Novel high-strength and high-brightness LED support

Abstract

The utility model discloses a novel LED support with high intensity and high brightness, which comprises a light-gathering bowl cup, two metal bonding pads and two soldering tin feet, the two metal bonding pads are arranged at the bottom of the light-gathering bowl cup, the two soldering tin feet are arranged on two sides of the light-gathering bowl cup, each soldering tin foot and the metal bonding pad on the corresponding side are integrally formed, and the soldering tin feet are arranged on the two sides of the light-gathering bowl cup. Steps with the width A and the height C of 0.15 mm are stretched out of the upper sides and the lower sides of the two metal bonding pads through molds, and stretching parts of the upper sides and the lower sides of the two metal bonding pads are clamped in the colloid of the light-gathering bowl cup; the thickness of a metal bonding pad of an existing product is reduced, a stretching part of the metal bonding pad is completely contained in a rubber body, the bonding performance of metal and the rubber body is effectively improved, the product strength is enhanced, and meanwhile the product reliability is improved. Compared with an existing product, by reducing the thickness of the metal support, the material cost is reduced, the light emitting angle is adjusted and enlarged through the light gathering bowl cup, the light emitting efficiency of a light source is improved, and therefore energy consumption is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED bracket structures, in particular to a new type of high-intensity and high-brightness LED bracket. Background Art

[0002] LED (Light-Emitting Diode), also known as light-emitting diode, is a semiconductor electronic component that can convert electrical energy into light energy. LED is mainly composed of chips, brackets, packaging materials and other parts. Chip: It is the core part of the LED and is made of semiconductor materials, such as gallium nitride (GaN). There is a PN junction inside the chip. When current passes through the PN junction, electrons and holes recombine, resulting in photon emission. Different semiconductor materials and doping processes can produce different colors of light. Bracket: It is used to support the chip and provide electrical connections for the chip. The bracket is usually made of metal materials, such as copper or iron plated with silver, which has good conductivity and heat dissipation. Packaging material: Its main function is to protect the chip from the influence of the external environment, and it also affects the light output efficiency of the LED. Common packaging materials include transparent materials such as epoxy resin.

[0003] The products currently on the market all use 0.2-0.23mm thick metal brackets as the base material, and make a step by thinning the base material. Figure 4 As shown, the traditional method of thinning thick materials (thickness must not be less than 0.18mm) to allow metal parts to be locked into the colloid is to reduce the step size to half, only 0.09mm, and the step width is only 0.05mm. The bonding between the colloid and the metal is not strong enough, and there is a high probability of separation between the colloid and the metal during subsequent manufacturing processes. Utility Model Content

[0004] The purpose of the utility model is to provide a new type of LED bracket with high strength and high brightness.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A new type of high-intensity and high-brightness LED bracket includes a focusing bowl cup, a metal pad and a solder foot. The two metal pads are installed at the bottom of the focusing bowl cup, and the two solder feet are installed on both sides of the focusing bowl cup. Each solder foot is integrally formed with the metal pad on the corresponding side. The thickness B of the metal solder is 0.13mm. The upper and lower sides of the two metal pads are stretched through a mold to form steps with a width A and a height C of 0.15mm. The upper and lower stretched parts of the two metal pads are clamped in the colloid of the focusing bowl cup.

[0007] Furthermore, the light-emitting angle F of the focusing bowl cup in the X direction is 76.4°, and the light-emitting angle E of the focusing bowl cup in the Y direction is 114°.

[0008] Furthermore, the focusing bowl cup is made of PPA colloid material.

[0009] Furthermore, the cup wall thickness D at the cup mouth of the focusing bowl cup is 0.4 mm.

[0010] In summary, the present invention has the following beneficial effects:

[0011] 1. By using a thin 0.13mm metal pad to stretch a step with a height of 0.15mm and a width of 0.15mm in the blanking die, the thickness of the metal pad of the existing product is reduced, and the stretched part of the metal pad is completely contained in the colloid, which effectively improves the bonding performance between the metal and the colloid, enhances the strength of the product, saves energy, and improves the reliability of the product;

[0012] 2. By reducing the thickness of the metal bracket, the material cost is reduced and the cost performance of the product is improved;

[0013] 3. By adjusting the focusing bowl cup, the luminous angle is increased, which is beneficial to increase the light output efficiency of the light source and thus reduce energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front view of the utility model;

[0015] Figure 2 yes Figure 1 A cross-sectional view of the AA portion;

[0016] Figure 3 yes Figure 1 A cross-sectional view of the BB portion;

[0017] Figure 4 It is a cross-sectional view of the prior art structure.

[0018] In the picture, 1. Focusing bowl; 2. Metal pad; 3. Solder foot. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the present invention in conjunction with the accompanying drawings, clearly and completely describing the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] like Figure 1 、 Figure 2 and Figure 3As shown, a new type of high-intensity and high-brightness LED bracket includes a focusing bowl cup 1, a metal pad 2 and a solder foot 3. The two metal pads 2 are installed at the bottom of the focusing bowl cup 1, and the two solder feet 3 are installed on both sides of the focusing bowl cup 1. Each solder foot 3 is integrally formed with the metal pad 2 on the corresponding side. The thickness B of the metal pad 2 is 0.13mm. The upper and lower sides of the two metal pads 2 are stretched through a mold to form steps with a width A and a height C of 0.15mm. The upper and lower stretched parts of the two metal pads 2 are clamped in the colloid of the focusing bowl cup 1.

[0021] Furthermore, the luminous angle F of the focusing bowl cup 1 in the X direction is 76.4°, and the luminous angle E of the focusing bowl cup 1 in the Y direction is 114°. On the basis of the original design, the luminous angle is increased, which is beneficial to increase the light output efficiency of the light source and thus reduce energy consumption.

[0022] Furthermore, the focusing bowl cup 1 is made of PPA colloid material.

[0023] For further reference, Figure 1 As shown, the cup wall thickness D at the cup mouth of the focusing bowl cup 1 is 0.4 mm, and the original design thickness at this position is 0.25 mm. By thickening the cup wall, the cup mouth of the focusing bowl cup 1 is reduced, and the product's anti-breaking strength is increased.

[0024] The utility model uses a thin 0.13mm metal pad to stretch a step with a height of 0.15mm and a width of 0.15mm in the blanking mold, thereby reducing the thickness of the metal pad of the existing product, allowing the stretched part of the metal pad to be completely contained in the colloid, effectively improving the bonding performance between the metal and the colloid, enhancing the strength of the product while saving energy, and improving the reliability of the product; compared with the existing products, by reducing the thickness of the metal bracket, the material cost is reduced, the cost performance of the product is improved, and the light-emitting angle is increased by adjusting the focusing bowl cup, which is conducive to increasing the light output efficiency of the light source and thus reducing energy consumption.

[0025] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A new type of high-intensity and high-brightness LED bracket, comprising a focusing bowl cup (1), a metal pad (2) and a solder foot (3), wherein two metal pads (2) are mounted on the bottom of the focusing bowl cup (1), and two solder feet (3) are mounted on both sides of the focusing bowl cup (1), and each solder foot (3) is integrally formed with the metal pad (2) on the corresponding side, characterized in that: The thickness B of the metal pad (2) is 0.13 mm, and the upper and lower sides of the two metal pads (2) are stretched by a mold to form steps with a width A and a height C of 0.15 mm. The stretched parts on the upper and lower sides of the two metal pads (2) are clamped in the colloid of the focusing bowl cup (1).

2. The high-intensity and high-brightness new LED bracket according to claim 1, characterized in that: The light-emitting angle F of the light-collecting bowl cup (1) in the X direction is 76.4°, and the light-collecting bowl cup (1) in the Y direction is 114°.

3. The high-intensity and high-brightness LED novel bracket according to claim 2, characterized in that: The focusing bowl cup (1) is made of PPA colloid material.

4. The high-intensity and high-brightness new type LED bracket according to claim 1, characterized in that: The cup wall thickness D at the cup opening of the focusing bowl cup (1) is 0.4 mm.

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