Encircling type ultra-small COB flip high-voltage five-color light source

Abstract

The utility model discloses a surrounding type ultra-small COB flip high-voltage five-color light source, and belongs to the technical field of photoelectricity. The five-color light source comprises a substrate, front warm white chips and RGB chips. The base plate is of a cup-in-cup structure and comprises a circle boss (3), a first arrangement area (1) located in the circle boss (3) and a second arrangement area (2) located on the periphery of the circle boss (3). The second layout area (2) surrounds the periphery of the circle boss (3) by 360 degrees; the circle boss (3) physically isolates the first layout area (1) from the second layout area (2); and the positive warm white chip and the RGB chip are respectively arranged in the first layout area (1) and the second layout area (2). According to the utility model, the problems of non-uniform color and non-uniform light spots and brightness during secondary optical color mixing can be solved, and the chromaticity and the condensation effect of a light source are improved.

Description

Technical Field

[0001] The utility model belongs to the field of optoelectronic technology, and in particular relates to an enveloping ultra-small COB flip-chip high-voltage five-color light source. Background Art

[0002] LED light sources are a commonly used type of light source at present. Different types of lamp beads are used according to different application scenarios. This is mainly due to the different types of LED brackets used. Specific categories include: direct-plug brackets, surface-mount brackets, high-power brackets, flat-panel brackets, and COB brackets. Since LED brackets need to conduct electricity and heat, metal is used as a conductive connecting material. At the same time, some areas need to be insulated, which requires the use of engineering plastics. Therefore, general LED brackets are formed by metal stamping and then injection molding. Different bracket materials are used for LEDs of different powers. Low-power generally uses PPA, medium-power generally uses PCT, and some high-power ones are currently made of EMC or ceramic substrate materials.

[0003] Currently, there are three-color, four-color, five-color or more-color lamp beads on the market. Generally, they are made by stamping and silver-plating the metal first, and then injection molding with plastic materials such as PPA and PCT. For RGB lamp beads, they are generally electroplated with copper, stamped into the required size, and then injection molded into a bracket. The RGB chip is soldered in the middle of the bracket bowl to make RGB lamp beads. They are arranged side by side, with the warm white on both sides. Figure 1 In addition, in existing COB multi-color lamp beads, generally, there is no isolation between the RGB chip and the white light chip. However, this design has the following disadvantages:

[0004] 1) Place the RGB in the middle of the cup of the bracket, and use a multi-chip parallel and serial distribution method. When the lens is installed and the secondary optical color mixing is lit, one side will be blue and the other side will be green. Figure 2 As shown, uneven color mixing of light spots occurs when RGB color mixing occurs, which has a serious impact on visual effects and aesthetics.

[0005] 2) The pure white and warm white are placed on both sides of the lamp bead. When the pure white and warm white are lit together, the light spots and brightness on both sides will be different, which affects the appearance and fails to achieve the effect of uniform color.

[0006] 3) The existing COB multi-color lamp beads, RGB chips and warm white chips are not isolated. Since the surface of the white light chip has phosphor material and the blue light has strong penetration, when the blue light emits, the blue light will penetrate the phosphor of the white light chip and change the color, resulting in a significant reduction in the color purity of the blue light, and the light effect of the blue light cannot reach the desired effect. Figure 1 As shown in (b).

[0007] 4) The currently available COB package type multi-color lamp beads are relatively large in size, which cannot meet the needs of small-size fields. Utility Model Content

[0008] The present invention aims to solve at least one of the technical problems in the above-mentioned related technologies to a certain extent.

[0009] To this end, the purpose of the present invention is to provide an enveloping ultra-small COB flip-chip high-voltage five-color light source, which can solve the problems of color unevenness, light spot and brightness unevenness during secondary optical color mixing, and improve the color and focusing effect of the light source.

[0010] In order to solve the above technical problems, the utility model is achieved as follows:

[0011] The embodiment of the utility model provides an enveloping ultra-small COB flip-chip high-voltage five-color light source, which includes a substrate, a positive warm white chip and an RGB chip;

[0012] The substrate adopts a cup-in-cup structure, which includes a circular boss 3, a first layout area 1 located inside the circular boss 3, and a second layout area 2 located outside the circular boss 3; the second layout area 2 surrounds the circular boss 3 at 360 degrees; the circular boss 3 physically isolates the first layout area 1 and the second layout area 2;

[0013] The warm white chip and the RGB chip are respectively arranged in the first layout area (1) and the second layout area 2.

[0014] In addition, the enveloping ultra-small COB flip-chip high-voltage five-color light source according to the present invention may also have the following additional technical features:

[0015] In some embodiments, the RGB chip is arranged in the first arrangement area 1 , and the warm white chip is arranged in the second arrangement area 2 .

[0016] In some embodiments, the blue chip in the RGB chip is arranged in the middle of the first arrangement area 1, and the green chip and the red chip in the RGB chip are arranged in sequence around the periphery of the blue chip;

[0017] The upper and lower sides and / or the left and right sides of the arrangement area of the blue light chip are arc-shaped; the arrangement area of the green light chip and the arrangement area of the red light chip are both in the form of a plurality of arc segments.

[0018] In some embodiments, the blue chip in the RGB chip is arranged on one side of the first arrangement area 1, and the green chip and the red chip in the RGB chip are arranged on the side of the blue chip in a manner of surrounding the sides.

[0019] The side of the blue light chip arrangement area close to the green light chip is arc-shaped; the arrangement area of the green light chip and the arrangement area of the red light chip are both arc-shaped.

[0020] In some embodiments, the positive warm white chips are arranged in a circle in the second arrangement area 2, and the positive white chips and the warm white chips in the positive warm white chips are arranged alternately.

[0021] In some embodiments, the RGB chip is arranged in the second arrangement area 2 , and the warm white chip is arranged in the first arrangement area 1 .

[0022] In some embodiments, the blue light chip in the RGB chip is arranged in a circle in the inner ring of the second arrangement area 2; the green light chip and the red light chip in the RGB chip are arranged in a circle around the blue light chip.

[0023] In some embodiments, the green light chip and the red light chip are arranged alternately to form a circle and are arranged around the blue light chip.

[0024] In some embodiments, the green light chip and the red light chip respectively form a circle and are sequentially arranged around the periphery of the blue light chip.

[0025] In some embodiments, the normal white chips and the warm white chips in the normal warm white chips are arranged in a semicircle in the first arrangement area 1, or:

[0026] The pure white chips and the warm white chips are evenly arranged in the first arrangement area 1 in an alternating and interlaced arrangement.

[0027] Compared with the prior art, the present invention has at least the following beneficial effects:

[0028] In the embodiment of the present invention, the provided enveloping ultra-small COB flip-chip high-voltage five-color light source achieves physical isolation between the RGB area and the white light area by providing a circular boss, thereby solving the problem of uneven color caused by insufficient blue light purity in the prior art.

[0029] In the embodiment of the present invention, the provided enveloping ultra-small COB flip-chip high-voltage five-color light source solves the problem of uneven brightness when mixing colors in the prior art by arranging the positive warm white chips in a uniform circular arrangement or in the middle of the substrate.

[0030] In the embodiment of the present invention, the provided enveloping ultra-small COB flip-chip high-voltage five-color light source adopts a unique RGB layout method to solve the "yin-yang light spot" problem of one side being biased towards one color when mixing colors in the prior art.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram of the prior art RGB light source disclosed in this utility model; wherein (a) is a diagram of the RGB lamp bead setting, and (b) is a diagram of the light source when the blue light color purity is insufficient;

[0033] Figure 2 This is a diagram showing the secondary optical color mixing effect of the prior art multi-color light source disclosed in the present utility model;

[0034] Figure 3 This is a schematic diagram of the encircling arrangement of red, green, and blue light chips disclosed in one embodiment of the present invention, including two arrangement methods: Solution 1 and Solution 2;

[0035] Figure 4 This is a schematic diagram of the layout of a warm white chip disclosed in one embodiment of the present utility model;

[0036] Figure 5 This is a schematic diagram of the layout of an enveloping ultra-small COB flip-chip high-voltage five-color light source disclosed in one embodiment of the present utility model;

[0037] Figure 6 This is a schematic diagram of the layout of an enveloping ultra-small COB flip-chip high-voltage five-color light source disclosed in another embodiment of the present utility model;

[0038] Figure 7 This is a schematic diagram of the layout of an enveloping ultra-small COB flip-chip high-voltage five-color light source disclosed in yet another embodiment of the present utility model.

[0039] Description of reference numerals:

[0040] 1. First layout area; 2. Second layout area; 3. Circular boss; 4. Outer shell. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] The embodiments of the present invention are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0043] In some embodiments of the present invention, an enveloping ultra-small COB flip-chip high-voltage five-color light source is provided, which is redesigned to address the defects of the existing technology.

[0044] In some embodiments of the present invention, in order to address the problem that when blue light is turned on, the blue color purity is greatly reduced due to the phosphor penetrating the white light chip, a cup-in-cup design is adopted, and a circular 360° boss is designed on the periphery of the RGB chip. The circular boss 3 physically divides the substrate into two layout areas, a first layout area 1 located on the inner side of the circular boss 3 and a second layout area 2 located on the outer periphery of the circular boss 3. The first layout area 1 is a circular area, and the second layout area 2 is a ring-shaped area. RGB chips and positive warm white chips are laid out in the two layout areas respectively, and the circular boss 3 physically isolates the chips in the two areas. This design method can effectively avoid the light in the RGB layout area from crossing with the positive warm white chip layout area, solve the problem of greatly reduced color purity mentioned above, and improve color saturation and uniformity.

[0045] In some embodiments of the present invention, the red, green and blue chips are placed in the first layout area 1 in the middle of the substrate and are distributed in an embracing manner, such as Figure 3 shown.

[0046] In the above embodiment, the blue chip is placed in the center, and then surrounded by a green chip, with the blue chip encircling it in the middle. This encircling method is a half-ring at the top and bottom. This design method perfectly solves the problem of "shade spots" with one color biased to one side during secondary optical RGB color mixing, and the resulting light efficiency is maximized, with more perfect uniformity and color. The red light then uses the same design method as the blue-green light, with the red light chip enclosing the green and blue light chips in the middle. This layered encircling design method perfectly solves the "shade spots" problem when mixing the red, green, and blue lights in pairs or in three ways, and achieves excellent light efficiency and color. The blue, green, and red chips are all placed in the first layout area 1.

[0047] In another embodiment of the present invention, Figure 3 As shown in Option 2, the blue chip is placed in the center area of the substrate, on one side of the first layout area 1. The green chip is placed around the blue chip from one side, and the red chip is placed around the green chip from one side, away from the blue light. The blue, green, and red chips are arranged in a circular shape. This design effectively solves the problem of "light spots" (light spots) caused by one color being biased towards one side during secondary optical RGB color mixing, and achieves excellent light efficiency, uniformity, and color. The blue, green, and red chips are all placed in the first layout area 1.

[0048] In some embodiments of the present invention, the problem of uneven color and brightness on both sides when the secondary optics are lit together, resulting in one side being bright and the other side being dark, is addressed. This embodiment adopts a 360° circular distribution of the positive and warm white chips around the periphery of the RGB chip (that is, within the second layout area 2), and the positive white chips and the warm white chips are arranged in an alternating manner, such as Figure 4 As shown, this design perfectly solves the problems of uneven light spots caused by lighting up one side while dimming the other when both the warm and white lights are turned on. It greatly improves the uniformity and color of the light spot, maximizing the spotlight effect. Furthermore, this 360° annular design creates a circular light pattern with a 360° area, achieving excellent lighting and spotlighting effects.

[0049] In the above embodiment, the arrangement of the warm white chip can be combined with the arrangement of the RGB chip to form a new five-color light source design. Figure 5 As shown, the overall layout diagram when combined with the previous solution 2 is as follows Figure 6 shown.

[0050] In some embodiments of the present invention, please refer to Figure 7 As shown, the warm white chips are arranged in the first layout area 1, and the RGB chips are arranged in the second layout area 2. The warm white chips are evenly arranged. Among the RGB chips, the blue chip is arranged in a circular shape around the outer periphery of the circular boss 3, and the green and red chips are arranged in a circular shape around the outer periphery of the blue chip. The green and red chips are arranged in an alternating arrangement with equal spacing. The blue chips are also arranged at equal spacing.

[0051] In the above embodiment, a five-color LED light source is used in the COB (Chip On Board) manner, all chips are flip-chip, and a multi-layer aluminum oxide or aluminum nitride ceramic substrate is used, which can achieve good heat dissipation and solve the heat dissipation problem; and the chips can be connected by routing on or within the substrate, avoiding the various hidden dangers such as short circuits and layout difficulties that may exist in open wire connections, solving the routing control problem. The size design of the entire product can also be further reduced due to the routing factors within the substrate. The size of the finished product can also be designed to be between 4.5mm*4.5mm and 5.0mm*5.0mm according to the use of chips of different sizes. The design voltage of the finished product has three voltage levels: 18V, 24V, and 27V. Then, by utilizing the excellent thermal conductivity, heat dissipation and insulation properties of alumina or aluminum nitride ceramic substrates, a multi-layer routing structure is designed, thereby reducing the complex wire bonding process of the upright chip and greatly improving the utilization of space, thus achieving a small-size, multi-color, high-voltage COB flip-chip five-color light source. In this way, by reducing the size of the product, not only can the focusing effect and color uniformity be greatly improved in secondary optics, but the design difficulty of secondary optics can also be reduced, thereby achieving better product design.

[0052] It should be noted that the specific structure, working principle, connection method with other components, working method, control logic, etc. of each color light chip and the LED light source manufacturing process that is not clearly stated can all refer to the existing technology. This embodiment does not limit this and will not be described in detail here.

[0053] The parts of the present invention that are not described in detail are well known to those skilled in the art.

[0054] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. An enveloping ultra-small COB flip-chip high-voltage five-color light source, characterized in that: The five-color light source includes a substrate, a warm white chip and an RGB chip; The substrate adopts a cup-in-cup structure, which includes a circular boss (3), a first layout area (1) located inside the circular boss (3), and a second layout area (2) located on the periphery of the circular boss (3); the second layout area (2) surrounds the periphery of the circular boss (3) at 360 degrees; the circular boss (3) physically isolates the first layout area (1) and the second layout area (2); The positive warm white chip and the RGB chip are respectively arranged in the first layout area (1) and the second layout area (2).

2. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 1 is characterized in that: The RGB chip is arranged in the first arrangement area (1), and the warm white chip is arranged in the second arrangement area (2).

3. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 2, characterized in that: The blue chip in the RGB chip is arranged in the middle of the first arrangement area (1), and the green chip and the red chip in the RGB chip are arranged in sequence around the periphery of the blue chip; The upper and lower sides and / or the left and right sides of the arrangement area of the blue light chip are arc-shaped; the arrangement area of the green light chip and the arrangement area of the red light chip are both in the form of a plurality of arc segments.

4. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 2, characterized in that: The blue light chip in the RGB chip is arranged on one side of the first arrangement area (1), and the green light chip and the red light chip in the RGB chip are arranged in sequence on the side of the blue light chip in a manner of embracing the sides; The side of the blue light chip arrangement area close to the green light chip is arc-shaped; the arrangement area of the green light chip and the arrangement area of the red light chip are both arc-shaped.

5. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 2, characterized in that: The positive warm white chips are arranged in a circular shape in the second arrangement area (2), and the positive white chips and the warm white chips in the positive warm white chips are arranged in an alternating manner.

6. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 1, characterized in that: The RGB chip is arranged in the second arrangement area (2), and the warm white chip is arranged in the first arrangement area (1).

7. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 6, characterized in that: The blue light chip in the RGB chip is arranged in a circle shape in the inner ring of the second arrangement area (2); the green light chip and the red light chip in the RGB chip are arranged in a circle shape on the periphery of the blue light chip.

8. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 7, characterized in that: The green light chip and the red light chip are arranged alternately to form a circle and are arranged around the blue light chip.

9. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 7, characterized in that: The green light chip and the red light chip respectively form a circle and are sequentially arranged around the periphery of the blue light chip.

10. The enveloping ultra-small COB flip-chip high-voltage five-color light source according to claim 6, characterized in that: The pure white chip and the warm white chip in the pure white and warm white chips are arranged in a semicircular shape in the first arrangement area (1), or: The pure white chips and the warm white chips are evenly arranged in the first arrangement area (1) in an alternating and interlaced arrangement.

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