High and low temperature test pressure head device

By designing a high and low temperature test head device, the complex chip testing operation problem in the existing technology in the high and low temperature environments is solved, efficient product pre-pressure and rapid replacement are achieved, and the production efficiency of chip testing is improved.

CN223244627UActive Publication Date: 2025-08-19SICHUAN CHUANPU RONG TECH CO LTD
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Patent Information

Application Number
CN202421934527.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-12
Publication Date
2025-08-19
Estimated Expiration
2034-08-12

AI Technical Summary

Technical Problem

The lack of indenter devices for high and low temperature testing in the prior art leads to complex operation and low efficiency of chip testing in high and low temperature environments.

Method used

A high and low temperature test head device is designed, including a guide mechanism, a quick change mechanism and a test head. It is connected to the quick change mechanism through the guide shaft through the high and low temperature working chamber cover plate, and the external pressure mechanism is used to apply pressure to the guide shaft to realize product pre-pressure in high and low temperature environments, and to achieve rapid replacement through the quick change mechanism.

Benefits of technology

It simplifies the operation process in high and low temperature environments, improves production efficiency and replacement efficiency, and is suitable for high and low temperature environments for chip testing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a high and low temperature test pressure head device, which comprises a guide mechanism, a quick change mechanism and a test pressure head, and is characterized in that the guide mechanism comprises a guide shaft, a guide block and an elastic mechanism, and the guide block is fixed on the outer side of a high and low temperature working bin cover plate; the guide shaft penetrates through the guide block and the high and low temperature working bin cover plate and is connected with the quick change mechanism; and one end, far away from the guide shaft, of the quick change mechanism is fixedly connected with the test pressure head. The guide shaft penetrates through the guide block and the high-low temperature working bin cover plate and is connected with the quick change mechanism, and the test pressure head is connected through the quick change mechanism. The design penetrating through the high-low temperature working bin cover plate is adopted, pressure is applied to the guide shaft through an external pressure mechanism, product pre-pressing in the high-low temperature environment can be achieved across the high-low temperature working bin cover plate, operation can be simplified to the maximum extent, and production efficiency is improved. And the quick replacement of the product can be realized through the quick replacement mechanism, and the replacement efficiency is improved.
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Description

Technical Field

[0001] The present application belongs to the field of chip testing technology, and more specifically, relates to a high and low temperature testing pressure head device. Background Art

[0002] In the RF testing industry, according to requirements, chips must be kept in the corresponding high and low temperature environments before testing. During chip testing, a certain amount of pressure needs to be applied in the Z direction. Currently, there is no such pressure head for high and low temperature testing equipment on the market. Utility Model Content

[0003] To achieve the above-mentioned purpose, the technical solution adopted in this application is: to provide a high and low temperature test pressure head device, including a guide mechanism, a quick-change mechanism and a test pressure head, the guide mechanism includes a guide shaft, a guide block and an elastic mechanism, the guide block is fixed to the outside of the high and low temperature working chamber cover, the guide shaft passes through the guide block and the high and low temperature working chamber cover and is connected to the quick-change mechanism, and the end of the quick-change mechanism away from the guide shaft is fixedly connected to the test pressure head.

[0004] Optionally, the elastic mechanism includes an elastic column, a movable plate and a fixed base, the fixed base is fixedly connected to the high and low temperature working chamber cover, the elastic column is fixedly connected to the fixed base, the movable plate is fixedly connected to the elastic column, the movable plate is fixedly connected to the guide shaft, the guide block is located in the middle of the fixed base, and the guide shaft is slidably sleeved on the inner side of the guide block.

[0005] Optionally, the elastic mechanism includes an elastic guide shaft, the elastic guide shaft is fixedly connected to the fixed base, and the elastic guide shaft passes through the movable plate and is slidably connected to the movable plate.

[0006] Optionally, the elastic column is threadedly connected to the fixed base.

[0007] Optionally, the quick-change mechanism includes a positioning block, a locking nut and a pressure head fixing block, the positioning block is fixedly connected to the guide shaft, the pressure head fixing block is detachably connected to the positioning block via the locking nut, and the pressure head fixing block is fixedly connected to the test pressure head.

[0008] Optionally, interconnected through holes are provided in the middle of the guide shaft, the positioning block and the pressure head fixing block, and a temperature sensor is provided in the through hole.

[0009] The beneficial effect of the high and low temperature test pressure head device provided by this application is that, compared with the prior art, this application uses a guide shaft that penetrates the guide block and the high and low temperature working chamber cover plate and is connected to the quick-change mechanism, and the test pressure head is connected via the quick-change mechanism. By adopting a design that penetrates the high and low temperature working chamber cover plate, an external pressure mechanism applies pressure to the guide shaft, which can cross the high and low temperature working chamber cover plate to achieve product pre-pressing in high and low temperature environments, greatly simplifying operation and improving production efficiency. Furthermore, the quick-change mechanism allows for rapid product replacement, improving replacement efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 A front view of the high and low temperature test head device provided in an embodiment of the present application;

[0012] Figure 2 A schematic cross-sectional view of a high and low temperature test head device provided in an embodiment of the present application;

[0013] Figure 3 A top view of the high and low temperature test head device provided in an embodiment of the present application;

[0014] Figure 4 A schematic diagram of the structure of the elastic mechanism in the high and low temperature test head device provided in an embodiment of the present application;

[0015] Among them, the reference numerals in the figures are:

[0016] 1. Guide mechanism; 101. Guide shaft; 102. Guide block; 103. Elastic mechanism; 1031. Elastic column; 1032. Elastic guide shaft; 1033. Movable plate; 1034. Fixed base; 2. High and low temperature working chamber cover; 3. Quick change mechanism; 301. Positioning block; 302. Locking nut; 303. Indenter fixing block; 4. Test indenter; 5. Temperature sensor. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0018] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0019] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0021] Please also refer to Figure 1 and Figure 2 , the high and low temperature test pressure head device provided in the embodiment of the present application is now described.

[0022] A high and low temperature test pressure head 4 device includes a guide mechanism 1, a quick-change mechanism 3 and a test pressure head 4. The guide mechanism 1 includes a guide shaft 101, a guide block 102 and an elastic mechanism 103. The guide block 102 is fixed to the outside of the high and low temperature working chamber cover 2. The guide shaft 101 passes through the guide block 102 and the high and low temperature working chamber cover 2 and is connected to the quick-change mechanism 3. The end of the quick-change mechanism 3 away from the guide shaft 101 is fixedly connected to the test pressure head 4.

[0023] In this application, a guide shaft 101 penetrates the guide block 102 and the high and low temperature working chamber cover plate 2 and is connected to the quick-change mechanism 3, which is then connected to the test pressure head 4. By adopting a design that penetrates the high and low temperature working chamber cover plate 2, an external pressure mechanism applies pressure to the guide shaft 101, which can cross the high and low temperature working chamber cover plate 2 to achieve product pre-pressing in high and low temperature environments, greatly simplifying operation and improving production efficiency. Furthermore, the quick-change mechanism 3 allows for rapid product replacement, improving replacement efficiency.

[0024] In some embodiments of the present application, see Figure 4The elastic mechanism 103 includes an elastic column 1031, a movable plate 1033 and a fixed base 1034. The fixed base 1034 is fixedly connected to the high and low temperature working chamber cover 2. The elastic column 1031 is fixedly connected to the fixed base 1034. The movable plate 1033 is fixedly connected to the elastic column 1031. The movable plate 1033 is fixedly connected to the guide shaft 101. The guide block 102 is located in the middle of the fixed base 1034, and the guide shaft 101 is slidably sleeved on the inner side of the guide block 102.

[0025] The guide shaft 101 is fixed to the movable plate 1033. The elastic column 1031 is made of an elastic material and provides a rebound force for the movable plate 1033. The external pressure mechanism adjusts the pressure of the test head 4 by adjusting the stroke of the downward pressure on the guide shaft 101. The elasticity of the elastic column 1031 provides a rebound effect on the guide shaft 101 through the movable plate 1033, making the guide shaft 101 tightly pressed against the external pressure mechanism. When the external pressure disappears, the guide shaft 101 can return to its original position. The guide shaft 101 passes through the high and low temperature working chamber cover 2 and is made of a high and low temperature resistant composite material, such as stainless steel or mold steel.

[0026] In some embodiments of the present application, see Figure 4 The elastic mechanism 103 includes an elastic guide shaft 1032 , which is fixedly connected to the fixed base 1034 . The elastic guide shaft 1032 passes through the movable plate 1033 and is slidably connected to the movable plate 1033 .

[0027] The elastic guide shaft 1032 provides a guide for the lifting and lowering of the movable plate 1033, making the lifting and lowering of the movable plate 1033 more stable.

[0028] In some embodiments of the present application, see Figure 4 The elastic column 1031 is threadedly connected to the fixed base 1034.

[0029] The height of the movable plate 1033 can be adjusted through the threaded connection to adjust the magnitude of the rebound force, and the threaded connection is convenient for installation and disassembly.

[0030] In some embodiments of the present application, see Figure 2 The quick-change mechanism 3 includes a positioning block 301, a locking nut 302 and a pressure head fixing block 303. The positioning block 301 is fixedly connected to the guide shaft 101. The pressure head fixing block 303 is detachably connected to the positioning block 301 through the locking nut 302. The pressure head fixing block 303 is fixedly connected to the test pressure head 4.

[0031] In some embodiments of the present application, the positioning block 301 is screwed to the guide shaft 101; the test indenter 4 is fixed to the indenter fixing block 303. When replacing, only the indenter fixing block 303 and the test indenter 4 need to be removed and replaced. This allows for quick replacement and positioning, shortens commissioning time, and improves production efficiency. The quick-change mechanism 3 is made of a high- and low-temperature resistant metal material (such as stainless steel, mold steel, etc.), and the test indenter 4 is made of a high- and low-temperature resistant material.

[0032] In some embodiments of the present application, see Figure 2 The guide shaft 101, the positioning block 301 and the pressure head fixing block 303 are provided with interconnected through holes in the middle thereof, and a temperature sensor 5 is provided in the through hole.

[0033] The lower end of the temperature sensor 5 is close to the test pressure head 4, and the upper end of the temperature sensor 5 passes through the through hole inside the guide shaft 101 to communicate with the outside world, which is convenient for displaying the temperature. The temperature near the high test pressure head 4 can be detected by the temperature sensor 5, which is convenient for precise control of the test temperature.

[0034] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A high and low temperature test head device, characterized by: It includes a guide mechanism, a quick-change mechanism and a test pressure head. The guide mechanism includes a guide shaft, a guide block and an elastic mechanism. The guide block is fixed to the outside of the high and low temperature working chamber cover. The guide shaft passes through the guide block and the high and low temperature working chamber cover and is connected to the quick-change mechanism. The end of the quick-change mechanism away from the guide shaft is fixedly connected to the test pressure head.

2. The high and low temperature test head device according to claim 1, characterized in that: The elastic mechanism includes an elastic column, a movable plate and a fixed base. The fixed base is fixedly connected to the high and low temperature working chamber cover plate, the elastic column is fixedly connected to the fixed base, the movable plate is fixedly connected to the elastic column, and the movable plate is fixedly connected to the guide shaft. The guide block is located in the middle of the fixed base, and the guide shaft is slidably sleeved on the inner side of the guide block.

3. The high and low temperature test head device according to claim 2, characterized in that: The elastic mechanism includes an elastic guide shaft, the elastic guide shaft is fixedly connected to the fixed base, and the elastic guide shaft passes through the movable plate and is slidably connected to the movable plate.

4. The high and low temperature test head device according to claim 2, characterized in that: The elastic column is threadedly connected to the fixed base.

5. The high and low temperature test head device according to claim 1, characterized in that: The quick-change mechanism includes a positioning block, a locking nut and a pressure head fixing block. The positioning block is fixedly connected to the guide shaft. The pressure head fixing block is detachably connected to the positioning block through the locking nut. The pressure head fixing block is fixedly connected to the test pressure head.

6. The high and low temperature test head device according to claim 5, characterized in that: Through holes that are interconnected are provided in the middle of the guide shaft, the positioning block and the pressure head fixing block, and a temperature sensor is provided in the through hole.