Handheld wafer adsorption device

Abstract

The application relates to a hand-held wafer adsorption device, comprising: a ventilation assembly comprising a ventilation housing and a switch member, the ventilation housing having a ventilation channel communicated with an external air source, the ventilation housing comprising a handle portion and a connection housing connected with two ends of the handle portion, the switch member being arranged on the handle portion and being used for opening or closing the ventilation channel; the adsorption assembly is arranged below the handle part, the two ends of the adsorption assembly are connected with the connecting shell, the adsorption assembly is provided with an air outlet channel and two sets of air outlets distributed in the two sides of the adsorption assembly in the axis direction, the two sets of air outlets communicate with the air outlet channel, the two sets of air outlets are evenly arranged at intervals, and airflow is blown out from the two sets of air outlets towards the two sides of the adsorption assembly. As the whole device is in a handheld design, compared with a traditional large-scale fixing device, the convenience and the working efficiency of moving wafers among different stations by operators are greatly improved.

Description

Technical field

[0001] The present application relates to a handheld wafer adsorption device, belonging to the field of wafer processing technology. [Background Technology]

[0002] In semiconductor manufacturing, wafer handling and processing are crucial. Traditional wafer handling methods typically use mechanical clamping or vacuum chucks, but these methods have limitations. For example, mechanical clamping can damage the wafer's edges, impacting wafer quality and performance. Vacuum chucks must form a good seal with the wafer surface, but minor imperfections or unevenness on the wafer surface can result in a poor seal, impacting the stability and reliability of the suction process.

[0003] In actual wafer production and processing scenarios, operators often need to move wafers between different workstations for inspection, cleaning, etching and other operations. For example, in the wafer inspection process, operators need to quickly and accurately transfer wafers from one inspection platform to another for inspection of different projects. If traditional handling tools are used, not only will the operation be cumbersome, but it will also easily damage the wafers, affecting the accuracy of the test results. During the wafer cleaning process, wafers need to be frequently placed in and out of the cleaning tank. Traditional handling methods are difficult to meet the needs of operators for flexible operation, high precision, and damage-free wafer handling.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. [Utility Model Content]

[0005] In view of this, the present invention provides a handheld wafer suction device to solve at least one problem in the background technology, including:

[0006] A vent assembly comprising a vent housing and a switch member, wherein the vent housing has a vent passage communicating with an external air source, the vent housing comprises a handle portion and a connecting housing connected to both ends of the handle portion, and the switch member is disposed on the handle portion for opening or closing the vent passage;

[0007] The adsorption component is arranged below the handle portion, and its two ends are respectively connected to the connecting shell. The adsorption component has an air outlet channel and two groups of air outlets distributed on both sides of the axial direction of the adsorption component. The two groups of air outlets are connected to the air outlet channel, and each group of air outlets is evenly spaced. The air flow is blown out from the two groups of air outlets toward both sides of the adsorption component.

[0008] Optionally, in the above-mentioned handheld wafer adsorption device, the adsorption component includes a conveying component and a connecting plate having an open end and a closed end, the air outlet channel is arranged on the conveying component, the conveying component is connected to the ventilation channel through the open end, and the connecting plate is connected to the connecting shell.

[0009] Optionally, in the above-mentioned handheld wafer adsorption device, the bottom of the connecting plate has guide grooves arranged near the two groups of air outlets, and each of the guide grooves has an inclined guide surface;

[0010] The inclined guide surface is arranged to be inclined from inside to outside and from top to bottom.

[0011] Optionally, in the above-mentioned handheld wafer adsorption device, an angle is formed between the inclined guide surface and the horizontal plane, and the range of the angle is 20-40 degrees.

[0012] Optionally, in the above-mentioned handheld wafer adsorption device, the switch component includes a switch part installed in the ventilation channel and a fastener installed under the handle part, the switch part has a switch tube connected to the ventilation channel, and the fastener can move relative to the switch tube under the action of external force to open or close the switch tube.

[0013] Optionally, in the above-mentioned handheld wafer adsorption device, the fastener includes a connecting part and an operating part connected to the connecting part, and the end of the connecting part is hinged under the handle part to apply force to the operating part to open or close the switch tube.

[0014] Optionally, in the above-mentioned handheld wafer adsorption device, the operating portion has an initial state and an operating state;

[0015] In the initial state, the switch tube is closed, and the ventilation channel cannot allow air to pass through;

[0016] When in the operating state, the switch tube is open, and air flows through the ventilation channel;

[0017] Wherein, when the operating portion is in an initial state, the operating portion is tilted relative to a horizontal plane.

[0018] Optionally, in the above-mentioned handheld wafer adsorption device, the ventilation shell has a hollow cavity, and the hollow cavity serves as the ventilation channel.

[0019] Optionally, in the above-mentioned handheld wafer adsorption device, the ventilation component also includes a connecting pipe, the ventilation shell has a hollow cavity, the connecting pipe passes through the hollow cavity and is connected to the air outlet channel, and the ventilation channel is arranged in the connecting pipe.

[0020] Optionally, in the above-mentioned handheld wafer adsorption device, the handle portion is a vertically detachable structure.

[0021] Compared with the prior art, the present application has the following beneficial effects: by providing a ventilation assembly, including a ventilation housing with a ventilation channel and a switch member that can control the opening and closing of the ventilation channel, the operator can conveniently start or stop the airflow supply at any time through the switch member on the handle, which greatly improves the flexibility and controllability of the operation; in addition, the adsorption assembly is arranged below the handle and has an air outlet channel and two groups of air outlets distributed on both sides of the axial direction. The airflow is blown out from the two groups of air outlets toward both sides of the adsorption assembly. This design makes the wafer evenly stressed during the adsorption process, avoiding deformation or damage to the wafer that may be caused by single-point adsorption, thereby effectively ensuring the integrity and quality of the wafer; each group of air outlets is evenly spaced, which helps to form a stable and uniform airflow field on the surface of the wafer, further enhancing the stability and reliability of adsorption, and ensuring stable adsorption even if there are minor unevenness or defects on the surface of the wafer. On the other hand, since the entire device is a handheld design, compared with traditional large-scale fixed devices, it greatly improves the convenience and work efficiency of operators in moving wafers between different workstations.

Brief Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the structure of the handheld wafer adsorption device shown in this application;

[0023] Figure 2 yes Figure 1 A schematic structural diagram of the handheld wafer adsorption device shown in another direction;

[0024] Figure 3 yes Figure 1 A cross-sectional schematic diagram of a handheld wafer adsorption device is shown;

[0025] Figure 4 yes Figure 1 The cross-sectional schematic diagram of the handheld wafer adsorption device in another direction is shown.

[0026] in,

[0027] 1-ventilation assembly, 11-ventilation housing, 111-ventilation channel, 112-handle, 113-connection housing, 114-hollow cavity, 12-switch member, 121-switch portion, 1211-switch tube, 122-fastener, 1221-connection portion, 1222-operation portion;

[0028] 2-adsorption component, 21-air outlet channel, 22-air outlet, 23-connecting plate, 231-open end, 232-closed end, 233-guide groove, 2331-inclined guide surface, 2332-angle, 24-conveying component. [Specific implementation method]

[0029] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] As used herein, the terms "comprise," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0031] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] See also Figures 1 to 4 As shown, a handheld wafer adsorption device shown in a preferred embodiment of the present application is used to adsorb wafers to drive the wafers to be transferred between various process flows. For example, the handheld wafer adsorption device shown in this embodiment can be used in wafer unloading, inspection, cleaning, etching and other processes.

[0033] The handheld wafer adsorption device comprises a ventilation assembly 1 and an adsorption assembly 2. The ventilation assembly 1 comprises a ventilation housing 11 and a switch 12. The ventilation housing 11 has a ventilation channel 111 connected to an external air source, and the switch 12 is used to open or close the ventilation channel 111. The adsorption assembly 2 comprises an outlet channel 21 and two groups of outlet ports 22 distributed on both sides of the adsorption assembly 2 in the axial direction. Both groups of outlet ports 22 are connected to the outlet channel 21, and each group of outlet ports 22 is evenly spaced. The airflow from the external source flows through the ventilation channel 111 into the outlet channel 21 and is then blown out from the two groups of outlet ports 22 toward both sides of the adsorption assembly 2. The airflow blown out from both sides has a high flow rate, resulting in a lower pressure near the outlet ports 22. The lower pressure forms a pressure difference with the higher pressure in other surrounding areas. The pressure difference can push the target wafer to the lower pressure area, so that the wafer is adsorbed by the adsorption device, and there is no contact between the wafer and the adsorption device, thereby achieving the purpose of adsorbing the wafer without damaging the wafer and achieving stable and reliable adsorption. It should be noted that, in this embodiment, the aperture of each air outlet 22 is 0.1-0.5 mm, and the double-sided air outlet 22 can ensure that the wafer is subjected to uniform and stable adsorption force during the adsorption process, thereby avoiding deformation or damage to the wafer that may be caused by single-point adsorption.

[0034] Furthermore, the ventilation housing 11 includes a handle 112 and a connecting housing 113 connected to both ends of the handle 112. The adsorption assembly 2 is disposed below the handle 112 and connected to the connecting housing 113 at both ends. The switch 12 is disposed on the handle 112, facilitating single-handed operation by the operator, and enabling precise control of the opening or closing of the ventilation channel 111. The switch 12 is convenient and sensitive to operation, and can quickly respond to the operator's instructions to instantly supply or cut off airflow.

[0035] Furthermore, the adsorption component 2 includes a conveying component 24 having an open end 231 and a closed end 232 and a connecting plate 23. The air outlet channel 21 and two groups of air outlets 22 are both arranged on the conveying component 24. The conveying component 24 is connected to the ventilation channel 111 through the open end 231 to ensure smooth transmission of the airflow. The connecting plate 23 is connected to the connecting shell 113 to ensure a firm connection between the adsorption component 2 and the ventilation component 1.

[0036] In this embodiment, the bottom of the connection plate 23 has two guide grooves 233, located near the two sets of air outlets 22. Each guide groove 233 has an inclined guide surface 2331. These inclined guide surfaces 2331 are arranged to tilt from the inside out and from top to bottom, effectively guiding the airflow and optimizing the adsorption effect. Specifically, the inclined guide surface 2331 forms an angle 2332 with the horizontal plane, and the angle 2332 ranges from 20 to 40 degrees. This ensures the airflow guidance effect while minimizing airflow resistance and improving adsorption efficiency.

[0037] As described above, the switch member 12 includes a switch portion 121 installed in the ventilation channel 111 and a fastener 122 installed below the handle portion 112. The switch portion 121 has a switch tube 1211 connected to the ventilation channel 111. The fastener 122 can move relative to the switch tube 1211 under the action of external force to open or close the switch tube 1211.

[0038] Fastener 122 includes a connecting portion 1221 and an operating portion 1222 connected to connecting portion 1221. The end of connecting portion 1221 is hinged below handle portion 112, allowing for flexible movement of operating portion 1222. By applying force to operating portion 1222, the operator can easily open or close switch tube 1211, thereby opening or closing the entire ventilation channel 111.

[0039] Specifically, the operating portion 1222 has an initial state and an operating state. When the operating portion 1222 is in the initial state, the switch tube 1211 is closed, and the ventilation channel 111 cannot pass air through. In other words, the entire adsorption device is in an inoperative state. When the operating portion 1222 is in the operating state, the switch tube 1211 is opened, and air flows through the ventilation channel 111. The adsorption device is in an operational state and can complete adsorption of wafers.

[0040] It is worth noting that when the operating portion 1222 is in the initial state, the operating portion 1222 is tilted relative to the horizontal plane. The purpose of this setting is to conform to human operating habits and prevent accidental opening of the airflow due to accidental touch.

[0041] In one embodiment, the vent assembly 1 further includes a connecting pipe (not shown). The vent housing 11 has a hollow cavity 114. A connecting pipe passes through the hollow cavity 114 and communicates with the air outlet channel 21. The air outlet channel 111 is disposed within the connecting pipe. Airflow delivered through the connecting pipe ensures sealing and prevents air leakage.

[0042] In this embodiment, the handle portion 112 is a detachable structure. The detachable design facilitates the installation, removal, maintenance, repair and replacement of the connecting pipe, reduces the maintenance cost of the device and extends its service life.

[0043] In another embodiment, the ventilation housing 11 has a hollow cavity 114, and the hollow cavity 114 serves as the ventilation channel 111, which has a simple structure and reduces the weight of the entire device, thereby reducing the weight on the operator when holding it.

[0044] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A handheld wafer adsorption device, characterized in that: include: A vent assembly comprising a vent housing and a switch member, wherein the vent housing has a vent passage communicating with an external air source, the vent housing comprises a handle portion and a connecting housing connected to both ends of the handle portion, and the switch member is disposed on the handle portion for opening or closing the vent passage; The adsorption component is arranged below the handle portion, and its two ends are respectively connected to the connecting shell. The adsorption component has an air outlet channel and two groups of air outlets distributed on both sides of the axial direction of the adsorption component. The two groups of air outlets are connected to the air outlet channel, and each group of air outlets is evenly spaced. The air flow is blown out from the two groups of air outlets toward both sides of the adsorption component.

2. The handheld wafer adsorption device according to claim 1, characterized in that: The adsorption assembly includes a conveying component with an open end and a closed end and a connecting plate. The air outlet channel is provided on the conveying component. The conveying component is connected to the ventilation channel through the open end. The connecting plate is connected to the connecting shell.

3. The handheld wafer adsorption device according to claim 2, characterized in that: The bottom of the connecting plate is provided with guide grooves arranged near the two groups of air outlets, and each guide groove has an inclined guide surface; The inclined guide surface is arranged to be inclined from inside to outside and from top to bottom.

4. The handheld wafer adsorption device according to claim 3, characterized in that: An included angle is formed between the inclined guide surface and the horizontal plane, and the range of the included angle is 20-40 degrees.

5. The handheld wafer adsorption device according to claim 1, characterized in that: The switch component includes a switch portion installed in the ventilation channel and a fastener installed below the handle portion. The switch portion has a switch tube connected to the ventilation channel. The fastener can move relative to the switch tube under the action of external force to open or close the switch tube.

6. The handheld wafer adsorption device according to claim 5, characterized in that: The fastener includes a connecting portion and an operating portion connected to the connecting portion. The end of the connecting portion is hinged below the handle portion, and a force is applied to the operating portion to open or close the switch tube.

7. The handheld wafer adsorption device according to claim 6, characterized in that: The operating portion has an initial state and an operating state; In the initial state, the switch tube is closed, and the ventilation channel cannot allow air to pass through; When in the operating state, the switch tube is open, and air flows through the ventilation channel; Wherein, when the operating portion is in an initial state, the operating portion is tilted relative to a horizontal plane.

8. The handheld wafer adsorption device according to claim 1, characterized in that: The ventilation housing has a hollow cavity, and the hollow cavity serves as the ventilation channel.

9. The handheld wafer adsorption device according to claim 1, characterized in that: The ventilation assembly further includes a communication pipeline. The ventilation housing has a hollow cavity. The communication pipeline passes through the hollow cavity and is communicated with the air outlet channel. The ventilation channel is arranged in the communication pipeline.

10. The handheld wafer adsorption device according to claim 9, characterized in that: The handle portion is a detachable structure.

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