 202 on one side edge away from the heating tube 102, and one side of the slot 203 extends to the inside of the mounting plate 202 near the end of the heating tube 102. Multiple lining plates can be placed inside the plate 202, and multiple mounting plates 202 surround the outside of the curing lamp 303. During operation, one curing lamp 303 can be used to thermally cure multiple lining plates, and the thermal curing effects of multiple lining plates are the same, which will not cause differences in product performance, greatly improving the efficiency of thermal curing and the quality of the lining plates. Multiple connecting grooves 204 with equal intervals are opened on both sides of the mounting plate 202. Multiple connecting grooves 204 can make the lining plates thermally cure faster and improve efficiency. A first handle 206 is fixedly provided in the middle of the side of the movable plate 201 away from the heating cylinder 102.

[0030] Secondly, the heating component 3 includes a circular plate 301 and a support plate 302, and one side of the support plate 302 is fixedly connected to the middle of the inner wall of the heating groove 103 close to the sliding component 2, and the front end of the outer wall of the circular plate 301 is symmetrically integrally formed with an extension plate 304 that is compatible with the extension groove 109, and a threaded knob 305 is installed on the extension plate 304. A second handle 306 is fixedly provided on the front side of the circular plate 301, and a curing lamp 303 is installed on the back side of the circular plate 301, and one end of the curing lamp 303 extends to the inside of the support plate 302. By unscrewing the threaded knob 305, the circular plate 301 and the curing lamp 303 are pulled out from the base component 1, which is convenient for maintenance or replacement of the curing lamp 303 and reduces the maintenance workload of the staff.

[0031] Working principle of this utility model:

[0032] During use, the extruded lining plate is inserted into the interior of the mounting plate 202 through the opening of the slot 203. Then, the movable plate 201 is pushed to move the sliding plate 205 closer to the base 101 in the slide groove 106. At the same time, the multiple mounting plates 202 slide into the corresponding straight grooves 104 until all the mounting plates 202 are inside the straight grooves 104. Then, the curing lamp 303 is turned on to generate heat, thereby thermally curing the lining plates inside the multiple mounting plates 202.

[0033] When the curing lamp 303 needs to be maintained, the circular plate 301 and the curing lamp 303 can be pulled out from the base assembly 1 by unscrewing the threaded knob 305, which facilitates maintenance or replacement of the curing lamp 303 and reduces the maintenance workload of the staff.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A device for heating and curing a silicon wafer cutting liner, characterized in that: It comprises a base assembly (1), a heating assembly (3) is mounted on the base assembly (1), and a sliding assembly (2) is mounted on one side of the base assembly (1); The base assembly (1) comprises a base (101), a heating cylinder (102) is fixedly provided on one side of the top end of the base (101), a heating groove (103) is provided inside the heating cylinder (102), and a sliding groove (106) is provided on the other side of the top end of the base (101); The sliding assembly (2) comprises a movable plate (201), and a sliding plate (205) adapted to the slide groove (106) is integrally formed at the bottom end of the movable plate (201); The heating component (3) comprises a circular plate (301) and a supporting plate (302), and one side of the supporting plate (302) is fixedly connected to the middle of the inner wall of the heating tank (103) close to the sliding component (2).

2. The device for heating and curing a silicon wafer cutting liner according to claim 1, characterized in that: The heating cylinder (102) is provided with a plurality of straight grooves (104) distributed in a circular array on an edge of one side close to the sliding component (2), and a through groove (105) is provided through the inner wall of the straight groove (104) on one side close to the heating groove (103).

3. The device for heating and curing a silicon wafer cutting liner according to claim 2, wherein: A limiting rod (107) is symmetrically fixedly provided inside the slide groove (106), and the limiting rod (107) is movable through the sliding plate (205). A circular groove (108) adapted to the circular plate (301) is provided through the middle of the side of the heating tube (102) away from the sliding component (2). An extension groove (109) is symmetrically provided at the opening of the side of the circular groove (108) away from the sliding component (2).

4. The device for heating and curing a silicon wafer cutting liner according to claim 3, wherein: A mounting plate (202) corresponding to and matching the plurality of straight grooves (104) is fixedly provided on one side edge of the movable plate (201) close to the heating tube (102), and one end of the mounting plate (202) extends to the inside of the corresponding straight groove (104). A slot (203) corresponding to the plurality of mounting plates (202) is penetrated through the edge of one side of the movable plate (201) away from the heating tube (102), and one side of the slot (203) extends to the inside of the mounting plate (202) close to one end of the heating tube (102).

5. The device for heating and curing a silicon wafer cutting liner according to claim 4, characterized in that: A plurality of connection slots (204) distributed at equal intervals are provided through both sides of the mounting plate (202), and a first handle (206) is fixedly provided in the middle of a side of the movable plate (201) away from the heating cylinder (102).

6. The device for heating and curing a silicon wafer cutting liner according to claim 5, characterized in that: An extension plate (304) adapted to the extension slot (109) is symmetrically formed and integrally provided at the front end of the outer side wall of the circular plate (301), and a threaded knob (305) is mounted on the extension plate (304).

7. The device for heating and curing a silicon wafer cutting liner according to claim 6, characterized in that: A second handle (306) is fixedly provided on the front of the circular plate (301), and a curing light (303) is installed on the back of the circular plate (301), with one end of the curing light (303) extending into the interior of the supporting plate (302).

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