Chip resistor structure
By designing the structure of PCB board, resistor substrate, mounting components, compression components and temperature control components, the offset and overheating of chip resistors during welding is solved, and stable connection and efficient heat dissipation are achieved to avoid damage.
Patent Information
- Application Number
- CN202421989040.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-16
AI Technical Summary
Chip resistors are prone to offset during welding and are easily damaged due to overheating, which affects working efficiency.
The structural design includes a PCB board, a resistor substrate, an installation component, a compression component and a temperature control component are adopted. The insertion component is connected to the installation component, and the stability is ensured by the compression component, and abnormal heating is suppressed through the temperature control component. Combined with the design of the thermal fin plate and the temperature difference power generator, the heat dissipation and abnormal heating are suppressed.
It effectively avoids the deviation phenomenon and overheating damage of the resistor during welding, improves the connection stability and heat dissipation efficiency, and ensures the normal operation of the resistor.
Smart Images

Figure CN223245345U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of resistors, in particular to a chip resistor structure. Background Art
[0002] Chip resistors, also known as chip resistors, are a new generation of leadless or short-lead electronic components. The soldering surfaces of their lead ends are on the same plane. The main function of chip resistors in circuits is to reduce voltage, share part of the voltage (i.e., voltage division), current limiting protection circuits, shunts, etc. They can also be used as time circuit components and sensors. For example, a chip resistor proposed in prior art announcement number CN202855461U includes an insulating substrate, surface electrodes, a resistance layer, end electrodes, and an insulating layer. The surface electrodes are respectively arranged on the upper surface of the insulating substrate, the resistance layer is arranged on the upper surface of the insulating substrate and connected to the two surface electrodes, the end electrodes are respectively arranged at both ends of the insulating substrate and connected to the corresponding surface electrodes, the insulating layer is arranged on the upper surface of the resistance layer, a groove is provided on the upper surface of the insulating substrate, and the resistance layer is arranged in the groove.
[0003] However, in order to save circuit space costs, chip resistors are often small in size and are generally fixed to the PCB board by soldering. However, during this process, the chip resistor is placed flat on the PCB board, resulting in it being deflected by the solder wire and the soldering iron when it comes into contact with the chip resistor. This requires re-soldering, and during operation, a relatively large amount of heat will be generated inside the chip resistor, causing damage and reducing the working efficiency of the chip resistor. Utility Model Content
[0004] In order to solve the above technical problems, the utility model provides a chip resistor structure which is easy to connect, avoids the resistor from shifting during welding, and avoids the resistor body from being damaged due to overheating.
[0005] The utility model discloses a chip resistor structure, comprising a PCB board, a resistor substrate, a mounting assembly, a plug-in assembly, a pressing assembly and a temperature control assembly. The PCB board is located below the resistor substrate, and electrical connection blocks are provided at the left and right ends of the resistor substrate. A plurality of heat dissipation fins are evenly installed on the bottom of the resistor substrate. The left and right ends of the resistor substrate are provided with mounting assemblies connected to the left and right ends of the top of the PCB board. The resistor substrate is connected to the mounting assembly through the plug-in assembly, and a pressing assembly is installed on the upper part of the mounting assembly. The temperature control assembly is installed on the side wall of the resistor substrate. When in use, the mounting assembly is welded to the PCB board, and the resistor substrate is mounted on the mounting assembly through the plug-in assembly. The pressing assembly ensures the stability of the connection with the mounting assembly, thereby preventing the resistor substrate from shifting when being fixed, thereby preventing the resistor from shifting when being welded. The temperature control assembly can suppress abnormal heating of the resistor substrate, thereby preventing the resistor body from being damaged due to overheating.
[0006] Preferably, the mounting assembly includes two welding plates, two groups of pins and two electrode plates, the bottom of the welding plate is installed with pins, the left and right ends of the top of the PCB board are provided with plug interfaces matching the pins, the middle part of the welding plate is opened and closed with multiple welding grooves, the top of the welding plate is installed with an electrode plate, and the inside of the electrode plate is provided with a mounting groove; when in use, the pins are inserted into the plug interfaces, the welding plate and the PCB board are docked, and then the solder wire is heated to liquid by an electric soldering iron, and the solder liquid is contacted with the welding grooves respectively, so that the solder liquid covers the surface of the welding plate, and when the electric soldering iron is separated from the solder liquid, the welding plate is fixed to the upper surface of the PCB board by the solidified solder liquid.
[0007] Preferably, the plug-in assembly includes two groups of limit plugs and two contact plates, the front and rear ends of the electrical connection block are connected to the limit plugs, the front and rear ends of the mounting slot of the welding plate are provided with limit slots, and a contact plate is installed at the bottom of the mounting slot; after the welding of the welding plate is completed, the resistor substrate drives the limit plugs at the left and right ends of the electrical connection block to be inserted into the limit slots, so that the electrical connection block contacts the contact plate, effectively avoiding the occurrence of offset.
[0008] Preferably, the clamping assembly includes two groups of screws, two top plates, multiple groups of springs and two voltage plates. The front and rear ends of the welding plate are screwed with screws, and the front and rear ends of the top plate are rotatably installed on the upper part of the front and rear screws. A cross thread groove is opened on the upper part of the screw, and the bottom of the top plate is evenly connected with multiple springs, and the bottom of the spring is connected to the voltage plate; after the electrical connection block is inserted into the mounting groove in the welding plate, the screw is rotated to cover the top plate above the welding plate, so that the top plate drives the voltage plate to be pressed above the electrical connection block, and the voltage plate is pushed by the spring to ensure the connection with the electrical connection block, effectively preventing the resistor substrate from falling.
[0009] Preferably, the temperature control component includes a shell, a thermoelectric power generation sheet, a plurality of threaded coils, a plurality of heat-conducting fins and a reminder component. The shell is installed on the rear side wall of the resistor substrate, the thermoelectric power generation sheet is installed inside the shell and in close contact with the resistor substrate, the plurality of heat-conducting fins are evenly installed inside the shell, the plurality of threaded coils and the heat-conducting fins are alternately installed inside the shell, and the thermoelectric power generation sheet is electrically connected to the threaded coils. When the resistor substrate is working normally, the heat generation is small. When the current inside the resistor substrate increases abnormally, a large amount of heat will be generated. After the resistor substrate is abnormally heated, the thermoelectric power generation sheet will supply power to the plurality of threaded coils, and then a magnetic field will be generated inside the plurality of threaded coils due to the power supply. It can be seen from the "magnetoresistance effect" that when a magnetic field is applied to a metal or semiconductor with current flowing through it, its resistance value will increase, thereby rapidly reducing the current flowing through the resistor substrate, suppressing the abnormal heating of the resistor substrate, and preventing the resistor body from being damaged due to overheating. The heat generated by the resistor substrate can be discharged outward through the heat-conducting fins, thereby improving the efficiency of the resistor substrate in dissipating heat outward.
[0010] Preferably, the reminder component includes a second shell, a temperature sensing piece and an alarm body, the second shell is installed at the front end of the resistor substrate, the temperature sensing piece is installed inside the second shell, and the alarm body is installed in the middle of the front end of the second shell; when the resistor body is abnormally heated, the temperature sensing piece located inside the second shell is deformed by the heat and contacts the alarm body, thereby activating the alarm body to promptly remind the resistor body of the abnormal heating condition.
[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: when in use, the mounting assembly is welded to the PCB board, the resistor substrate is mounted on the mounting assembly through the plug-in assembly, and the connection stability with the mounting assembly is ensured by the clamping assembly, which can avoid the resistor substrate from shifting when fixed, thereby avoiding the resistor from shifting when welding, and the temperature control assembly can suppress the abnormal heating of the resistor substrate to avoid damage to the resistor body due to overheating. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a structural diagram of the utility model;
[0013] Figure 2 It is a schematic diagram of the lower three-dimensional structure of the utility model;
[0014] Figure 3 It is a right side cross-sectional structural schematic diagram of the utility model;
[0015] Figure 4 This is a schematic diagram of the cross-sectional structure of the utility model;
[0016] Figure 5 It is a left-side cross-sectional structural schematic diagram of the utility model;
[0017] Markings in the accompanying drawings: 1. PCB board; 2. Welding board; 3. Pin; 4. Welding slot; 5. Electrode plate; 6. Resistor substrate; 7. Electrical connection block; 8. Limit plug; 9. Screw; 10. Top plate; 11. Spring; 12. Voltage plate; 13. Shell; 14. Thermoelectric generator; 15. Threaded coil; 16. Thermal fin; 17. Second shell; 18. Temperature sensor; 19. Alarm body; 20. Contact plate; 21. Heat dissipation fin. DETAILED DESCRIPTION
[0018] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.
[0019] like Figures 1 to 5 As shown, the PCB board 1 is located below the resistor substrate 6, and electrical connection blocks 7 are set at the left and right ends of the resistor substrate 6. A plurality of heat dissipation fins 21 are evenly installed on the bottom of the resistor substrate 6. A pin 3 is installed at the bottom of the welding plate 2. Plug interfaces matching the pin 3 are opened at the left and right ends of the top of the PCB board 1. A plurality of welding grooves 4 are opened and closed in the middle of the welding plate 2. An electrode plate 5 is installed on the top of the welding plate 2. A mounting groove is opened inside the electrode plate 5. The front and rear ends of the electrical connection block 7 are connected to a limited plug block 8. The front and rear ends of the mounting groove of the welding plate 2 are provided with a limited slot. A contact plate 20 is installed at the bottom of the mounting groove. The front and rear ends of the welding plate 2 are screwed with screws 9. The front and rear ends of the top plate 10 are rotatably installed at the front and rear ends. The upper part of the two screws 9 has a cross thread groove, the bottom of the top plate 10 is evenly connected to multiple springs 11, the bottom of the spring 11 is connected to the voltage plate 12, the shell 13 is installed on the rear side wall of the resistor substrate 6, the thermoelectric power generation sheet 14 is installed inside the shell 13 and is in close contact with the resistor substrate 6, multiple heat-conducting fins 16 are evenly installed inside the shell 13, multiple threaded coils 15 and the heat-conducting fins 16 are alternately installed inside the shell 13, the thermoelectric power generation sheet 14 is electrically connected to the threaded coil 15, the second shell 17 is installed at the front end of the resistor substrate 6, the interior of the second shell 17 is installed with a temperature sensor 18, and the alarm body 19 is installed in the middle of the front end of the second shell 17;
[0020] When in use, insert the pin 3 into the plug interface, connect the welding board 2 with the PCB board 1, and then use the electric soldering iron to heat the solder wire to liquid state, and make the solder liquid contact with the welding groove 4 respectively so that the solder liquid covers the surface of the welding board 2. When the electric soldering iron is separated from the solder liquid, the welding board 2 is fixed to the upper surface of the PCB board 1 by the solidified solder liquid. After the welding of the welding board 2 is completed, the resistor substrate 6 drives the limit plugs 8 at the left and right ends of the electrical connection block 7 to insert into the limit slots, so that the electrical connection block 7 contacts the contact plate 20, effectively avoiding the occurrence of offset. After the electrical connection block 7 is inserted into the mounting slot in the welding board 2, rotate the screw 9 to cover the top plate 10 on top of the welding board 2, so that the top plate 10 drives the voltage plate 12 to be pressed tightly on top of the electrical connection block 7, and the voltage plate 12 is pushed by the spring 11 to ensure the connection with the electrical connection block 7, effectively avoiding the phenomenon of the resistor substrate 6 falling off, and the resistor substrate 6 works normally When the heat generation is small, the abnormal increase of the current inside the resistor substrate 6 will generate a large amount of heat. The thermoelectric power generation sheet 14 will power the multiple threaded coils 15 after the resistor substrate 6 is abnormally heated. Then, the internal parts of the multiple threaded coils 15 will generate a magnetic field due to the power supply. From the "magnetoresistance effect", it can be seen that when a magnetic field is applied to a metal or semiconductor with current flowing through it, its resistance value will increase, thereby causing the current flowing through the inside of the resistor substrate 6 to decrease rapidly, suppressing the abnormal heating of the resistor substrate 6, and preventing the resistor body from being damaged by overheating. The heat generated by the resistor substrate 6 can be discharged outward through the heat-conducting fins 16, thereby improving the efficiency of the resistor substrate 6 in dissipating heat outward. When the resistor body is abnormally heated, the temperature sensing sheet 18 inside the second shell 17 is deformed by the heat and contacts the alarm body 19, and the alarm body 19 is activated to promptly remind the resistor body of the abnormal heating condition.
[0021] like Figures 1 to 5As shown, a chip resistor structure of the present invention, when working, the pin 3 is inserted into the plug interface, the welding board 2 and the PCB board 1 are connected, and then the solder wire is heated to liquid by the electric soldering iron, and the solder liquid is respectively contacted with the welding groove 4, so that the solder liquid covers the surface of the welding board 2, and when the electric soldering iron is separated from the solder liquid, the welding board 2 is fixed to the upper surface of the PCB board 1 by the solidified solder liquid. After the welding of the welding board 2 is completed, the resistor substrate 6 drives the limit plugs 8 at the left and right ends of the electrical connection block 7 to be inserted into the limit slots, so that the electrical connection block 7 is in contact with the contact plate 20, effectively avoiding the occurrence of offset phenomenon. After the electrical connection block 7 is inserted into the mounting groove in the welding board 2, the screw 9 is rotated to cover the top plate 10 on the top of the welding board 2, so that the top plate 10 drives the voltage plate 12 to be pressed tightly on the top of the electrical connection block 7, and the voltage plate 12 is pushed by the spring 11 to ensure the connection with the electrical connection block 7, effectively To prevent the resistor substrate 6 from falling, the resistor substrate 6 generates little heat when it is working normally. If the current inside the resistor substrate 6 increases abnormally, a large amount of heat will be generated. The thermoelectric generator 14 will supply power to the multiple threaded coils 15 after the resistor substrate 6 is abnormally heated. Then, a magnetic field will be generated inside the multiple threaded coils 15 due to the power supply. From the "magnetoresistance effect", it can be seen that when a magnetic field is applied to a metal or semiconductor with current flowing through it, its resistance value will increase, thereby rapidly reducing the current flowing through the resistor substrate 6, suppressing the abnormal heating of the resistor substrate 6, and preventing the resistor body from being damaged by overheating. The heat generated by the resistor substrate 6 can be discharged outward through the heat-conducting fins 16. At the same time, the temperature sensing sheet 18 inside the second shell 17 is deformed by the heat and contacts the alarm body 19, which activates the alarm body 19 to promptly remind the resistor body of the abnormal heating.
[0022] The thermoelectric power generation sheet 14, threaded coil 15, temperature sensing sheet 18 and alarm body 19 of a chip resistor structure of the utility model are purchased on the market. Technicians in this industry only need to install and operate them according to the accompanying instruction manual, without the need for creative work by technicians in this field.
[0023] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A chip resistor structure, characterized in that: The invention comprises a PCB board (1), a resistor substrate (6), a mounting assembly, a plug-in assembly, a pressing assembly and a temperature control assembly, wherein the PCB board (1) is located below the resistor substrate (6), electrical connection blocks (7) are provided at the left and right ends of the resistor substrate (6), a plurality of heat dissipation fins (21) are evenly installed at the bottom of the resistor substrate (6), mounting assemblies are provided at the left and right ends of the resistor substrate (6) and are connected to the left and right ends of the top of the PCB board (1), the resistor substrate (6) is connected to the mounting assembly via the plug-in assembly, a pressing assembly is installed on the top of the mounting assembly, and the temperature control assembly is installed on the side wall of the resistor substrate (6).
2. A chip resistor structure according to claim 1, characterized in that: The mounting assembly comprises two welding plates (2), two groups of pins (3) and two electrode plates (5); the pins (3) are mounted on the bottom of the welding plate (2); the left and right ends of the top of the PCB (1) are provided with plug interfaces matching the pins (3); a plurality of welding slots (4) are opened and closed in the middle of the welding plate (2); the electrode plate (5) is mounted on the top of the welding plate (2); and the electrode plate (5) has a mounting slot inside.
3. A chip resistor structure as claimed in claim 2, characterized in that: The plug-in assembly includes two groups of limit plug-ins (8) and two contact plates (20), the front and rear ends of the electrical connection block (7) are connected to the limit plug-ins (8), the front and rear ends of the installation slot of the welding plate (2) are provided with limit slots, and the contact plate (20) is installed at the bottom of the installation slot.
4. The chip resistor structure according to claim 2, wherein: The clamping assembly comprises two groups of screw rods (9), two top plates (10), multiple groups of springs (11) and two voltage plates (12). The front and rear ends of the welding plate (2) are screwed with screw rods (9). The front and rear ends of the top plate (10) are rotatably mounted on the upper parts of the front and rear screw rods (9). A cross thread groove is provided on the upper part of the screw rod (9). The bottom of the top plate (10) is evenly connected with multiple springs (11), and the bottom of the spring (11) is connected with the voltage plate (12).
5. The chip resistor structure according to claim 1, wherein: The temperature control component comprises a shell (13), a temperature difference power generation sheet (14), a plurality of threaded coils (15), a plurality of heat-conducting fins (16) and a reminder component. The shell (13) is mounted on the rear side wall of the resistance substrate (6). The temperature difference power generation sheet (14) is mounted inside the shell (13) and is in close contact with the resistance substrate (6). The plurality of heat-conducting fins (16) are evenly mounted inside the shell (13). The plurality of threaded coils (15) and the heat-conducting fins (16) are alternately mounted inside the shell (13). The temperature difference power generation sheet (14) is electrically connected to the threaded coils (15).
6. The chip resistor structure according to claim 5, wherein: The reminder component comprises a second shell (17), a temperature sensing piece (18) and an alarm body (19); the second shell (17) is mounted on the front end of the resistor substrate (6); the temperature sensing piece (18) is mounted inside the second shell (17); and the alarm body (19) is mounted in the middle of the front end of the second shell (17).
Citation Information
Patent Citations
Chip resistor
CN202855461U