Chip split positioning device

Abstract

The utility model discloses a chip split positioning device, which relates to the technical field of chip positioning devices, and comprises a positioning tray consisting of a tray main body, a handle part, a stacking boss, a positioning groove, a through notch and a stacking groove, the inner side of the stacking groove is provided with a pressing assembly, and the pressing assembly is used for pressing the stacking boss and the through notch when the two positioning trays are stacked. And limiting and pressing operation is performed on the upper surface of the chip on the inner side of the lower positioning groove. According to the utility model, through the arrangement of the pressing assembly, when the positioning trays are stacked and placed, the upper elastic pressing sheet exerts a downward extrusion force on the lower chip, so that the chip is pressed, and the situation that the chip shakes and collides in the transferring process is effectively avoided; through deformation and bending of the elastic pressing sheet, the pressing device can adapt to pressing operation of chips with different heights, and the universality is high.

Description

Technical Field

[0001] The utility model relates to the technical field of chip positioning devices, in particular to a split chip positioning device. Background Art

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is often part of a computer or other electronic device. It is divided from a wafer.

[0003] During the chip processing and production process, the transfer of chips between various processes requires the use of an IC positioning tray for coordinated operation. The IC positioning tray is formed with grooves that match the chips to achieve independent placement of batches of chips, which can effectively prevent static electricity from touching the chips and play a good protective role.

[0004] However, during actual use of the IC positioning tray, there is still a slight difference between the size of the groove on the IC positioning tray and the size of the chip, that is, the inner wall size of the groove is slightly larger than the chip size. Although the chip will not shake when the IC positioning tray is transported by a conveying device, when the IC positioning tray is transferred by a manual transfer device (such as a cart), the chip will shake and collide in the groove, which will cause damage to the chip. In order to avoid this situation, a chip split positioning device is provided. Summary of the Invention

[0005] The purpose of the present utility model is to provide a chip split positioning device in order to solve the above-mentioned background problems.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip split positioning device, comprising a positioning tray consisting of a tray body, a handle portion, a stacking boss, a positioning groove, a through-notch, and a stacking groove, wherein the handle portion is symmetrically fixed to both sides of the outer wall of the tray body, the stacking boss is fixed to the top of the tray body, a plurality of positioning grooves are provided, and the plurality of positioning grooves are distributed in a matrix and are opened on the top of the stacking boss and extend through to the inside of the tray body, the through-notch is opened at the bottom of the positioning groove and passes through to the bottom of the tray body, the stacking groove is opened at the bottom of the tray body and is connected to the plurality of through-notches, and a pressing assembly is provided on the inner side of the stacking groove, and the pressing assembly is used to form a limiting pressing operation on the upper surface of the chip inside the lower positioning groove when two positioning trays are stacked;

[0007] The pressing assembly includes a top plate, an opening groove, and an elastic pressing piece;

[0008] The top plate is clamped to the inner side of the stacking slot, the open slot is opened at the top of the top plate and passes through the bottom of the top plate, the number of the open slots matches the number of the through slots, and the positions of the open slots correspond to the through slots one by one;

[0009] The elastic pressing plates are symmetrically fixed on both sides of the inner wall of the opening groove and are tilted downward. When two positioning trays are stacked, the bottom ends of the elastic pressing plates contact the upper surface of the chips below to achieve limited pressing of the chips.

[0010] As a further solution of the present invention: the outer sides of the top plate are further formed with rectangular snap-fitting folds, the vertical cross-section of the rectangular snap-fitting folds is "concave" and the side of the rectangular snap-fitting folds away from the top plate is formed with an arc-shaped protrusion;

[0011] A rectangular slot is provided on the inner wall side of the stacking slot, which is engaged with the inner side of the stacking slot through an arc-shaped protrusion to achieve position limiting and fixing of the top plate.

[0012] As a further solution of the present invention: the length, width and height of the concave structure composed of the top plate and the rectangular snap-fit folding edge respectively match the length, width and height of the stacking boss.

[0013] As a further solution of the present invention: the horizontal height of the lower surface of the rectangular snap-fit folded edge and the bottom end of the elastic pressing piece is higher than the horizontal height of the lower surface of the tray body.

[0014] As a further solution of the present invention: the tray body, handle, stacking boss, positioning groove, through-notch, stacking slot, and rectangular slot are integrally formed by injection molding;

[0015] The top plate, the rectangular snap-fitting folding edge, the opening groove and the elastic pressing sheet are integrally formed by an injection molding process.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] By setting up a clamping assembly, when the positioning tray is stacked, the upper elastic pressure plate exerts a downward squeezing force on the chip below, so that the chip is compressed, effectively preventing the chip from shaking and colliding during the transfer process. In addition, the deformation and bending of the elastic pressure plate can adapt to the clamping operation of chips at different heights, and it has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the utility model;

[0019] Figure 2 This is a structural sectional view of the utility model;

[0020] Figure 3 For the utility model Figure 2 A magnified view of position A in the middle;

[0021] Figure 4 This is a sectional exploded view of the present utility model;

[0022] Figure 5 This is a bottom view of the bottom structure of the positioning tray of the present invention.

[0023] In the figure: 1. Positioning tray; 101. Tray body; 102. Handle; 103. Stacking boss; 104. Positioning groove; 105. Through-slot; 106. Stacking slot; 107. Rectangular slot; 2. Clamping assembly; 201. Top plate; 202. Rectangular snap-fit fold; 203. Opening slot; 204. Elastic pressing piece. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figures 1 to 5 104 , a plurality of positioning grooves 104 are provided on the top of the tray body 101 , and the plurality of positioning grooves 104 are arranged on the top of the stacking boss 103 and extend into the interior of the tray body 101 . The through notch 105 is arranged at the bottom of the positioning groove 104 and extends into the bottom of the tray body 101 . The stacking groove 106 is arranged at the bottom of the tray body 101 and communicates with the plurality of through notches 105 . A pressing assembly 2 is provided on the inner side of the stacking groove 106 . The pressing assembly 2 is used to form a limited pressing operation on the upper surface of the chip inside the lower positioning groove 104 when two positioning trays 1 are stacked.

[0026] The pressing assembly 2 includes a top plate 201, an opening slot 203, and an elastic pressing piece 204;

[0027] The top plate 201 is snapped onto the inner side of the stacking slot 106. The opening slot 203 is opened at the top of the top plate 201 and passes through the bottom of the top plate 201. The number of the opening slots 203 matches the number of the through slots 105, and the positions of the opening slots 203 correspond one-to-one with the through slots 105.

[0028] The elastic pressing pieces 204 are symmetrically fixed on both sides of the inner wall of the opening slot 203 and are tilted downward. When two positioning trays 1 are stacked, the bottom end of the elastic pressing piece 204 contacts the upper surface of the chip below to achieve limited pressing of the chip.

[0029] A rectangular snap-fitting fold 202 is formed on the outer sides of the top plate 201. The vertical cross-section of the rectangular snap-fitting fold 202 is concave and an arc-shaped protrusion is formed on the side of the rectangular snap-fitting fold 202 away from the top plate 201.

[0030] A rectangular slot 107 is provided on the inner wall of the stacking slot 106, which is engaged with the inner side of the stacking slot 106 through an arc-shaped protrusion to achieve position fixing of the top plate 201;

[0031] The length, width and height of the concave structure formed by the top plate 201 and the rectangular snap-fitting folded edge 202 respectively match the length, width and height of the stacking boss 103 .

[0032] In this embodiment, multiple positioning grooves 104 can be used to realize independent positioning and placement of batches of chips, and then multiple positioning trays 1 are stacked to reduce the space occupied by storage and transfer.

[0033] By holding the handle 102, lift the positioning tray 1 as a whole and transfer it to the top of another positioning tray 1, and align the concave structure composed of the top plate 201 and the rectangular snap-fit fold 202 with the stacking protrusion 102 of the other positioning tray 1, so that the inner side of the rectangular snap-fit fold 202 is sleeved on the outer side of the stacking protrusion 102, so that the two positioning trays 1 are stacked;

[0034] During this process, the bottom end of the upper elastic pressing sheet 204 will contact the upper surface of the chip in the lower positioning groove 104. As the two positioning trays 1 approach, the elastic pressing sheet 204 will be deformed and bent upward under the force. The corresponding elastic pressing sheet 204 has a downward squeezing force on the chip, so that the chip is pressed tightly, effectively preventing the chip from shaking and colliding during the transfer process. In addition, the deformation and bending of the elastic pressing sheet 204 can adapt to the chip pressing operation of different heights (it should be noted that the chip on the top positioning tray 1 can be pressed by placing an empty positioning tray 1).

[0035] Please refer to Figures 1 to 4 The lower surface of the rectangular snap-fitting folded edge 202 and the bottom end of the elastic pressing piece 204 are higher than the lower surface of the tray body 101 .

[0036] In this embodiment, this structure can ensure that the pressing assembly 2 does not affect the daily placement and transportation operations of the positioning tray 1.

[0037] Please refer to Figures 1 to 5The tray body 101, the handle 102, the stacking boss 103, the positioning groove 104, the through-notch 105, the stacking groove 106, and the rectangular slot 107 are integrally formed by an injection molding process;

[0038] The top plate 201 , the rectangular snap-fitting fold 202 , the opening groove 203 , and the elastic pressing piece 204 are integrally formed by an injection molding process.

[0039] In this embodiment: by independently forming the positioning tray 1 and the clamping assembly 2 and then assembling them, it is convenient to improve the production based on the existing tray. In addition, after the elastic force of the elastic pressing piece 204 is weakened, the clamping assembly 2 can be replaced independently, which is convenient for maintenance.

[0040] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip split positioning device, comprising a positioning tray (1) consisting of a tray body (101), a handle (102), a stacking boss (103), a positioning groove (104), a through slot (105), and a stacking slot (106), wherein the handle (102) is symmetrically fixed on both sides of the outer wall of the tray body (101), the stacking boss (103) is fixed on the top of the tray body (101), a plurality of positioning grooves (104) are provided, and the plurality of positioning grooves (104) are arranged in a matrix and opened on the top of the stacking boss (103) and extend through to the inside of the tray body (101), the through slot (105) is opened at the bottom of the positioning groove (104) and passes through to the bottom of the tray body (101), and the stacking slot (106) is opened at the bottom of the tray body (101) and communicated with the plurality of through slots (105), characterized in that: A pressing assembly (2) is provided on the inner side of the stacking groove (106), and the pressing assembly (2) is used to perform a limiting pressing operation on the upper surface of the chip inside the lower positioning groove (104) when two positioning trays (1) are stacked; The pressing assembly (2) comprises a top plate (201), an opening groove (203), and an elastic pressing piece (204); The top plate (201) is clamped to the inner side of the stacking groove (106), the opening groove (203) is opened at the top of the top plate (201) and passes through the bottom of the top plate (201), the number of the opening grooves (203) matches the number of the through-notches (105), and the positions of the opening grooves (203) correspond one-to-one to the through-notches (105); The elastic pressing piece (204) is symmetrically fixed on both sides of the inner wall of the opening groove (203) and is tilted downward. When two positioning trays (1) are stacked, the bottom end of the elastic pressing piece (204) contacts the upper surface of the chip below, thereby achieving limited pressing of the chip.

2. A chip split positioning device according to claim 1, characterized in that: The top plate (201) is further formed with rectangular snap-fit folding edges (202) on the outer sides thereof, wherein the vertical cross-section of the rectangular snap-fit folding edge (202) is concave, and an arc-shaped convex portion is formed on the side of the rectangular snap-fit folding edge (202) away from the top plate (201); A rectangular slot (107) is provided on the inner wall side of the stacking slot (106), which is engaged with the inner side of the stacking slot (106) via an arc-shaped protrusion to achieve position limiting and fixing of the top plate (201).

3. A chip split positioning device according to claim 2, characterized in that: The length, width and height of the concave structure formed by the top plate (201) and the rectangular snap-fit folding edge (202) respectively match the length, width and height of the stacking boss (103).

4. The chip split positioning device according to claim 2, characterized in that: The lower surface of the rectangular snap-fit folding edge (202) and the bottom end of the elastic pressing piece (204) are higher than the lower surface of the tray body (101).

5. The chip split positioning device according to claim 2, characterized in that: The tray body (101), the handle portion (102), the stacking boss (103), the positioning groove (104), the through-notch (105), the stacking groove (106), and the rectangular slot (107) are integrally formed by an injection molding process; The top plate (201), the rectangular snap-fitting fold (202), the opening groove (203), and the elastic pressing sheet (204) are integrally formed by an injection molding process.

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