Turnover transportation tool for silicon wafer processing

Abstract

The utility model relates to the field of transportation tools, in particular to a silicon wafer processing turnover transportation tool which comprises a turnover box and a separated placement module. The inner side of the turnover box is provided with a separation placement module which is adjusted according to the size condition of the silicon wafers and facilitates stable placement of the silicon wafers. According to the utility model, the silicon wafers are adjusted according to the sizes of the silicon wafers through the separated placement modules, then the silicon wafers are sequentially placed in the turnover boxes, and the adjustable separated placement structures are arranged, so that flexible adjustment can be performed according to the sizes and the number of the silicon wafers, the silicon wafers are tightly arranged in the transportation process, gaps are reduced, the transportation efficiency is improved, and the transportation cost is reduced. And moreover, more stable support and fixation can be provided for the silicon wafers, shaking and collision of the silicon wafers in the transportation process are reduced, and the silicon wafers are effectively protected from being damaged.

Description

Technical Field

[0001] The utility model relates to the field of transport tooling, in particular to a silicon wafer processing turnover transport tooling. Background Art

[0002] A silicon wafer is a thin, flat, round silicon-based material, also known as a wafer. During the silicon wafer processing process, the silicon wafer requires transport tooling to flow and move between various process steps. These tooling are usually customized according to the size, shape and processing requirements of the silicon wafer to ensure the safety and stability of the silicon wafer during transportation.

[0003] Most existing transport tooling adopts a fixed structure and may not be able to accurately place silicon wafers of different sizes. As a result, if the silicon wafers are affected by external forces such as vibration and collision during transportation, they are prone to loosening or falling off, thereby increasing the risk of damage to the silicon wafers. Damaged silicon wafers may not be used for subsequent processing or production, resulting in material waste and increased costs, while reducing production efficiency.

[0004] Therefore, since most of the existing transport tooling mentioned above adopts a fixed structure, it may not be possible to accurately place silicon wafers of different sizes, and it is easy to loosen or fall off, thereby increasing the risk of damage to the silicon wafers, which will cause material waste and reduced production efficiency. A silicon wafer processing turnover transport tooling can be designed, with an adjustable partition placement structure to improve the flexibility of the transport tooling. Utility Model Content

[0005] In order to overcome the problem that most existing transport tooling adopts a fixed structure, it may not be possible to accurately place silicon wafers of different sizes, and it is easy to loosen or fall off, thereby increasing the risk of damage to the silicon wafers, which will cause material waste and reduced production efficiency.

[0006] The technical solution of the utility model is: a silicon wafer processing turnover and transportation tooling, including a turnover box and a partitioning and placing module; the inner side of the turnover box is provided with a partitioning and placing module for adjusting according to the size of the silicon wafers and facilitating the stable placement of the silicon wafers, a plurality of groups of strip clamping grooves are longitudinally symmetrically provided on both sides of the inner wall of the turnover box, the partitioning and placing module includes a connecting plate, a strip clamping block is installed on each upper side of the connecting plate, the strip clamping block drives the connecting plate to be positioned and connected with the turnover box along the strip clamping groove, a plurality of groups of first connecting grooves are provided on the connecting plate at horizontal intervals, a plurality of groups of partition plates are provided on the connecting plate at horizontal intervals, a second connecting groove is provided below the partition plate, and the partition plate is positioned and clamped with the connecting plate along the first connecting groove through the second connecting groove.

[0007] Preferably, the separation placement module is adjusted according to the size of the silicon wafers, and then the silicon wafers are placed in the turnover box in sequence.

[0008] Preferably, a plurality of sets of pulleys are installed laterally and symmetrically at the edges on both sides of the lower end of the turnover box, and a U-shaped push rod is fixedly installed on the upper side of one side of the turnover box.

[0009] Preferably, a rectangular soft pad is provided on the inner bottom of the turnover box.

[0010] Preferably, a plurality of groups of partition splicing panels are provided on both sides of the partition panel, and strip cushions are installed on both sides of the partition splicing panels.

[0011] Preferably, rectangular snap-in grooves are provided on both sides of the partition plate and on one side of the partition splicing plate.

[0012] Preferably, a rectangular snap-in plate is installed on a side of the partition splicing plate away from the rectangular snap-in groove and corresponding to the side.

[0013] Preferably, the rectangular snap-fitting plate drives the partitioning splicing plate to be positioned and snap-fitted with the partitioning plate or another group of partitioning splicing plates along the rectangular snap-fitting groove.

[0014] The beneficial effects of the present invention are as follows: the separation and placement module is adjusted according to the size of the silicon wafers, and then the silicon wafers are placed in the turnover box in sequence. By setting an adjustable separation and placement structure, it can be flexibly adjusted according to the size and quantity of the silicon wafers, ensuring that the silicon wafers are closely arranged during transportation, reducing gaps, thereby improving transportation efficiency, and providing more stable support and fixation for the silicon wafers, reducing shaking and collision of the silicon wafers during transportation, and effectively protecting the silicon wafers from damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shown is a schematic diagram of the overall structure of the turnover transport tooling of the utility model;

[0016] Figure 2 Shown is a schematic diagram of the turnover box structure of the turnover transport tooling of the present invention;

[0017] Figure 3 Shown is a schematic diagram of the strip-shaped card-joining block structure of the turnover transport tooling of the present invention;

[0018] Figure 4 Shown is a schematic diagram of the structure of the partition splicing plate of the turnover transport tooling of the present invention.

[0019] Explanation of the reference numerals: 1. Turnover box; 101. Pulley; 102. U-shaped push rod; 103. Strip clip groove; 104. Rectangular cushion; 201. Connecting plate; 202. Strip clip block; 203. First connecting groove; 204. Partition plate; 205. Second connecting groove; 206. Rectangular clip groove; 207. Partitioning splicing plate; 208. Rectangular clip plate; 209. Strip cushion. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] See also Figure 1-Figure 4 The utility model provides an embodiment: a silicon wafer processing turnover and transportation tooling, including a turnover box 1 and a partitioning and placing module; the turnover box 1 is provided with a partitioning and placing module for adjusting according to the size of the silicon wafers and facilitating the stable placement of the silicon wafers. A plurality of groups of bar clamping grooves 103 are longitudinally symmetrically provided on both sides of the inner wall of the turnover box 1. The partitioning and placing module includes a connecting plate 201, and a bar clamping block 202 is installed on each of the upper sides of the connecting plate 201. The bar clamping block 202 drives the connecting plate 201 to be positioned and connected with the turnover box 1 along the bar clamping groove 103. A plurality of groups of first connecting grooves 203 are horizontally spaced apart on the connecting plate 201, and a plurality of groups of partition plates 204 are horizontally spaced apart on the connecting plate 201. A second connecting groove 205 is provided below the partition plate 204. The partition plate 204 is positioned and clamped with the connecting plate 201 along the first connecting groove 203 through the second connecting groove 205.

[0022] See also Figure 2 In this embodiment, multiple sets of pulleys 101 are installed laterally and symmetrically on the edges of both sides of the lower end of the turnover box 1. A U-shaped push rod 102 is fixedly installed on the upper side of the turnover box 1. When the U-shaped push rod 102 is pushed, the pulley 101 drives the turnover box 1 to move to the next processing position. A rectangular soft pad 104 is provided on the bottom inside the turnover box 1. The rectangular soft pad 104 can protect the edges of the silicon wafers from being damaged.

[0023] See also Figure 3-Figure 4 In this embodiment, a plurality of partition splicing plates 207 are provided on both sides of the partition plate 204. Strip soft pads 209 are installed on both sides of the partition splicing plate 207. The strip soft pads 209 can protect the edges of the silicon wafers from damage. Rectangular snap-in grooves 206 are provided on both sides of the partition plate 204 and one side of the partition splicing plate 207. The rectangular snap-in grooves 206 are convenient for positioning and connecting with the rectangular snap-in plates 208. A rectangular snap-in plate 208 is installed on the side of the partition splicing plate 207 away from the rectangular snap-in groove 206. 208 can drive the partition splicing plate 207 to be assembled with the partition plate 204 and another group of partition splicing plates 207. The rectangular snap-in plate 208 drives the partition splicing plate 207 to be positioned and snap-fitted with the partition plate 204 or another group of partition splicing plates 207 along the rectangular snap-in groove 206. According to the space conditions on the left and right sides of the inner side of the turnover box 1, pick up the partition splicing plate 207. The rectangular snap-in plate 208 drives the partition splicing plate 207 to be positioned and snap-fitted with the partition plate 204 or another group of partition splicing plates 207 along the rectangular snap-in groove 206.

[0024] When working, first pick up the connecting plate 201 according to the diameter of the silicon wafer, and the strip clamping block 202 drives the connecting plate 201 to be positioned and connected with the turnover box 1 along the strip clamping groove 103. Then, according to the space conditions on the left and right sides of the inner side of the turnover box 1, pick up the partition splicing plate 207, and the rectangular clamping plate 208 drives the partition splicing plate 207 to be positioned and clamped along the rectangular clamping groove 206 with the partition plate 204 or another set of partition splicing plates 207. Then, according to the thickness of the silicon wafer, pick up the assembled partition plate 204 and partition splicing plate 207, and the partition plate 204 is positioned and clamped with the connecting plate 201 along the first connecting groove 203 through the second connecting groove 205. When all the assembly is completed, the silicon wafers are placed in the separated space in turn. The rectangular soft pad 104 and the strip soft pad 209 can protect the edges of the silicon wafers to prevent them from being damaged. Then push the U-shaped push rod 102, and the pulley 101 drives the turnover box 1 to move to the next processing position.

[0025] Through the above steps, the separation and placement module is adjusted according to the size of the silicon wafers, and then the silicon wafers are placed in the turnover box 1 in turn. By setting an adjustable separation and placement structure, it can be flexibly adjusted according to the size and quantity of the silicon wafers to ensure that the silicon wafers are closely arranged during transportation and reduce gaps, thereby improving transportation efficiency. It can also provide more stable support and fixation for the silicon wafers, reduce shaking and collision of the silicon wafers during transportation, and effectively protect the silicon wafers from damage, so as to solve the problem that most existing transportation tooling adopts a fixed structure, which may not be able to be accurately placed according to silicon wafers of different sizes, and is easy to loosen or fall off, thereby increasing the risk of damage to the silicon wafers, which will cause material waste and reduced production efficiency.

Claims

1. A silicon wafer processing turnover transport tool, comprising a turnover box (1); characterized in that: The invention also includes a partitioning and placing module; the inner side of the turnover box (1) is provided with a partitioning and placing module for adjusting according to the size of the silicon wafer and facilitating the stable placement of the silicon wafer; a plurality of groups of strip-shaped clamping grooves (103) are longitudinally symmetrically provided on both sides of the inner wall of the turnover box (1); the partitioning and placing module includes a connecting plate (201); a strip-shaped clamping block (202) is installed above each side of the connecting plate (201); the strip-shaped clamping block (202) drives the connecting plate (201) to be positioned and connected with the turnover box (1) along the strip-shaped clamping groove (103); a plurality of groups of first connecting grooves (203) are provided on the connecting plate (201) at intervals in the horizontal direction; a plurality of groups of partition plates (204) are provided on the connecting plate (201) at intervals in the horizontal direction; a second connecting groove (205) is provided below the partition plate (204); the partition plate (204) is positioned and clamped with the connecting plate (201) along the first connecting groove (203) through the second connecting groove (205).

2. The silicon wafer processing turnover and transportation tooling according to claim 1, characterized in that: A plurality of pulleys (101) are symmetrically installed on both sides of the lower end of the turnover box (1), and a U-shaped push rod (102) is fixedly installed on the upper side of one side of the turnover box (1).

3. The silicon wafer processing turnover and transportation tooling according to claim 1, characterized in that: A rectangular soft pad (104) is provided on the inner bottom of the turnover box (1).

4. The silicon wafer processing turnover and transportation tooling according to claim 1, characterized in that: A plurality of groups of partition splicing plates (207) are provided on both sides of the partition plate (204), and strip-shaped soft pads (209) are installed on both sides of the partition splicing plates (207).

5. The silicon wafer processing turnover and transportation tooling according to claim 1, characterized in that: Rectangular snap-in grooves (206) are provided on both sides of the partition plate (204) and one side of the partition splicing plate (207).

6. The silicon wafer processing turnover and transportation tooling according to claim 4, characterized in that: A rectangular snap-in plate (208) is mounted on the side of the partitioning splicing plate (207) away from the rectangular snap-in groove (206) corresponding thereto.

7. The silicon wafer processing turnover and transportation tooling according to claim 6, characterized in that: The rectangular snap-fit plate (208) drives the partitioning splicing plate (207) to be positioned and snap-fitted with the partitioning plate (204) or another set of partitioning splicing plates (207) along the rectangular snap-fit groove (206).

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