5G communication heat dissipation shell

Abstract

The utility model relates to a 5G communication heat dissipation shell, which comprises a heat dissipation shell base, the bottom of the heat dissipation shell base is connected with a plurality of heat dissipation bosses corresponding to the position of a chip, the upper part of the heat dissipation shell base is connected with heat dissipation fins, a heat dissipation layer is arranged between the heat dissipation bosses and the chip, and the heat dissipation layer is connected with the heat dissipation bosses. The heat dissipation layer is sprayed on the heat dissipation boss through printing, the thickness of the heat dissipation layer ranges from 0.5 mm to 10 mm, and the area of the heat dissipation layer is larger than or equal to the area of the chip corresponding to the heat dissipation layer. According to the utility model, the heat dissipation rate can be improved.

Description

Technical Field

[0001] The utility model relates to a 5G communication heat dissipation housing, and in particular to an auxiliary heat sink using the 5G communication heat dissipation housing. Background Art

[0002] At present, in 5G communication equipment, due to the problems of 5G equipment itself, its power consumption is relatively high, resulting in the need to install a radiator. After searching, the patent: Folded Fin Radiator (CN201110232351.1) includes heat dissipation fins and an aluminum substrate. The heat dissipation fins are flatly attached to the top surface of the aluminum substrate by welding. The heat dissipation fins are formed into a folded wavy shape by multiple bending of thin aluminum plates. The aluminum substrate is made of a thicker aluminum plate and cut into the required shape and size. The present invention uses a thin aluminum plate to form a folded wavy heat dissipation fin by multiple bending and uses a thicker aluminum plate as the aluminum substrate. At the same time, the aluminum substrate is cut into the required shape and size, and then the heat dissipation fins and the aluminum substrate are combined by welding to form a complete radiator that can dissipate heat well. However, although the above-mentioned heat sink can achieve heat dissipation, when it comes into contact with the product (chip), there may be insufficient contact (i.e., there are non-contact positions), resulting in low heat dissipation efficiency.

[0003] In view of the above-mentioned defects, the designer actively carried out research and innovation in order to create a new type of 5G communication heat dissipation shell to make it more valuable for industrial use. Utility Model Content

[0004] In order to solve the above technical problems, the purpose of the present utility model is to provide a 5G communication heat dissipation housing.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A 5G communication heat dissipation housing includes a heat dissipation housing base, the bottom of which is connected to a plurality of heat dissipation bosses corresponding to chip positions, and the top of the heat dissipation housing base is connected to heat dissipation fins. A heat dissipation layer is provided between the heat dissipation bosses and the chip, and the heat dissipation layer is sprayed on the heat dissipation bosses by printing. At the same time, the thickness of the heat dissipation layer is between 0.5 mm and 10 mm, and the area of the heat dissipation layer is greater than or equal to the area of the corresponding chip.

[0007] Preferably, in the 5G communication heat dissipation housing, the heat dissipation layer is a heat dissipation layer made of copper.

[0008] Preferably, in the 5G communication heat dissipation housing, the heat dissipation layer has an area length of 10 mm to 150 mm and a width of 0.8 mm to 1.2 mm.

[0009] Preferably, in the 5G communication heat dissipation housing, the thickness of the heat dissipation layer is 3 mm.

[0010] Preferably, in the 5G communication heat dissipation housing, the combined strength of the heat dissipation layer and the heat dissipation boss (2) is greater than or equal to 20 MPa.

[0011] By means of the above solution, the present invention has at least the following advantages:

[0012] The utility model can make the contact between the chip and the heat dissipation boss more closely, and at the same time adopts the copper middle layer to improve the thermal conductivity, so that the heat can be dissipated faster, ensuring the stable operation of the chip.

[0013] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 It is a side view of the present utility model. DETAILED DESCRIPTION

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0019] Example

[0020] like Figure 1 and Figure 2 As shown, a 5G communication heat dissipation housing includes a heat dissipation housing base 1, the bottom of the heat dissipation housing base 1 is connected to a plurality of heat dissipation bosses 2 corresponding to the chip positions, and the top of the heat dissipation housing base 1 is connected to heat dissipation fins 3. A heat dissipation layer 4 is provided between the heat dissipation boss 2 and the chip. The heat dissipation layer 4 is sprayed on the heat dissipation boss 2 by printing. At the same time, the thickness of the heat dissipation layer 4 is between 0.5 mm and 10 mm, and the area of the heat dissipation layer 4 is greater than or equal to the area of the corresponding chip.

[0021] The heat dissipation layer 4 in the present invention is a heat dissipation layer made of copper, such as red copper. By adding a heat dissipation layer made of copper, the thermal conductivity of the die-cast aluminum material can be increased from 130w / mk to more than 300w / mk, thereby achieving rapid heat dissipation.

[0022] The heat dissipation layer 4 in the present invention has an area length ranging from 10 mm to 150 mm and a width ranging from 0.8 mm to 1.2 mm, and can be adjusted accordingly according to the size of different new products, thus having wide applicability.

[0023] The thickness of the heat dissipation layer 4 in the present invention is 3 mm.

[0024] The combined strength of the heat dissipation layer 4 and the heat dissipation boss 2 in the present invention is greater than or equal to 20 MPa, thus ensuring the strength.

[0025] The working principle of this utility model is as follows:

[0026] During the specific work, it is only necessary to spray the copper heat dissipation layer onto the heat dissipation boss by printing and spraying, and spray it according to the size of different chips, and then contact and fix the heat dissipation shell base with the chip.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0028] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] In addition, the terms "horizontal" and "vertical" do not mean that the components must be absolutely horizontal or vertical, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0030] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A 5G communication heat dissipation housing, comprising a heat dissipation housing base (1), the bottom of the heat dissipation housing base (1) is connected to a plurality of heat dissipation bosses (2) corresponding to chip positions, and the top of the heat dissipation housing base (1) is connected to heat dissipation fins (3), characterized in that: A heat dissipation layer (4) is provided between the heat dissipation boss (2) and the chip. The heat dissipation layer (4) is sprayed onto the heat dissipation boss (2) by printing. The thickness of the heat dissipation layer (4) is between 0.5 mm and 10 mm, and the area of the heat dissipation layer (4) is greater than or equal to the area of the corresponding chip.

2. A 5G communication heat dissipation housing according to claim 1, characterized in that: The heat dissipation layer (4) is a heat dissipation layer made of copper.

3. A 5G communication heat dissipation housing according to claim 1, characterized in that: The heat dissipation layer (4) has an area length ranging from 10 mm to 150 mm and a width ranging from 0.8 mm to 1.2 mm.

4. A 5G communication heat dissipation housing according to claim 1, characterized in that: The thickness of the heat dissipation layer (4) is 3 mm.

5. A 5G communication heat dissipation housing according to claim 1, characterized in that: The combined strength of the heat dissipation layer (4) and the heat dissipation boss (2) is greater than or equal to 20 MPa.

Images