Memory heat dissipation structure
By designing the memory heat dissipation structure of thermally conductive copper plates, heat sinks, fans and removable filters, the problems of poor heat dissipation and dust entry are solved, efficient heat dissipation and equipment cleaning are achieved, and the service life of the memory is extended.
Patent Information
- Application Number
- CN202422050786.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The existing memory has poor heat dissipation effect inside the computer, which causes heat accumulation to affect processing speed and service life. At the same time, dust is prone to entering the fan, causing equipment failure.
A memory heat dissipation structure is designed, including thermally conductive copper plates, heat sinks, heat dissipation fans, neck tubes, covers, filters and guides. External air is extracted through the fan and cooled through the neck tube and then blown to the heat dissipation fins. Combined with a removable filter, dust is prevented from entering, achieving efficient heat dissipation and cleaning.
Effectively export memory heat, improve heat dissipation effect, extend service life, and prevent dust from entering through a simple filter design to ensure stable operation of the equipment.
Smart Images
Figure CN223245297U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of memory heat dissipation, in particular to a memory heat dissipation structure. Background Art
[0002] Memory refers to a storage device used to store programs and various data information. It can save digital data, instructions, intermediate results, etc. Memory can be divided into internal memory and external memory. Internal memory is fast, but has a relatively small capacity, and data may be lost after power failure. External memory has a large capacity and can store data for a long time, but has a relatively slow reading and writing speed. Memory plays a vital role in computers and electronic devices and is the basis for data storage and program operation.
[0003] However, most existing memories can only be cooled by fans installed inside the computer when installed in the computer. When the memory is in operation for a long time, the heat accumulated inside cannot be discharged, which in turn affects the processing speed and service life of the memory.
[0004] Therefore, it is necessary to provide a new memory heat dissipation structure to solve the above technical problems. Utility Model Content
[0005] The technical problem solved by the utility model is to provide a memory heat dissipation structure which can conduct and dissipate the heat accumulated on the memory and can also prevent dust from entering the fan.
[0006] In order to solve the above technical problems, the utility model provides a memory heat dissipation structure including a memory body and an outer frame, the bottom of the outer frame is fixedly connected to a heat-conducting copper plate, the top rear side of the outer frame is penetrated and provided with a heat sink, and the heat sink is fixedly connected to the heat-conducting copper plate, the top front side of the outer frame is penetrated and provided with a cooling fan, and the cooling fan is fixedly connected to the heat-conducting copper plate, the top rear side of the outer frame is provided with a cover, a narrow-necked tube is penetrated and fixedly connected between the cover and the cooling fan, the left and right sides of the front side of the cooling fan are fixedly connected with guide rails, a filter is provided between the guide rails, a screw is penetrated and threadedly connected to the middle of the top of the cooling fan, the top of the screw is fixedly connected to a circular filter, and the top middle of the circular filter is fixedly connected to a knob.
[0007] Preferably, sliding rods are passed through and slidably connected on both the left and right sides of the outer frame, the end of the sliding rod adjacent to the outer frame is fixedly connected to a limiting plate, a spring is fixedly connected between the limiting plate and the outer frame, the end of the sliding rod opposite to the spring is fixedly connected to a clamping plate, and a pad is provided on the inner side of the clamping plate.
[0008] Preferably, the pad is made of sponge or rubber.
[0009] Preferably, protrusions are fixedly connected to the left and right sides of the filter screen, and the protrusions penetrate and are slidably connected to the guide rails, and a lifting plate is fixedly connected to the top of the filter screen.
[0010] Preferably, evenly distributed through holes are provided on both the front and rear sides of the heat dissipation fan.
[0011] Compared with the related art, the memory heat dissipation structure provided by the present invention has the following advantages:
[0012] Beneficial effects:
[0013] 1. The utility model provides a heat dissipation structure for a memory. First, through the cooperation of the provided heat dissipation fan, narrow-necked tube, cover, heat-conducting copper plate and heat sink, the heat generated by the memory body during operation is conducted from the heat-conducting copper plate to the heat sink. At this time, the heat dissipation fan is started to draw external air and blow it into the narrow-necked tube. Since the air is compressed and the flow speed is increased when passing through the narrow-necked tube, the temperature of the air is reduced. The air after the reduction is blown toward the heat sink inside the cover, thereby dissipating the heat accumulated on the heat sink, thereby increasing the storage effect and service life of the memory body.
[0014] 2. The utility model provides a memory heat dissipation structure. Through the provision of a circular filter, knob, protrusion, filter and guide rail, when there is too much dust on the circular filter and the filter, first pinch the pull plate to extract the filter from the guide rail, thereby realizing quick disassembly of the filter and facilitating cleaning. Then, the knob is twisted to drive the circular filter and the screw to rotate, so that the screw is separated from the cooling fan, thereby realizing quick disassembly of the circular filter from the cooling fan. The device is simple to disassemble and easy to install, easy to clean, and can effectively prevent dust from entering the cooling fan.
[0015] 3. The utility model provides a memory heat dissipation structure. Through the mutual cooperation of the clamping plate, pad, spring, sliding rod and limit plate, when the device and the memory body are installed, it is only necessary to pull out the clamping plate and then place the memory body between the clamping plates. Then, the clamping plate is loosened, and the sliding rod and the clamping plate are quickly reset under the action of the spring, so that the pad on the clamping plate contacts the side of the memory body, thereby realizing rapid installation and disassembly of the device and the memory body, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic structural diagram of a preferred embodiment of the memory heat dissipation structure provided by the present invention;
[0017] Figure 2 for Figure 1The side view schematic diagram shown;
[0018] Figure 3 for Figure 1 The front view structural diagram shown;
[0019] Figure 4 for Figure 2 The side view of the exploded structure is shown;
[0020] Figure 5 for Figure 3 The exploded diagram shown is from the front;
[0021] Figure 6 for Figure 5 Schematic diagram of the partial cross-section structure shown.
[0022] Numbers in the figure: 1. Memory body; 2. Bump; 3. Circular filter; 4. Knob; 5. Cooling fan; 6. Filter; 7. Narrow-necked tube; 8. Cover; 9. Guide rail; 10. Outer frame; 11. Thermal copper plate; 12. Lifting plate; 13. Screw; 14. Heat sink; 15. Clamping plate; 16. Pad; 17. Spring; 18. Sliding rod; 19. Limit plate. DETAILED DESCRIPTION
[0023] The present invention will be further described below with reference to the accompanying drawings and implementation examples.
[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 ,in, Figure 1 A schematic structural diagram of a preferred embodiment of the memory heat dissipation structure provided by the present invention;
[0025] Figure 2 for Figure 1 The side view schematic diagram shown; Figure 3 for Figure 1 The front view structural diagram shown; Figure 4 for Figure 2 The side view of the exploded structure is shown; Figure 5 for Figure 3 The exploded diagram shown is from the front; Figure 6 for Figure 5The schematic diagram of the partial cross-section structure shown. A memory heat dissipation structure includes a memory body 1 and an outer frame 10. The bottom of the outer frame 10 is fixedly connected to a heat-conducting copper plate 11. The top rear side of the outer frame 10 is penetrated and provided with a heat sink 14, and the heat sink 14 is fixedly connected to the heat-conducting copper plate 11. The top front side of the outer frame 10 is penetrated and provided with a heat dissipation fan 5, and the heat dissipation fan 5 is fixedly connected to the heat-conducting copper plate 11. The top rear side of the outer frame 10 is provided with a cover 8. A narrow-necked tube 7 is penetrated and fixedly connected between the cover 8 and the heat dissipation fan 5. When the memory body 1 is in operation, the heat generated therein is guided to the heat sink 14 by the heat-conducting copper plate 11. At this time, the heat dissipation fan 5 is started to extract external air and blow it into the narrow-necked tube 7. Since the air is compressed and the flow velocity increases when passing through the narrow-necked tube 7, the temperature of the air is reduced, and the air after the reduction is The air is blown toward the heat sink 14 inside the cover 8, thereby dissipating the heat accumulated on the heat sink 14 and increasing the heat dissipation effect. The left and right sides of the front side of the cooling fan 5 are fixedly connected with guide rails 9, and a filter 6 is arranged between the guide rails 9. A screw 13 passes through and is threadedly connected to the middle of the top of the cooling fan 5, and the top of the screw 13 is fixedly connected to the circular filter 3. The top middle of the circular filter 3 is fixedly connected to the knob 4. After the cooling fan 5 has been running for a long time and there is too much dust on it, first pinch the lifting plate 12 to extract the filter 6 from the guide rail 9, thereby realizing quick disassembly of the filter 6 and facilitating cleaning. Twisting the knob 4 drives the circular filter 3 and the screw 13 to rotate, so that the screw 13 is separated from the cooling fan 5, thereby realizing quick disassembly of the circular filter 3 from the cooling fan 5 and facilitating cleaning of the circular filter 3.
[0026] The left and right sides of the outer frame 10 are penetrated and slidably connected with sliding rods 18, and the end of the sliding rod 18 adjacent to the outer frame 10 is fixedly connected to the limit plate 19, and a spring 17 is fixedly connected between the limit plate 19 and the outer frame 10. The end of the sliding rod 18 opposite to the spring 17 is fixedly connected to the clamping plate 15, and a pad 16 is provided on the inner side of the clamping plate 15. When in use, the clamping plate 15 is pulled outward, and then the memory body 1 is placed between the clamping plates 15. This is to loosen the clamping plates 15, and under the action of the spring 17, the sliding rod 18 and the clamping plate 15 are quickly reset, so that the pad 16 on the clamping plate 15 contacts the side of the memory body 1, thereby clamping the memory body 1 and realizing rapid installation of the device and the memory body 1.
[0027] The pad 16 is made of sponge or rubber so as not to cause damage to the memory body 1 when the memory body 1 is clamped.
[0028] The left and right sides of the filter screen 6 are fixedly connected with protrusions 2, and the protrusions 2 are penetrated and slidably connected to the guide rails 9. The top of the filter screen 6 is fixedly connected with a lifting plate 12, which can be combined with the groove on the guide rails 9, so that the filter screen can be installed between the guide rails 9.
[0029] The cooling fan 5 is provided with evenly distributed through holes on both the front and rear sides. The through holes on the front side are air inlets, and the through holes on the rear side are air outlets.
[0030] The working principle of the memory heat dissipation structure provided by the utility model is as follows:
[0031] First, when in use, the clamping plate 15 is pulled outward, and then the memory body 1 is placed between the clamping plates 15. This is to loosen the clamping plate 15. Under the action of the spring 17, the sliding rod 18 and the clamping plate 15 are quickly reset, so that the pad 16 on the clamping plate 15 contacts the side of the memory body 1, thereby clamping the memory body 1 and realizing the rapid installation of the device and the memory body 1. When the memory body 1 is running, the heat generated inside it is guided to the heat sink 14 by the heat-conducting copper plate 11. At this time, the cooling fan 5 is started to extract external air and blow it into the narrow-necked tube 7. Since the air is compressed and the flow is increased when passing through the narrow-necked tube 7, the heat generated by the heat-conducting copper plate 11 is reduced. Speed, so that the temperature of the air is reduced, and the reduced air is blown toward the heat sink 14 inside the cover body 8, thereby dissipating the heat accumulated on the heat sink 14, thereby increasing the heat dissipation effect. After the cooling fan 5 has been running for a long time and there is too much dust on it, first pinch the lifting plate 12 to extract the filter 6 from the guide rail 9, so as to realize the rapid disassembly of the filter 6 and facilitate cleaning. Then, twist the knob 4 to drive the circular filter 3 and the screw 13 to rotate, so that the screw 13 is separated from the cooling fan 5, thereby realizing the rapid disassembly of the circular filter 3 from the cooling fan 5, facilitating the cleaning of the circular filter 3, and there is no need to dismantle the entire equipment, which is convenient and quick.
[0032] Compared with the related art, the memory heat dissipation structure provided by the present invention has the following advantages:
[0033] Beneficial effects:
[0034] First, through the mutual cooperation of the cooling fan 5, narrow-necked tube 7, cover 8, heat-conducting copper plate 11 and heat sink 14, the heat generated by the memory body 1 during operation is conducted from the heat-conducting copper plate 11 to the heat sink 14. At this time, the cooling fan 5 is started to draw external air and blow it into the narrow-necked tube 7. Since the air is compressed and the flow speed increases when passing through the narrow-necked tube 7, the temperature of the air is reduced. The air after the reduction is blown toward the heat sink 14 inside the cover 8, thereby dissipating the heat accumulated on the heat sink 14, thereby increasing the storage effect and service life of the memory body 1.
[0035] The utility model provides a heat dissipation structure of a storage device. By arranging the circular filter 3, knob 4, protrusion 2, filter 6 and guide rail 9, when there is too much dust on the circular filter 3 and the filter 6, first pinch the lifting plate 12 to extract the filter 6 from the guide rail 9, thereby realizing quick disassembly of the filter 6 and facilitating cleaning. Then, the knob 4 is twisted to drive the circular filter 3 and the screw 13 to rotate, so that the screw 13 is disengaged from the cooling fan 5, thereby realizing quick disassembly of the circular filter 3 from the cooling fan 5. The device is simple to disassemble and easy to install, easy to clean, and can effectively prevent dust from entering the cooling fan 5.
[0036] The present invention provides a heat dissipation structure for a memory. By cooperating with the provided clamping plate 15, the pad 16, the spring 17, the sliding rod 18 and the limit plate 19, when installing the device and the memory body 1, it is only necessary to pull out the clamping plate 15 and then place the memory body 1 between the clamping plates 15. Then, the clamping plate 15 is loosened, and the sliding rod 18 and the clamping plate 15 are quickly reset under the action of the spring 17, so that the pad 16 on the clamping plate 15 contacts the side surface of the memory body 1, thereby realizing rapid installation and disassembly of the device and the memory body 1, which is convenient and quick.
[0037] The above are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A memory heat dissipation structure, comprising a memory body and an outer frame, characterized in that: The bottom of the outer frame is fixedly connected to a heat-conducting copper plate, the top rear side of the outer frame is penetrated and provided with a heat sink, and the heat sink is fixedly connected to the heat-conducting copper plate, the top front side of the outer frame is penetrated and provided with a cooling fan, and the cooling fan is fixedly connected to the heat-conducting copper plate, the top rear side of the outer frame is provided with a cover, a narrow-necked tube is penetrated and fixedly connected between the cover and the cooling fan, the left and right sides of the front side of the cooling fan are fixedly connected with guide rails, a filter is provided between the guide rails, a screw is penetrated and threadedly connected to the middle of the top of the cooling fan, the top of the screw is fixedly connected to a circular filter, and the top middle of the circular filter is fixedly connected to a knob.
2. The memory heat dissipation structure according to claim 1, wherein: Sliding rods are passed through and slidably connected on both sides of the outer frame. The end of the sliding rod adjacent to the outer frame is fixedly connected to a limiting plate. A spring is fixedly connected between the limiting plate and the outer frame. The end of the sliding rod opposite to the spring is fixedly connected to a clamping plate, and a pad is provided on the inner side of the clamping plate.
3. The memory heat dissipation structure according to claim 2, wherein: The pad is made of sponge or rubber.
4. The memory heat dissipation structure according to claim 1, wherein: The left and right sides of the filter screen are both fixedly connected with protrusions, and the protrusions penetrate and are slidably connected with the guide rails. The top of the filter screen is fixedly connected with a lifting plate.
5. The memory heat dissipation structure according to claim 1, wherein: The front and rear sides of the heat dissipation fan are both provided with evenly distributed through holes.