Micro-display wafer and head-mounted display device
By integrating photosensitive devices and auxiliary light sources in the microdisplay chip, the volume problem caused by split settings is solved, and a smaller head-mounted display device design is realized, which improves lightness.
Patent Information
- Application Number
- CN202422495395.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-10-15
AI Technical Summary
In the existing head-mounted display devices, the split arrangement of photosensitive wafers for iris recognition and microdisplay wafers for display leads to a large component size, affecting the lightness of the device.
The photosensitive device for iris recognition is integrated into the microdisplay chip, especially the display light emitting area and photosensitive area are set on the display surface, and combined with auxiliary light sources and eye control devices, the integration of image display, iris recognition and human eye line acquisition is achieved.
By integrating photosensitive devices, the volume occupied by components is reduced, the lightness of the head-mounted display device is improved, and a smaller design is achieved.
Smart Images
Figure CN223246998U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display, and in particular to a micro display chip and a head-mounted display device. Background Art
[0002] Micro-LED (Micro Light Emitting Diode) display chips are considered to be the most suitable display modules for head-mounted display devices due to their high stability and high brightness.
[0003] Some head-mounted display devices have an iris recognition function. In the prior art, the photosensitive chip used for iris recognition and the micro-display chip used for display are separately arranged, making the assembly larger. Utility Model Content
[0004] The present application provides a micro-display chip and a head-mounted display device, which integrates a photosensitive device for iris recognition into a micro-display chip for display, thereby improving the lightness of the components.
[0005] In a first aspect, an embodiment of the present application provides a micro-display chip, wherein the display surface of the micro-display chip has a pixel array area, the pixel array area includes a display light-emitting area and a photosensitive area, and the micro-display chip includes: a plurality of display micro-light-emitting diodes arranged in the display light-emitting area for image display; a plurality of photosensitive devices arranged in the photosensitive area, and the plurality of photosensitive devices can obtain human iris images for iris recognition.
[0006] According to the aforementioned implementation of the first aspect of the present application, the photosensitive area is arranged around the display light-emitting area.
[0007] According to any of the aforementioned implementations of the first aspect of the present application, the photosensitive area is located at an edge position of the pixel array area.
[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel array area further includes an auxiliary light source area, and the micro display chip further includes: an auxiliary light source device, disposed in the auxiliary light source area, and the auxiliary light source device can emit infrared light.
[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel array area also includes an eye control device area, the eye control device area includes an infrared emitting area and an infrared receiving area, and the micro display chip also includes: at least one infrared light source device, located in the infrared emitting area; at least one infrared collection device, located in the infrared receiving area, the infrared light emitted by the infrared light source device is reflected by the human eye and then received by the infrared collection device for acquiring the human eye's line of sight.
[0010] According to any of the aforementioned implementations of the first aspect of the present application, at least part of the photosensitive devices are reused as the infrared collection devices.
[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the number of the photosensitive devices is greater than 200.
[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the micro-display chip also includes: a circuit substrate, the circuit substrate has a circuit structure inside, the circuit structure includes a light-emitting driving circuit and a photosensitive driving circuit, the display micro-light-emitting diode is electrically connected to the light-emitting driving circuit through a first via hole, and the photosensitive device is electrically connected to the photosensitive driving circuit through a fourth via hole.
[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting driving circuit and the photosensitive driving circuit are both complementary metal oxide semiconductor circuits.
[0014] In a second aspect, an embodiment of the present application provides a head-mounted display device, which includes a micro-display chip according to any of the aforementioned embodiments of the first aspect of the present application.
[0015] According to the micro-display chip of the embodiment of the present application, the display surface of the micro-display chip has a pixel array area, which includes a display light-emitting area and a photosensitive area. The display micro-light-emitting diodes for image display are arranged in the display light-emitting area. The photosensitive device for obtaining the human iris image for iris recognition is arranged in the photosensitive area. The above-mentioned micro-display chip integrates the photosensitive device for iris recognition into the micro-display chip for display. Compared with the photosensitive chip and micro-display chip arranged separately, the micro-display chip with both image display function and iris recognition function occupies a smaller volume, improves the lightness of the components, and is more conducive to achieving the lightness of the head-mounted display device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0017] Figure 1 This is a schematic top view of the first embodiment of the micro display chip of the present application;
[0018] Figure 2 This is a schematic cross-sectional view of the first embodiment of the micro display chip of the present application;
[0019] Figure 3This is a schematic top view of a second embodiment of the micro display chip of the present application;
[0020] Figure 4 This is a cross-sectional schematic diagram of the second embodiment of the micro display chip of the present application.
[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0023] It should be noted that all directional indications in the embodiments of the present application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly. When describing the structure of a component, when a layer or an area is referred to as being "above" or "above" another layer or another area, it can mean that it is directly above the other layer or another area, or that there are other layers or areas between it and the other layer or another area. In addition, if the component is turned over, the layer or one area will be "below" or "beneath" the other layer or another area.
[0024] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. The terms "comprise", "include" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. Without further restrictions, an element defined by the phrase "comprise..." does not exclude the presence of other identical elements in the process, method, article or device comprising the elements. In addition, the technical solutions between the various embodiments may be combined with each other, but this must be based on the ability of a person of ordinary skill in the art to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0025] An embodiment of the present application provides a micro display chip. Figure 1 This is a top view of the first embodiment of the micro-display chip of the present application. In this article, "micro-display chip" refers to a display component that mainly uses micro light emitting diodes (Micro-LEDs) as light-emitting pixels.
[0026] As used herein, "micro" LEDs and other "micro" devices refer to the size of the LEDs and devices. In some embodiments, the term "micro" refers to devices with a size ranging from 1 micron to 100 microns. However, it is understood that the embodiments of the present application are not limited thereto, and certain aspects of the embodiments may be applicable to larger or smaller sizes.
[0027] The display surface of the micro display chip 100 has a pixel array area A1 , which includes a light-emitting area A11 and a photosensitive area A13 .
[0028] Microdisplay chip 100 includes multiple display micro-LEDs 110 and multiple photosensitive devices 170. The multiple display micro-LEDs 110 are arranged in a display light-emitting area A11 for image display. Multiple photosensitive devices 170 are arranged in a photosensitive area A13. The multiple photosensitive devices 170 can capture iris images for iris recognition.
[0029] In this embodiment, the display micro-LEDs 110 are colored light Micro-LEDs, such as red Micro-LEDs, green Micro-LEDs, and blue Micro-LEDs.
[0030] Photosensitive device 170 is, for example, a photosensitive element sensitive to infrared light. The cornea, iris, and pupil of the human eye each absorb and reflect infrared light differently. Each person's iris contains unique texture information that remains constant throughout life, making it a highly reliable biometric feature. Multiple photosensitive devices 170 can be used to obtain an iris image, which can serve as biometric data.
[0031] According to the micro-display chip 100 of the embodiment of the present application, the display surface of the micro-display chip 100 has a pixel array area A1, which includes a display light-emitting area A11 and a photosensitive area A13. The display micro-light-emitting diode 110 for image display is arranged in the display light-emitting area A11. The photosensitive device 170 for obtaining the human eye iris image for iris recognition is arranged in the photosensitive area A13. The above-mentioned micro-display chip 100 integrates the photosensitive device 170 for iris recognition into the micro-display chip 100 for display. Compared with the photosensitive chip and micro-display chip 100 that are separately arranged, the micro-display chip 100 with both image display function and iris recognition function occupies a smaller volume, improves the lightness of the components, and is more conducive to achieving the lightness of the head-mounted display device.
[0032] In some embodiments, the number of photosensitive devices 170 is greater than 200 to ensure iris recognition accuracy.
[0033] In the embodiment of the present application, the shape of the pixel array area A1 can be set as needed. The array shape of the display micro-LEDs 110 can be set as needed. In some embodiments, each display micro-LED 110 is rectangular, in some embodiments, each display micro-LED 110 is hexagonal, and in other embodiments, each display micro-LED 110 can be other shapes.
[0034] In some embodiments, the light-sensing area A13 is disposed around the display light-emitting area A11.
[0035] In some embodiments, the photosensitive area A13 is located at an edge of the pixel array area A1.
[0036] In this embodiment, the display light emitting area A11 is located at the center of the pixel array area A1 , and the photosensitive area A13 completely surrounds the display light emitting area A11 .
[0037] In some embodiments, the pixel array area A1 further includes an auxiliary light source area A14. The micro display chip 100 further includes an auxiliary light source device 180. The auxiliary light source device 180 is disposed in the auxiliary light source area A14 and can emit infrared light.
[0038] The auxiliary light source device 180 can provide auxiliary infrared light when the multiple photosensitive devices 170 are capturing iris images, thereby improving the accuracy of iris recognition. In this embodiment, the auxiliary light source device 180 includes at least one infrared Micro-LED.
[0039] In this embodiment, there are multiple auxiliary light source devices 180. In other embodiments, there may be a single auxiliary light source device 180. In this embodiment, the multiple auxiliary light source devices 180 are spaced apart from each other, for example, at the corners of the pixel array area A1. In other embodiments, at least two of the multiple auxiliary light source devices 180 may be adjacent to each other.
[0040] Figure 2 This is a cross-sectional schematic diagram of the first embodiment of the microdisplay wafer of the present application. In some embodiments, the microdisplay wafer 100 further includes a circuit substrate 140. Circuit substrate 140 internally contains a circuit structure comprising a light-emitting driver circuit and a light-sensing driver circuit. The display micro-LED 110 is electrically connected to the light-emitting driver circuit via a first via H1. The light-sensing device 170 is electrically connected to the light-sensing driver circuit via a fourth via H4.
[0041] In some embodiments, both the light-emitting driving circuit and the light-sensing driving circuit are complementary metal oxide semiconductor (CMOS) circuits, so that all structures of the micro display chip 100 can be manufactured using a CMOS process technology.
[0042] Figure 3 This is a top view schematic diagram of the second embodiment of the micro-display chip of the present application. The display surface of the micro-display chip 100 has a pixel array area A1, and the pixel array area A1 includes a display light-emitting area A11 and a photosensitive area A13. The micro-display chip 100 includes a plurality of display micro-light-emitting diodes 110 and a plurality of photosensitive devices 170. The plurality of display micro-light-emitting diodes 110 are arranged in the display light-emitting area A11 for image display. The plurality of photosensitive devices 170 are arranged in the photosensitive area A13. The plurality of photosensitive devices 170 can obtain human iris images for iris recognition. In the second embodiment, the pixel array area A1 also includes an eye control device area A12, and the eye control device area A12 includes an infrared emission area A121 and an infrared receiving area A122.
[0043] In the second embodiment, the microdisplay chip 100 further includes at least one infrared light source device 120 and at least one infrared collection device 130. The at least one infrared light source device 120 is located in an infrared emission area A121. The at least one infrared collection device 130 is located in an infrared reception area A122. Infrared light emitted by the infrared light source device 120 is reflected by the human eye and then received by the infrared collection device 130, thereby capturing the human eye's line of sight.
[0044] The acquisition of human eye line of sight is, for example, based on corneal reflection, with eye features such as the corner of the eye or corneal reflection point (Purkinje spot) as the reference point for eye movement. The line of sight is estimated by analyzing the mapping relationship between the vector formed by the corner of the eye or corneal reflection point and the pupil center position and the line of sight vector, thereby obtaining the human eye line of sight to facilitate the realization of eye control function.
[0045] In the above embodiment, the micro display chip 100 also has a function of acquiring the sight line of the human eye, thereby further improving the integration of the chip.
[0046] Figure 4 This is a cross-sectional schematic diagram of the second embodiment of the micro-display chip of the present application. The micro-display chip 100 also includes a circuit substrate 140. The circuit substrate 140 has a circuit structure inside, and the circuit structure includes a light-emitting drive circuit and a photosensitive drive circuit. The display micro-LED 110 is electrically connected to the light-emitting drive circuit through the first via H1. The photosensitive device 170 is electrically connected to the photosensitive drive circuit through the fourth via H4. In this embodiment, the infrared light source device 120 is electrically connected to the light-emitting drive circuit in the circuit substrate 140 through the second via H2, and the infrared collection device 130 is electrically connected to the photosensitive drive circuit in the circuit substrate 140 through the third via H3. Both the light-emitting drive circuit and the photosensitive drive circuit are CMOS circuits.
[0047] In this embodiment, the infrared collection device 130 is an infrared Micro-LED. In this embodiment, the infrared collection device 130 is a photodiode.
[0048] The infrared collection device 130 can convert the optical signal into an electrical signal. The infrared collection device 130 converts the collected infrared light stimulus into an electrical signal, which is transmitted to the photosensitive driving circuit through the third via H3 and stored through the peripheral storage circuit for subsequent analysis.
[0049] The number of eye control device areas A12 can be single or multiple. In some embodiments, the infrared emitting area A121 and the infrared receiving area A122 are adjacent to each other in each eye control device area A12. In some embodiments, the infrared emitting area A121 and the infrared receiving area A122 are separated by the display light-emitting area A11. For example, in the present embodiment, the infrared emitting area A121 and the infrared receiving area A122 are respectively located at the edge positions of the pixel array area A1, for example, at the edge position or corner position of the pixel array area A1. In the present embodiment, the infrared emitting area A121 and the infrared receiving area A122 are respectively located at the corner positions of the pixel array area A1. In the present embodiment, the pixel array area A1 is rectangular, and the infrared emitting area A121 and the infrared receiving area A122 are respectively located at different corner positions of the pixel array area A1.
[0050] In some embodiments, at least part of the photosensitive device 170 is reused as the infrared collection device 130. For example, Figure 3 In the second embodiment, all infrared collection devices 130 may be multiplexed by the photosensitive devices 170 , that is, at least a portion of the photosensitive devices 170 may also serve as the infrared collection devices 130 , thereby further improving the utilization rate of the devices on the micro display chip 100 .
[0051] The present application also provides a head-mounted display device, comprising the microdisplay chip 100 according to any of the aforementioned embodiments. The head-mounted display device may be an augmented reality (AR) head-mounted display device, a virtual reality (VR) head-mounted display device, or a mixed reality (MR) head-mounted display device.
[0052] The display surface of the micro display chip 100 has a pixel array area A1 , which includes a light-emitting area A11 and a photosensitive area A13 .
[0053] Microdisplay chip 100 includes multiple display micro-LEDs 110 and multiple photosensitive devices 170. The multiple display micro-LEDs 110 are arranged in a display light-emitting area A11 for image display. Multiple photosensitive devices 170 are arranged in a photosensitive area A13. The multiple photosensitive devices 170 can capture iris images for iris recognition.
[0054] According to an embodiment of the present application, a head-mounted display device includes a micro-display chip 100. The display surface of the micro-display chip 100 has a pixel array area A1, which includes a display light-emitting area A11 and a photosensitive area A13. A display micro-LED 110 for image display is arranged in the display light-emitting area A11. A photosensitive device 170 for acquiring an iris image for iris recognition is arranged in the photosensitive area A13. The micro-display chip 100 integrates the photosensitive device 170 for iris recognition into the micro-display chip 100 for display. Compared to separate photosensitive chips and micro-display chips 100, this micro-display chip 100, which has both image display and iris recognition functions, occupies a smaller volume, improves the lightness of the components, and thus facilitates the portability of the head-mounted display device.
[0055] The above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made based on the contents of the present application specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present application.
Claims
1. A micro display chip, characterized in that: The display surface of the micro display chip has a pixel array area, and the pixel array area includes a display light emitting area and a photosensitive area. The micro display chip includes: A plurality of display micro light emitting diodes are arranged in the display light emitting area and are used for displaying images; A plurality of photosensitive devices are arranged in the photosensitive area, and the plurality of photosensitive devices can obtain human iris images for iris recognition.
2. The micro display chip according to claim 1, wherein: The photosensitive area is arranged around the display light-emitting area.
3. The micro display chip according to claim 1, wherein: The photosensitive area is located at an edge of the pixel array area.
4. The micro display chip according to claim 1, wherein: The pixel array area further includes an auxiliary light source area, and the micro display chip further includes: An auxiliary light source device is arranged in the auxiliary light source area, and the auxiliary light source device can emit infrared light.
5. The micro display chip according to claim 1, wherein: The pixel array area further includes an eye control device area, the eye control device area includes an infrared emitting area and an infrared receiving area, and the micro display chip further includes: At least one infrared light source device, located in the infrared emission area; At least one infrared collection device is located in the infrared receiving area. The infrared light emitted by the infrared light source device is reflected by the human eye and then received by the infrared collection device for acquiring the human eye's line of sight.
6. The micro display chip according to claim 5, wherein: At least part of the photosensitive devices are reused as the infrared collection devices.
7. The micro display chip according to claim 1, wherein: The number of the photosensitive devices is more than 200.
8. The micro display chip according to claim 1, wherein: Also includes: A circuit substrate having a circuit structure therein, wherein the circuit structure includes a light-emitting driving circuit and a photosensitive driving circuit, the display micro-LED is electrically connected to the light-emitting driving circuit through a first via hole, and the photosensitive device is electrically connected to the photosensitive driving circuit through a fourth via hole.
9. The micro display chip according to claim 8, wherein: The light-emitting driving circuit and the light-sensing driving circuit are both complementary metal oxide semiconductor circuits.
10. A head-mounted display device, characterized in that: The micro display chip comprises the micro display chip according to any one of claims 1 to 9.