Micro projection structure and micro projection device based on Micro

Abstract

The utility model provides a micro projection structure and a micro projection device based on Micro, the micro projection structure comprises an installation support, the installation support comprises a first installation surface, a second installation surface and a third installation surface which are used for enclosing to form a rectangular installation space; a first mounting surface is arranged on the first mounting surface, a control panel, a power panel, a Micro chip and a PCB substrate, the Micro chip is fixed on the PCB substrate and is mounted on the first mounting surface, and the control panel and the power panel are respectively and oppositely arranged on the second mounting surface and the third mounting surface which are positioned on the two sides of the PCB substrate. According to the utility model, the technical problems that the existing chip and the drive thereof are generally arranged in a plane, the extension area is large, and the chip and the drive thereof are difficult to be applied to a limited installation space or a space in which parts are intensively installed are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-projection, in particular to a micro-projection structure and a micro-projection device based on MicroLED. Background Art

[0002] Existing chip drivers are typically designed as flat plates to facilitate connection to the chip, resulting in a large footprint. In practical applications, these drivers are not suitable for environments with limited or concentrated space. For example, when using Microled chips in automotive headlights, conventional Microled chip drivers have a flat design, meaning the control panel, power board, and PCB substrate connecting the Microled chip are all located on the same plane. This makes them difficult to install within the limited space of a headlight. Therefore, the overall structure of the chip and its driver needs to be redesigned to accommodate installation requirements in spaces with limited or concentrated mounting space. Utility Model Content

[0003] A technical problem to be solved by the present invention is that, since existing chips and their drivers are usually arranged in a plane, they have a large extension area and are difficult to be applied in spaces where the installation space is limited or where components are centrally installed.

[0004] In order to solve the above technical problems, an embodiment of the present utility model provides a micro-projection structure based on MicroLED.

[0005] The micro-projection structure includes: a mounting bracket, the mounting bracket including a first mounting surface, a second mounting surface, and a third mounting surface for enclosing a rectangular mounting space;

[0006] A control panel, a power board, a MicroLED chip, and a PCB substrate. The MicroLED chip is fixed to the PCB substrate and mounted on the first mounting surface. The control panel and the power board are respectively arranged opposite to each other on the second mounting surface and the third mounting surface located on both sides of the PCB substrate.

[0007] The present invention provides a micro-projection structure based on MicroLEDs. A mounting bracket comprising a first mounting surface, a second mounting surface, and a third mounting surface are provided to enclose a rectangular mounting space. A PCB substrate equipped with a MicroLED chip is mounted on the first mounting surface. A control panel and a power board are disposed on the second mounting surface and the third mounting surface, located on opposite sides of the PCB substrate. Thus, the PCB substrate, which provides driving support for the MicroLED chip, the control panel, and the power board are arranged in a three-dimensional spatial structure. This allows for a more centralized spatial layout, facilitates application in different scenarios, and adapts to the installation requirements of different spaces. This avoids the low installation adaptability associated with arrangements on the same plane. Furthermore, this solves the technical problem that existing chips and their drivers are typically arranged in a flat surface, resulting in a large extension area and difficulty in application in spaces with limited installation space or where components are centrally mounted.

[0008] Preferably, the micro-projection structure includes a heat sink, and the heat sink is attached to the PCB substrate and arranged in the installation space.

[0009] Preferably, the micro-projection structure includes a heat dissipation fan, which is located at an end of the radiator away from the Microled chip and is fixedly mounted on the mounting bracket.

[0010] Preferably, the extending end of the first mounting surface is provided with a mounting lug.

[0011] Preferably, at least one of the control panel, the power board and the PCB substrate is arranged on the mounting bracket by a clamping manner.

[0012] Preferably, the heat sink includes multiple groups of heat sinks and air guide grooves arranged between the heat sinks, the multiple heat sinks are arranged in parallel, and the air guide grooves extend from one end of the Microled chip to one end of the cooling fan.

[0013] Preferably, the multiple groups of heat sinks are distributed in a matrix shape, and the air guide grooves are connected to the heat dissipation space between the control panel and the power board.

[0014] The utility model also provides a micro-projection device based on MicroLED.

[0015] The micro-projection device comprises a lens and any one of the above-described micro-projection structures, wherein the lens is arranged on the first mounting surface corresponding to the Microled chip;

[0016] Preferably, a lens mounting seat for mounting the lens is provided on the first mounting surface.

[0017] Preferably, the lens mounting seat is provided with a limiting mounting hole along its circumferential side wall for installing a bolt for fastening the lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of the micro-projection structure disclosed in the embodiment of the present utility model;

[0020] Figure 2 yes Figure 1 A schematic diagram of a first structure when applied to a micro-projection device;

[0021] Figure 3 yes Figure 1 A second structural diagram when applied to a micro-projection device;

[0022] Figure 4 yes Figure 1 A third structural diagram when applied to a micro-projection device.

[0023] Description of reference numerals:

[0024] 1. Mounting bracket; 101. First mounting surface; 102. Second mounting surface; 103. Third mounting surface; 104. Mounting ears; 2. Control panel; 3. Power board; 4. PCB substrate; 5. MicroLED chip; 6. Radiator; 601. Heat sink; 602. Air guide slot; 7. Cooling fan; 8. Lens; 9. Lens mount; 901. Limit mounting holes. DETAILED DESCRIPTION

[0025] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The detailed description of the following examples and the accompanying drawings are intended to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention. The present invention can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions within the scope of the claims.

[0026] The present invention provides these embodiments to make the present invention thorough and complete, and to fully convey the scope of the present invention to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangements of parts and steps, material components, numerical expressions and numerical values described in these embodiments should be interpreted as merely exemplary and not as limiting.

[0027] It should be noted that, in the description of this utility model, unless otherwise specified, "plurality" means greater than or equal to two. Terms such as "upper," "lower," "inner," and "outer" indicating positions or location relationships are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. When the absolute position of the objects being described changes, the relative positional relationships may also change accordingly.

[0028] In addition, the terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are simply used to distinguish different parts. "Perpendicular" does not mean perpendicular in the strict sense, but rather means that the positions are within the allowable error range. "Parallel" does not mean parallel in the strict sense, but rather means that the positions are within the allowable error range. "Include" and similar terms mean that the elements listed before the word include the elements listed after the word, and do not exclude the possibility that other elements may also be included.

[0029] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intervening device between the specific device and the first or second device.

[0030] All terms used in this utility model have the same meaning as those understood by ordinary technicians in the field to which this utility model belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0031] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0032] like Figures 1 to 4 As shown, the present invention provides a micro-projection structure based on MicroLEDs. The micro-projection structure includes a mounting bracket 1, a control panel 2, a power board 3, a PCB substrate 4, and a MicroLED chip 5. The mounting bracket 1 includes a first mounting surface 101, a second mounting surface 102, and a third mounting surface 103, which enclose a rectangular mounting space. The MicroLED chip 5 is fixed to the PCB substrate 4 and mounted on the first mounting surface 101. The control panel 2 and the power board 3 are respectively arranged on the second mounting surface 102 and the third mounting surface 103 on either side of the PCB substrate 4. Preferably, the panel dimensions of the control panel 2, the power board 3, and the PCB substrate 4 are all 50 mm × 50 mm, and the specific dimensions can be adjusted according to actual usage requirements. The areas of the first mounting surface 101, the second mounting surface 102, and the third mounting surface 103 of the mounting bracket 1, which enclose the rectangular mounting space, are all larger than the areas of the functional panels (control panel 2, power board 3, and PCB substrate 4) mounted thereon, thereby reducing the risk of collisions with the functional panels during installation. This allows the mounting bracket 1 to protect the functional panels while supporting them. The installation space not only serves to install components, but also provides heat dissipation space for the control panel 2, the power board 3, the PCB substrate 4, and the Microled chip 5, thereby avoiding the occurrence of a situation in which a large amount of heat is generated during the use of the micro-projection structure and the normal operation is affected.

[0033] The present invention provides a microLED-based micro-projection structure. A mounting bracket 1 is provided, comprising a first mounting surface 101, a second mounting surface 102, and a third mounting surface 103, which enclose a rectangular mounting space. A PCB substrate 4, which carries a MicroLED chip 5, is mounted on the first mounting surface 101. A control panel 2 and a power board 3 are disposed on the second mounting surface 102 and the third mounting surface 103, respectively, located on opposite sides of the PCB substrate 4. Thus, the PCB substrate 4, which provides driving support for the MicroLED chip 5, the control panel 2, and the power board 3 are arranged in a three-dimensional spatial structure. This allows for a more centralized spatial layout, facilitates application in different scenarios, and adapts to installation requirements in different spaces. This avoids the low adaptability of installations arranged on the same plane. This solves the technical problem that existing chips and their drivers are typically arranged in a flat surface, resulting in a large extension area and difficulty in application in spaces with limited installation space or where components are centrally installed.

[0034] In an optional embodiment of the present invention, the micro-projection structure includes a heat sink 6, which is mounted in the installation space in contact with the PCB substrate 4. This heat sink 6 dissipates heat from the PCB substrate 4 and the MicroLED chip 5 mounted thereon, preventing the MicroLED chip 5 from overheating during operation and potentially affecting normal operation. It should be noted that the PCB substrate 4 is made of copper, which facilitates both thermal and electrical conductivity. To prevent damage to the PCB substrate 4 during installation, a thermally conductive copper plate is preferably provided between the heat sink 6 and the PCB substrate 4 to provide separation without affecting heat conduction.

[0035] In a further optional embodiment of the present invention, the micro-projection structure includes a cooling fan 7 to dissipate heat transferred from the heat sink 6 from the mounting space. Preferably, the cooling fan 7 is located at the end of the heat sink 6 away from the MicroLED chip and is fixed to the mounting bracket 1. This ensures heat dissipation while improving the overall structure's centralization and stability.

[0036] In an optional embodiment of the present invention, mounting ears 104 are provided at the extended end of the first mounting surface 101. Preferably, the mounting ears 104 are provided at the four corners of the first mounting surface to facilitate assembly or installation of the micro-projection structure.

[0037] In an optional embodiment of the present invention, at least one of the control panel 2, power board 3, and PCB substrate 4 is secured to the mounting bracket 1 by snapping. Specifically, this snapping method may involve snapping edges of relatively positioned positioning structures, such as positioning holes or positioning posts, into slots provided on the mounting bracket 1. The specific configuration can be adjusted based on actual production requirements. To facilitate assembly and disassembly, the control panel 2, power board 3, and PCB substrate 4 are preferably secured to the mounting bracket 1 by bolts.

[0038] In an optional embodiment of the present invention, the heat sink 6 includes multiple groups of heat sinks 601 and air guide grooves 602 arranged between the heat sinks 601. The heat sinks 601 are preferably copper heat sinks with good thermal conductivity. The multiple heat sinks 601 are spaced apart and arranged in parallel, and the air guide grooves 602 extend from one end of the Microled chip 5 to one end of the cooling fan 7, thereby more conducive to dissipating heat from the Microled chip 5 outside the installation space.

[0039] In a further optional embodiment of the present invention, multiple groups of heat sinks 601 are distributed in a matrix shape, and the air guide grooves 602 are connected to the heat dissipation space between the control panel 2 and the power board 3, thereby facilitating overall ventilation and cooling of the installation space, and facilitating overall cooling of the micro-projection structure, so that it is in a temperature environment that can maintain normal operation.

[0040] The present invention also provides a micro-projection device based on MicroLED, which includes a lens 8 and a micro-projection structure according to any one of the above. The corresponding MicroLED chip 5 of the lens 8 is arranged on the first mounting surface 101 to facilitate clear image projection.

[0041] The present invention provides a microLED-based pico-projection device structure. A mounting bracket 1 comprising a first mounting surface 101, a second mounting surface 102, and a third mounting surface 103 is provided within the pico-projection structure. A PCB substrate 4 carrying a MicroLED chip 5 is mounted on the first mounting surface 101. A control panel 2 and a power board 3 are disposed on the second mounting surface 102 and the third mounting surface 103, respectively, located on opposite sides of the PCB substrate 4. Thus, the PCB substrate 4, which provides driving support for the MicroLED chip 5, the control panel 2, and the power board 3 are arranged in a three-dimensional spatial structure. This allows for a more centralized spatial layout, facilitates application in different scenarios, and adapts to installation requirements in different spaces. This avoids the low adaptability of installations arranged on the same plane. Furthermore, this solves the technical problem that existing chips and their drivers are typically arranged in a flat surface, resulting in a large extension area and difficulty in application in spaces with limited installation space or where components are centrally installed.

[0042] In an optional embodiment of the present invention, to facilitate replacement of lens 8 without damaging the micro-projection structure during replacement, a lens mount 9 for mounting lens 8 is further provided on the first mounting surface 101. Preferably, lens 8 and lens mount 9 are threadedly mounted together. In a further optional embodiment of the present invention, to enhance the stability of lens 8 installation, a retaining hole 901 for mounting a lens fastening bolt is provided on the axial sidewall of lens mount 9. During use, the fastening bolt passes through retaining hole 901 and screws into the outer periphery of lens 8, thereby securing lens 8. Multiple retaining holes 901 may be provided.

[0043] Thus far, various embodiments of the present invention have been described in detail. To avoid obscuring the concept of the present invention, some details well known in the art have not been described. Based on the above description, those skilled in the art will fully understand how to implement the technical solutions disclosed herein.

[0044] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art will understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present invention. In particular, the various technical features described in the various embodiments may be combined in any manner as long as there are no structural conflicts.

Claims

1. A micro-projection structure based on MicroLED, characterized in that: The micro-projection structure includes: a mounting bracket, the mounting bracket including a first mounting surface, a second mounting surface, and a third mounting surface for enclosing a rectangular mounting space; A control panel, a power board, a MicroLED chip, and a PCB substrate. The MicroLED chip is fixed to the PCB substrate and mounted on the first mounting surface. The control panel and the power board are respectively arranged opposite to each other on the second mounting surface and the third mounting surface located on both sides of the PCB substrate.

2. The micro-projection structure according to claim 1, characterized in that: The micro-projection structure includes a heat sink, and the heat sink is attached to the PCB substrate and is arranged in the installation space.

3. The micro-projection structure according to claim 2, characterized in that: The micro-projection structure includes a heat dissipation fan, which is located at an end of the radiator away from the Microled chip and is fixedly arranged on the mounting bracket.

4. The micro-projection structure according to claim 1, characterized in that: The extending end of the first mounting surface is provided with a mounting lug.

5. The micro-projection structure according to claim 1, characterized in that: At least one of the control panel, the power board and the PCB substrate is arranged on the mounting bracket in a clamping manner.

6. The micro-projection structure according to claim 3, characterized in that: The heat sink includes multiple groups of heat sinks and air guide grooves arranged between the heat sinks. The multiple heat sinks are arranged in parallel, and the air guide grooves extend from one end of the Microled chip to one end of the heat dissipation fan.

7. The micro-projection structure according to claim 6, characterized in that: The multiple groups of heat sinks are distributed in a matrix shape, and the air guide slots are communicated with the heat dissipation space between the control panel and the power board.

8. A micro-projection device based on MicroLED, characterized in that: The micro-projection device includes a lens and a micro-projection structure according to any one of claims 1 to 7, and the lens is arranged on the first mounting surface corresponding to the Microled chip.

9. The micro-projection device according to claim 8, wherein: A lens mounting seat for mounting the lens is provided on the first mounting surface.

10. The micro-projection device according to claim 9, wherein: The lens mounting seat is provided with a limiting mounting hole along its circumferential side wall for mounting a bolt for fastening the lens.

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