Nozzle for semiconductor equipment purification device

Abstract

The utility model belongs to the technical field of semiconductor purification devices, in particular to a nozzle for a semiconductor equipment purification device, which comprises a connecting arm, a fixing ring, a lock catch and a spray head, the fixing ring is arranged in the middle of the front end of the connecting arm, the lock catch is arranged on the surface of the upper end of the connecting arm, and the spray head is arranged below the fixing ring. Through the arrangement of the rotary adjusting ring, the inner gear ring, the positioning gear, the spoiler and the bearing ring, when the structure is used as a nozzle of a semiconductor purification device, an operator can install the structure at the tail end of high-pressure cleaning equipment through the connecting column, and when water flow is conveyed into the structure, the structure is convenient to use. An operator can drive the rotary adjusting ring by shifting the connecting arm, the movement of the spoiler in the structure can be finely controlled through the cooperation of the positioning gear, the inner gear ring and the rotary adjusting ring, and compared with an existing nozzle structure, the nozzle structure has the advantages that the structure is simple, and the operation is convenient. According to the scheme, the controllable degree of water flow during semiconductor cleaning is improved by adopting a water flow tail end control mode.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor purification devices, in particular to a nozzle used in semiconductor equipment purification devices. Background Art

[0002] A semiconductor refers to a material with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communications systems, photovoltaic power generation, lighting, and high-power power conversion. Diodes, for example, are devices made from semiconductors. Cleaning semiconductor components requires specialized cleaning and purification equipment.

[0003] The existing technology has the following deficiencies: The prior art, "A nozzle cleaning mechanism for semiconductor glue coating equipment," with publication number CN219400765U, "comprises a glue coating frame, wherein a cleaning box and a vacuum suction cup are sequentially arranged from one end of the glue coating frame to the other end; an electric device box is arranged at the other end of the glue coating frame and below the vacuum suction cup; and a glue spraying device is movably connected to the front of the upper end of the glue coating frame."

[0004] The above structure realizes a more convenient function of installing and removing the nozzle on the nozzle pipe by arranging a nozzle structure on the glue spraying equipment and a motorized brush structure on the cleaning box. However, the structure still adopts the traditional water flow control method, that is, controlling water at the water supply source. Although this water control method is fast and sensitive, the water supply position is a certain distance away from the cleaning terminal, and some water flow still remains in the pipeline after the water supply end is closed, resulting in a long water flow control process and a delayed control step. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the utility model provides a nozzle for a semiconductor equipment purification device, which solves the current problems of insufficient precision and delay in water flow control.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a nozzle for a semiconductor equipment purification device, comprising a connecting arm, a fixing ring, a locking buckle, and a nozzle, wherein the fixing ring is arranged at the front middle portion of the connecting arm, the locking buckle is arranged at the upper end surface of the connecting arm, and the nozzle is arranged below the fixing ring;

[0007] A rotation adjustment ring is provided at the upper end of the fixed ring, a sealing ring is provided at the upper end of the rotation adjustment ring, and a connecting column is provided on the inner end surface of the sealing ring;

[0008] The rotating adjustment ring also includes an inner gear ring, a positioning gear, and a spoiler. The inner gear ring is fixedly mounted on the inner wall end face of the rotating adjustment ring. The tooth groove of the positioning gear is engaged with the inner gear ring. The spoiler is sleeved on the outer end face of the positioning gear.

[0009] As a preferred technical solution of the present invention, the fixing ring further comprises a bearing and a receiving ring, the bearing is movably connected to the wall end surface of the fixing ring, and the receiving ring is fixedly connected to the upper end of the bearing.

[0010] As a preferred technical solution of the present invention, the receiving ring is in a movable connection with the bottom of the positioning gear, and a shaft seat structure is provided at the connection.

[0011] As a preferred technical solution of the present invention, five groups of positioning gears and spoilers are provided, and are equidistantly distributed in an annular manner on the upper end surface of the receiving ring.

[0012] As a preferred technical solution of the present invention, the outer end surface of the fixing ring is connected to a strip structure, and the lock buckle passes through the inner end of the strip structure.

[0013] As a preferred technical solution of the present invention, the bearing is fixedly connected to the upper end of the nozzle, and the receiving ring and the bearing need to be connected to an external fixed structure before installation and use.

[0014] As a preferred technical solution of the present invention, the spoiler is an overall right-angle structure, both inner and outer sides thereof are rounded, and the spoiler is made of a transparent colloid material.

[0015] Compared with the prior art, the present invention provides a nozzle for a semiconductor equipment purification device, which has the following beneficial effects:

[0016] The nozzle for a semiconductor equipment purification device is provided with a rotating adjustment ring, an internal gear ring, a positioning gear, a baffle and a receiving ring. When the structure is used as a nozzle for a semiconductor purification device, the operator can install it on the end of a high-pressure cleaning device through a connecting column. When water flows into the interior of the structure, the operator can drive the rotating adjustment ring by toggling the connecting arm. The fixed ring connected to the connecting arm rotates at its outer end through the connection of the internal bearing, and the rotating adjustment ring is driven in the same direction by the connecting arm under the connection of the lock. When the rotating adjustment ring rotates, the internal gear ring inside it rotates in the same direction and simultaneously drives five groups of positioning gears meshed with it. The positioning gear rotates according to the direction of the rotating adjustment ring and drives the baffle connected to the bottom end. When the baffle rotates toward the middle of the fixed ring, the baffle blocks the water flowing through the interior of the rotating adjustment ring. The water flow blocking area is determined by the rotation amplitude of the baffle.

[0017] Through the above process, the device can achieve the following beneficial effects:

[0018] Through the obstruction of the baffle, the water flow inside the nozzle can be mechanically blocked, thereby adjusting the impact force and flow rate of the water flow. Through the cooperation of the positioning gear, the internal gear ring and the rotating adjustment ring, the movement of the baffle inside the structure can be finely controlled. Compared with the current nozzle structure, this solution adopts the water flow end control method to improve the controllability of the water flow during semiconductor cleaning and reduce the delay time of water flow control. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the split structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the installation position structure of the internal gear ring and the positioning gear of the utility model;

[0022] Figure 4 This is a schematic diagram of the bearing installation position structure of the utility model.

[0023] In the figure: 1. Connecting arm; 2. Fixing ring; 201. Bearing; 202. Adapter ring; 3. Locking buckle; 4. Nozzle; 5. Rotating adjustment ring; 501. Internal gear ring; 502. Positioning gear; 503. Baffle; 6. Sealing ring; 7. Connecting column. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Please refer to this embodiment: A nozzle for a semiconductor equipment purification device includes a connecting arm 1, a fixing ring 2, a locking buckle 3 and a nozzle 4, wherein the fixing ring 2 is arranged at the front middle part of the connecting arm 1, the locking buckle 3 is arranged on the upper end surface of the connecting arm 1, and the nozzle 4 is arranged below the fixing ring 2;

[0026] The upper end of the fixed ring 2 is provided with a rotating adjustment ring 5, the upper end of the rotating adjustment ring 5 is provided with a sealing ring 6, and the inner end surface of the sealing ring 6 is provided with a connecting column 7;

[0027] The rotating adjustment ring 5 also includes an inner gear ring 501, a positioning gear 502, and a spoiler 503. The inner gear ring 501 is fixedly mounted on the inner wall end face of the rotating adjustment ring 5, the tooth groove of the positioning gear 502 is engaged with the inner gear ring 501, and the spoiler 503 is sleeved on the outer end face of the positioning gear 502.

[0028] In this embodiment, the fixing ring 2 further includes a bearing 201 and a receiving ring 202. The bearing 201 is movably connected to the wall end surface of the fixing ring 2, and the receiving ring 202 is fixedly connected to the upper end of the bearing 201. The receiving ring 202 is movably connected to the bottom of the positioning gear 502, and a shaft seat structure is provided at the connection.

[0029] Specifically, such as Figure 1 and Figure 2 As shown, the receiving ring 202 is connected to the middle of the bearing 201 and remains fixed, and the positioning gear 502 is installed on the upper end surface of the receiving ring 202;

[0030] In this embodiment, five groups of positioning gears 502 and spoilers 503 are provided, and are equidistantly distributed in an annular pattern on the upper end surface of the receiving ring 202. The outer end surface of the fixing ring 2 is connected to a strip structure, and the lock buckle 3 passes through the inner end of the strip structure.

[0031] Specifically, such as Figure 3 As shown, the five sets of positioning gears 502 and the spoiler 503 will rotate in different directions when the rotary adjustment ring 5 rotates clockwise and counterclockwise, respectively, so that the spoiler 503 switches between the water flow position and the edge;

[0032] In this embodiment, the bearing 201 is fixedly connected to the upper end of the nozzle 4, and the receiving ring 202 and the bearing 201 need to be connected to the external fixed structure before installation and use; the spoiler 503 is an overall right-angle structure, and its inner and outer sides are rounded on the left and right, and the spoiler 503 is made of transparent colloid material.

[0033] The working principle and usage process of the present invention are as follows: when the structure is used as a nozzle of a semiconductor purification device, the operator can install it on the end of the high-pressure cleaning equipment through the connecting column 7. When the water flow is delivered to the inside of the structure, the operator can drive the rotating adjustment ring 5 by toggling the connecting arm 1. The fixed ring 2 connected to the connecting arm 1 rotates at its outer end through the connection of the internal bearing 201, and the rotating adjustment ring 5 is driven in the same direction by the connecting arm 1 under the connection of the lock buckle 3. When the rotating adjustment ring 5 rotates, the inner gear ring 501 on its inner side rotates in the same direction and simultaneously drives the five groups of positioning gears 502 meshed with it. The positioning gear 502 rotates according to the direction of the rotating adjustment ring 5 and drives the baffle 503 connected to the bottom end. When the baffle 503 rotates toward the middle of the fixed ring 2, the baffle 503 will block the water flow flowing through the inside of the rotating adjustment ring 5. The water flow blocking area is determined according to the rotation amplitude of the baffle 503.

[0034] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A nozzle for a semiconductor equipment purification device, comprising a connecting arm (1), a fixing ring (2), a locking buckle (3) and a nozzle (4), wherein the fixing ring (2) is arranged at the middle part of the front end of the connecting arm (1), the locking buckle (3) is arranged on the upper end surface of the connecting arm (1), and the nozzle (4) is arranged below the fixing ring (2), characterized in that: The upper end of the fixed ring (2) is provided with a rotation adjustment ring (5), the upper end of the rotation adjustment ring (5) is provided with a sealing ring (6), and the inner end surface of the sealing ring (6) is provided with a connecting column (7); The rotating adjustment ring (5) further comprises an inner gear ring (501), a positioning gear (502), and a spoiler (503); the inner gear ring (501) is fixedly mounted on the inner wall end face of the rotating adjustment ring (5); the tooth groove of the positioning gear (502) is meshed with the inner gear ring (501); and the spoiler (503) is sleeved on the outer end face of the positioning gear (502).

2. The nozzle for semiconductor equipment purification device according to claim 1, characterized in that: The fixing ring (2) further comprises a bearing (201) and a receiving ring (202), wherein the bearing (201) is movably connected to the wall end surface of the fixing ring (2), and the receiving ring (202) is fixedly connected to the upper end of the bearing (201).

3. The nozzle for semiconductor equipment purification device according to claim 2, characterized in that: The receiving ring (202) is in a movable connection with the bottom of the positioning gear (502), and a shaft seat structure is provided at the connection.

4. The nozzle for semiconductor equipment purification device according to claim 1, characterized in that: The positioning gears (502) and the spoilers (503) are each provided in five groups and are distributed in an equidistant annular pattern on the upper end surface of the receiving ring (202).

5. The nozzle for semiconductor equipment purification device according to claim 1, characterized in that: The outer end surface of the fixing ring (2) is connected to a strip structure, and the lock buckle (3) passes through the inner end of the strip structure.

6. The nozzle for semiconductor equipment purification device according to claim 2, characterized in that: The bearing (201) is fixedly connected to the upper end of the nozzle (4), and the receiving ring (202) and the bearing (201) need to be connected to an external fixed structure before installation and use.

7. The nozzle for semiconductor equipment purification device according to claim 1, characterized in that: The spoiler (503) is a right-angle structure as a whole, and both the inner and outer sides thereof are rounded on the left and right sides, and the spoiler (503) is made of a transparent colloid material.

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