Automatic processing equipment for semiconductor wafer surface

Abstract

The utility model discloses a semiconductor wafer surface automatic processing device, which comprises a turntable and a chassis, the middle part of the top of the turntable penetrates through and is rotatably connected with a support shaft, and the lower end of the support shaft penetrates through and is rotatably connected with a support shaft. And the side wall, close to the upper end, of the supporting shaft is fixedly connected with three third fixing discs which are evenly distributed at equal angles, the side walls, at through holes, of the third fixing discs penetrate through and are slidably connected with limiting blocks, and the left portion of the top of the chassis is fixedly connected with two second electric push rods which are distributed front and back. According to the wafer polishing device, firstly, a plurality of through holes are formed in a third fixing disc, a wafer is clamped through a limiting block, then polishing heads are arranged on the upper side and the lower side corresponding to the through holes of the third fixing disc, an air cylinder is controlled to stretch, and then a second motor is controlled to work; and the multiple polishing heads work at the same time and conduct polishing machining on the upper surfaces and the lower surfaces of the multiple wafers at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to an automatic processing device for the surface of a semiconductor wafer. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. The silicon crystal rod is ground, polished, and sliced ​​to form a silicon wafer, also known as a wafer.

[0003] At present, in the process of polishing wafers, one side of the wafer is generally polished first, and then the other side is polished. Such polishing efficiency is low. Therefore, an automated surface processing equipment for semiconductor wafers is introduced to solve the above technical problems. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor wafer surface automatic processing equipment.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a semiconductor wafer surface automated processing equipment, comprising a turntable and a chassis, a support shaft passing through the middle of the top of the turntable and rotatably connected, a support shaft passing through the lower end of the support shaft and rotatably connected to the support shaft, three third fixed plates uniformly distributed at equal angles are fixedly connected to the side wall of the support shaft near the upper end, the side walls of the through holes of the third fixed plate are all passed through and slidably connected to the limiting blocks, two second electric push rods distributed front and back are fixedly connected to the left part of the top of the chassis, the other ends of the second electric push rods are fixedly connected to the second fixed plate, and the top of the second fixed plate is fixedly connected There are evenly distributed support rods that pass through and are slidably connected to the turntable, and a material frame is passed through and slidably connected between the upper ends of the three adjacent support rods, and the material frame corresponds to the through-holes on the third fixed plate. The upper ends of the support rods are fixedly connected to the tray, and the tray is slidably connected to the material frame. A first fixed plate is provided above and below the third fixed plate on the right side, and the two first fixed plates are passed through and rotatably connected to an evenly distributed connecting shaft on one side close to the third fixed plate, and the two first fixed plates are fixedly connected to the second motor on the opposite sides, and the output end of the second motor passes through the first fixed plate, and the top front of the chassis is fixedly connected to the first motor.

[0006] For further description of the above technical solution:

[0007] A first gear is provided below the turntable, and a support shaft passes through and is fixedly connected to the first gear.

[0008] For further description of the above technical solution:

[0009] A spring is fixedly connected to the middle portion of the opposite side of the limit block, and the other end of the spring passes through and is fixedly connected to the third fixed plate.

[0010] For further description of the above technical solution:

[0011] A first electric push rod is fixedly connected to the middle of the bottom of the material frame, and the first electric push rod is fixedly connected to the turntable.

[0012] For further description of the above technical solution:

[0013] Wafers are evenly and vertically distributed on the top of the tray and are located in the material frame.

[0014] For further description of the above technical solution:

[0015] One end of the connecting shaft close to the third fixed disk is fixedly connected with a grinding head, and the grinding head corresponds to the through hole of the third fixed disk.

[0016] For further description of the above technical solution:

[0017] The output end of the second motor and the middle of the connecting shaft are both penetrated and fixedly connected with a third gear, and the third gear on the second motor is meshed with the third gear on the connecting shaft.

[0018] For further description of the above technical solution:

[0019] A fixing bracket is fixedly connected to the right side of the turntable, and the fixing bracket is fixedly connected to the chassis.

[0020] For further description of the above technical solution:

[0021] The two first fixed disks are fixedly connected to cylinders at the rear middle portion of the opposite side, and the other ends of the upper and lower cylinders are fixedly connected to the fixed bracket and the turntable respectively.

[0022] For further description of the above technical solution:

[0023] The output end of the first motor is fixedly connected to a second gear, and the second gear is meshed with the first gear.

[0024] The utility model has the following beneficial effects:

[0025] In the present utility model, firstly, a plurality of through holes are provided on the third fixed plate, and the wafer is clamped by a limit block, and then grinding heads are provided on the upper and lower sides corresponding to the through holes of the third fixed plate, and then the cylinder is controlled to extend so that the two grinding heads contact the upper and lower surfaces of the wafer, and then the second motor is controlled to work so that the multiple grinding heads work simultaneously and grind the upper and lower surfaces of multiple wafers at the same time, thereby greatly improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of a semiconductor wafer surface automated processing equipment proposed by the present invention;

[0027] Figure 2 This is a bottom view of a semiconductor wafer surface automated processing device proposed by the present invention;

[0028] Figure 3 This is a schematic diagram of a first fixed plate of a semiconductor wafer surface automated processing equipment proposed by the present invention;

[0029] Figure 4 This is a schematic diagram of a material frame of a semiconductor wafer surface automated processing equipment proposed by the present invention;

[0030] Figure 5 This is an exploded diagram of the local structure of a semiconductor wafer surface automated processing equipment proposed by the present invention;

[0031] Figure 6 This is a cross-sectional view of a third fixed plate of a semiconductor wafer surface automated processing device proposed by the present invention;

[0032] Figure 7 This is a schematic diagram of a third fixed plate of a semiconductor wafer surface automated processing equipment proposed by the present invention.

[0033] Legend:

[0034] 1. Fixed bracket; 2. First fixed plate; 3. Turntable; 4. Chassis; 5. Spring; 6. Limit block; 7. Support shaft; 8. First gear; 9. Second fixed plate; 10. Second gear; 11. First motor; 12. Cylinder; 13. Second motor; 14. Connecting shaft; 15. Grinding head; 16. Third gear; 17. Wafer; 18. Material frame; 19. First electric push rod; 20. Support rod; 21. Second electric push rod; 22. Tray; 23. Third fixed plate. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limiting the present invention. The terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, unless otherwise expressly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections, indirect connections through an intermediate medium, or internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Reference Figure 1-7, the utility model provides an embodiment: a semiconductor wafer surface automated processing equipment, including a turntable 3 and a chassis 4, the middle part of the top of the turntable 3 is penetrated and rotatably connected to a support shaft 7, first by storing the wafer 17 in the material frame 18 at the front, the lower end of the support shaft 7 is penetrated and rotatably connected to the support shaft 7, the side wall of the support shaft 7 near the upper end is fixedly connected with three third fixed plates 23 evenly distributed at equal angles, the side walls of the through holes of the third fixed plate 23 are penetrated and slidably connected to the limit block 6, and then by controlling the second electric push rod 21 to extend, the support rod 20 moves upward a specified distance and lifts the wafer 17 through the tray 22, the left part of the top of the chassis 4 is fixedly connected with two second electric push rods 21 distributed front and back, the other ends of the second electric push rods 21 are fixedly connected to the second fixed plate 9, by controlling the first electric push rod 19 and the second electric push rod 21 to extend together, the material frame 18 moves upward and is inserted into the through hole of the third fixed plate 23, the top of the second fixed plate 9 is fixedly connected with evenly distributed support rods 20 and the support rods 20 The material frame 18 is passed through and slidably connected to the turntable 3, and the upper ends of the three adjacent support rods 20 are passed through and slidably connected to the material frame 18, and the material frame 18 corresponds to the through hole on the third fixed plate 23. As the material frame 18 continues to rise, the material frame 18 squeezes the limit block 6, and then the limit block 6 compresses the spring 5 and is inserted into the inside of the third fixed plate 23. The upper ends of the support rods 20 are fixedly connected to the tray 22, and the tray 22 is slidably connected to the material frame 18. The first fixed plate 2 is provided above and below the third fixed plate 23 on the right side. The two first fixed plates 2 The side of the fixed plate 2 close to the third fixed plate 23 is penetrated and rotatably connected with evenly distributed connecting shafts 14, and then the second electric push rod 21 is controlled to continue to extend a specified distance, so that the top wafer 17 rises and separates from the material frame 18 (at this time, the wafer 17 is located in the gap between the upper limit block 6 and the lower limit block 6). The two first fixed plates 2 are fixedly connected to the opposite sides with the second motor 13 and the output end of the second motor 13 passes through the first fixed plate 2, and the top front of the chassis 4 is fixedly connected to the first motor 11.

[0038] A first gear 8 is provided under the turntable 3 and the support shaft 7 passes through and is fixedly connected to the first gear 8, and then the first electric push rod 19 and the second electric push rod 21 are controlled to retract together, and the middle part of the opposite side of the limit block 6 is fixedly connected with a spring 5 and the other end of the spring 5 passes through and is fixedly connected to the third fixed disk 23. When the material frame 18 is separated from the limit block 6, the limit block 6 will be reset under the action of the spring 5 and the top wafer 17 will be clamped. The middle part of the bottom of the material frame 18 is fixedly connected to the first electric push rod 19 and the third electric push rod 21. An electric push rod 19 is fixedly connected to the turntable 3, and wafers 17 are evenly and vertically distributed on the top of the tray 22, and the wafers 17 are located in the material frame 18. Then, by controlling the first motor 11 to work and drive the second gear 10 to rotate, and then through the transmission of the first gear 8 and the support shaft 7, the third fixed plate 23 is rotated to a specified angle, and then the third fixed plate 23 that has just been loaded with material in the previous step will be aligned with the grinding head 15, and the end of the connecting shaft 14 close to the third fixed plate 23 is fixedly connected to the grinding head 15 and the grinding head 15 is aligned with the third fixed plate The through hole of the disk 23 corresponds to the through hole of the disk 23, and then the cylinder 12 is controlled to extend, so that the first fixed disk 2 is driven by the cylinder 12 to move toward the direction close to the third fixed disk 23 until the grinding head 15 contacts the wafer 17 at the through hole of the third fixed disk 23. The output end of the second motor 13 and the middle part of the connecting shaft 14 are penetrated and fixedly connected with the third gear 16, and the third gear 16 on the second motor 13 is meshed with the third gear 16 on the connecting shaft 14. The right side of the turntable 3 is fixedly connected to the fixed bracket 1, and the fixed bracket 1 is fixed to the chassis 4. The second motor 13 is controlled to work, and then the third gear 16 is driven to make the connecting shaft 14 start to rotate and drive the grinding head 15 to work, so that the surfaces of the upper and lower sides of the wafer 17 can be polished at the same time. The two first fixed plates 2 are fixedly connected to the rear middle position of the opposite side of each other with a cylinder 12, and the other ends of the upper and lower cylinders 12 are fixedly connected to the fixed bracket 1 and the turntable 3 respectively. The output end of the first motor 11 is fixedly connected to the second gear 10, and the second gear 10 is meshed with the first gear 8.

[0039] Working principle: First, the wafer 17 is stored in the material frame 18 at the front, and then the second electric push rod 21 is controlled to extend, so that the support rod 20 moves upward a specified distance and lifts the wafer 17 through the tray 22. At the same time, the first electric push rod 19 and the second electric push rod 21 are controlled to extend together, so that the material frame 18 moves upward and is inserted into the through hole of the third fixed plate 23. As the material frame 18 continues to rise, the material frame 18 squeezes the limit block 6, and then the limit block 6 compresses the spring 5 and is inserted into the inside of the third fixed plate 23. Then, the second electric push rod 21 is controlled to continue to extend a specified distance, so that the top wafer 17 rises and leaves the material frame 18 (at this time, the wafer 17 is located in the gap between the upper limit block 6 and the lower limit block 6). Then, the first electric push rod 19 and the second electric push rod 21 are controlled to retract together. When the material frame 18 is separated from the limit block 6, the limit block 6 will be reset under the action of the spring 5 and will clamp the top wafer 17. Then, by controlling the first motor 11 to work and drive the second gear 10 to rotate, the third fixed plate 23 is rotated to a specified angle through the transmission of the first gear 8 and the support shaft 7. Then, the third fixed plate 23 that has just loaded the material in the previous step will be aligned with the grinding head 15. Then, by controlling the extension of the cylinder 12, the first fixed plate 2 is driven by the cylinder 12 to move in the direction close to the third fixed plate 23 until the grinding head 15 contacts the wafer 17 at the through hole of the third fixed plate 23. Then, by controlling the work of the second motor 13, the connecting shaft 14 is started to rotate and drives the grinding head 15 to work through the transmission of the third gear 16, so that the surfaces of the upper and lower sides of the wafer 17 can be polished at the same time.

[0040] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor wafer surface automated processing device, comprising a turntable (3) and a chassis (4), characterized in that: The middle part of the top of the turntable (3) is penetrated and rotatably connected with a support shaft (7), the lower end of the support shaft (7) is penetrated and rotatably connected with a support shaft (7), the side wall of the support shaft (7) near the upper end is fixedly connected with three third fixed disks (23) uniformly distributed at equal angles, the side walls of the through holes of the third fixed disk (23) are penetrated and slidably connected with a limited block (6), the left part of the top of the chassis (4) is fixedly connected with two second electric push rods (21) distributed front and back, the other ends of the second electric push rods (21) are fixedly connected with a second fixed disk (9), the top of the second fixed disk (9) is fixedly connected with uniformly distributed support rods (20), and the support rods (20) are penetrated and slidably connected with the turntable (3), and the three adjacent support rods are fixedly connected. A material frame (18) is passed through and slidably connected between the upper ends of the support rods (20), and the material frame (18) corresponds to the through hole on the third fixed plate (23). The upper ends of the support rods (20) are fixedly connected to the tray (22), and the tray (22) is slidably connected to the material frame (18). A first fixed plate (2) is provided above and below the third fixed plate (23) on the right side. The two first fixed plates (2) are passed through and rotatably connected to evenly distributed connecting shafts (14). The two first fixed plates (2) are fixedly connected to the opposite sides of the second motor (13), and the output end of the second motor (13) passes through the first fixed plate (2). The top front of the chassis (4) is fixedly connected to the first motor (11).

2. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: A first gear (8) is provided below the turntable (3), and a support shaft (7) passes through and is fixedly connected to the first gear (8).

3. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: The middle portion of the opposite side of the limit block (6) is fixedly connected to a spring (5), and the other end of the spring (5) passes through and is fixedly connected to the third fixed disk (23).

4. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: A first electric push rod (19) is fixedly connected to the middle of the bottom of the material frame (18), and the first electric push rod (19) is fixedly connected to the turntable (3).

5. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: Wafers (17) are evenly and vertically distributed on the top of the tray (22), and the wafers (17) are located in the material frame (18).

6. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: One end of the connecting shaft (14) close to the third fixed disk (23) is fixedly connected to a grinding head (15), and the grinding head (15) corresponds to the through hole of the third fixed disk (23).

7. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: The output end of the second motor (13) and the middle of the connecting shaft (14) are both penetrated and fixedly connected with a third gear (16), and the third gear (16) on the second motor (13) and the third gear (16) on the connecting shaft (14) are meshed with each other.

8. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: A fixed bracket (1) is fixedly connected to the right side of the turntable (3), and the fixed bracket (1) is fixedly connected to the chassis (4).

9. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: The two first fixed disks (2) are both fixedly connected to cylinders (12) at the rear middle portion of the opposite sides, and the other ends of the upper and lower cylinders (12) are respectively fixedly connected to the fixed bracket (1) and the rotating disk (3).

10. The semiconductor wafer surface automated processing equipment according to claim 1, characterized in that: The output end of the first motor (11) is fixedly connected to a second gear (10), and the second gear (10) is meshedly connected to the first gear (8).

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