Electrostatic chuck with ejector pin device
By integrating the thimble device on the electrostatic chuck body, the automatic wafer separation is achieved using the elastic force of the thimble spring and the thimble body, solving the problem of increasing costs and extending the disengagement time of the robotic arm control thimble, improving work efficiency and reducing costs.
Patent Information
- Application Number
- CN202422579771.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-25
AI Technical Summary
The existing electrostatic chucks use robotic arms to control the thimble to increase costs and extend wafer disengagement time, reducing working efficiency.
The thimble device is integrated on the electrostatic chuck body, including a base thimble hole and a thimble assembly, and the elastic force of the thimble spring and the thimble body can achieve automatic separation of the wafer and avoid the use of the robotic arm.
Reduces overall costs and improves the efficiency of separation between wafer and electrostatic chuck body.
Smart Images
Figure CN223250605U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck with an ejector pin device. Background Art
[0002] In the prior art, the ejector pins used in the electrostatic chuck are additionally designed pins on the robotic arm. When the wafer is desorbed from the electrostatic chuck, the power needs to be cut off, and then the ejector pins on the robotic arm intervene to separate the wafer from the electrostatic chuck.
[0003] However, setting up a dedicated robotic arm to control the ejector pins increases costs and increases the time it takes to detach the wafer, thereby reducing work efficiency. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide an electrostatic chuck with an ejector pin device to solve the problems raised in the background technology, improve work efficiency and reduce costs.
[0005] In order to solve the above technical problems, the technical solution of the utility model is:
[0006] An electrostatic chuck with an ejector pin device comprises an electrostatic chuck body, the electrostatic chuck body comprising an electrostatic chuck base and an electrostatic chuck ceramic disk, the electrostatic chuck base being provided with a plurality of base ejector pin holes, the electrostatic chuck ceramic disk being provided with through holes corresponding to the base ejector pin holes, an ejector pin assembly being provided in any one of the base ejector pin holes, the ejector pin assembly comprising a base, an ejector pin body being provided above the base, the base and the ejector pin body being connected by an ejector pin spring, when a wafer is adsorbed on the electrostatic chuck ceramic disk, the upper surface of the ejector pin body is flush with the upper surface of the electrostatic chuck ceramic disk, the ejector pin spring is compressed, at which time the total elastic force of the ejector pin spring is less than the adsorption force of the electrostatic chuck body, and the total elastic force of the ejector pin spring is greater than the gravity of the wafer on the electrostatic chuck body.
[0007] Preferably, the ejector body is made of metal aluminum.
[0008] Preferably, the ejector body includes an ejector, a limiting ring is provided at the bottom of the ejector, the diameter of the ejector is less than or equal to the diameter of the through hole, the diameter of the limiting ring is greater than the diameter of the through hole, and the length of the ejector is greater than the length of the through hole.
[0009] Preferably, the base ejector hole includes a threaded hole located at the bottom end, and the base is cooperatively connected to the threaded hole.
[0010] Preferably, there are three base pinholes, the central axes of the three base pinholes are located on the circumference of the same circular ring, the center of the circular ring is the center of the electrostatic chuck base, and the three base pinholes are evenly distributed on the circular ring.
[0011] Preferably, the ejector pin body is made of metal iron, and the base is an electromagnet. When the electrostatic chuck body adsorbs the wafer, the base adsorbs the ejector pin body. When the wafer is separated from the electrostatic chuck, the base is powered off.
[0012] The above technical solution has the following beneficial effects:
[0013] By integrating the ejector pin assembly, compared with the existing method of separating wafers with a robotic arm, the overall cost can be reduced, the work efficiency can be improved, and the time required to separate the wafer from the electrostatic chuck body can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a partial cross-sectional structural diagram of an electrostatic chuck with an ejector pin device according to the present invention;
[0015] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of A in the figure. DETAILED DESCRIPTION
[0016] The following further describes specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the descriptions of these embodiments are intended to aid understanding of the present invention and do not constitute limitations on the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined with one another as long as they do not conflict with one another.
[0017] refer to Figure 1 、 Figure 2 An electrostatic chuck with an ejector pin device includes an electrostatic chuck body, which includes an electrostatic chuck base 1 and an electrostatic chuck ceramic disc 2. The electrostatic chuck base 1 and the electrostatic chuck ceramic disc 2 are both disc-shaped. The electrostatic chuck base 1 is provided with a plurality of base ejector pin holes 6, and the electrostatic chuck ceramic disc 2 is provided with through holes 7 corresponding to the base ejector pin holes. When the electrostatic chuck body is powered on, the wafer is adsorbed on the upper surface of the electrostatic chuck ceramic disc 2. When the wafer is processed, it needs to be separated from the electrostatic chuck body, and the ejector pin assembly lifts the wafer through the through holes 7 to complete the separation.
[0018] An ejector assembly is provided in any one of the ejector holes 6 of the base, and the ejector assembly includes a base 3, an ejector body is provided above the base 3, and the base 3 and the ejector body are connected by an ejector spring 4. When a wafer is adsorbed on the electrostatic chuck ceramic disk 2, the ejector body is subjected to the pressure of the wafer, so that the upper surface of the ejector body is flush with the upper surface of the electrostatic chuck ceramic disk 2. At this time, the ejector spring 4 is compressed. At this time, the total elastic force of the ejector spring 4 is less than the adsorption force of the electrostatic chuck body, thereby preventing the electrostatic chuck body from failing to adsorb. The total elastic force of the ejector spring 4 is greater than the gravity of the wafer on the electrostatic chuck body, ensuring that the elastic force of the ejector spring 4 can lift the wafer after the electrostatic chuck body is powered off, thereby completing the separation;
[0019] The material of the ejector body can be made of metal aluminum material, or other metal or non-metal materials;
[0020] The ejector pin body includes an ejector pin 5, and a limiting ring 8 is provided at the bottom of the ejector pin 5. The limiting ring 8 is used to limit the upward position of the ejector pin. By setting the diameter of the ejector pin 5 to be less than or equal to the diameter of the through hole 7, and the diameter of the limiting ring 8 to be larger than the diameter of the through hole 7, the limiting ring 8 can be restricted by the through hole 7, thereby restricting the ejector pin 5. The length of the ejector pin 5 is greater than the length of the through hole 7. When the position of the ejector pin 5 is restricted, the wafer can be lifted by the ejector pin 5 to complete the separation work.
[0021] The bottom of the limiting ring 8 is provided with an upper connecting block 10 for connecting with the ejector spring 4, and the top of the base is provided with a lower connecting block 9 for connecting with the ejector spring 4;
[0022] The base ejector hole 6 includes a threaded hole at the bottom end, and the base 3 is connected to the threaded hole for easy disassembly, so as to facilitate the replacement of the ejector spring;
[0023] The number of the base ejector pin holes 6 is three, and the central axes of the three base ejector pin holes 6 are located on the circumference of the same circular ring. The circular ring takes the center of the electrostatic chuck base 1 as the center. The three base ejector pin holes 6 are evenly distributed on the circular ring. The three ejector pins 5 work together to lift the wafer. Three ejector pins 5 are set and evenly distributed along the circular ring to better separate the electrostatic chuck body and the wafer. In other implementations of this embodiment, the number of the base ejector pin holes 6 can be set to four, and the four base ejector pin holes 6 are evenly distributed on a circle with the center of the electrostatic chuck ceramic base 1 as the center.
[0024] In another embodiment, the ejector pin body is made of metal iron, and the base 3 is an electromagnet. When the electrostatic chuck body adsorbs the wafer, the base adsorbs the ejector pin body. When the wafer needs to be separated from the electrostatic chuck, the base 3 is powered off. By setting the base 3 as an electromagnet, when the electrostatic chuck body is powered on to adsorb the wafer, the base is charged and adsorbs the ejector pin body made of metal iron. This can avoid the electrostatic chuck body applying an upward separation force to the wafer when adsorbing the wafer, allowing the electrostatic chuck body to adsorb the wafer more stably. When the wafer needs to be separated, the electromagnet is powered off. The ejector body is not attracted, but is pushed upward by the elastic force of the ejector spring 4, lifting and separating the wafer. By configuring the base 3 in the form of an electromagnet, on the one hand, the wafer can be attracted more stably when the electrostatic chuck body is working, and on the other hand, the requirements for the ejector spring 4 are reduced. The ejector spring 4 only needs to be able to lift the wafer, and the adsorption force of the electromagnet can overcome the elastic force of the ejector spring 4. Due to the provision of the upper connecting block 10 and the lower connecting block 9, when the ejector spring 4 is compressed by the magnetic force, it only needs to be compressed until the ejector 5 is lower than the upper surface of the electrostatic chuck ceramic disk.
[0025] By integrating the ejector pin assembly, compared with the existing method of separating wafers with a robotic arm, the overall cost can be reduced, the work efficiency can be improved, and the time required to separate the wafer from the electrostatic chuck body can be reduced.
[0026] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.
Claims
1. An electrostatic chuck with an ejector pin device, characterized in that: It includes an electrostatic chuck body, which includes an electrostatic chuck base and an electrostatic chuck ceramic disk. The electrostatic chuck base is provided with a plurality of base ejector pin holes, and the electrostatic chuck ceramic disk is provided with through holes corresponding to the base ejector pin holes. An ejector assembly is provided in any one of the base ejector pin holes, and the ejector assembly includes a base. An ejector body is provided above the base, and the base and the ejector body are connected by an ejector spring. When a wafer is adsorbed on the electrostatic chuck ceramic disk, the upper surface of the ejector body is flush with the upper surface of the electrostatic chuck ceramic disk, and the ejector spring is compressed. At this time, the total elastic force of the ejector spring is less than the adsorption force of the electrostatic chuck body, and the total elastic force of the ejector spring is greater than the gravity of the wafer on the electrostatic chuck body.
2. An electrostatic chuck with an ejector pin device according to claim 1, characterized in that: The ejector pin body is made of metal aluminum.
3. An electrostatic chuck with an ejector pin device according to claim 2, characterized in that: The ejector body includes an ejector pin, a limiting ring is provided at the bottom of the ejector pin, the diameter of the ejector pin is less than or equal to the diameter of the through hole, the diameter of the limiting ring is greater than the diameter of the through hole, and the length of the ejector pin is greater than the length of the through hole.
4. The electrostatic chuck with an ejector pin device according to claim 1, characterized in that: The base ejector pin hole includes a threaded hole at the bottom end, and the base is cooperatively connected with the threaded hole.
5. An electrostatic chuck with an ejector pin device according to claim 4, characterized in that: There are three base ejector pinholes, and the central axes of the three base ejector pinholes are located on the circumference of the same circular ring. The circular ring has the center of the electrostatic chuck base as its center, and the three base ejector pinholes are evenly distributed on the circular ring.
6. The electrostatic chuck with an ejector pin device according to claim 1, characterized in that: The ejector pin body is made of metal iron, and the base is an electromagnet. When the electrostatic chuck body adsorbs the wafer, the base adsorbs the ejector pin body. When the wafer is separated from the electrostatic chuck, the base is powered off.