Rotating mechanism of semiconductor wafer processing groove

Abstract

The utility model belongs to the technical field of wafer manufacturing, and discloses a rotating mechanism of a semiconductor wafer processing groove, which comprises a support, a driving mechanism and a transmission mechanism, the support is arranged outside the processing groove, one side of the support is connected with the outer side of the processing groove, the driving mechanism is arranged on the support, and the transmission mechanism comprises a transmission frame, a driving wheel and a driven wheel. The transmission frame is arranged in the processing groove, the driving wheel and the driven wheel are arranged up and down and meshed with each other, the driving wheel is located above the driven wheel, the output end of the driving mechanism is connected with the driving wheel, the driven wheel is connected with a jacking mechanism, and the jacking mechanism is used for intermittently jacking semiconductor wafers located in the cleaning basket. According to the rotating mechanism of the semiconductor wafer processing groove, the bracket is erected outside the processing groove, and the driving mechanism is placed on the bracket for supporting, so that the driving mechanism is arranged far away from the processing groove, and fine particles generated by friction in the operation process cannot fall into the processing groove; and the condition that the treating fluid or the semiconductor wafer is polluted is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a rotating mechanism of a semiconductor wafer process tank. Background Art

[0002] Wafer processing is a production process. The production process of wafer processing is crystal rod growth → crystal rod cutting and inspection → outer diameter grinding → slicing → round edge → surface grinding → etching → defect removal → polishing → cleaning → inspection → packaging, etc.

[0003] Rotating mechanisms play a crucial role in semiconductor wafer processing, ensuring uniform contact between wafers and the processing fluid during processing, thereby improving processing efficiency and product quality. Traditional rotating mechanisms utilize a combination of lifting and rotating mechanisms within and above the process tank. These mechanisms utilize Z-axis movement to evenly distribute the semiconductor wafer cleaning basket within the processing fluid for cleaning or etching.

[0004] However, the rotating mechanism is mounted above the process tank, causing vibration during operation. Friction between the mechanisms also creates fine particles that can contaminate the processing fluid or semiconductor wafers. Therefore, a new rotating mechanism for semiconductor wafer process tanks is urgently needed to address these issues. Utility Model Content

[0005] The purpose of the present utility model is to provide a rotating mechanism for a semiconductor wafer processing tank to solve the technical problems that the rotating mechanism vibrates during operation and the friction between the mechanisms easily generates fine particles, thereby causing contamination of the processing liquid or the semiconductor wafer.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] The rotating mechanism of the semiconductor wafer process tank includes:

[0008] A bracket, the bracket being arranged outside the process tank, with one side of the bracket being connected to the outer side of the process tank;

[0009] a driving mechanism, the driving mechanism being mounted on the bracket;

[0010] The transmission mechanism includes a transmission frame, a driving wheel and at least one driven wheel. The transmission frame is arranged inside the process tank. The driving wheel and the driven wheel are arranged up and down and mesh with each other. The driving wheel is located above the driven wheel. The output end of the driving mechanism is connected to the driving wheel. The driven wheel is connected to a lifting mechanism. The lifting mechanism is used to intermittently lift the semiconductor wafers located in the cleaning basket.

[0011] As a preferred solution for the rotation mechanism of the semiconductor wafer processing groove, the driving mechanism includes a rotating driving member, the output end of the rotating driving member is coaxially connected to the first long shaft, the end of the first long shaft is provided with a first bevel gear, the driving wheel is coaxially connected to the second long shaft, the end of the second long shaft is provided with a second bevel gear, the axial direction of the first long shaft and the axial direction of the second long shaft are perpendicular to each other, and the first bevel gear is meshed with the second bevel gear.

[0012] As a preferred solution for the rotation mechanism of the semiconductor wafer processing tank, a plurality of bearing seats are provided on the bracket, and the first long axis and the second long axis are fixedly inserted into the bearing seats.

[0013] As a preferred solution for the rotating mechanism of the semiconductor wafer processing tank, there are three bearing seats, which are the first bearing seat, the second bearing seat and the third bearing seat. The first bearing seat is arranged at the end of the second long axis away from the driving wheel and is connected to the bracket. The second bearing seat and the third bearing seat are respectively arranged at both ends of the first long axis and are connected to the bracket.

[0014] As a preferred solution for the rotation mechanism of the semiconductor wafer process tank, the output end of the driving mechanism is coaxially connected to the driving wheel.

[0015] As a preferred solution for the rotation mechanism of the semiconductor wafer process tank, a coupling is provided at the output end of the driving mechanism, and the coupling is connected to the driving wheel.

[0016] As a preferred solution for the rotation mechanism of the semiconductor wafer process groove, there are several driven wheels, adjacent driven wheels are arranged up and down and mesh with each other, the number of the driven wheels is positively correlated with the depth of the process groove, and the driven wheel located at the bottom of the bracket is connected to the lifting mechanism.

[0017] As a preferred solution for the rotating mechanism of the semiconductor wafer process tank, the lifting mechanism includes a cam, one end of the cam is connected to the driven wheel, and the other end is provided with a mounting seat, and the mounting seat is provided on the bottom wall of the process tank.

[0018] As a preferred solution for the rotation mechanism of the semiconductor wafer processing groove, the circumferential side of the cam is provided with small teeth extending along its axial direction, and the small teeth are provided with a plurality of small teeth, and the plurality of small teeth are arranged at intervals along the circumference of the cam.

[0019] As a preferred solution for the rotation mechanism of the semiconductor wafer processing tank, the transmission mechanism is made of polytetrafluoroethylene material.

[0020] Beneficial effects of the utility model:

[0021] The drive mechanism rotates the active pulley, which in turn rotates synchronously with the driven pulley meshing with it, driving the lifting mechanism to intermittently lift the semiconductor wafers held in the wash basket, ensuring more uniform cleaning or etching of the semiconductor wafers. By erecting a bracket outside the process tank and supporting the drive mechanism on it, the drive mechanism is positioned away from the process tank, ensuring that fine particles generated by friction during operation do not fall into the process tank, reducing the risk of contamination of the processing fluid or semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of a rotating mechanism of a semiconductor wafer process tank provided by an embodiment of the present utility model;

[0023] Figure 2 This is a schematic structural diagram of a semiconductor wafer process tank provided by an embodiment of the present invention, in which a rotating mechanism of the process tank is hidden;

[0024] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0025] In the picture:

[0026] 1. Bracket;

[0027] 2. Driving mechanism; 20. Rotating driving member; 21. First long shaft; 22. First bevel gear; 23. Second long shaft; 24. Second bevel gear; 25. Bearing seat; 251. First bearing seat; 252. Second bearing seat; 253. Third bearing seat;

[0028] 3. Transmission mechanism; 31. Transmission frame; 32. Driving wheel; 33. Driven wheel;

[0029] 4. Lifting mechanism; 41. Cam; 411. Small tooth; 42. Mounting seat. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0031] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0034] Traditional rotary mechanisms utilize a combination of lifting and rotating mechanisms installed inside and above the process tank, moving the semiconductor wafer cleaning basket up and down along the Z axis to evenly clean or etch the process liquid. However, the rotary mechanism, mounted above the process tank, vibrates during operation, and friction between the mechanisms can easily generate fine particles, which can contaminate the process liquid or semiconductor wafers.

[0035] Example 1

[0036] In order to solve the above problems, combined Figure 1-Figure 3As shown, this embodiment provides a rotation mechanism for a semiconductor wafer process tank, which includes a bracket 1, a drive mechanism 2, and a transmission mechanism 3. The bracket 1 is disposed outside the process tank, with one side of the bracket 1 connected to the outside of the process tank, and the drive mechanism 2 is mounted on the bracket 1. By mounting the bracket 1 outside the process tank and supporting the drive mechanism 2 on the bracket 1, the drive mechanism 2 is positioned away from the process tank, ensuring that fine particles generated by friction during operation do not fall into the process tank, thereby reducing the risk of contamination of the processing liquid or semiconductor wafers.

[0037] like Figure 1 and Figure 2 As shown, the transmission mechanism 3 includes a transmission frame 31, a driving wheel 32, and at least one driven wheel 33. The transmission frame 31 is located inside the process tank. The driving wheel 32 and the driven wheel 33 are arranged vertically and meshed with each other. The driving wheel 32 is located above the driven wheel 33. The output end of the drive mechanism 2 is connected to the driving wheel 32, and the driven wheel 33 is connected to a lifting mechanism 4. The lifting mechanism 4 is used to intermittently lift the semiconductor wafers located in the cleaning basket. The drive mechanism 2 drives the driving wheel 32 to rotate, and the driven wheel 33 meshed with the driving wheel 32 rotates synchronously to drive the lifting mechanism 4 to intermittently lift the semiconductor wafers placed in the cleaning basket, so that the semiconductor wafers can be cleaned or etched more evenly.

[0038] Among them, the transmission mechanism 3 is preferably made of polytetrafluoroethylene material, that is, the driving wheel 32 and the driven wheel 33 are made of polytetrafluoroethylene material, which has the characteristics of acid, alkali resistance, and resistance to various organic solvents, ensuring that the driving wheel 32 and the driven wheel 33 can be immersed in the processing liquid to operate. In addition, its friction coefficient is extremely low, ensuring that no particles or metal particles will appear during the rotation operation of the mechanism, further reducing the occurrence of contamination of the processing liquid or semiconductor wafers.

[0039] Specifically, if Figure 2 As shown, the drive mechanism 2 includes a rotary drive member 20, the output end of which is coaxially connected to a first long shaft 21, a first bevel gear 22 being provided at the end of the first long shaft 21, a driving wheel 32 being coaxially connected to a second long shaft 23, a second bevel gear 24 being provided at the end of the second long shaft 23, the axial direction of the first long shaft 21 and the axial direction of the second long shaft 23 being perpendicular to each other, and the first bevel gear 22 meshes with the second bevel gear 24. The rotary drive member 20 drives the first long shaft 21 to rotate, and the rotation of the first bevel gear 22 at the end of the first long shaft 21 simultaneously drives the rotation of the second bevel gear 24, and the second bevel gear 24 rotates synchronously with the second long shaft 23, that is, drives the driving wheel 32 coaxially connected to the second long shaft 23 to rotate, and the structure is tightly matched.

[0040] Preferably, the rotating driving member 20 is a motor, and in other embodiments it may also be a driving motor, etc., which is not specifically limited in this embodiment.

[0041] It should be noted that, according to the characteristics of the processing liquid, the rotation direction of the motor can be selectively set to achieve clockwise or counterclockwise rotation of the semiconductor wafer in the process tank.

[0042] Furthermore, in order to improve the stability of the first long axis 21 and the second long axis 23, as shown in FIG. Figure 2 As shown, the bracket 1 is provided with a plurality of bearing seats 25. The first long axis 21 and the second long axis 23 are fixedly inserted into the bearing seats 25. The provision of the bearing seats 25 can reduce the vibration of the first long axis 21 and the second long axis 23, thereby improving the rotation accuracy of the driving member 20 driving the driving wheel 32. Specifically, in this embodiment, there are three bearing seats 25. For ease of description, the three bearing seats 25 are set as the first bearing seat 251, the second bearing seat 252, and the third bearing seat 253. The first bearing seat 251 is provided at the end of the second long axis 23 away from the driving wheel 32 and is connected to the bracket 1. The second bearing seat 252 and the third bearing seat 253 are respectively provided at both ends of the first long axis 21 and are connected to the bracket 1.

[0043] In other embodiments, the number of bearing seats 25 can be adaptively adjusted according to the length and installation position of the first long axis 21 and the second long axis 23, and can be one, two, four or even more, which is not specifically limited in this embodiment.

[0044] Among them, there are several driven wheels 33. In this embodiment, there are four driven wheels 33. Adjacent driven wheels 33 are arranged up and down and mesh with each other. The number of driven wheels 33 is positively correlated with the depth of the process groove. In other embodiments, the appropriate diameter and number of driven wheels 33 are selected according to the depth of the process groove. The number of driven wheels 33 can also be one, two, three, five or even more, and this embodiment does not make specific limitations on this.

[0045] In addition, the driven wheel 33 at the bottom of the bracket 1 is connected to the lifting mechanism 4, as shown in FIG. Figure 2 and Figure 3 As shown, the lifting mechanism 4 includes a cam 41. One end of the cam 41 is connected to the driven wheel 33, and the other end is provided with a mounting seat 42. The mounting seat 42 is arranged on the bottom wall of the process tank. In this embodiment, the cam 41 is a rod-shaped structure. The outer edge of the cam 41 is tangential to the outer edge of the semiconductor wafer. The cam 41 can also rotate the semiconductor wafer during the rolling process, so that the semiconductor wafer can rotate 360 degrees in the process tank while also shaking up and down, so that the semiconductor wafer can more fully contact the processing liquid.

[0046] It is understandable that the cam 41 can lift the semiconductor wafer and drive the semiconductor wafer to rotate during its rotation.

[0047] Furthermore, if Figure 3 As shown, the cam 41 is provided with a plurality of small teeth 411 extending along its axial direction on its circumference. The small teeth 411 are arranged at intervals along the circumference of the cam 41. The provision of the small teeth 411 can reduce the contact area between the semiconductor wafer and the cam 41, reducing the portion of the semiconductor wafer that is not cleaned or etched, and further ensuring sufficient contact between the semiconductor wafer and the chemical solution.

[0048] Example 2

[0049] The structure of this embodiment is basically the same as that of the first embodiment, except that the specific structure of the drive mechanism 2 is different. The drive mechanism 2 of this embodiment includes a rotating drive member 20, which is preferably a motor. The output end of the motor is coaxially connected to the driving wheel 32. In addition, a coupling is provided between the output end of the motor and the driving wheel 32, and the two are connected by the coupling. The motor directly drives the driving wheel 32 to rotate through the coupling, and the coupling serves as an overload protection.

[0050] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A rotating mechanism for a semiconductor wafer process tank, characterized in that: include: A bracket (1), the bracket (1) being arranged outside the process tank, and one side of the bracket (1) being connected to the outer side of the process tank; A driving mechanism (2), wherein the driving mechanism (2) is mounted on the bracket (1); A transmission mechanism (3) includes a transmission frame (31), a driving wheel (32) and at least one driven wheel (33); the transmission frame (31) is arranged inside a process tank; the driving wheel (32) and the driven wheel (33) are arranged up and down and mesh with each other; the driving wheel (32) is located above the driven wheel (33); the output end of the driving mechanism (2) is connected to the driving wheel (32); the driven wheel (33) is connected to a lifting mechanism (4); the lifting mechanism (4) is used to intermittently lift the semiconductor wafers located in the cleaning basket.

2. The rotating mechanism of the semiconductor wafer processing tank according to claim 1, wherein: The driving mechanism (2) comprises a rotating driving member (20), the output end of the rotating driving member (20) is coaxially connected to a first long shaft (21), the end of the first long shaft (21) is provided with a first bevel gear (22), the driving wheel (32) is coaxially connected to a second long shaft (23), the end of the second long shaft (23) is provided with a second bevel gear (24), the axial direction of the first long shaft (21) and the axial direction of the second long shaft (23) are perpendicular to each other, and the first bevel gear (22) and the second bevel gear (24) are meshed.

3. The rotation mechanism of the semiconductor wafer process tank according to claim 2, wherein: A plurality of bearing seats (25) are provided on the bracket (1), and the first long axis (21) and the second long axis (23) are fixedly inserted into the bearing seats (25).

4. The rotating mechanism of the semiconductor wafer processing tank according to claim 3, wherein: There are three bearing seats (25), which are respectively a first bearing seat (251), a second bearing seat (252) and a third bearing seat (253). The first bearing seat (251) is arranged at one end of the second long axis (23) away from the driving wheel (32) and is connected to the bracket (1). The second bearing seat (252) and the third bearing seat (253) are respectively arranged at two ends of the first long axis (21) and are connected to the bracket (1).

5. The rotating mechanism of the semiconductor wafer processing tank according to claim 1, wherein: The output end of the driving mechanism (2) is coaxially connected to the driving wheel (32).

6. The rotating mechanism of the semiconductor wafer process tank according to claim 5, wherein: The output end of the driving mechanism (2) is provided with a coupling, and the coupling is connected to the driving wheel (32).

7. The rotating mechanism of the semiconductor wafer process tank according to any one of claims 1 to 6, characterized in that: A plurality of driven wheels (33) are provided, and adjacent driven wheels (33) are arranged up and down and mesh with each other. The number of driven wheels (33) is positively correlated with the depth of the process groove. The driven wheel (33) located at the bottom of the bracket (1) is connected to the lifting mechanism (4).

8. The rotating mechanism of the semiconductor wafer process tank according to claim 7, wherein: The lifting mechanism (4) includes a cam (41), one end of the cam (41) is connected to the driven wheel (33), and the other end is provided with a mounting seat (42), and the mounting seat (42) is arranged on the bottom wall of the process tank.

9. The rotating mechanism of the semiconductor wafer processing tank according to claim 8, wherein: The circumferential side of the cam (41) is provided with small teeth (411) extending along the axial direction thereof, and a plurality of small teeth (411) are provided, and the plurality of small teeth (411) are arranged at intervals along the circumference of the cam (41).

10. The rotating mechanism of the semiconductor wafer process tank according to any one of claims 1 to 6, characterized in that: The transmission mechanism (3) is made of polytetrafluoroethylene material.

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