Chip testing equipment

Abstract

The utility model provides chip testing equipment, and relates to the technical field of chip testing. The chip testing device comprises a feeding mechanism, a discharging mechanism, a testing mechanism and at least one carrying mechanism, the feeding mechanism comprises a plurality of feeding assemblies, and each feeding assembly is used for feeding tested chips with different packaging modes. The discharging mechanism and the feeding mechanism are arranged side by side, the testing mechanism is located between the feeding mechanism and the discharging mechanism and provided with a plurality of testing stations arranged in the horizontal direction, and the testing stations are used for conducting functional testing on a tested chip. According to the technical scheme, conveying of different bearing pieces can be achieved, multiple feeding modes of chips are met, and universality is high.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing device. Background Art

[0002] As electronic products require electronic components to have good performance and reliability, it is necessary to perform electrical performance testing on chips.

[0003] Existing chip testing equipment primarily includes chip loading equipment, chip handling equipment, chip testing equipment, and chip unloading equipment, enabling automated chip testing. However, existing chip testing equipment is often only suitable for loading chips in a specific packaging format. This makes it highly targeted and inflexible, and it cannot accommodate multiple chip loading formats. Therefore, there is an urgent need to design chip testing equipment that can accommodate multiple chip loading formats. Utility Model Content

[0004] One purpose of the present invention is to provide a chip testing device to solve the technical problem that the chip testing device in the prior art cannot meet the requirements of various forms of chip loading.

[0005] A further object of the present invention is to avoid scratching the chip.

[0006] In particular, the present invention provides a chip testing device, comprising:

[0007] The loading mechanism includes multiple groups of loading components, each group of the loading components is used to load the chips under test in different packaging methods;

[0008] A material unloading mechanism, arranged side by side with the material loading mechanism, for unloading the tested chip after the test is completed;

[0009] A testing mechanism, located between the loading mechanism and the unloading mechanism, the testing mechanism having a plurality of testing stations arranged in a horizontal direction, the testing stations being used to perform functional testing on the chip under test;

[0010] At least one transport mechanism is arranged to be movable along the arrangement direction of the loading mechanism, the testing mechanism and the unloading mechanism to transport the chip under test.

[0011] Optionally, the number of the feeding components is three groups;

[0012] Wherein, a set of the loading components includes a waffle box carrying the chip under test and a moving component for transporting the chip under test;

[0013] A set of loading components is used to transport the wafer with the chip to be tested;

[0014] The remaining set of the loading components is used to convey the tape of the roll-to-roll chip feeder, and the tape has the chip to be tested.

[0015] Optionally, the chip testing equipment further includes:

[0016] At least one visual correction mechanism is provided on a side of the loading mechanism close to the testing mechanism, the visual correction mechanism is used to receive the chip under test conveyed from the loading mechanism by the conveying mechanism and correct the position of the chip under test;

[0017] Each of the vision correction mechanisms comprises:

[0018] A carrier, having a mounting position for placing the chip under test;

[0019] The XYR adjustment module is connected to the carrier and is used to drive the carrier to rotate and / or move in a controlled manner, thereby adjusting the position of the chip under test.

[0020] Optionally, each of the vision correction mechanisms further comprises:

[0021] A coaxial light source is installed below the carrier and aligned with the installation position;

[0022] a lens, aligned with a side of the coaxial light source and connected to the XYR adjustment module, wherein the lens is configured to obtain the actual position of the chip under test through the coaxial light source;

[0023] The XYR adjustment module is configured to adjust the position of the chip under test according to the actual position and target position of the chip under test.

[0024] Optionally, the lens is configured to generate first position information of the chip under test after taking a first picture; and to take a second picture after the XYR adjustment module completes the angle adjustment of the chip under test, and to generate second position information of the chip under test again;

[0025] The XYR adjustment module is configured to drive the carrier to rotate according to the first position information and the target position information to complete the angle adjustment of the chip under test, and to drive the carrier to move according to the second position information and the target position information of the chip under test to complete the position adjustment of the chip under test.

[0026] Optionally, the carrier includes:

[0027] A mounting plate, one end of which is connected to the XYR adjustment module, and an air channel is provided inside the mounting plate for adsorbing the chip under test;

[0028] a first glass carrier, the first glass carrier having a mounting position and a suction port aligned with the mounting position, and being mounted on a top portion of an end of the mounting plate away from the XYR adjustment module, the suction port being in communication with the air passage;

[0029] A second glass carrier is disposed on the bottom of the mounting plate and aligned with the first glass carrier.

[0030] Optionally, each of the vision correction mechanisms further comprises:

[0031] An XR adjustment module, connected to the lens, for controlling the position of the lens; and / or

[0032] a cleaning assembly, the cleaning assembly having an air nozzle aligned with the mounting position, the air nozzle being used for controlled air jetting to clean the chip under test; and / or

[0033] An ion wind component is aligned with the mounting position and is used to controllably remove static electricity from the chip under test.

[0034] Optionally, the chip testing equipment includes a mounting platform, and the loading assembly for conveying wafers includes:

[0035] a pair of first slide rails, the first slide rails being mounted on the mounting platform and arranged along a vertical direction perpendicular to the horizontal direction;

[0036] A sliding platform is used to carry wafers, and both ends of the sliding platform are slidably connected to corresponding first slide rails, and is configured to slide along the pair of first slide rails in a controlled manner to transport the wafer, wherein the wafer includes at least one chip under test.

[0037] Optionally, the loading assembly for conveying wafers further includes:

[0038] A feeding device, the feeding device is used to place wafers;

[0039] A robot arm is slidably mounted on the mounting table, and the robot arm is configured to grab the wafer in the feeding device and slide in a controlled manner to transport the wafer to the sliding platform.

[0040] Optionally, the loading assembly for conveying wafers further includes:

[0041] a heating device mounted on the bottom of the mounting platform, the heating device being configured to heat the bottom of the wafer on the sliding platform when the sliding platform moves to the top thereof along the pair of first slide rails;

[0042] A demolding device is installed on the mounting table, and is configured to separate the chip under test from the blue film on the wafer when the sliding platform moves to the top of the sliding platform along the pair of first slide rails.

[0043] The chip testing equipment in this utility model includes a loading mechanism, an unloading mechanism, a testing mechanism, and at least one transport mechanism. The loading mechanism includes multiple loading assemblies, each of which is used to load chips under test in different packaging methods. The unloading mechanism is arranged side by side with the loading mechanism, and the testing mechanism is located between the loading and unloading mechanisms. The testing mechanism has multiple horizontally arranged testing stations for performing functional testing on the chips under test. This technical solution can realize the transportation of different carriers, meet the needs of various chip loading methods, and has strong versatility.

[0044] Furthermore, each visual correction mechanism in the present invention includes a carrier with a mounting position for the chip under test and an XYR adjustment module. The carrier has a mounting position for the chip under test, and the XYR adjustment module is connected to the carrier and is used to controllably rotate and / or move the carrier to adjust the position of the chip under test. Compared to the technical solution of using a shift fork to move the chip under test, this technical solution can avoid friction between the chip under test and the carrier, which can cause scratches.

[0045] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0047] Figure 1 is a schematic block diagram of a chip testing device according to an embodiment of the present invention;

[0048] Figure 2 is a schematic structural diagram of a chip testing device according to an embodiment of the present utility model;

[0049] Figure 3 This is a schematic structural diagram of a visual correction mechanism in a chip testing device according to an embodiment of the present invention from one angle;

[0050] Figure 4 is a schematic structural diagram of a vision correction mechanism in a chip testing device according to an embodiment of the present invention from another angle;

[0051] Figure 5is a schematic structural diagram of a first adsorption component according to an embodiment of the present utility model;

[0052] Figure 6 is a schematic structural diagram of a carrier in a vision correction mechanism according to an embodiment of the present utility model;

[0053] Figure 7a 1 is a schematic connection diagram of a carrier and an XYR adjustment module according to an embodiment of the present invention;

[0054] Figure 7b 1 is a schematic connection diagram of a loading assembly and an XYR adjustment module according to an embodiment of the present invention;

[0055] Figure 8 is a schematic cross-sectional view of a carrier according to one embodiment of the present utility model;

[0056] Figure 9 This is a schematic structural diagram of a loading mechanism in a chip testing device according to an embodiment of the present invention from one angle;

[0057] Figure 10 This is a schematic structural diagram of a sliding platform and a manipulator according to an embodiment of the present utility model;

[0058] Figure 11 1 is a schematic structural diagram of a loading mechanism in a chip testing device according to an embodiment of the present invention from another angle;

[0059] Figure 12 This is a schematic structural diagram of a test station according to an embodiment of the present invention from one angle;

[0060] Figure 13 is a schematic structural diagram of a test fixture according to an embodiment of the present utility model;

[0061] Figure 14 is a schematic structural diagram of a test station according to an embodiment of the present invention from another angle;

[0062] Figure 15 It is a schematic structural diagram of a crossbeam according to an embodiment of the present utility model.

[0063] Reference numerals:

[0064] 100- chip testing equipment, 200- wafer, 300- chip under test, 10- loading mechanism, 20- unloading mechanism, 30- testing mechanism, 40- transport mechanism, 50- visual correction mechanism, 60- mounting platform, 31- testing station, 41- first adsorption component, 42- beam, 51- carrier, 52- XYR adjustment module, 53- coaxial light source, 54- lens, 55- XR adjustment module, 56- cleaning component, 57- ion wind component, 58- first slide, 59- bracket, 521- X-axis adjustment component, 522- R-axis adjustment component, 523- Y-axis adjustment component, 511- first glass carrier, 512- mounting plate, 513- airway, 514- adsorption port, 515- second glass carrier, 516 -Sealing ring, 517-Annular carrier, 518-First moving block, 519-Second moving block, 520-Rotating shaft, 11-Loading assembly, 111-Feeding device, 112-Sliding platform, 113-A pair of first slide rails, 114-Manipulator, 115-Chip placement area, 116-Heating device, 117-Demolding device, 118-Sliding device, 119-Film expansion device, 311-Downward pressure assembly, 312-Second slide, 313-Test fixture, 314-A pair of second slide rails, 315-Prism, 316-Cleaning brush, 317-Second adsorption part, 411-Suction nozzle, 421-Border patrol camera, 422-Loading AOI camera, 423-Residue cleaning assembly, 424-Unloading AOI camera. DETAILED DESCRIPTION

[0065] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0066] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0067] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0068] Unless otherwise specified or limited, the terms "connection" and "installation" should be interpreted broadly. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. A person of ordinary skill in the art should be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0069] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0070] Figure 1 is a schematic block diagram of a chip testing device 100 according to an embodiment of the present invention. Figure 2 FIG is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present invention. Figure 1 and Figure 2As shown, in a specific embodiment, the chip testing equipment 100 includes a loading mechanism 10, an unloading mechanism 20, a testing mechanism 30 and at least one conveying mechanism 40. The loading mechanism 10 includes multiple groups of loading components 11, and each group of loading components 11 is used to load chips under test in different packaging methods. The unloading mechanism 20 is arranged side by side with the loading mechanism 10 and is used to unload the chips under test after the test is completed. The testing mechanism 30 is located between the loading mechanism 10 and the unloading mechanism 20. The testing mechanism 30 has multiple test stations 31 arranged in a horizontal direction. The test stations 31 are used to perform functional tests on the chips under test. At least one conveying mechanism 40 is configured to be movable along the arrangement direction of the loading mechanism 10, the testing mechanism 30 and the unloading mechanism 20 to convey the chips under test. It can be understood that in the chip testing apparatus 100 of this embodiment, the loading mechanism 10, the testing mechanism 30, and the unloading mechanism 20 are arranged in a straight line in the horizontal direction. The transport mechanism 40 slides along this straight line to transport the chip under test from the loading mechanism 10 to the testing mechanism 30, and then from the testing mechanism 30 to the unloading mechanism 20, completing the transport of the chip under test during the entire testing process. Here, the horizontal direction can be regarded as the X direction.

[0071] This embodiment integrates multiple loading assemblies 11 into a single chip testing device 100, enabling the transport of different carriers and accommodating a variety of loading methods for differently packaged chips, resulting in high versatility. Furthermore, in this embodiment, the loading mechanism 10, the testing mechanism 30, and the unloading mechanism 20 are arranged in a straight line, along which the transport mechanism 40 slides to transport the chips under test. The entire chip testing device 100 is a rectangular parallelepiped with a compact structure and a simple transport route, which reduces the transport time of the chips under test and improves the testing efficiency of the chips under test.

[0072] In some embodiments, the number of loading assemblies 11 is three groups, wherein one group of loading assemblies 11 includes a waffle box carrying the chip under test and a moving assembly for transporting the chip under test, one group of loading assemblies 11 is used to transport the wafer 200 with the chip under test, and the remaining group of loading assemblies 11 is used to transport the tape of the roll chip feeder, on which the chip under test is provided. In other embodiments, the number of loading assemblies 11 can also be selected according to specific design requirements, for example, it can be one or two groups. When the number of loading assemblies 11 is one group, any one of the three groups of loading assemblies 11 can be selected. When the number of loading assemblies 11 is two groups, any two of the three groups of loading assemblies 11 can be selected.

[0073] In some embodiments, multiple groups of loading components 11 are arranged side by side along a vertical direction perpendicular to the horizontal direction. It can be understood that multiple groups of loading components 11 are arranged in parallel, which is equivalent to being arranged along the front-to-back direction of the chip testing equipment 100, and the chips to be tested are transported along the front-to-back direction of the chip testing equipment 100 for loading. In other embodiments, the arrangement positions of the multiple groups of loading components 11 can also be selected according to specific design requirements. For example, two of the groups of loading components 11 are arranged perpendicular to each other, one group is arranged in the vertical direction, the other group is arranged in the horizontal direction, and the remaining group is also arranged in the vertical direction. That is to say, two of the three groups of loading components 11 are arranged in parallel, and the remaining group is arranged perpendicular to these two groups. Here, the vertical direction can be regarded as the Y direction.

[0074] During the actual testing process, when loading is achieved through the above-mentioned loading assembly 11, the incoming bare die products are all angled and need to be straightened by the straightening mechanism before testing. As for the alignment and positioning of chip loading, the existing technology generally adopts a pick form for mechanical alignment and positioning, that is, the chip is slid on the ceramic plate and positioned using the right-angled edge of the pick. This method is prone to scratches on the bottom of the chip, and because the chip is very thin, the thinnest chip is only 0.1mm at present, and the chip can easily get stuck in the pick, causing damage to the chip. In response to this, the present invention further provides a visual correction mechanism 50 with an improved structure.

[0075] Figure 3 1 is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present invention, showing a visual correction mechanism 50 at one angle. Figure 4 FIG. 1 is a schematic structural diagram of the visual correction mechanism 50 in the chip testing device 100 according to an embodiment of the present invention from another angle. Figure 3 and Figure 4 As shown, and see Figure 2 In some embodiments, the chip testing equipment 100 further includes at least one visual correction mechanism 50. The visual correction mechanism 50 is arranged on the side of the loading mechanism 10 close to the testing mechanism 30. The visual correction mechanism 50 is used to receive the chip under test transported from the loading mechanism 10 by the conveying mechanism 40 and correct the position of the chip under test. It can be understood that the visual correction mechanism 50 is arranged between the loading mechanism 10 and the testing mechanism 30. After the conveying mechanism 40 absorbs the chip under test from the loading mechanism 10, the chip under test is first placed on the visual correction mechanism 50 for position and angle correction. After the correction is completed, the conveying mechanism 40 then transports the corrected chip under test to the testing mechanism 30 for functional testing. Here, the number of visual correction mechanisms 50 can be designed according to specific design requirements. For example, it can be set to two. Two visual correction mechanisms 50 can calibrate two chips under test at the same time, thereby improving test efficiency.

[0076] Figure 5 FIG is a schematic structural diagram of the first adsorption member 41 according to an embodiment of the present invention. Figure 5 As shown, and see Figure 2 In some embodiments, the transport mechanism 40 includes a horizontally arranged crossbeam 42 and a plurality of first adsorption members 41 slidable along the crossbeam 42, wherein at least one first adsorption member 41 slides between the loading mechanism 10 and the vision correction mechanism 50 and the testing mechanism 30 to enable the chip under test 300 to be transported between the loading mechanism 10 and the vision correction mechanism 50, and between the vision correction mechanism 50 and the testing mechanism 30, and at least one first adsorption member 41 slides between the testing mechanism 30 and the unloading mechanism 20 to enable the chip under test 300 to be transported between the testing mechanism 30 and the unloading mechanism 20. In some embodiments, the transport mechanism 40 includes six first adsorption members 41, wherein three first adsorption members 41 are configured to slide between the loading mechanism 10 and the vision correction mechanism 50 and the testing mechanism 30, and the remaining three first adsorption members 41 are configured to slide between the testing mechanism 30 and the unloading mechanism 20. The plurality of first adsorption parts 41 are configured to be able to simultaneously adsorb the chips under test 300, and synchronously transport the chips under test 300, work in parallel, and do not interfere with each other, so that multiple chips under test 300 can be tested at one time. Here, the first adsorption part 41 can meet the adsorption requirements of the chips under test 300 transported by three types of loading components 11, and has strong versatility. Each first adsorption part 41 has a suction nozzle 411, and each suction nozzle 411 can be individually position-calibrated to facilitate the rapid switching of different chips under test 300. In addition, the downward pressure of the suction nozzle 411 to absorb the chip under test 300 can be adjusted to avoid inappropriate force that fails to adsorb the chip under test 300 or damages the surface of the chip under test 300.

[0077] In some embodiments, when there are multiple first adsorption members 41 sliding between the loading mechanism 10 and the visual correction mechanism 50, the visual correction mechanism 50 is also arranged in multiples, so that the multiple first adsorption members 41 can synchronously adsorb the chip under test 300 and place the chip under test 300 on the corresponding visual correction mechanism 50 for simultaneous correction. Each visual correction mechanism 50 includes a carrier 51 and an XYR adjustment module 52, and the carrier 51 has a mounting position for placing the chip under test 300. The XYR adjustment module 52 is connected to the carrier 51 and is used to drive the carrier 51 to rotate and / or move in a controlled manner, thereby adjusting the position of the chip under test 300. Here, the XYR adjustment module 52 can realize correction in three directions, namely the X-axis, the Y-axis and the R-axis, the X-axis and the Y-axis are two axes of translation, and the R-axis is the axis of rotation.

[0078] In some embodiments, the XYR adjustment module 52 includes an X-axis adjustment member 521, a Y-axis adjustment member 523, and an R-axis adjustment member 522, wherein the R-axis adjustment member 522 and the Y-axis adjustment member 523 are arranged in parallel and perpendicular to the X-axis adjustment member 521. In other embodiments, the arrangement direction of the X-axis adjustment member 521, the Y-axis adjustment member 523, and the R-axis adjustment member 522 can also be designed according to specific design requirements.

[0079] In some embodiments, the R-axis adjustment member 522 includes a first drive assembly, the X-axis adjustment member 521 includes a second drive assembly, and the Y-axis adjustment member 523 includes a third drive assembly. The second drive assembly drives the stage 51 to reciprocate in a first direction, the third drive assembly drives the stage 51 to reciprocate in a second direction, and the first drive assembly drives the stage 51 to rotate on a first plane; the first direction and the second direction are perpendicular to each other, and the plane in which the first and second directions coexist is the first plane.

[0080] In some embodiments, each visual correction mechanism 50 further includes a coaxial light source 53 and a lens 54. The coaxial light source 53 is mounted below the carrier 51 and aligned with the mounting position. The lens 54 is aligned with the side of the coaxial light source 53 and is connected to the XYR adjustment module 52. The lens 54 is configured to obtain the actual position of the chip under test 300 through the coaxial light source 53. The XYR adjustment module 52 is configured to adjust the position of the chip under test 300 based on the actual position of the chip under test and the target position. Here, the coaxial light source 53 is directly opposite the mounting position and is arranged vertically, and the lens 54 is arranged horizontally.

[0081] In some embodiments, each visual correction mechanism 50 also includes a first slide 58, which is connected to the coaxial light source 53 through a mounting plate 512, and is used to adjust the position of the coaxial light source 53, thereby realizing the convenience of object distance adjustment. By adjusting the first slide 58, the object distance focus can be quickly adjusted, thereby facilitating the lens 54 to more accurately obtain the position and angle of the chip 300 under test.

[0082] In some embodiments, each vision correction mechanism 50 further includes a bracket 59 , on which the first slide 58 and the XYR adjustment module 52 are respectively mounted. Specifically, the first slide 58 is mounted on the side of the bracket 59 , and the XYR adjustment module 52 is mounted on the top of the bracket 59 .

[0083] In some embodiments, the lens 54 is configured to generate first position information of the chip under test 300 after the first photograph is taken; after the XYR adjustment module 52 completes the angle adjustment of the chip under test 300, a second photograph is taken and second position information of the chip under test 300 is again generated. The XYR adjustment module 52 is configured to rotate the carrier 51 based on the first position information and the target position information to complete the angle adjustment of the chip under test 300, and to move the carrier 51 based on the second position information and the target position information of the chip under test 300 to complete the position adjustment of the chip under test 300. Compared to the technical solution of using a shift fork to move the chip under test 300, this embodiment can avoid friction between the chip under test 300 and the carrier 51, which may cause scratches.

[0084] In this embodiment, the first image is taken to calculate the relative rotation angle based on the first position information and the target position information, and the angle of the chip under test 300 is adjusted. The XY displacement is also adjusted to ensure that the chip under test 300 is located in the center of the field of view of the lens 54. A second image is then taken to calculate the position deviation value based on the second position information and the target position information, and the position of the chip under test 300 is adjusted accordingly. It can be understood that the R-axis angle is adjusted first, followed by the X- and Y-axis position adjustments.

[0085] Figure 6 : is a schematic structural diagram of a platform 51 in a vision correction mechanism 50 according to an embodiment of the present invention. Figure 7a : is a schematic connection diagram of the carrier 51 and the XYR adjustment module 52 according to one embodiment of the present invention. Figure 7b : is a schematic connection diagram of the object carrier assembly and the XYR adjustment module 52 according to an embodiment of the present invention. Figure 8 FIG is a schematic cross-sectional view of a carrier 51 according to an embodiment of the present invention. Figures 6 to 8 As shown, and see Figure 3 and Figure 4In some embodiments, the carrier 51 includes a mounting plate 512, a first glass carrier 511, and a second glass carrier 515. One end of the mounting plate 512 is connected to the XYR adjustment module 52. The mounting plate 512 has an air channel 513 inside for adsorbing the chip under test 300. The glass carrier 51 has an adsorption port 514 connected to the air channel 513. The adsorption port 514 is connected to the air channel 513. The first glass carrier 511 has a mounting position and an adsorption port 514 aligned with the mounting position, and is installed on the top of the mounting plate 512 away from the XYR adjustment module 52. It can be understood that the chip under test 300 is placed at the adsorption port 514. The first glass carrier 511 is made of quartz glass. After long-term use, dirt on the surface of the chip under test 300 will remain on the surface of the first glass carrier 511. The quartz glass surface can be quickly cleaned with an alcohol swab. In addition, due to the adsorption of the chip under test 300 and the overall angular and positional movement with the carrier 51, the bottom surface of the chip under test 300 will not rub against the first glass carrier 511, thereby reducing the scratch rate of the bottom of the chip under test 300. The second glass carrier 515 is arranged at the bottom of the mounting plate 512 and is aligned with the first glass carrier 511. It can be understood that the second glass carrier 512 is located below the first glass carrier 511 and is arranged spaced apart from the first glass carrier 511. The coaxial light source 53 is located below the second glass carrier 515. A sealing ring 516 is provided below the first glass carrier 511 and above the second glass carrier 515 to seal the space defined by the two. This space can be regarded as a vacuum chamber, which can ensure a clear and unobstructed view when taking pictures of the chip under test 300.

[0086] In some embodiments, the visual correction mechanism 50 also includes a carrier assembly, which includes a ring-shaped carrier 517, a first movable block 518 and a second movable block 519. The ring-shaped carrier 517 is rotatably mounted on the top of the second movable block 519 through a rotating shaft 520, and the second movable block 519 is slidably mounted on the upper part of the first movable block 518. The first driving assembly is transmission-connected to the ring-shaped carrier 517, and the carrier 51 is fixedly connected to the ring-shaped carrier 517; the ring-shaped carrier 517 is driven by the first driving assembly to rotate on the first plane; the second driving assembly is transmission-connected to the first movable block 518, and the first movable block 518 is driven by the second driving assembly to reciprocate along the first direction; the third driving assembly is transmission-connected to the second movable block 519, and the second movable block 519 is driven by the third driving assembly to reciprocate along the second direction.

[0087] In some embodiments, each vision correction mechanism 50 further includes an XR adjustment module 55, and / or a cleaning assembly 56, and / or an ion wind assembly 57. The XR adjustment module 55 is connected to the lens 54 and is used to controllably adjust the position of the lens 54. The cleaning assembly 56 has an air nozzle aligned with the mounting position and is used to controllably spray air to clean the chip under test 300. The ion wind assembly 57 is aligned with the mounting position and is used to controllably remove static electricity from the chip under test 300.

[0088] In some embodiments, the number of the vision correction mechanism 50 can be set to two, and the two vision correction mechanisms 50 are integrated together. Figure 3 and Figure 4 In other embodiments, the number of vision correction mechanisms 50 can also be designed according to specific design requirements.

[0089] In some embodiments, the number of visual correction mechanisms 50 is set to two, and the two visual correction mechanisms 50 are integrated together to simultaneously correct the positions of two chips under test 300. Furthermore, each test station 31 may include two placement positions for the chips under test 300. During actual operation, the placement positions of the two chips under test 300 in the test station 31 can be photographed with a camera to obtain the spacing between the two placement positions. While using the visual correction mechanism 50 to correct the chips under test 300, the two integrated visual correction mechanisms 50 can also be used to adjust the spacing between the two chips under test 300 to be the same as the spacing between the two placement positions. This can avoid the need to adjust the positions of the two placement positions after transporting the two chips under test 300 to the test station 31.

[0090] Figure 9 1 is a schematic structural diagram of a loading mechanism 10 in a chip testing device 100 according to an embodiment of the present invention from one angle. Figure 10 1 is a schematic structural diagram of a sliding platform 112 and a manipulator 114 according to an embodiment of the present invention. Figure 11 FIG. 1 is a schematic structural diagram of the loading mechanism 10 in the chip testing device 100 according to an embodiment of the present invention from another angle. Figures 9 to 11 As shown, chip testing equipment 100 includes a mounting platform 60. A loading assembly 11 for carrying and / or transporting a waffle box containing a chip under test includes at least one waffle box body. The waffle box body includes a base and a plurality of chip placement areas 115 arrayed on the upper surface of the base. Chip placement areas 115 are used to place the chip under test 300. During loading using this loading assembly 11, the first suction member 41 of the transport mechanism 40 is used to absorb the chip under test 300 from the chip placement area 115 and transport the chip under test 300 to the vision correction mechanism 50.

[0091] In some embodiments, the chip testing apparatus 100 includes a mounting platform 60. The loading assembly 11 for transporting wafers includes a pair of first rails 113 and a sliding platform 112. The pair of first rails 113 are mounted on the mounting platform 60 and arranged in a vertical direction perpendicular to the horizontal direction. The sliding platform 112 is used to support the wafer 200. The sliding platform 112 is slidably connected to the corresponding first rails 113 at each end and is configured to slide along the pair of first rails 113 in a controlled manner to transport the wafer 200, which includes at least one chip under test 300. It can be understood that the pair of first rails 113 are arranged in the front-to-back direction of the chip testing apparatus 100, that is, the Y direction, and are used to transport the wafer 200 from the front side of the chip testing apparatus 100 to the bottom of the transport mechanism 40, so that the first suction member 41 on the transport mechanism 40 suctions the chip under test 300 from the wafer 200 and transports the chip under test 300 to the vision correction mechanism 50. The sliding platform 112 can limit the position of the wafer 200 to ensure the stability of the wafer 200 during the sliding process along the first slide rail 113 .

[0092] In some specific embodiments, at least one waste tray is mounted on the side of the sliding platform 112. When the visual inspection assembly detects scratches or contamination on the chip under test 300, the scratched or contaminated chip under test 300 can be transferred to the waste tray via the first suction member 41, eliminating the need for testing by the testing mechanism 30 and conserving testing resources. In some other embodiments, the waste tray can be a waffle box with the same structure as the waffle box body in the waffle box loading assembly.

[0093] In some embodiments, the loading assembly 11 for conveying wafers further includes a feeding device 111 and a robot 114. The feeding device 111 is used to place the wafer 200. The robot 114 is slidably mounted on the mounting table 60. The robot 114 is configured to grab the wafer 200 in the feeding device 111 and slide in a controlled manner to transport the wafer 200 to the sliding platform 112. Figure 10 The robot arm 114 can move in the vertical direction, that is, the Y direction, to clamp the steel ring of the wafer 200 from the feeding device 111 and pull the wafer 200 from the feeding device 111 to the sliding platform 112 to complete the loading of the wafer 200. The feeding device 111 can accommodate multiple wafers 200, and the multiple wafers 200 are arranged in a vertical stack.

[0094] In some embodiments, the loading assembly 11 further includes a sliding assembly mounted on the sliding platform 112 and extending in the same direction as the pair of first slide rails 113 , ie, along the Y direction. The manipulator 114 is mounted on the sliding assembly to move along the Y direction.

[0095] In some embodiments, the loading assembly 11 for transporting wafers further includes a film stripping device 117 and a film expansion device 119. The film stripping device 117 is mounted on the mounting platform 60 and is configured to move along a pair of first slide rails 113 on a sliding platform 112. The film expansion device 119 is mounted on the sliding platform 112 arranged along the X and Y axes. The film expansion device 119 includes a cylindrical film expansion platform, which is positioned below the wafer 200. The top edge of the film expansion platform is provided with a film expansion rib cut into a rounded shape, and the bottom edge of the film expansion platform is movably mounted on a carrier, which is configured to slide controlledly along the pair of first slide rails 113. During the loading process, the film expansion rib passively pushes against the blue film attached to the bottom of the wafer 200, causing the blue film to be taut and slightly expanded. This creates a gap between adjacent chips under test 300 and eliminates the force between the chips under test 300. At the same time, the demolding device 117 moves to a corresponding position and moves up and down in the Y-axis direction, lifting the blue film to separate the chip under test 300 on the wafer 200 from the blue film.

[0096] The loading assembly 11 for conveying wafers further includes a heating device 116 disposed at the bottom of the mounting platform 60. The heating device 116 is configured to heat the bottom of the wafer 200 on the sliding platform 112 when the sliding platform 112 slides along the pair of first slide rails 113 to its top. Here, the sliding platform 112 first reaches the top of the heating device 116, and after being heated, it continues to move along the Y direction to the top of the demolding device 117 for demolding.

[0097] In some embodiments, the demolding device 117 includes a pin cap and at least one pin, the top of the pin cap has at least one through hole, and the pin cap is configured to move vertically in a controlled manner. The pin is located inside the pin cap, and each pin corresponds to a through hole. The pin is configured to pass through the pin cap from the corresponding through hole when the pin cap moves downward to lift the chip under test 300, thereby allowing the chip under test 300 to detach from the blue film. Here, the demolding device 117 also includes a driving structure, which drives the pin cap to move up and down in a controlled manner. The top of the pin cap is provided with an adsorption port 514 for adsorbing the blue film. When the pin cap moves to a position in contact with the blue film, the blue film is first adsorbed through the adsorption port 514, and then the pin cap moves downward, so that the pin protrudes from the pin cap, thereby lifting the chip under test 300.

[0098] See also Figure 11 In some specific embodiments, the loading assembly 11 for conveying wafers further includes a sliding device 118, which is installed at the bottom of the mounting platform 60 and is connected to the demolding device 117 to drive the demolding device 117 to move vertically, so that the demolding device 117 lifts the wafer 200 and separates the chip under test 300 on the wafer 200 from the blue film.

[0099] In some embodiments, see Figure 9 The loading assembly 11 for conveying wafers further includes a reel loading device provided on one side of the chip testing equipment 100 , and the reel loading device is used for loading reel chips.

[0100] It can be understood that this embodiment supports three loading methods: wafer 200 loading, tape loading, and waffle box loading. The first suction member 41 can absorb chips on the wafer 200 and chips directly transferred from the waffle box. This embodiment can accommodate more than two loading methods, making loading more convenient and versatile.

[0101] Figure 12 is a schematic structural diagram of a test station 31 according to an embodiment of the present utility model. Figure 13 FIG is a schematic structural diagram of a test fixture 313 according to an embodiment of the present invention. Figure 12 and Figure 13 As shown, in some embodiments, the test station 31 includes at least one pressing assembly 311, at least one second slide 312, at least one test fixture 313 and a pair of second slide rails 314. The pair of second slide rails 314 are arranged along the Y direction, and the second slide 312 is mounted on the pair of second slide rails 314 and can slide along the second slide rails 314 to the bottom of the pressing assembly 311. The test fixture 313 is mounted on the second slide 312, and the chip under test 300 is placed on the second slide 312. In this embodiment, each pressing assembly 311 corresponds to one second slide 312 and one test fixture 313. Specifically, the number of the pressing assembly 311, the second slide 312 and the test fixture 313 is two respectively, so that two chips under test 300 can be tested at the same time. When the chip under test 300 needs to be moved from the visual correction mechanism 50 to the test station 31, the second slide 312 first slides along the second slide rail 314 to the bottom of the first adsorption member 41. Then, the first adsorption member 41 places the adsorbed chip under test 300 on the test fixture 313 of the second slide 312. Then, the second slide 312 slides along the second slide rail 314 to the bottom of the pressing assembly 311. Finally, the pressing assembly 311 is pressed down to cooperate with the test fixture 313 to test the chip under test 300. Here, a test probe is provided at the bottom of the pressing assembly 311. After the pressing assembly 311 is pressed down, the test probe contacts the chip under test 300 to test the chip under test 300. The current capacity of the test probe is customized according to the test requirements. A single test probe supports a maximum of 10A, and the pressure of the test probe is adjustable. The pressing assembly 311 has a spring floating structure, which, in conjunction with the positioning pin and bushing, can ensure the flatness of the chip under test after pressing and ensure the accurate positioning of the chip under test.

[0102] In some embodiments, there are four test stations 31 , spaced apart in the X-direction. This embodiment supports parallel testing at multiple test stations 31 , with different test stations 31 supporting different temperatures and test items. Specifically, static, dynamic, and avalanche functional testing can be supported, with adjustable test sequence. High-temperature testing is also supported, with a temperature range of room temperature to 200°C. This means that the test stations 31 have flexible adjustment capabilities from room temperature to high temperature, covering a wider range of applications and providing greater flexibility.

[0103] Figure 14 FIG. 1 is a schematic structural diagram of the test station 31 according to another angle of an embodiment of the present invention. Figure 14 As shown, the test station 31 includes a probe cleaning assembly, which includes a cleaning brush 316, a second suction member 317, and a prism 315. The probe cleaning assembly can be moved below the pressing assembly 311. The cleaning brush 316 can clean the test probe on the pressing assembly 311, and the second suction member 317 can absorb dirt on the test probe. The lens can detect the dirt of the test probe through the prism 315, so that the cleaning brush 316 and the second suction member 317 can clean the test probe accordingly. The probe cleaning assembly can automatically and regularly clean dirt or oxides on the probe, extending the service life of the test station 31.

[0104] Figure 15 : is a schematic structural diagram of the crossbeam 42 according to an embodiment of the present invention. Figure 15 As shown, the chip testing equipment 100 also includes a patrol camera 421, an AOI camera for loading materials 422, an AOI camera for unloading materials 424, and a debris cleaning assembly 423. The patrol camera 421, the AOI camera for loading materials 422, the AOI camera for unloading materials 424, and the debris cleaning assembly 423 are each slidably connected to the crossbeam 42 and can slide along the extension direction of the crossbeam 42. The patrol camera 421 is used to locate the first chip under test 300 on the wafer, and the debris cleaning assembly 423 is used to absorb damaged chips under test 300 on the test fixture 313 after testing and remove them from the test fixture 313. The AOI camera 422 for loading materials is used for incoming inspection of the chips under test 300, and the AOI camera 424 for unloading materials is used for unloading inspection of the chips under test 300, ensuring that the surface quality of the six surfaces of the chips under test 300 can be traced.

[0105] In some embodiments, the structure of the unloading mechanism 20 is substantially the same as that of the loading mechanism 10, and the demolding device 117 and the heating device 116 are not required. After the chip under test 300 is tested, the first suction member 41 transfers the tested chip under test 300 to the wafer 200, then slides along the Y direction, and finally transfers the wafer 200 to the feeding device of the unloading mechanism 20 via a robot.

[0106] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention can be directly determined or deduced from the contents disclosed herein without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A chip testing device, characterized in that: include: The loading mechanism includes multiple groups of loading components, each group of the loading components is used to load the chips under test in different packaging methods; A material unloading mechanism, arranged side by side with the material loading mechanism, for unloading the tested chip after the test is completed; A testing mechanism, located between the loading mechanism and the unloading mechanism, the testing mechanism having a plurality of testing stations arranged in a horizontal direction, the testing stations being used to perform functional testing on the chip under test; At least one transport mechanism is arranged to be movable along the arrangement direction of the loading mechanism, the testing mechanism and the unloading mechanism to transport the chip under test.

2. The chip testing device according to claim 1, characterized in that: The number of the feeding components is three; Wherein, a set of the loading components includes a waffle box carrying the chip under test and a moving component for transporting the chip under test; A set of loading components is used to transport the wafer with the chip to be tested; The remaining set of the loading components is used to convey the tape of the roll-to-roll chip feeder, and the tape has the chip to be tested.

3. The chip testing device according to claim 1, characterized in that: The chip testing equipment further includes: At least one visual correction mechanism is provided on a side of the loading mechanism close to the testing mechanism, the visual correction mechanism is used to receive the chip under test conveyed from the loading mechanism by the conveying mechanism and correct the position of the chip under test; Each of the vision correction mechanisms comprises: A carrier, having a mounting position for placing the chip under test; The XYR adjustment module is connected to the carrier and is used to drive the carrier to rotate and / or move in a controlled manner, thereby adjusting the position of the chip under test.

4. The chip testing device according to claim 3, characterized in that: Each of the vision correction mechanisms further comprises: A coaxial light source is installed below the carrier and aligned with the installation position; a lens, aligned with a side of the coaxial light source and connected to the XYR adjustment module, wherein the lens is configured to obtain the actual position of the chip under test through the coaxial light source; The XYR adjustment module is configured to adjust the position of the chip under test according to the actual position and target position of the chip under test.

5. The chip testing device according to claim 4, characterized in that: The lens is configured to generate first position information of the chip under test after taking a first picture; and to take a second picture after the XYR adjustment module completes the angle adjustment of the chip under test, and to generate second position information of the chip under test again; The XYR adjustment module is configured to drive the carrier to rotate according to the first position information and the target position information to complete the angle adjustment of the chip under test, and to drive the carrier to move according to the second position information and the target position information of the chip under test to complete the position adjustment of the chip under test.

6. The chip testing device according to any one of claims 3 to 5, characterized in that: The carrier comprises: A mounting plate, one end of which is connected to the XYR adjustment module, and an air channel is provided inside the mounting plate for adsorbing the chip under test; a first glass carrier, the first glass carrier having a mounting position and a suction port aligned with the mounting position, and being mounted on a top portion of an end of the mounting plate away from the XYR adjustment module, the suction port being in communication with the air passage; A second glass carrier is disposed on the bottom of the mounting plate and aligned with the first glass carrier.

7. The chip testing device according to any one of claims 4 to 5, characterized in that: Each of the vision correction mechanisms further comprises: An XR adjustment module, connected to the lens, for controlling the position of the lens; and / or a cleaning assembly, the cleaning assembly having an air nozzle aligned with the mounting position, the air nozzle being used for controlled air jetting to clean the chip under test; and / or An ion wind component is aligned with the mounting position and is used to controllably remove static electricity from the chip under test.

8. The chip testing device according to claim 2, characterized in that: The chip testing equipment includes a mounting platform, and the loading assembly for conveying wafers includes: a pair of first slide rails, the first slide rails being mounted on the mounting platform and arranged along a vertical direction perpendicular to the horizontal direction; A sliding platform is used to carry wafers, and both ends of the sliding platform are slidably connected to corresponding first slide rails, and is configured to slide along the pair of first slide rails in a controlled manner to transport the wafer, wherein the wafer includes at least one chip under test.

9. The chip testing device according to claim 8, characterized in that: The loading assembly for conveying wafers also includes: A feeding device, the feeding device is used to place wafers; A robot arm is slidably mounted on the mounting table, and the robot arm is configured to grab the wafer in the feeding device and slide in a controlled manner to transport the wafer to the sliding platform.

10. The chip testing device according to claim 9, characterized in that: The loading assembly for conveying wafers also includes: a heating device mounted on the bottom of the mounting platform, the heating device being configured to heat the bottom of the wafer on the sliding platform when the sliding platform moves to the top thereof along the pair of first slide rails; A demolding device is installed on the mounting table, and is configured to separate the chip under test from the blue film on the wafer when the sliding platform moves to the top of the sliding platform along the pair of first slide rails.

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