Single-tube IGBT parallel driver

Abstract

The utility model provides a single-tube IGBT (Insulated Gate Bipolar Translator) parallel driver, which belongs to the technical field of power devices and comprises a tube body mechanism, the tube body mechanism comprises a low-position plate, and the low-position plate is provided with an alignment mechanism in a matched manner; and the alignment mechanism comprises three tenon blocks fixedly connected to the side face of the low-position plate, one side of each tenon block is connected with a clamping cavity in a clamped mode, the end face of each clamping cavity is fixedly connected with a heat dissipation base, and the surface of the low-position plate is connected with a protective shell in an inserted mode. The side face of the protective shell is slidably connected with an abutting block, the surface of the abutting block is rotationally sleeved with a supporting table, through matched arrangement of the pipe body mechanism and the alignment mechanism, the pipe body mechanism can be stably aligned and cannot shake or fall off during heat dissipation, the low-position plates can be stably in butt joint at any position through fixed connection of the low-position plates and the tenon blocks, and the heat dissipation efficiency is improved. Meanwhile, the tenon block is arranged on the outer side face of the low-position plate, the influence of heat on the tenon block is small, and the situation of clamping failure caused by excessive expansion is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of power devices, and in particular relates to a single-tube IGBT parallel driver. Background Art

[0002] An IGBT series driver is an electronic device specifically designed to drive an insulated gate bipolar transistor (IGBT). The IGBT is a voltage-controlled semiconductor device that combines the high input impedance of a MOSFET with the high current density of a bipolar transistor. The function of the IGBT driver is to quickly charge and discharge the gate of the IGBT according to the control signal to turn the IGBT on and off.

[0003] In the prior art, a single-tube IGBT parallel driver with application number 202220111582.0 includes an IGBT chip assembly, a capacitor assembly, a driver board assembly, and a heat sink. The capacitor assembly and the driver board assembly are connected and fixed via a laminated busbar, and the IGBT chip assembly is mounted on both sides of the heat sink. The laminated busbar has jacks and pins, and each IGBT single-tube chip in the IGBT chip assembly is connected to the heat dissipation surfaces on both sides of the heat sink via a retaining spring.

[0004] In the above, the IGBT single-tube chip is elastically clamped with the side of the heat sink through the retaining spring, which basically realizes the heat dissipation function of the semiconductor device. However, the IGBT single-tube chip will emit a large amount of heat during operation. This heat will cause the physical deformation of the retaining spring, and the abutment support effect on the single-tube chip will be realized, causing the parts inside the driver to fall off, affecting its electrical function. Utility Model Content

[0005] The purpose of the present invention is to provide a single-tube IGBT parallel driver, aiming to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A single-tube IGBT parallel driver includes a tube body mechanism, wherein the tube body mechanism includes a low-position plate, and the low-position plate is provided with an alignment mechanism;

[0008] In addition, the alignment mechanism includes a tenon block fixedly connected to the side of the low-position plate, and the number of the tenon blocks is three. One side of the three tenon blocks is clamped and connected with a card cavity, the end face of the card cavity is fixedly connected with a heat dissipation base, and the surface of the low-position plate is plugged and connected with a protective shell, the side of the protective shell is slidably connected with a stop block, the surface of the stop block is rotatably sleeved with a support platform, and the side of the support platform is plugged and connected with a universal ball joint.

[0009] As a preferred solution of the present invention, a plug rod is fixedly connected to the surface of the universal ball joint, the surface of the plug rod is fixedly penetrated by the heat dissipation base, and a shift ring is fixedly provided on the end surface of the plug rod.

[0010] As a preferred solution of the present invention, the side of the low-position plate is fixedly connected with a contact pin, and the contact pin is cooperated with an external mechanism. The external mechanism also includes a side plate plugged into the surface of the heat dissipation base, and the end face of the side plate is threadedly connected with a stud, and the bottom of the stud is plugged into a connecting plate.

[0011] As a preferred solution of the present invention, the low-position plates and the contact pins are provided in multiple groups, and the multiple groups of low-position plates and the contact pins are arranged at equal distances on the surface of the heat dissipation base.

[0012] As a preferred solution of the present invention, the heat dissipation base is equipped with a heat conduction mechanism, which includes a square frame snap-connected to one side of the heat dissipation base. There are two square frames, and the outer side of the square frame is connected to a guide pipe.

[0013] As a preferred solution of the present invention, the tenon block is an integrally formed structural block, and an arc corner is provided at the outer end corner of the tenon block.

[0014] As a preferred solution of the present invention, grease is coated between the support platform and the universal ball joint, and the setting height of the universal ball joint is greater than the height of the support platform.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) through the coordinated arrangement of the tube body mechanism and the alignment mechanism, the tube body mechanism can be stably aligned during heat dissipation without shaking or falling; the fixed connection between the low-position plate and the tenon block allows the low-position plate to be stably docked at any position; at the same time, the tenon block is arranged on the outer side of the low-position plate, so that the tenon block is less affected by heat during docking, thus avoiding the situation where the clamping fails due to excessive expansion; the fixed connection between the clamping cavity and the heat dissipation base allows the heat to be retained inside the low-position plate after it is firmly aligned, and can also serve as an intermediate barrier to reduce the expansion of the tenon block caused by the heat source, thereby indirectly ensuring the clamping effect.

[0016] (2) The coordination of the heat conduction mechanism and the heat dissipation base makes the absorption and circulation of heat more efficient. The connection between the square frame and the guide tube allows the heat to be circulated and absorbed in the guide tube, thus avoiding the impact of high temperature on the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. Among them:

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the parts related to achieving the alignment and stabilization effect of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the parts related to achieving continuous heat dissipation effect in the present invention;

[0021] Figure 4 It is a schematic diagram of the top view of the structure of all parts of the utility model.

[0022] In the figure: 100, external mechanism; 101, connecting plate; 102, stud; 103, side panel; 104, heat dissipation base; 200, tube mechanism; 201, low-position plate; 202, contact pin; 203, protective shell; 300, alignment mechanism; 301, tenon; 302, card cavity; 303, stop block; 304, support platform; 305, universal ball joint; 306, insertion rod; 307, dial ring; 400, heat conduction mechanism; 401, square frame; 402, guide tube. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0024] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0026] Example 1

[0027] Reference Figure 1-2, which is the first embodiment of the present utility model, provides a single-tube IGBT parallel driver, including a tube body mechanism 200, the tube body mechanism 200 includes a low-position plate 201, and the low-position plate 201 is equipped with an alignment mechanism 300;

[0028] In addition, the alignment mechanism 300 includes a tenon block 301 fixedly connected to the side of the low-level plate 201, and the number of the tenon blocks 301 is three. One side of the three tenons 301 is clamped and connected with a card cavity 302, and the end face of the card cavity 302 is fixedly connected with the heat dissipation base 104, and the surface of the low-level plate 201 is plugged and connected with a protective shell 203, and the side of the protective shell 203 is slidably connected with a stop block 303, and the surface of the stop block 303 is rotatably sleeved with a support platform 304, and the side of the support platform 304 is plugged and connected with a universal ball joint 305.

[0029] Specifically, the tube mechanism 200 and the alignment mechanism 300 are arranged in coordination, so that the tube mechanism 200 can be stably aligned during heat dissipation without shaking or falling. The fixed connection between the low plate 201 and the tenon block 301 allows the low plate 201 to be stably docked at any position. At the same time, the tenon block 301 is arranged on the outer side of the low plate 201, so that the tenon block 301 is less affected by heat during docking, thereby avoiding the situation where the card connection fails due to excessive expansion. The fixed connection between the card cavity 302 and the heat dissipation base 104 is stable. The connection between the protective shell 203 and the low plate 201 can protect the low plate 201 from physical collisions. The sliding connection between the block 303 and the protective shell 203 can keep the internal parts relatively stable. The plug-in connection between the support platform 304 and the universal ball joint 305 can further ensure the balance during sliding displacement.

[0030] Furthermore, a rod 306 is fixedly connected to the surface of the universal joint 305 , the surface of the rod 306 is fixedly penetrated by the heat dissipation base 104 , and a shift ring 307 is fixedly provided on the end surface of the rod 306 .

[0031] Preferably, the fixed connection between the insertion rod 306 and the universal joint 305 provides a stable support for the universal joint 305 itself, and the fixed penetration of the heat dissipation base 104 and the insertion rod 306 allows the rotation effect of the dial ring 307 to be transmitted, and the abutment degree between the block 303 and the protective shell 203 can be adjusted, which is conducive to the stable docking of the low-position plate 201.

[0032] It should be noted that the side of the low-position plate 201 is fixedly connected to a contact pin 202, and the contact pin 202 is cooperated with an external mechanism 100. The external mechanism 100 also includes a side plate 103 plugged into the surface of the heat dissipation base 104. The end face of the side plate 103 is threadedly connected to a stud 102, and the bottom of the stud 102 is plugged into a connecting plate 101.

[0033] Afterwards, the fixed connection between the contact pin 202 and the low-position plate 201 allows the component to perform electrical functions. The coordinated setting of the contact pin 202 and the external mechanism 100 protects the root position of the contact pin 202. The coordination of the side panel 103, the stud 102 and the connecting plate 101 basically improves the supporting and stabilizing function of the component.

[0034] Example 2

[0035] Reference Figure 2-3 , which is the second embodiment of the present utility model. Different from the previous embodiment, this embodiment provides related parts to achieve multiple groups of series connection and circulating heat dissipation effects.

[0036] Specifically, multiple groups of low-position plates 201 and contact pins 202 are provided, and the multiple groups of low-position plates 201 and contact pins 202 are arranged on the surface of the heat dissipation base 104 at equal intervals.

[0037] Furthermore, the arrangement of multiple sets of low-position plates 201 and contact pins 202 makes the electrical performance of the component faster and also reflects the practical effect of parallel enhancement.

[0038] Preferably, the heat dissipation base 104 is provided with a heat conduction mechanism 400 , which includes a square frame 401 snap-connected to one side of the heat dissipation base 104 . There are two square frames 401 , and the outer side of the square frame 401 is connected to a guide pipe 402 .

[0039] Among them, the coordinated arrangement of the heat conducting mechanism 400 and the heat dissipation base 104 makes the heat absorption and circulation dissipation more efficient. The connection between the square frame 401 and the guide tube 402 allows circulation absorption in the guide tube 402 to avoid the impact of significant high temperature on the components.

[0040] Example 3

[0041] Reference Figure 2-4 , which is the third embodiment of the present utility model. Different from the previous embodiment, this embodiment provides relevant parts for achieving stable clamping and flexible rotation effects.

[0042] Specifically, the tenon block 301 is an integrally formed structural block, and arc corners are provided at the outer end corners of the tenon block 301 .

[0043] Furthermore, the one-piece structure of the tenon block 301 allows the force applied to the tenon block 301 to be uniform and consistent, and no splicing or breakage will occur. At the same time, the setting of the arc angle prevents the tenon block 301 from direct collision and wear.

[0044] Preferably, grease is applied between the support platform 304 and the universal joint 305 , and the universal joint 305 is arranged at a height greater than that of the support platform 304 .

[0045] The grease arrangement of the support platform 304 and the universal ball joint 305 significantly reduces the rotational friction and also allows the displacement and docking of the low-position plate 201 to be faster.

[0046] Working principle: First, fit the low-position plate 201 and the contact pin 202 together, then fix the protective shell 203 on the side of the low-position plate 201, and at the same time, fix the tenon block 301 on the outside of the protective shell 203, so that the tenon block 301 and the card cavity 302 set on the side of the heat dissipation base 104 are aligned with the tenon; in order to ensure the stable support of the low-position plate 201, the support block 303 and the support platform 304 are rotated and installed, the universal joint 305 and the insertion rod 306 are fixedly installed, and then the dial ring 307 and the end face of the insertion rod 306 are rotated and installed, which is used for flexible contact between the support block 303 and the protective shell 203, helping to stabilize the alignment of the low-position plate 201.

[0047] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0048] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0049] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.

Claims

1. Single-tube IGBT parallel driver, characterized by: It comprises a tube body mechanism (200), wherein the tube body mechanism (200) comprises a low-position plate (201), and the low-position plate (201) is provided with a positioning mechanism (300); Furthermore, the alignment mechanism (300) comprises a tenon block (301) fixedly connected to the side of the low-position plate (201), the number of the tenon blocks (301) is three, one side of each of the three tenon blocks (301) is snap-connected with a card cavity (302), the end face of the card cavity (302) is fixedly connected with a heat dissipation base (104), and the surface of the low-position plate (201) is plug-connected with a protective shell (203), the side of the protective shell (203) is slidably connected with a stop block (303), the surface of the stop block (303) is rotatably sleeved with a support platform (304), and the side of the support platform (304) is plug-connected with a universal ball joint (305).

2. The single-tube IGBT parallel driver according to claim 1, characterized in that: The surface of the universal joint (305) is fixedly connected with an insertion rod (306), the surface of the insertion rod (306) is fixedly penetrated by the heat dissipation base (104), and the end surface of the insertion rod (306) is fixedly sleeved with a dial ring (307).

3. The single-tube IGBT parallel driver according to claim 1, characterized in that: The side of the low-position plate (201) is fixedly connected to a contact pin (202), and the contact pin (202) is provided with an external mechanism (100) in cooperation. The external mechanism (100) further comprises a side plate (103) plugged into the surface of the heat dissipation base (104), the end face of the side plate (103) is threadedly connected to a stud (102), and the bottom of the stud (102) is plugged into the connecting plate (101).

4. The single-tube IGBT parallel driver according to claim 3, characterized in that: The low-position plates (201) and the contact pins (202) are provided in multiple groups, and the multiple groups of the low-position plates (201) and the contact pins (202) are arranged at equal distances on the surface of the heat dissipation base (104).

5. The single-tube IGBT parallel driver according to claim 1, characterized in that: The heat dissipation base (104) is provided with a heat conduction mechanism (400), and the heat conduction mechanism (400) comprises a square frame (401) connected to one side of the heat dissipation base (104) by snapping, and two square frames (401) are provided, and the outer side surfaces of the square frames (401) are connected to a flow guide pipe (402).

6. The single-tube IGBT parallel driver according to claim 1, characterized in that: The tenon block (301) is an integrally formed structural block, and a circular arc angle is provided at the outer end corner of the tenon block (301).

7. The single-tube IGBT parallel driver according to claim 1, characterized in that: Grease is coated between the support platform (304) and the universal joint (305), and the universal joint (305) is arranged at a height greater than the height of the support platform (304).

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