Gold immersion device for printed circuit board

Abstract

The utility model relates to a gold immersion device for a printed circuit board, and belongs to the technical field of printed circuit boards. A movable electric cylinder is arranged on the inner side of the top of the door-shaped support, a movable sliding block is arranged on the movable electric cylinder, a lifting air cylinder is arranged on the movable sliding block, a circuit board hanging structure is arranged on an air cylinder shaft of the lifting air cylinder, and the circuit board hanging structure comprises a hanging supporting base and a plurality of circuit board containing inserting plates installed on the hanging supporting base. The circuit board hanging structure has the beneficial effects that a plurality of circuit boards to be processed are placed in the inner placing grooves of the circuit board placing insertion plates, then the circuit board placing insertion plates are inserted into the U-shaped seat plate, and the circuit board hanging structure inserted with the circuit board placing insertion plates is moved into a gold deposition pool to be processed through the movable electric cylinder and the lifting air cylinder; the problems that a traditional gold immersion device needs to be inserted with force when being inserted into the PCB and needs to be taken out with force when needing to be taken out, time is wasted, and the PCB is prone to being damaged during insertion are solved.

Description

Technical Field

[0001] The utility model relates to a gold sinking device for a printed circuit board, belonging to the technical field of printed circuit boards. Background Art

[0002] Printed circuit boards, also known as PCBs, utilize an immersion gold (Immersion Gold) process during their production. This involves immersing the circuit board in a chemical solution containing gold ions. Through an electrochemical reaction, the gold ions are reduced to metal and deposited on the circuit board's surface, forming a uniform metal film. During this deposition process, an extremely thin layer of oxide forms on the metal film, effectively preventing metal corrosion and thus improving the circuit board's corrosion resistance.

[0003] In the prior art, when performing immersion gold treatment on PCB circuit boards, the PCB boards are generally placed in a basket, and then the basket is submerged in a reaction solution for reaction. After the reaction, the basket is lifted out of the solution. However, when the basket is lifted out of the reaction solution, the reaction solution is easily carried out of the immersion gold tank by the basket.

[0004] In response to the above situation, corresponding solutions have emerged in the industry, such as the authorization announcement number: CN219876326 U, and the patent name: A Chinese authorized utility model patent for a PCB board immersion gold device, which includes an immersion gold pool, a mother basket, and a child basket. The mother basket is hung under the hanging plate frame, and the child basket is detachably installed in the mother basket. Multiple PCB boards can be clamped in the child basket. In this solution, the lifting column and the mother basket are connected by a soft wire, so that after the PCB board is lifted out of the immersion gold liquid, the child basket and the mother basket will shake, which facilitates the outflow of excess immersion gold liquid and reduces the hanging time after immersion gold.

[0005] Although the above patent solves the problem that the reaction solution is easily carried out of the gold precipitation pool by the lifting basket, the above patent has the following problems during use: a plurality of horizontal insertion racks are provided, and the PCB boards to be processed are respectively inserted into the card-mounting openings of the horizontal insertion racks to fix the PCB boards. Although the horizontal insertion racks can fix the PCB boards, each time the PCB boards are inserted, force is required to insert them, and force is also required to remove them when they need to be removed. When mass production is carried out, not only is time wasted, but the PCB boards are also easily damaged during insertion, resulting in unnecessary losses. Summary of the Invention

[0006] The technical problem to be solved by the utility model is to provide a gold sinking device for printed circuit boards to solve the problems faced in the industry.

[0007] In order to solve the above technical problems, the utility model is realized through the following technical solutions: a gold sinking device for printed circuit boards, comprising a door-shaped bracket installed on the ground, a gold sinking pool is provided at the inner bottom of the door-shaped bracket, a moving electric cylinder is provided on the inner side of the top of the door-shaped bracket, a moving slider is provided on the moving electric cylinder, a lifting cylinder is provided on the moving slider, a circuit board hanging structure is provided on the cylinder shaft of the lifting cylinder, the circuit board hanging structure comprises a hanging support seat, a plurality of circuit board placement plug-ins installed on the hanging support seat, and a plurality of circuit boards to be gold-sinked are placed in the circuit board placement plug-in.

[0008] Preferably, the suspension support seat has a rectangular structure and is hollow inside. The front and rear sides of the suspension support seat are interconnected. The left and right sides, top and bottom of the suspension support seat are respectively provided with multiple rectangular through holes. Multiple U-shaped seat plates are respectively provided on both sides of the interior of the suspension support seat. The circuit board placement plug-in plate is inserted into the U-shaped seat plate, and the upper surface of the U-shaped seat plate is provided with an upper side mesh plate.

[0009] Preferably, a plurality of baffles are provided on the back of the suspension support seat.

[0010] Preferably, the circuit board placement plug-in plate has a rectangular structure, the upper surface of the circuit board placement plug-in plate is provided with an inner placement groove, a plurality of inner partitions are provided in the inner placement groove, the lower surface of the circuit board placement plug-in plate is provided with a bottom through hole, and the circuit board to be immerged in gold is placed in the inner placement groove.

[0011] Preferably, a cylinder shaft connecting seat with a hollow interior is provided on the top of the suspension support seat, and the cylinder shaft of the lifting cylinder is inserted into the cylinder shaft connecting seat.

[0012] Preferably, handles are provided on the front and rear sides of the circuit board placement board.

[0013] Compared with the prior art, the benefits of the present invention are as follows: when in use, multiple circuit boards to be processed are placed in the inner placement grooves of the circuit board placement plug-in plate, and then the circuit board placement plug-in plate is inserted into the U-shaped seat plate. The circuit board hanging structure with the inserted circuit board placement plug-in plate is moved to the gold sinking pool for processing by moving the electric cylinder and the lifting cylinder. The above method solves the problem that the traditional gold sinking device needs to use force when inserting the PCB board, and also needs to use force when taking it out. When mass production is carried out, it not only wastes time, but also easily damages the PCB board during insertion, resulting in unnecessary losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings.

[0015] Figure 1It is a structural schematic diagram of the utility model when in use.

[0016] Figure 2 It is a structural schematic diagram of the utility model during loading and unloading.

[0017] Figure 3 It is a structural diagram of the circuit board suspension structure.

[0018] Figure 4 This is the main view of the suspension support seat.

[0019] Figure 5 This is the rear view of the suspension support.

[0020] Figure 6 It is a structural diagram of the upper side mesh panel installed on the suspension support seat.

[0021] Figure 7 It is a structural diagram of the circuit board placed on the plug-in board.

[0022] Figure 8 It is a structural diagram of the upper side screen.

[0023] In the figure: 1. Door-type bracket; 2. Gold sinking pool; 3. Moving electric cylinder; 301. Moving slider; 4. Lifting cylinder; 5. Circuit board hanging structure; 6. Suspension support seat; 601. Rectangular through hole; 602. U-shaped seat plate; 603. Baffle; 604. Cylinder shaft connecting seat; 7. Circuit board placement plug-in plate; 701. Inner placement groove; 702. Inner partition; 703. Bottom through hole; 704. Handle; 8. Upper side mesh plate. DETAILED DESCRIPTION

[0024] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments:

[0025] like Figures 1 to 8 The illustrated device for immersion gold deposition on printed circuit boards comprises a door-shaped bracket 1 installed on the ground, a gold immersion pool 2 being provided at the inner bottom of the door-shaped bracket 1, a movable electric cylinder 3 being provided on the inner side of the top of the door-shaped bracket 1, a movable slider 301 being provided on the movable electric cylinder 3, a lifting cylinder 4 being provided on the movable slider 301, a circuit board hanging structure 5 being provided on the cylinder shaft of the lifting cylinder 4, the circuit board hanging structure 5 comprising a hanging support seat 6, and a plurality of circuit board placement inserts 7 installed on the hanging support seat 6, wherein a plurality of circuit boards to be immerged gold are placed on the circuit board placement inserts 7.

[0026] like Figure 3 and Figure 4As shown, in order to be able to install the circuit board placement plug-in plate 7, the suspension support seat 6 is further provided with a rectangular structure and is hollow inside. The front and rear sides of the suspension support seat 6 are interconnected, and the left and right sides and the top and bottom of the suspension support seat 6 are respectively provided with a plurality of rectangular through holes 601. A plurality of U-shaped seat plates 602 are respectively provided on both sides of the interior of the suspension support seat 6. The circuit board placement plug-in plate 7 is inserted into the U-shaped seat plate 602, and the upper surface of the U-shaped seat plate 602 is provided with an upper side mesh plate 8.

[0027] like Figure 5 As shown, in order to prevent the circuit board placement plug-in board 7 from falling off from the U-shaped seat plate 602, a plurality of baffles 603 are further provided on the back of the suspension support seat 6.

[0028] In order to be able to place the circuit board, the circuit board placement plug-in board 7 is further in a rectangular structure, the upper surface of the circuit board placement plug-in board 7 is provided with an inner placement groove 701, and a plurality of inner partitions 702 are provided in the inner placement groove 701. The lower surface of the circuit board placement plug-in board 7 is provided with a bottom through hole 703, and the circuit board to be immerged in gold is placed in the inner placement groove 701.

[0029] In order to facilitate the connection of the lifting cylinder 4 , a cylinder shaft connecting seat 604 with a hollow interior is further provided on the top of the suspension support seat 6 , and the cylinder shaft of the lifting cylinder 4 is inserted into the cylinder shaft connecting seat 604 .

[0030] In order to facilitate taking, further, handles 704 are provided on the front and rear sides of the circuit board placement board 7 respectively.

[0031] When in use, place the set solution in the gold precipitation pool 2, and place the circuit board to be processed into the inner placement groove 701 of the circuit board placement plug-in plate 7. Since a plurality of inner partitions 702 are provided in the inner placement groove 701, the circuit boards placed in the inner placement groove 701 will be separated from each other and will not interfere with each other. The circuit board placement plug-in plate 7 for placing the circuit boards is inserted between the U-shaped seat plates 602 of the suspension support seat 6, thereby achieving the purpose of fixing the circuit board placement plug-in plate 7. A baffle 603 is provided on the back of the suspension support seat 6, which can effectively prevent the circuit board placement plug-in plate 7 from falling off from the U-shaped seat plate 602.

[0032] Since an upper mesh plate 8 is provided above the U-shaped seat plate 602, the circuit board to be processed is wrapped by the upper mesh plate 8 and the circuit board placement inserting plate 7 to prevent the circuit board from falling off.

[0033] Start the lifting cylinder 4 and the moving electric cylinder 3, and drive the circuit board suspension structure 5 to rise and fall through the lifting cylinder 4. The circuit board suspension structure 5 is moved left and right through the cooperation of the moving electric cylinder 3 and the moving slider 301. Through the mutual cooperation of the above structures, the circuit board suspension structure 5 with the circuit board placed on it is sent into the gold sinking pool 2 for processing.

[0034] When the processing is completed, the lifting cylinder 4 is started, and the lifting cylinder 4 drives the circuit board suspension structure 5 to rise and suspend the circuit board suspension structure 5 above the gold sinking pool 4. The moving slider 301 is started, and the moving slider 301 drives the circuit board suspension structure 5 to move left and right above the gold sinking pool 4. During the movement of the circuit board suspension structure 5, the liquid on the circuit board suspension structure 5 is thrown into the gold sinking pool 4, thereby preventing the liquid in the gold sinking pool 4 from splashing everywhere.

[0035] After the liquid on the circuit board hanging structure 5 is shaken off, the moving slider 301 and the lifting cylinder 4 are started to move the circuit board hanging structure 5 to the set position. The operator uses the handle 704 to pull out the circuit board placement plug-in plate 7 from the U-shaped seat plate 602, and the circuit board placed in the circuit board placement plug-in plate 7 can be directly taken away. The above method solves the problem that the traditional immersion gold device needs to use force to insert the circuit board, and also needs to use force to take it out. When mass production is carried out, it not only wastes time, but also easily damages the circuit board during insertion.

[0036] It should be emphasized that the above are only preferred embodiments of the present invention and do not constitute any form of limitation to the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A gold sinking device for printed circuit boards, characterized in that: The invention comprises a door-shaped bracket (1) installed on the ground, wherein a gold sinking pool (2) is provided at the inner bottom of the door-shaped bracket (1), a movable electric cylinder (3) is provided at the inner side of the top of the door-shaped bracket (1), a movable slider (301) is provided on the movable electric cylinder (3), a lifting cylinder (4) is provided on the movable slider (301), a circuit board hanging structure (5) is provided on the cylinder shaft of the lifting cylinder (4), and the circuit board hanging structure (5) comprises a hanging support seat (6), and a plurality of circuit board placement plug-ins (7) installed on the hanging support seat (6), wherein a plurality of circuit boards to be slushed are placed in the circuit board placement plug-ins (7).

2. The gold immersion device for printed circuit boards according to claim 1, characterized in that: The suspension support seat (6) has a rectangular structure and is hollow inside. The front and rear sides of the suspension support seat (6) are interconnected. The left and right sides, top and bottom of the suspension support seat (6) are respectively provided with a plurality of rectangular through holes (601). The two sides inside the suspension support seat (6) are respectively provided with a plurality of U-shaped seat plates (602). The circuit board placement plug-in plate (7) is inserted into the U-shaped seat plate (602). The upper surface of the U-shaped seat plate (602) is provided with an upper side mesh plate (8).

3. The gold immersion device for printed circuit boards according to claim 2, characterized in that: A plurality of baffles (603) are provided on the back side of the suspension support seat (6).

4. The gold immersion device for printed circuit boards according to claim 2, wherein: The circuit board placement insert (7) has a rectangular structure, an inner placement groove (701) is provided on the upper surface of the circuit board placement insert (7), a plurality of inner partitions (702) are provided in the inner placement groove (701), a bottom through hole (703) is provided on the lower surface of the circuit board placement insert (7), and a circuit board to be immerged in gold is placed in the inner placement groove (701).

5. The gold immersion device for printed circuit boards according to claim 1, characterized in that: A cylinder shaft connecting seat (604) with a hollow interior is provided on the top of the suspension support seat (6), and the cylinder shaft of the lifting cylinder (4) is inserted into the cylinder shaft connecting seat (604).

6. The gold immersion device for printed circuit boards according to claim 4, characterized in that: Handles (704) are respectively provided on the front and rear sides of the circuit board placement plug board (7).

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