Substrate positioning structure

Abstract

The utility model provides a substrate positioning structure. The substrate positioning structure comprises a substrate; the mold is arranged opposite to the base plate, and a connecting area is arranged on the side, facing the base plate, of the mold; a plurality of first connecting pieces are fixedly arranged in the connecting area, the first connecting pieces extend towards the direction where the substrate is located, the first connecting pieces correspond to the second connecting pieces in a one-to-one mode, and the positions close to the connecting positions of the first connecting pieces and the second connecting pieces are filled with scaling powder; according to the invention, the corresponding structures between the first connecting piece and the second connecting piece are stably positioned, and the dislocation between the first connecting piece and the second connecting piece caused by material transportation vibration, large and abnormal vibration value in the furnace and slight collision caused by non-standard material loading and taking can be avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of wafers, and in particular relates to a substrate positioning structure. Background Art

[0002] In existing technology, vibrations from material transport in front of the furnace, abnormally high vibrations within the furnace, and minor collisions from improper loading and unloading can cause overall mold misalignment. Before the reflow soldering operation is complete, the positioning is solely determined by the weak adhesive force of the flux, which can be widely affected by irregular external forces.

[0003] To address the above issues, no effective solutions have been proposed so far.

[0004] It should be noted that the above technical background is merely for the purpose of providing a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. It should not be assumed that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present invention. Utility Model Content

[0005] The purpose of this application is to provide a substrate positioning structure to solve the above problems.

[0006] The present application provides a substrate positioning structure, comprising:

[0007] substrate;

[0008] a mold disposed opposite to the substrate, wherein a connection area is provided on a side of the mold facing the substrate;

[0009] A plurality of first connecting members are fixedly provided in the connection area, the plurality of first connecting members extend toward the direction where the substrate is located, and the plurality of first connecting members correspond one-to-one with the plurality of second connecting members, and solder flux is filled near the connection points between the plurality of first connecting members and the plurality of second connecting members;

[0010] Among them, multiple positioning parts are provided on the connection area on the mold, multiple positioning grooves are opened on the substrate, multiple positioning parts extend toward the direction of the substrate, and multiple positioning parts all extend into the corresponding positioning grooves for positioning the mold and the substrate.

[0011] Preferably, the plurality of first connecting members are evenly distributed.

[0012] Preferably, a head is provided at one end of the positioning member away from the mold, and an outer wall of the head is arc-shaped.

[0013] Preferably, the end of the positioning groove away from the substrate is set as the first side, the end of the positioning groove close to the substrate is set as the second side, and the outer diameter of the first side decreases linearly toward the second side.

[0014] Preferably, the minimum outer diameter of the head is larger than the second side outer diameter, and the minimum outer diameter of the head is smaller than the first side outer diameter.

[0015] Preferably, the plurality of positioning members are installed on the mold by a five-point distribution method.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. The utility model extends multiple first connecting members to positions close to multiple second connecting members, and the multiple first connecting members maintain a one-to-one correspondence with the multiple second connecting members. A flux is set at the position corresponding to any first connecting member and the second connecting member. During the extension of the positioning member, it can be extended to the positioning member to penetrate into the positioning groove, so that the corresponding structures between the first connecting member and the second connecting member can stably complete the positioning, and can avoid the misalignment between the first connecting member and the second connecting member caused by material transportation vibration, abnormal large vibration value in the furnace, and slight collision due to irregular loading and unloading.

[0018] 2. The utility model provides a head at one end of the positioning piece away from the mold, and the outer wall of the head is arc-shaped. The arc-shaped head is in contact with the inner wall of the positioning groove, so that the positioning piece and the positioning groove can maintain the stability of the contact part structure when they conflict with each other, thereby avoiding the rupture of the inner wall of the positioning groove in the event of extrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 This is an overall structural diagram of a substrate positioning structure provided in an embodiment of the present application.

[0021] In the figure: 1, substrate; 11, second connecting member; 12, positioning groove; 121, first side; 122, second side; 2, mold; 21, connection area; 211, first connecting member; 212, positioning member; 2121, head. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0023] In the description of the present invention, it should be noted that the terms "upper", "middle", "lower", "inside", "outside", "front", "back", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention. The terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following describes the implementation of the present invention based on its overall structure.

[0024] Reference Figure 1 As shown, an embodiment of the present application provides a substrate positioning structure, including:

[0025] substrate1;

[0026] A mold 2 is disposed opposite to the substrate 1, and a connection area 21 is provided on the side of the mold 2 facing the substrate 1;

[0027] A plurality of first connectors 211 are fixedly provided in the connection area 21. The plurality of first connectors 211 extend toward the substrate 1. The plurality of first connectors 211 correspond one-to-one with the plurality of second connectors 11. Furthermore, solder flux is filled near the connection points between the plurality of first connectors 211 and the plurality of second connectors 11.

[0028] Among them, multiple positioning parts 212 are provided on the connection area on the mold 2, multiple positioning grooves 12 are opened on the substrate 1, multiple positioning parts 212 extend toward the direction of the substrate 2, and multiple positioning parts 212 all extend into the corresponding positioning grooves 12 for positioning the mold 2 and the substrate 1.

[0029] according to Figure 1 , those skilled in the art can set the substrate 1 and the mold 2 for connection and positioning. Specifically, the mold 2 can be moved toward the substrate 1 so that the first connecting member 211 and the second connecting member 11 are in conflict, completing the preliminary positioning of the substrate and the mold 2.

[0030] In a specific configuration, a person skilled in the art may provide a connection region 21 on the side of the mold 2 facing the substrate 1. The connection region 21 is provided with a plurality of first connectors 211, and the plurality of first connectors 211 all extend toward the direction where the substrate 1 is located and extend to positions corresponding to the plurality of second connectors 11.

[0031] In one embodiment, the plurality of first connectors 211 extend to positions close to the plurality of second connectors 11, and the plurality of first connectors 211 maintain a one-to-one correspondence with the plurality of second connectors 11. Furthermore, a person skilled in the art can place soldering flux at positions corresponding to any of the first connectors 211 and the second connectors 11. Specifically, the soldering flux can be filled to the positions corresponding to any of the first connectors 211 and the second connectors 11.

[0032] The above arrangement can connect the first connecting member 211 with the second connecting member 11 . To further solve the positioning problem during connection and the stability problem of the connection, those skilled in the art can set a structure in which the positioning member 212 cooperates with the positioning groove 12 .

[0033] Specifically, those skilled in the art further provide a positioning member 212 in the connection area 21 of the mold 2, and the extending direction of the positioning member 212 is the same as the extending direction of the first connecting member 211. In this embodiment, the extending length of the positioning member 212 can be set to be greater than the extending length of the first connecting member 211.

[0034] With the above structure, during the extension process of the positioning member 212, the positioning member 212 can be extended until it is inserted into the positioning groove 12. It is understood that after being inserted into the positioning groove 12, the positioning member 212 will not be inserted out of the positioning groove 12, and the end of the positioning member 212 away from the mold 2 will contact the inner wall of the positioning groove 12.

[0035] In the above structure, those skilled in the art may set a plurality of positioning members 212 on the connection region 21, that is, set a plurality of positioning grooves 12 at corresponding positions on the substrate 1. It is understood that the plurality of positioning members 212 set on the connection region 21 will not interfere with the plurality of first connecting members 211.

[0036] With the above structure, the positioning member 212 can cooperate with the positioning groove 12 during the connection between the first connecting member 211 and the second connecting member 11, thereby completing the positioning of the substrate 1 and the mold 2 when the first connecting member 211 and the second connecting member 11 are close to each other.

[0037] It is understood that during the above process, when those skilled in the art position the base 1 and the mold 2, the positioning member 212 is close to the inner wall of the positioning groove 12. When the first connecting member 211 and the second connecting member 11 reach the preset position, the positioning member 212 contacts the inner wall of the positioning groove 12.

[0038] The above-mentioned structure in which the positioning piece 212 and the positioning groove 12 are arranged on the mold 2 can stably complete the positioning of the corresponding structures between the first connecting piece 211 and the second connecting piece 11, and can avoid the misalignment between the first connecting piece 211 and the second connecting piece 11 caused by material transportation vibration, abnormal large vibration value in the furnace and slight collision due to irregular loading and unloading of materials.

[0039] In the above arrangement structure, preferably, the plurality of first connecting members 211 are evenly distributed, that is, the distance between any first connecting member 211 and the adjacent first connecting members 211 arranged in the connection area 21 of the mold 2 is kept equal.

[0040] With the above structure, the flux filled between the first connector 211 and the corresponding second connector 11 can be evenly distributed, which can effectively prevent misalignment between the substrate 1 and the mold 2 caused by uneven thickness of the flux.

[0041] In the above arrangement, the plurality of positioning members 212 and the plurality of first connecting members 211 do not interfere with each other. That is, in this embodiment, the plurality of first connecting members 211 are evenly distributed, and the plurality of positioning members 212 are arranged in the gaps between the plurality of first connecting members 211 .

[0042] It is understandable that, in the above configuration, the number of the plurality of positioning members 212 is not fixed and is set according to the actual positioning effect.

[0043] In the above arrangement, the end of the positioning member 212 away from the mold 2 contacts the inner wall of the positioning groove 12. Preferably, the end of the positioning member 212 away from the mold 2 is provided with a head 2121, and the outer wall of the head 2121 is arc-shaped. That is, in this embodiment, those skilled in the art can configure the head 2121 of the positioning member 212 to be arc-shaped, and the arc-shaped head 2121 maintains contact with the inner wall of the positioning groove 12.

[0044] The structure in which the arc-shaped head 2121 maintains contact with the inner wall of the positioning groove 12 can ensure that the positioning member 212 and the positioning groove 12 maintain the stability of the contact part structure when they conflict with each other, thereby avoiding the inner wall of the positioning groove 12 from breaking when extrusion occurs.

[0045] In the specific setting of the positioning groove 12, preferably, the end of the positioning groove 12 away from the substrate is set as the first side 121, the end of the positioning groove 12 close to the substrate is set as the second side 122, and the outer diameter of the first side 121 decreases linearly toward the outer diameter of the second side 122.

[0046] In this embodiment, the positioning groove 12 can be positioned upward toward the mold 2 and downward away from the mold 2. That is, the positioning groove 12 is shaped like a cone with a larger outer diameter at the top than at the bottom. In the above configuration, the first side 121 is positioned upward, and the second side 122 is positioned downward. More preferably, the minimum outer diameter of the head 2121 is greater than the outer diameter of the second side 122, and the minimum outer diameter of the head 2121 is smaller than the outer diameter of the first side 121.

[0047] With the above structure, the head 2121 of the positioning member 212 can be inserted into the positioning groove 12 without passing out of the positioning groove 12 , thereby stably forming a structure in which the head 2121 of the positioning member 212 contacts the inner wall of the positioning groove 12 .

[0048] In an optional embodiment, preferably, multiple positioning members 212 are installed on the mold 2 using a five-point distribution method. That is, positioning members 212 are provided at the four corners and the middle of the outer wall of the connection area 21, thereby effectively and accurately positioning the mold 2 and the substrate 1.

[0049] Although different specific embodiments are mentioned in this application, this application is not limited to the situations described in industry standards or embodiments. Some industry standards or slightly modified implementations based on customized methods or implementations described in the embodiments can also achieve the same, equivalent, or similar implementation effects as the above embodiments, or predictable implementation effects after modification. Examples that apply these modified or modified data acquisition, processing, output, judgment methods, etc. can still fall within the scope of optional implementation schemes of this application.

[0050] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and variations to the present application without departing from the spirit of the present application. It is intended that the appended embodiments include these modifications and variations without departing from the present application.

Claims

1. A substrate positioning structure, characterized in that: include: substrate; a mold disposed opposite to the substrate, wherein a connection area is provided on a side of the mold facing the substrate; A plurality of first connecting members are fixedly provided in the connection area, the plurality of first connecting members extend toward the direction where the substrate is located, and the plurality of first connecting members correspond one-to-one with the plurality of second connecting members, and solder flux is filled near the connection points between the plurality of first connecting members and the plurality of second connecting members; Among them, multiple positioning parts are provided on the connection area on the mold, multiple positioning grooves are opened on the substrate, multiple positioning parts extend toward the direction of the substrate, and multiple positioning parts all extend into the corresponding positioning grooves for positioning the mold and the substrate.

2. The substrate positioning structure according to claim 1, wherein: The plurality of first connecting members are evenly distributed.

3. The substrate positioning structure according to claim 1, wherein: A head is provided at one end of the positioning member away from the mold, and an outer wall of the head is arc-shaped.

4. The substrate positioning structure according to claim 3, wherein: An end of the positioning groove away from the substrate is set as a first side, and an end of the positioning groove close to the substrate is set as a second side. The outer diameter of the first side decreases linearly toward the second side.

5. The substrate positioning structure according to claim 4, wherein: The minimum outer diameter of the head is greater than the second side outer diameter, and the minimum outer diameter of the head is smaller than the first side outer diameter.

6. The substrate positioning structure according to claim 1, wherein: The plurality of positioning members are installed on the mold by a five-point distribution method.

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