Electronic package
By forming openings on the packaging substrate and filling the conductive material connecting metal parts, the problems of difficulty in line layout and high cost in the prior art are solved, and a simplified ground connection is achieved.
Patent Information
- Application Number
- CN202422342341.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-16
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-25
AI Technical Summary
Existing semiconductor packages require grounding circuits within the packaging substrate and metal layers to be coated on the outer surface, resulting in difficult line layout, cumbersome process and high cost.
Passive elements are arranged on the packaging substrate, and the grounding end is exposed through the cladding layer, filled with conductive material and connected metal parts to avoid preset grounding lines and outer surface coating of metal layers in the substrate.
The line layout is simplified, the process is cumbersome and cost is reduced, and efficient grounding connection is achieved.
Smart Images
Figure CN223245602U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a semiconductor packaging process, and more particularly to an electronic packaging device. Background Art
[0002] With the rapid development of the electronics industry, most electronic products are moving towards miniaturization and high speed. In particular, the development of the communications industry has been widely integrated into various electronic products, such as cell phones and laptops.
[0003] Semiconductor packages currently used in mobile communication devices often have passive components such as capacitors installed on their package substrates to act as DC blocks to resist electrostatic discharge (ESD) and prevent instantaneous high-voltage static electricity from damaging the circuit.
[0004] However, the aforementioned semiconductor package requires a ground circuit to be designed in the package substrate and exposed to the package substrate. At the same time, a metal layer must be coated on the outer surface of the semiconductor package and extended to contact the ground circuit of the package substrate for electrical conduction.
[0005] Since the aforementioned semiconductor package requires a ground circuit to be preset in the package substrate and electrically connected to the metal layer coated on the outer surface, it not only causes circuit layout problems but also leads to complicated manufacturing processes and increased costs.
[0006] Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem that needs to be overcome urgently in the industry. Utility Model Content
[0007] In view of the various deficiencies of the above-mentioned prior art, the present application provides an electronic package, comprising: a substrate structure; a passive component, disposed on the substrate structure and having a first electrode terminal and a second electrode terminal relative to each other; a coating layer, formed on the substrate structure and covering the passive component, wherein the coating layer is formed with an opening for allowing the first electrode terminal of the passive component to be exposed from the coating layer; a conductive material, filled in the opening to electrically contact the first electrode terminal of the passive component; and a metal part, disposed on the coating layer and electrically contacting the conductive material.
[0008] The present application also provides a method for manufacturing an electronic package, comprising: setting a passive component on a substrate structure, wherein the passive component has a first electrode terminal and a second electrode terminal relative to each other; forming a coating layer covering the passive component on the substrate structure, wherein the coating layer is formed with an opening for allowing the first electrode terminal of the passive component to be exposed from the coating layer; filling the opening with a conductive material to electrically contact the first electrode terminal of the passive component; and setting a metal part on the coating layer to electrically contact the conductive material.
[0009] The aforementioned electronic package and its manufacturing method further include an electronic component disposed on the substrate structure and covered by the covering layer.
[0010] In the aforementioned electronic package and its manufacturing method, the first electrode terminal is a ground terminal, and the second electrode terminal is a power terminal.
[0011] In the aforementioned electronic package and its manufacturing method, the size of the opening is the same as the size of the first electrode terminal.
[0012] In the aforementioned electronic package and its manufacturing method, the metal component and the passive component are grounded via the conductive material.
[0013] In the aforementioned electronic package and its manufacturing method, the size of the opening varies according to its depth in the coating layer.
[0014] In the aforementioned electronic package and its manufacturing method, the conductive material has a first end and a second end opposite to each other, and the size of the first end is different from the size of the second end.
[0015] In the aforementioned electronic package and its manufacturing method, the first end portion electrically contacts the passive component, and the size of the first end portion is smaller than the size of the second end portion.
[0016] As can be seen from the above, the electronic package and its manufacturing method of the present application mainly configure electronic components and passive components on a substrate structure, then cover the electronic components and the passive components with a coating layer, and form an opening in the coating layer to expose the grounding end of the passive component, so as to form a conductive material electrically connected to the passive component in the opening, and then provide a metal part on the coating layer to electrically contact the conductive material. Accordingly, the metal part and the passive component (grounding end) can be connected through the conductive material without pre-setting a grounding circuit in the substrate structure and coating a metal layer on the outer surface of the electronic package, thereby avoiding problems such as circuit layout problems, complicated processes and high costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figures 1A to 1E It is a cross-sectional schematic diagram of the electronic package and its manufacturing method of the present application.
[0018] Figure 2This is a cross-sectional schematic diagram of a second embodiment of the electronic package of the present application.
[0019] Description of Reference Numerals
[0020] 1,2 Electronic packaging
[0021] 10 Substrate Structure
[0022] 11 Electronic components
[0023] 12 Passive Components
[0024] 121 first electrode terminal
[0025] 122 second electrode terminal
[0026] 13,23 Cladding
[0027] 130,230 openings
[0028] 14,24 Conductive materials
[0029] 15 Metal parts
[0030] 241 First End
[0031] 242 Second End
[0032] d1,d2 dimensions. DETAILED DESCRIPTION
[0033] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0034] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for understanding and reading by those skilled in the art, and are not used to limit the conditions for implementation of this application. Therefore, they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "on" and "a" quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation of this application. Changes or adjustments in their relative relationships should also be considered as the scope of implementation of this application without substantially changing the technical content.
[0035] See also Figures 1A to 1E , which is a cross-sectional schematic diagram of the method for manufacturing the electronic package of this application.
[0036] like Figure 1AAs shown, at least one electronic component 11 and at least one passive component 12 are placed and electrically connected on a substrate structure 10 .
[0037] The substrate structure 10 is, for example, a package substrate having a core layer and a circuit structure, or a coreless circuit structure including multiple circuit layers, such as a fan-out redistribution layer (RDL). It should be understood that the substrate structure 10 may also be other supporting structures for electronic components such as chips, such as a silicon interposer or a lead frame, and is not limited to the above.
[0038] The electronic component 11 is, for example, a semiconductor chip, which is mounted on the substrate structure 10 and can be electrically connected to the circuit layer of the substrate structure 10 via solder balls or bonding wires.
[0039] The passive component 12 is, for example, a capacitor, a resistor, or an inductor, and has a first electrode terminal 121 (for example, a ground terminal) and a second electrode terminal 122 (for example, a power terminal) relative to each other, and can be electrically connected to the circuit layer of the substrate structure 10 through solder material using surface mount technology (SMT).
[0040] like Figure 1B As shown, a coating layer 13 is formed on the substrate structure 10 to cover the electronic component 11 and the passive component 12 .
[0041] The coating layer 13 is an insulating material, such as polyimide (PI), dry film, or an encapsulant or molding compound such as epoxy. The coating layer 13 can be formed on the substrate structure 10 by a liquid compound, injection, lamination, or compression molding.
[0042] like Figure 1C As shown, an opening 130 is formed in the cladding layer 13 by, for example, laser drilling to expose the first electrode terminal 121 (ground terminal) of the passive component 12 , wherein the size of the opening 130 is the same as that of the first electrode terminal 121 .
[0043] like Figure 1D As shown, the opening 130 is filled with a conductive material 14 such as a conductive adhesive.
[0044] like Figure 1E As shown, a metal member 15 is disposed on the coating layer 13 and electrically contacts the conductive material 14 to produce the electronic package 1 of the present application. The conductive material 14 electrically connects the first electrode terminal 121 (ground terminal) of the passive component 12 to the metal member 15, thereby achieving a grounding effect for the metal member 15. Furthermore, the position of the conductive material 14 (opening 130) does not need to be completely fixed and can be within a certain range (to match the placement of the passive component 12), providing greater design flexibility.
[0045] Through the above-mentioned manufacturing method, the present application also discloses an electronic package 1, comprising a substrate structure 10, an electronic component 11 arranged on the substrate structure 10, a passive component 12 arranged on the substrate structure 10, a coating layer 13 formed on the substrate structure 10 and covering the electronic component 11 and the passive component 12, a conductive material 14 arranged in the opening 130 of the coating layer 13 and electrically connected to the passive component 12, and a metal part 15 arranged on the coating layer 13 and electrically contacting the conductive material 14. Accordingly, the metal part 15 and the passive component 12 (ground end) can form a grounding connection through the conductive material 14, without the need to pre-set a grounding circuit in the substrate structure and coat a metal layer on the outer surface of the electronic package, thereby avoiding problems such as circuit layout problems, complicated processes and excessive costs.
[0046] See also Figure 2 , which is a cross-sectional view of a second embodiment of the electronic package 2 of the present application. This embodiment is substantially the same as the previous embodiment, with the primary difference being that the size of the opening 230 of the cladding layer 23 varies with its depth, such that the conductive material 24 formed in the opening 230 has a first end 241 and a second end 242 opposite to each other, with the first end 241 and the second end 242 having different dimensions.
[0047] For example, in this embodiment, the opening 230 has a conical cross-section, and the conductive material 24 has a first end 241 and a second end 242 relative to each other, and the first end 241 electrically contacts the passive component 12, wherein the dimension d1 of the first end 241 is the same as the dimension of the first electrode end 121 (ground end) of the passive component 12, but smaller than the dimension d2 of the second end 242, so as to facilitate the conductive material 24 to fill the opening 230 and have a larger contact area with the metal component 15.
[0048] In summary, the electronic package and its manufacturing method of the present application mainly configure electronic components and passive components on a substrate structure, then cover the electronic components and the passive components with a coating layer, and form an opening in the coating layer to expose the grounding end of the passive component, so as to form a conductive material electrically connected to the passive component in the opening, and then provide a metal part on the coating layer to electrically contact the conductive material. Accordingly, the metal part and the passive component (grounding end) can be connected through the conductive material, without the need to pre-set a grounding circuit in the substrate structure and coat a metal layer on the outer surface of the electronic package, thereby avoiding problems such as circuit layout problems, complicated processes and high costs.
[0049] The above embodiments are intended only to illustrate the principles and effects of this application and are not intended to limit this application. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.
Claims
1. An electronic package, characterized in that: include: substrate structure; A passive component is disposed on the substrate structure and has a first electrode terminal and a second electrode terminal opposite to each other; A cladding layer is formed on the substrate structure and covers the passive component, wherein the cladding layer is formed with an opening for allowing the first electrode terminal of the passive component to be exposed outside the cladding layer; A conductive material is filled in the opening to electrically contact the first electrode terminal of the passive component; and The metal piece is disposed on the cladding layer and electrically contacts the conductive material.
2. The electronic package according to claim 1, wherein The electronic package comprises an electronic component which is arranged on the substrate structure and covered by the covering layer.
3. The electronic package according to claim 1, wherein: The first electrode terminal is a ground terminal, and the second electrode terminal is a power terminal.
4. The electronic package according to claim 1, wherein: The size of the opening is the same as that of the first electrode terminal.
5. The electronic package according to claim 1, wherein: The metal piece and the passive component are grounded via the conductive material.
6. The electronic package according to claim 1, wherein: The size of the opening varies depending on its depth in the cladding.
7. The electronic package according to claim 1, wherein: The conductive material has a first end and a second end opposite to each other, and a size of the first end is different from a size of the second end.
8. The electronic package according to claim 7, wherein: The first end portion electrically contacts the passive component, and a size of the first end portion is smaller than a size of the second end portion.