Device for detecting semiconductor device

Abstract

The utility model discloses a device for detecting a semiconductor device, which comprises a platform plate, a base plate, a carrier, a detection plug, a piston, a floating plate, a lifting plate, an ejector rod, a first spring and a second spring, a semiconductor device positioning groove is concavely arranged at the top of the carrier, the piston is arranged in an adsorption hole, a square groove is concavely arranged at the bottom of the platform plate, and the detection plug is arranged in the square groove. The floating plate is arranged in the square groove, the detection plug is arranged at the bottom of the lifting plate and located over the semiconductor device positioning groove, the ejector rod is vertically arranged at the bottom of the lifting plate and downwards points to the floating plate, a guide rod is arranged in the through hole, and a limiting plate is arranged at the top of the guide rod. And the second spring is arranged between the limiting plate and the floating plate. According to the device for detecting the semiconductor device, the semiconductor device can be adsorbed, fixed and detected, and the subsequent detection plug is ensured to be separated from the semiconductor device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device detection, in particular to a device for detecting semiconductor devices. Background Art

[0002] To ensure the performance of semiconductor devices, they must be tested during the production process. This can be done by plugging the pins on a test plug into the semiconductor device and then connecting the test plug to a tester.

[0003] To achieve automated testing during the production process, semiconductor device positioning and automatic insertion and removal of test plugs are required. Existing carriers can only position semiconductor devices but cannot secure them by suction. This can cause the test plug to move upward during removal, impacting subsequent testing or causing the device to fall and be damaged. Improvements are needed. Utility Model Content

[0004] The purpose of the utility model is to provide a device for detecting semiconductor devices, to fix and detect semiconductor devices, and to improve the stability of the detection process.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A device for detecting semiconductor devices, comprising: a platform plate, a pad, a carrier, a detection plug, a piston, a floating plate, a lifting plate, a push rod, a first spring, and a second spring, wherein the platform plate is arranged on the pad, the carrier is arranged on the platform plate, a semiconductor device positioning groove is provided in a concave manner on the top of the carrier, an adsorption hole extending downward to the bottom surface of the carrier is provided at the bottom of the semiconductor device positioning groove, the piston is arranged in the adsorption hole, a square groove is provided in a concave manner on the bottom of the platform plate, the floating plate is arranged in the square groove, and a driving mechanism is provided at the bottom of the piston that extends into the square groove and is connected to the floating plate. Rod, the first spring is arranged between the bottom of the floating plate and the pad, the platform plate is provided with a bracket extending to the top of the carrier, the bracket is provided with a lifting drive mechanism, the lifting plate is provided at the bottom of the lifting drive mechanism, the detection plug is provided at the bottom of the lifting plate and is located directly above the semiconductor device positioning groove, the push rod is vertically arranged at the bottom of the lifting plate and points downward to the floating plate, the floating plate is provided with a through hole located below the push rod, a guide rod is provided in the through hole, a limit plate is provided on the top of the guide rod, and the second spring is provided between the limit plate and the floating plate.

[0007] Wherein, a pad is provided on the pad and is located below the floating plate.

[0008] Wherein, a detector is also included, and the detection plug is linearly connected to the detector.

[0009] Wherein, the lifting drive mechanism adopts a cylinder or an electric telescopic rod.

[0010] Wherein, a guide sleeve corresponding to the push rod is provided on the platform plate.

[0011] Wherein, the platform plate is provided with an avoidance hole located below the guide sleeve.

[0012] The beneficial effects of the present utility model are as follows: a device for detecting semiconductor devices, wherein the semiconductor device is placed in the semiconductor device positioning groove on the top of the carrier for positioning, and the lifting plate drives the detection plug and the ejector pin to move downward. In the process of the lifting plate driving the detection plug and the ejector pin to move downward, the ejector pin first contacts the limit plate, compresses the limit plate and the second spring, and transmits the pressure to the floating plate and the first spring. The elasticity of the first spring is small and is compressed first. The floating plate moves downward accordingly and drives the driving rod and the piston to move downward, generating negative pressure at the top of the adsorption hole, adsorbing and fixing the semiconductor device, and the lifting plate continues to descend. The detection plug and the semiconductor device are plugged in for detection, and the second spring is compressed to adapt to the synchronous descent of the ejector pin and the detection plug. After the detection is completed, the lifting plate drives the detection plug and the ejector pin to move upward, and the second spring first releases the compression and maintains the downward pressure on the floating plate, that is, maintains the adsorption and fixation of the semiconductor device to ensure the separation of the detection plug and the semiconductor device. Then the first spring releases the compression and pushes the floating plate to move up and reset, and the piston moves upward to release the adsorption and fixation of the semiconductor device, making it convenient for the unloading of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the utility model;

[0014] Figure 2 yes Figure 1 Schematic diagram of the structure in which the detection plug is lowered to perform semiconductor device detection. DETAILED DESCRIPTION

[0015] The following combination Figure 1~Figure 2 The technical solution of the present utility model is further illustrated by specific embodiments.

[0016] like Figure 1 and Figure 2 The device for detecting semiconductor devices shown includes: a platform plate 1, a pad 17, a carrier 11, a detection plug 8, a piston 19, a floating plate 14, a lifting plate 6, a push rod 4, a first spring 15, a second spring 22 and a detector 9. The platform plate 1 is set on the pad 17 and can be fixed with bolts, and the structure is stable.

[0017] The carrier 11 is placed on the platform plate 1 . A semiconductor device positioning groove 10 is provided inwardly on the top of the carrier 11 . The semiconductor device 18 can be placed in the semiconductor device positioning groove 10 for positioning, thereby ensuring positioning accuracy during detection.

[0018] An adsorption hole 12 extending downward to the bottom of the carrier 11 is provided at the bottom of the semiconductor device positioning groove 10. The piston 19 is provided in the adsorption hole 12. When the piston 19 moves downward, negative pressure can be generated at the top of the adsorption hole 12. Figure 2 As shown, the semiconductor device 18 is fixed by adsorption.

[0019] like Figure 1 As shown, a square groove is provided in the bottom of the platform plate 1, the floating plate 14 is provided in the square groove, and a driving rod 13 is provided at the bottom of the piston 19, extending into the square groove and connected to the floating plate 14, so that the piston 19 and the floating plate 14 are lifted and lowered synchronously.

[0020] The first spring 15 is disposed between the bottom of the floating plate 14 and the pad 17 to elastically support the floating plate 14. In this embodiment, a pad 16 is disposed on the pad 17 below the floating plate 14 to limit the downward movement of the floating plate 14 and control its downward movement stroke.

[0021] A bracket 5 extending to the top of the carrier 11 is provided on the platform plate 1, and a lifting drive mechanism 7 is provided on the bracket 5. The lifting plate 6 is arranged at the bottom of the lifting drive mechanism 7. In this embodiment, the lifting drive mechanism 7 adopts a cylinder or an electric telescopic rod, which can be telescopically controlled by PLC to drive the lifting plate 6 to move up and down.

[0022] like Figure 1 As shown, the detection plug 8 is set at the bottom of the lifting plate 6 and is located just above the semiconductor device positioning groove 10. In this embodiment, the detection plug 8 is linearly connected to the detector 9, as shown in FIG. Figure 2 As shown, during the downward movement of the detection plug 8 , the detection plug 8 is connected to the semiconductor device 18 and then subjected to online detection by the detector 9 .

[0023] The push rod 4 is vertically arranged at the bottom of the lifting plate 6 and points downwardly toward the floating plate 14. In this embodiment, a guide sleeve 3 corresponding to the push rod 4 is provided on the platform plate 1 to guide the push rod 4. The platform plate 1 is provided with a relief hole 2 below the guide sleeve 3 so as not to affect the push rod 4 from entering the square groove downwardly.

[0024] The floating plate 14 is provided with a through hole 20 located below the ejector pin 4. A guide rod 21 is provided in the through hole 20. A limit plate 23 is provided at the top of the guide rod 21. A second spring 22 is provided between the limit plate 23 and the floating plate 14 to elastically support the limit plate 23. The elastic force of the second spring 22 is greater than the elastic force of the first spring 15. When the lifting plate 6 drives the detection plug 8 and the ejector pin 4 downward, the ejector pin 4 first contacts the limit plate 23, compressing the limit plate 23 and the second spring 22, and transmitting the pressure to the floating plate 14 and the first spring 15. The first spring 15 has a low elasticity and is compressed first, causing the floating plate 14 to move downward and drive the drive rod 13 and the piston 19 to move downward, generating negative pressure at the top of the adsorption hole 12, adsorbing and fixing the semiconductor device 18 and improving stability.

[0025] like Figure 2 As shown, as the lifting plate 6 continues to descend, the detection plug 8 and the semiconductor device 18 are plugged in for testing. At this time, the second spring 22 is compressed to accommodate the synchronous descent of the ejector pin 4 and the detection plug 8. After the test is completed, the lifting plate 6 drives the detection plug 8 and the ejector pin 4 to move upward. The second spring 22 first releases its compression and maintains downward pressure on the floating plate 14, that is, it maintains the adsorption and fixation of the semiconductor device 18 by the adsorption hole 12, ensuring the separation of the detection plug 8 from the semiconductor device 18. Then, the first spring 15 releases its compression and pushes the floating plate 14 upward to reset. The piston 19 moves upward to release the adsorption and fixation of the semiconductor device 18, making it easier for manual or robotic arms to unload the semiconductor device 18.

[0026] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation methods and application scope. The content of this specification should not be understood as limiting the present invention.

Claims

1. A device for detecting a semiconductor device, characterized in that: include: A platform plate, a pad, a carrier, a detection plug, a piston, a floating plate, a lifting plate, a push rod, a first spring, and a second spring. The platform plate is arranged on the pad, the carrier is arranged on the platform plate, a semiconductor device positioning groove is provided in a concave manner on the top of the carrier, an adsorption hole is provided at the bottom of the semiconductor device positioning groove and extends downward to the bottom surface of the carrier, the piston is arranged in the adsorption hole, a square groove is provided in the bottom of the platform plate, the floating plate is arranged in the square groove, a driving rod is provided at the bottom of the piston and extends into the square groove and is connected to the floating plate, the first spring is arranged between the bottom of the floating plate and the pad, a bracket is provided on the platform plate and extends above the carrier, a lifting drive mechanism is provided on the bracket, the lifting plate is arranged at the bottom of the lifting drive mechanism, the detection plug is arranged at the bottom of the lifting plate and is located directly above the semiconductor device positioning groove, the push rod is vertically arranged at the bottom of the lifting plate and points downward to the floating plate, the floating plate is provided with a through hole located below the push rod, a guide rod is provided in the through hole, a limit plate is provided on the top of the guide rod, and the second spring is arranged between the limit plate and the floating plate.

2. The device for inspecting semiconductor devices according to claim 1, wherein: The pad is provided with a pad below the floating plate.

3. The device for inspecting semiconductor devices according to claim 1, wherein: It also includes a detector, and the detection plug is linearly connected to the detector.

4. The device for inspecting semiconductor devices according to claim 1, wherein: The lifting drive mechanism adopts a cylinder or an electric telescopic rod.

5. The device for inspecting semiconductor devices according to claim 1, wherein: A guide sleeve corresponding to the ejector rod is provided on the platform plate.

6. The device for inspecting semiconductor devices according to claim 5, wherein: The platform plate is provided with an avoidance hole located below the guide sleeve.

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