Semiconductor plasma degumming machine

Abstract

The utility model relates to a semiconductor plasma degumming machine applied to the field of degumming equipment, which comprises an equipment cavity, the inner end of the equipment cavity is provided with a storage tray, the inner end of the storage tray is fixedly connected with a hollow-out inner plate, the upper end of the hollow-out inner plate is provided with a plurality of pairs of clamping pieces, and each clamping piece comprises a cylindrical stand column. A circular groove inner hole is formed in the outer end of the cylindrical stand column, an electromagnetic inner block is fixedly connected to the inner side wall of the circular groove inner hole, a limiting transverse rod is slidably connected to the inner end of the circular groove inner hole, a linkage iron sheet is fixedly connected to the end, close to the electromagnetic inner block, of the limiting transverse rod, and a spring is fixedly connected between the linkage iron sheet and the electromagnetic inner block. According to the semiconductor plasma degumming machine, through the semiconductor plasma degumming machine with the material clamping function, the workpiece to be degummed is not directly placed on the hollow inner plate, so that an operator can quickly find a proper acting point when taking out the workpiece to be degummed, and mechanical damage to the workpiece to be degummed is avoided.

Description

Technical Field

[0001] The utility model relates to a semiconductor plasma debonding machine, in particular to a semiconductor plasma debonding machine used in the field of debonding equipment. Background Art

[0002] The principle of a plasma stripper is similar to that of plasma cleaning, primarily removing photoresist through a reaction between oxygen nuclei and the photoresist in a plasma environment. Since photoresist is primarily composed of hydrocarbon organic compounds, under the influence of radio frequency or microwaves, the process gas oxygen is ionized into oxygen atoms, which react chemically with the photoresist to produce carbon monoxide and water, which are then vacuumed away by a pump, completing the photoresist removal. Adding nitrogen or hydrogen to the reaction gas can improve stripping performance and enhance residue removal. Compared to traditional chemical stripping methods, plasma strippers offer higher cleaning efficiency and less environmental pollution.

[0003] The specification of Chinese patent CN117732804A discloses a plasma degumming machine, which includes a vacuum box, an ionization component, a bunching component, a degumming mechanism, a brush, a clamping mechanism, a residual glue collection mechanism, a suction cup and a filtering mechanism. It solves the problem that after the plasma degumming machine in the prior art removes the glue on the surface of the wafer through high-energy particles, the residual glue and glue chips formed fall into the degumming machine, which increases the difficulty of the degumming machine cleaning process. In addition, there is no effective way to remove the harmful gases generated during the high-energy particle ionization process, which may cause certain harm to the human body.

[0004] The specification of Chinese patent CN219832561U discloses a plasma degumming machine, which relates to the technical field of plasma degumming equipment. The machine includes a chassis, a wafer placement unit and an airflow ion guide unit. The ionized airflow can be swung to flow to the wafer surface through a guide plate. The quartz plate in the guide plate can eliminate high-energy active particles again, forming an airflow moving in the left and right directions, which is conducive to blowing away the powder generated by degumming on the wafer surface.

[0005] In the prior art, the workpiece to be debonded is usually placed directly on a storage tray. When the workpiece to be debonded needs to be taken out after debonding is completed, especially when facing some thinner workpieces, due to their thin thickness, it is difficult for the operator to find a suitable fulcrum when taking out the workpiece. The workpiece may also be damaged due to improper force, causing the workpiece to be subjected to uneven pulling force during separation, resulting in strong friction between the workpiece and the storage tray, which can easily cause mechanical damage to the wafer. Therefore, it is necessary to design a semiconductor plasma debonding machine with a clamping function to solve the above problems. Summary of the Invention

[0006] In view of the above-mentioned existing technology, the technical problem to be solved by the present invention is that the workpiece to be debonded is usually placed directly on the storage tray, making it difficult for the operator to find a suitable fulcrum when removing the workpiece, causing the workpiece to be subjected to uneven pulling force during separation, which can easily cause mechanical damage to the wafer.

[0007] In order to solve the above problems, the utility model provides a semiconductor plasma degumming machine, including an equipment cavity, a storage tray is installed at the inner end of the equipment cavity, the inner end of the storage tray is fixedly connected to a hollow inner plate, and the upper end of the hollow inner plate is provided with multiple pairs of clamping members, the clamping members include a cylindrical column, the outer end of the cylindrical column is provided with a circular groove inner hole, the inner side wall of the circular groove inner hole is fixedly connected to an electromagnetic inner block, the inner end of the circular groove inner hole is slidably connected to a limiting cross bar, the limiting cross bar is fixedly connected to an end close to the electromagnetic inner block with a linkage iron sheet, and a spring is fixedly connected between the linkage iron sheet and the electromagnetic inner block.

[0008] In the above-mentioned semiconductor plasma degumming machine, this solution uses a semiconductor plasma degumming machine with a clamping function, so that the workpiece to be degummed is not placed directly on the hollow inner plate, so that the operator can quickly find a suitable fulcrum when taking out the workpiece to be degummed, and will not cause mechanical damage to the workpiece to be degummed.

[0009] As a further improvement of the present application, a plurality of circular holes are provided at the upper end of the hollow inner plate, and the clamping member is engaged with the hollow inner plate through the plurality of circular holes.

[0010] As a further improvement of the present application, the lower end of the cylindrical column is fixedly connected to a snap-fit ​​main rod, which passes through the corresponding circular hole.

[0011] As a further improvement of the present application, a small rubber ball is fixedly connected to the lower end of the engaging main rod, and the small rubber ball is engaged with the corresponding circular hole.

[0012] As a further improvement of the present application, a V-shaped opening is provided at one end of the limiting cross bar away from the inner hole of the circular groove.

[0013] As another improved supplement of the present application, one end of the V-shaped opening away from the electromagnetic inner block is fixedly connected to a flexible outer sheet.

[0014] As another improved supplement to the present application, a device door panel is hingedly connected to the left side of the front end of the device cavity, and the device door panel and the device cavity are engaged with each other.

[0015] In summary, this solution can place multiple clamps on the outer side of the workpiece to be de-glued according to the size of the workpiece to be de-glued, and make the side end position of the workpiece to be de-glued be engaged with the inner side of the cylindrical column in the clamp, so that a spacing space is formed between the workpiece to be de-glued and the circular hole. Through this semiconductor plasma de-gluing machine with a clamping function, the workpiece to be de-glued is not directly placed on the hollow inner plate. When some thinner workpieces to be de-glued need to be taken out after de-gluing is completed, the operator can quickly find a suitable fulcrum when taking out the workpiece to be de-glued, and will not damage the workpiece to be de-glued due to improper force. The workpiece to be de-glued is subjected to a more uniform pulling force during separation, avoiding strong friction between the workpiece to be de-glued and the hollow inner plate, and will not cause mechanical damage to the workpiece to be de-glued. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an axonometric view of the device cavity according to the first embodiment of the present application;

[0017] Figure 2 This is a diagram of the interior of the device cavity according to the first embodiment of the present application;

[0018] Figure 3 This is an enlarged view of the storage tray of the first embodiment of the present application;

[0019] Figure 4 This is a partially cutaway enlarged view of the storage tray according to the first embodiment of the present application;

[0020] Figure 5 This is a side view of the electromagnetic inner block in the first embodiment of the present application in a power-off state;

[0021] Figure 6 A top view of the electromagnetic inner block in the energized state according to the first and second embodiments of the present application;

[0022] Figure 7 This is a side view of the first embodiment of the present application in which two limiting cross bars are in a power-off state, clamping a workpiece to be debonded.

[0023] Description of the numbers in the figure:

[0024] 1. Equipment cavity; 2. Equipment door panel; 3. Storage tray; 4. Hollow inner panel; 5. Round hole; 6. Workpiece to be debonded; 7. Clamping piece; 8. Engaging main rod; 9. Rubber ball; 10. Cylindrical column; 12. Inner hole of circular groove; 13. Electromagnetic inner block; 14. Spring; 15. Linkage iron sheet; 17. Limiting cross bar; 18. Flexible outer sheet; 19. V-shaped opening. DETAILED DESCRIPTION

[0025] Two implementation modes of the present application are described in detail below with reference to the accompanying drawings.

[0026] The first implementation method:

[0027] Figure 2-7 A semiconductor plasma degumming machine is shown, which includes an equipment cavity 1, a storage tray 3 is installed at the inner end of the equipment cavity 1, and a hollow inner plate 4 is fixedly connected to the inner end of the storage tray 3. A plurality of pairs of clamping members 7 are provided at the upper end of the hollow inner plate 4. The clamping members 7 include a cylindrical column 10, and a circular groove inner hole 12 is opened at the outer end of the cylindrical column 10. An electromagnetic inner block 13 is fixedly connected to the inner side wall of the circular groove inner hole 12. The inner end of the circular groove inner hole 12 is slidably connected to a limiting cross bar 17. The limiting cross bar 17 is fixedly connected to an end of the limiting cross bar 17 close to the electromagnetic inner block 13 with a linkage iron sheet 15, and a spring 14 is fixedly connected between the linkage iron sheet 15 and the electromagnetic inner block 13.

[0028] Figure 2-7 It is shown that a plurality of circular holes 5 are opened at the upper end of the hollow inner plate 4, and the clamping part 7 is engaged with the hollow inner plate 4 through the plurality of circular holes 5. The lower end of the cylindrical column 10 is fixedly connected with a locking main rod 8, and the locking main rod 8 passes through the corresponding circular holes 5. The lower end of the locking main rod 8 is fixedly connected with a rubber ball 9, and the rubber ball 9 and the corresponding circular hole 5 are engaged with each other. The equipment door panel 2 is hinged to the left side of the front end of the equipment cavity 1, and the equipment door panel 2 and the equipment cavity 1 are engaged with each other.

[0029] Figure 1-7 It is shown that the equipment cavity 1 adopts the inductively coupled isotropic plasma excitation method in all directions, which is suitable for all substrates and complex geometric structures and can perform plasma debonding operations. It has a wider range of applications and is easier to operate.

[0030] When the workpiece 6 to be de-glued is to be processed, first, the electromagnetic inner block 13 is energized (how to energize and de-energize the electromagnetic inner block 13 is a well-known technology for those skilled in the art and will not be described in detail here). After the electromagnetic inner block 13 is energized, under the action of magnetic attraction, the linkage iron sheet 15 will drive the limiting cross bar 17 to slide toward the inner side of the circular groove inner hole 12 and cause the spring 14 to contract. Then, the workpiece 6 to be de-glued is placed horizontally between the two clamping members 7, and the workpiece 6 to be de-glued is aligned with the limiting cross bar 17, and the electromagnetic inner block 13 is de-energized, so that the spring 14 can rebound to a certain extent. The rebound of the spring 14 will cause the limiting cross bar 17 to counteract the workpiece 6 to be de-glued, and because the spring 14 has not fully rebounded, the limiting cross bar 17 can apply a clamping force to the workpiece 6 to be de-glued under the action of the spring 14, and then the workpiece 6 to be de-glued can be clamped and fixed above the hollow inner plate 4 through a pair of clamping members 7, so that a gap is formed between the workpiece 6 to be de-glued and the hollow inner plate 4. After the workpiece 6 to be degummed is removed, the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator, and the workpiece 6 to be degummed can be removed by the operator,

[0031] Since the clamping member 7 is engaged with the hollow inner plate 4 through the circular hole 5, the distance between the clamping members 7 can be adjusted by inserting the clamping member 7 into different circular holes 5, so that the clamping member 7 can be adaptively adjusted according to the size of the workpiece 6 to be debonded, and when the engaging main rod 8 and the corresponding hollow inner plate 4 are engaged with each other, adding a small rubber ball 9 thereunder can make the engaging state of the engaging main rod 8 tighter and less likely to cause the risk of loosening.

[0032] The second implementation method:

[0033] Figure 6A semiconductor plasma degumming machine is shown, in which a V-shaped opening 19 is provided at one end of the limiting cross bar 17 away from the inner hole 12 of the circular groove, and a flexible outer sheet 18 is fixedly connected to the end of the V-shaped opening 19 away from the electromagnetic inner block 13. The V-shaped opening 19 allows the limiting cross bar 17 to better fit the side walls of workpieces of different shapes when the side wall end of the workpiece 6 to be degummed is in contact with the V-shaped contact surface, so that the force point of the limiting cross bar 17 is expanded, and the distribution of multiple force points can effectively prevent the workpiece 6 to be degummed from sliding or rotating during the clamping process, thereby improving the reliability of clamping. At the same time, a flexible outer sheet 18 is provided at the outer end of the limiting cross bar 17, and the flexible outer sheet 18 can reduce the hard contact of the limiting cross bar 17 with the workpiece 6 to be degummed, thereby further reducing the chance of damage to the workpiece 6 to be degummed.

[0034] In view of current actual needs, the protection scope of the above-mentioned implementation mode adopted in this application is not limited to this. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A semiconductor plasma degumming machine, characterized by: The invention comprises an equipment cavity (1), wherein a storage tray (3) is installed at the inner end of the equipment cavity (1), the inner end of the storage tray (3) is fixedly connected to a hollow inner plate (4), the upper end of the hollow inner plate (4) is provided with multiple pairs of clamping members (7), the clamping members (7) comprise cylindrical columns (10), the outer end of the cylindrical columns (10) is provided with a circular groove inner hole (12), the inner side wall of the circular groove inner hole (12) is fixedly connected to an electromagnetic inner block (13), the inner end of the circular groove inner hole (12) is slidably connected to a limiting cross bar (17), the limiting cross bar (17) is fixedly connected to an end of a linkage iron sheet (15) close to the electromagnetic inner block (13), and a spring (14) is fixedly connected between the linkage iron sheet (15) and the electromagnetic inner block (13).

2. A semiconductor plasma stripping machine according to claim 1, characterized in that: A plurality of circular holes (5) are provided at the upper end of the hollow inner plate (4), and the clamping member (7) is engaged with the hollow inner plate (4) through the plurality of circular holes (5).

3. A semiconductor plasma stripping machine according to claim 2, characterized in that: The lower end of the cylindrical column (10) is fixedly connected to a snap-fit ​​main rod (8), and the snap-fit ​​main rod (8) passes through the corresponding circular hole (5).

4. A semiconductor plasma stripping machine according to claim 3, characterized in that: A small rubber ball (9) is fixedly connected to the lower end of the engaging main rod (8), and the small rubber ball (9) and the corresponding circular hole (5) are engaged with each other.

5. The semiconductor plasma stripping machine according to claim 1, characterized in that: A V-shaped opening (19) is provided at one end of the limiting cross bar (17) away from the inner hole of the circular groove (12).

6. The semiconductor plasma stripping machine according to claim 5, characterized in that: One end of the V-shaped opening (19) away from the electromagnetic inner block (13) is fixedly connected to a flexible outer sheet (18).

7. The semiconductor plasma stripping machine according to claim 1, characterized in that: The left side of the front end of the equipment cavity (1) is hingedly connected to an equipment door panel (2), and the equipment door panel (2) and the equipment cavity (1) are engaged with each other.

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