Carrier for reflow soldering of power module

Abstract

The utility model discloses a carrier for reflow soldering of a power module, which is characterized in that a carrier body is formed by splicing two flat plates; a groove is formed in each flat plate, a plurality of groups of mounting holes are formed in the bottom of each groove, and each group of mounting holes is formed by arraying a plurality of mounting holes in the longitudinal direction or the transverse direction of the groove; a plurality of groups of pin positioning columns are mounted at the bottom of the groove, and each group of pin positioning columns are arranged around each group of mounting holes; and each PIN substrate is correspondingly inserted into each group of mounting holes, and each PIN substrate is correspondingly mounted on each group of pin positioning columns. The integrated reflow soldering carrier structure is adopted, and the integrated reflow soldering carrier structure is flexibly compatible with various substrate layout structures.

Description

Technical Field

[0001] The utility model relates to relevant technical fields such as power module reflow soldering, and in particular to a carrier for power module reflow soldering. Background Art

[0002] With the development of technology, IGBT automotive power modules are often used in harsh operating conditions such as high current, high heat, and high humidity. More excellent heat dissipation substrates have become an important component of power modules. Today, direct liquid cooling has become the mainstream heat dissipation method for automotive-grade IGBT power modules, that is, adding a needle-shaped heat dissipation structure on the back of the substrate, referred to as "Pin-Fin".

[0003] At present, IGBT automotive power modules are mostly welded using vacuum reflow equipment. These devices are usually only equipped with some conventional vacuum reflow oven tray carriers, which are just standardized power module placement carriers. If you want to weld and produce the mainstream modules with Pin-Fin heat dissipation structure mentioned above, you need to make a special base on which to place the heat dissipation structure, so as to obtain a larger thermal contact area with the vacuum reflow oven tray, so that more sufficient heat can be transferred from the heating plate to the reflow tray, and then to the base, and then from the base to the substrate and the related flux solder on the substrate, so as to achieve the purpose of melting and cooling the welding. This process is time-consuming and inefficient, and cannot fully utilize the performance of the equipment. In addition, the special base cannot be fixed, and is prone to shaking and offset during manual handling and transfer, which can easily scratch the aluminum plate and also lead to low adaptability to automatic mechanization. Utility Model Content

[0004] In view of this, in order to solve the above problems, the purpose of the present invention is to provide a carrier for reflow soldering of power modules, which includes:

[0005] Carrier body, PIN substrate, and several pin positioning columns;

[0006] The carrier body is formed by splicing two flat plates;

[0007] Each of the flat plates is provided with a groove, and the bottom of each of the grooves is provided with a plurality of groups of mounting holes, and each group of the mounting holes is formed by a plurality of the mounting holes arrayed along the longitudinal or transverse direction of the groove;

[0008] Several groups of pin positioning columns are installed at the bottom of the groove, and each group of pin positioning columns is arranged around each group of mounting holes;

[0009] Each of the PIN substrates is correspondingly inserted into each group of the mounting holes, and each of the PIN substrates is correspondingly mounted on each group of the pin positioning columns.

[0010] The above-mentioned carrier for reflow soldering of power modules, wherein the pin positioning column includes: a first positioning part and a second positioning part; the first positioning part is installed on the second positioning part, the first positioning part is arranged in a cylindrical shape, the lower part of the second positioning part is arranged in a cylindrical shape, the upper part of the second positioning part is arranged in a frustum, and the connection between the lower part of the second positioning part and the upper part of the second positioning part is arranged in a rounded corner and forms an arc surface.

[0011] In the above-mentioned carrier for reflow soldering of a power module, the diameter of each of the mounting holes is larger than the diameter of the substrate pins of the PIN substrate.

[0012] In the above-mentioned carrier for reflow soldering of a power module, the depth of each mounting hole is greater than the length of the substrate pin of the PIN substrate.

[0013] In the above-mentioned carrier for reflow soldering of power modules, the edges of the two flat plates are welded to form the carrier body, and the two flat plates are symmetrically arranged along their welded edges.

[0014] In the above-mentioned carrier for reflow soldering of power modules, a chamfer is provided inside each of the mounting holes.

[0015] In the above-mentioned carrier for reflow soldering of power modules, both of the two flat plates are made of metal.

[0016] In the above-mentioned carrier for reflow soldering of a power module, the diameter of the pin positioning column is smaller than the diameter of the positioning hole of the PIN substrate.

[0017] Compared with the prior art, the above technical solution has the following positive effects:

[0018] 1. This utility model adopts an integrated reflow soldering carrier structure, which is flexible and compatible with a variety of substrate layout structures;

[0019] 2. The utility model eliminates the intermediate heat transfer medium and adopts the form of direct contact with the heat source to reduce heat loss. At the same time, the power module with a heat dissipation structure of the PIN substrate is placed in the mounting hole, which increases the heat transfer contact area, improves the heating and cooling condensation rate, and reduces the liquid phase time of the power module solder, further ensuring the high quality of the product;

[0020] 3. The utility model is provided with a plurality of regularly arranged conical structure pin positioning columns, which facilitates manual or automatic mechanical positioning and placement of the power module in the carrier, and the mounting holes are all provided with certain chamfers to avoid burr interference caused by mechanical processing;

[0021] 4. The outer shell material of the pin positioning column of the utility model is made of metal material, which has a lower hardness than copper, reducing the risk of scratching the positioning hole of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of a carrier for reflow soldering of a power module according to the present invention.

[0023] Figure 2 This is a schematic diagram of the PIN substrate in the present invention.

[0024] Figure 3 This is a schematic diagram of the pin positioning column in the utility model.

[0025] Figure 4 This is a schematic diagram of the installation of the PIN substrate in the present utility model.

[0026] 1. Carrier body; 2. Flat plate; 3. Mounting hole; 4. Pin positioning column; 5. PIN substrate; 6. First positioning portion; 7. Second positioning portion; 8. Arc surface; 9. Groove. DETAILED DESCRIPTION

[0027] The present invention will be further described below with reference to the accompanying drawings and specific implementations, but they are not intended to limit the present invention.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by those familiar with this technology. They are not used to limit the conditions for implementation of the present invention and therefore have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the efficacy and purpose of the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of implementation of the present invention. Changes or adjustments in their relative relationships should also be considered as the scope of implementation of the present invention without substantially changing the technical content.

[0029] like Figures 1 to 4 , a carrier for reflow soldering of a power module according to a preferred embodiment is shown, which includes: a carrier body 1 , a PIN substrate 5 , and a plurality of pin positioning columns 4 .

[0030] The carrier body 1 is composed of two flat plates 2. Each flat plate 2 is provided with a groove 9. The bottom of each groove 9 is provided with several groups of mounting holes 3. Each group of mounting holes 3 is formed by a plurality of mounting holes 3 arranged in a longitudinal or transverse array along the groove 9. The bottom of the groove 9 is provided with several groups of pin locating columns 4. Each group of pin locating columns 4 is arranged around each group of mounting holes 3. Each PIN substrate 5 is correspondingly inserted into each group of mounting holes 3, and each PIN substrate 5 is correspondingly mounted on each group of pin locating columns 4.

[0031] During actual use, the positioning hole of the PIN substrate 5 is installed on the pin positioning column 4 mechanically or manually, and the substrate pin of the PIN substrate 5 enters the installation hole. Then the device is transported to the designated position via the conveyor track of the vacuum reflow furnace. The fixed structure inside the furnace cavity presses and fixes the carrier frame. Then the heating plate is slowly lifted and fits to lift the two aluminum plates for heat transfer heating. As the temperature rises, the solder reaches the melting point and melts, realizing the component welding process of the power module.

[0032] Furthermore, in a preferred embodiment, the PIN substrate 5 is placed in the mounting hole 3 on the carrier body 1 and heated by direct contact with a heating plate, eliminating multiple intermediate superimposed heat transfer media. This increases the heated area while reducing heat loss, thereby improving the heating and cooling rates, which, to a certain extent, plays a positive role in meeting the basic production requirements of ensuring quality and quantity.

[0033] The present invention also has the following implementation methods based on the above:

[0034] Furthermore, a carrier for reflow soldering of power modules is provided, wherein the pin locating column 4 includes a first locating portion 6 and a second locating portion 7. The first locating portion 6 is mounted on the second locating portion 7. The first locating portion 6 is cylindrical, the lower portion of the second locating portion 7 is cylindrical, and the upper portion of the second locating portion 7 is truncated. The connection between the lower portion of the second locating portion 7 and the upper portion of the second locating portion 7 is rounded and forms an arc surface 8. Specifically, the pin locating column 4 is used to mount the PIN substrate 5 and the carrier body 1 together.

[0035] Furthermore, a carrier for reflow soldering of a power module is provided, wherein the diameter of each mounting hole 3 is larger than the diameter of the substrate pin of the PIN substrate 5. Specifically, the substrate pin of the PIN substrate 5 is easily inserted into the mounting hole 3.

[0036] Furthermore, a carrier for reflow soldering of a power module is provided, wherein the depth of each mounting hole 3 is greater than the length of the substrate pin of the PIN substrate 5 .

[0037] Furthermore, a carrier for reflow soldering of a power module is provided, wherein the edges of two flat plates 2 are welded to form a carrier body 1 , and the two flat plates 2 are symmetrically arranged along their welded edges.

[0038] Furthermore, a carrier for reflow soldering of power modules is provided, wherein each mounting hole 3 is provided with a chamfer. Specifically, the chamfers provided in the mounting holes 3 can effectively avoid burrs generated during machining and effectively ensure the flatness of the aluminum plate after the holes are opened.

[0039] Furthermore, a carrier for reflow soldering of a power module is provided, wherein both flat plates 2 are made of metal. Specifically, the two flat plates 2 can be made of aluminum.

[0040] Furthermore, a carrier for reflow soldering of a power module is provided, wherein the diameter of the pin positioning column 4 is smaller than the diameter of the positioning hole of the PIN substrate 5 .

[0041] In a preferred embodiment, the outer contour of each group of mounting holes 3 on the vehicle body 1 is rectangular, and each mounting hole 3 is a circular mounting hole. The shape of the mounting hole 3 can also be triangular, square, etc., which has high compatibility. When faced with various large automotive-grade power modules during the production process, it can respond more flexibly while ensuring production efficiency and quality.

[0042] In a preferred embodiment, the number, shape and distribution of the mounting holes 3 are all based on a group as an area unit, and the mounting holes 3 of each area unit are arranged in a centrally symmetrical manner, so that the produced power modules are evenly limited and distributed on the reflow carrier.

[0043] In a preferred embodiment, pin locating posts 4, randomly arranged in the same row or column, are positioned around each set of mounting holes 3. These pin locating posts 4 face the positioning holes of the PIN substrate 5 and position the substrate pins of the PIN substrate within the through-holes. The clearance tolerance between the pin locating posts 4 and the positioning holes of the PIN substrate 5 is smaller than the clearance tolerance between the substrate pins of the PIN substrate 5 and the mounting holes 3, ensuring that the wobble and movement of the power module are within acceptable limits. This secures the product position, facilitates the use of automated production lines, and improves production efficiency and quality.

[0044] The above description is only a preferred embodiment of the present invention and does not limit the implementation method and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A carrier for reflow soldering of power modules, characterized in that: include: Carrier body, PIN substrate, and several pin positioning columns; The carrier body is formed by splicing two flat plates; Each of the flat plates is provided with a groove, and the bottom of each of the grooves is provided with a plurality of groups of mounting holes, and each group of the mounting holes is formed by a plurality of the mounting holes arrayed along the longitudinal or transverse direction of the groove; Several groups of pin positioning columns are installed at the bottom of the groove, and each group of pin positioning columns is arranged around each group of mounting holes; Each of the PIN substrates is correspondingly inserted into each group of the mounting holes, and each of the PIN substrates is correspondingly mounted on each group of the pin positioning columns.

2. A carrier for reflow soldering of a power module according to claim 1, characterized in that: The pin positioning column includes: a first positioning part and a second positioning part; the first positioning part is installed on the second positioning part, the first positioning part is cylindrical, the lower part of the second positioning part is cylindrical, the upper part of the second positioning part is frustum, and the connection between the lower part of the second positioning part and the upper part of the second positioning part is rounded and forms an arc surface.

3. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The diameter of each mounting hole is larger than the diameter of the substrate pin of the PIN substrate.

4. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The depth of each mounting hole is greater than the length of the substrate pin of the PIN substrate.

5. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The edges of the two flat plates are welded to form the carrier body, and the two flat plates are symmetrically arranged along the welded edges.

6. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The interior of each mounting hole is provided with a chamfer.

7. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The two flat plates are both made of metal.

8. The carrier for reflow soldering of a power module according to claim 1, characterized in that: The diameter of the pin positioning column is smaller than the diameter of the positioning hole of the PIN substrate.

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