Slicing device for semiconductor processing

By using a dust collecting cover composed of arc sleeves and arc-shaped clamps in the semiconductor slice device, combined with a dust collecting pump and air hose, the problem of powder falling and dissipation during the cutting process is solved, and efficient dust collection and safety improvement is achieved.

CN223252055UActive Publication Date: 2025-08-22KUNSHAN SHANGYI PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202422525035.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-08-22
Estimated Expiration
2034-10-18

AI Technical Summary

Technical Problem

During the cutting process of existing semiconductor slice devices, powder or particles are prone to fall to the cut joint and affect the incision, and the remaining powder on the blade is prone to scattering out, affecting the air quality.

Method used

A slice device for semiconductor processing is designed, and a dust collector is installed on the blade, and dust is collected to the outside through a dust collector pump and air guide hose. The dust collector consists of an arc sleeve and a arc-shaped clamp to ensure that the dust does not escape and enhance safety.

Benefits of technology

Effectively collect and discharge dust, reduce dust dissipation, and improve the safety of the processing process and air quality.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223252055U_ABST
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Abstract

The utility model discloses a slicing device for semiconductor processing, which comprises a processing box and a cutting tool arranged in the processing box, the cutting tool comprises a control arm and a blade, a cutting motor is arranged at the head of the control arm, a blade is arranged on an output shaft of the cutting motor, a bracket is further arranged in the processing box, and the cutting tool is arranged on the bracket. And the bracket is fixedly installed on the inner side of the bottom face of the machining box, a lifting frame is installed on the head of the bracket in a sliding mode, a dust removal cover is fixedly installed on the head of the lifting frame, and the dust removal cover is arranged on the blade in a sleeving mode. According to the dust removal device, the blade is sleeved with the dust removal cover, the dust removal cover is designed to be of the structure of the arc-shaped sleeve and the arc-shaped clamping plate, in this way, it can be guaranteed that dust can be stably collected for use in the blade machining process, and the dust is collected in real time in cooperation with the dust removal pump; the possibility of dust dissipation can be greatly reduced in the mode that the blades are sleeved with the dust collecting device, and it is guaranteed that dust is better gathered through the arrangement of the arc-shaped sleeve.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor slicing devices, in particular to a slicing device for semiconductor processing. Background Art

[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. It is a material whose electrical conductivity can be controlled, ranging from an insulator to a conductor. Common semiconductor materials include silicon, germanium, gallium arsenide, etc.

[0003] The existing Chinese patent with publication number CN204585582U discloses a semiconductor slicing device, including a box, a substrate arranged at the bottom of the box, and a cutting device arranged on the box. The cutting device includes a drive motor arranged on the box so as to be able to be raised and lowered, and a blade arranged on the rotating shaft of the drive motor. A blade cleaning device is provided on the box above the blade. The blade cleaning device includes air blow pipes respectively arranged on the front and rear sides of the blade, and the air outlets of the two air blow pipes are respectively directed to the cutting edge of the blade.

[0004] Regarding the above-mentioned related technologies, it was found in actual use that the above-mentioned blowing and cleaning method easily causes powder or particles to fall back into the cutting seam, thereby affecting the incision. At the same time, the powder remaining on the blade is easily scattered under the action of centrifugal force, affecting the air quality. Utility Model Content

[0005] The purpose of the utility model is to provide a slicing device for semiconductor processing, aiming to improve the processing effect of powder impurities in the processing process.

[0006] The utility model is implemented as follows: a slicing device for semiconductor processing includes a processing box and a cutting tool installed in the processing box, the cutting tool includes a control arm and a blade, the head of the control arm is installed with a cutting motor, the output shaft of the cutting motor is installed with a blade, and a bracket is also installed in the processing box, the bracket is fixedly installed on the inner side of the bottom surface of the processing box, the head of the bracket is slidably installed with a lifting frame, the head of the lifting frame is fixedly installed with a dust cover, the dust cover is sleeved on the blade, a dust pump is fixedly installed in the middle of the bracket, and the air intake of the dust pump is connected to the dust cover through an air guide hose.

[0007] Preferably, the bracket includes a seat block and a bending bracket, the bending bracket is installed on both sides of the seat block, and the bending bracket is fixedly connected to the seat block.

[0008] Preferably, the lifting frame includes a main frame and a longitudinal slide rod, the main frame is fixedly installed on the rear end surface of the dust cover, the longitudinal slide rod is vertically installed at both ends of the main frame, and the longitudinal slide rod is fixedly connected to the main frame.

[0009] Preferably, the main frame includes a radian plate and side rods, the side rods are arranged at both ends of the radian plate, and the side rods are fixedly connected to the radian plate.

[0010] Preferably, the dust removal cover includes an arc-shaped sleeve and an arc-shaped clamping plate, the arc-shaped clamping plate is arranged at both ends of the arc-shaped sleeve, and the arc-shaped clamping plate and the arc-shaped sleeve are formed in one piece.

[0011] Preferably, a shielding cover is installed at one end of the dust removal cover, one end of the shielding cover is rotatably connected to the arc sleeve, and the other end of the shielding cover is connected to the arc clamping plate through a screw.

[0012] Preferably, a connecting screw connected to the radian plate is welded and fixed on the outer side surface of the arc-shaped clamping plate, and a matching locking nut is installed on the connecting screw.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the present application arranges a dust cover on the blade, and designs the dust cover into a structure of an arc-shaped cover and an arc-shaped splint, so that dust can be stably collected and used during the blade processing process, and cooperates with a dust removal pump to collect dust in real time. By being arranged on the blade, the possibility of dust escape can be greatly reduced, and the setting of the arc-shaped cover can ensure that the dust is better gathered. At the same time, sufficient deformation space can be reserved for the blade edge part, thereby increasing the safety of the equipment use, and having the advantages of good dust removal effect and convenient and safe use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a three-dimensional diagram of the bracket, lifting frame, dust cover, dust pump and air guide hose of the utility model;

[0016] Figure 3 yes Figure 2 a side view of the device shown;

[0017] Figure 4 It is a three-dimensional diagram of the lifting frame and the dust cover of the utility model in coordination;

[0018] Figure 5 yes Figure 4 Front view of the device shown.

[0019] In the figure: 1. Processing box; 2. Cutting tool; 21. Control arm; 22. Blade; 3. Bracket; 31. Seat block; 32. Bending bracket; 4. Lifting frame; 41. Main frame; 411. Curved plate; 412. Side rod; 42. Longitudinal slide rod; 5. Dust cover; 51. Curved sleeve; 52. Curved splint; 521. Connecting screw; 522. Locking nut; 53. Shielding cover; 6. Dust removal pump; 7. Air guide hose. DETAILED DESCRIPTION

[0020] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0021] The following is a further description with reference to the accompanying drawings and specific embodiments:

[0022] Reference Figure 1 、 Figure 2 and Figure 3 As shown, a slicing device for semiconductor processing includes a processing box 1 and a cutting tool 2 installed in the processing box 1, the cutting tool 2 includes a control arm 21 and a blade 22, the head of the control arm 21 is installed with a cutting motor, and the output shaft of the cutting motor is installed with a blade 22, and a bracket 3 is also installed in the processing box 1, the bracket 3 is fixedly installed on the inner side of the bottom surface of the processing box 1, the head of the bracket 3 is slidably installed with a lifting frame 4, the head of the lifting frame 4 is fixedly installed with a dust cover 5, the dust cover 5 is sleeved on the blade 22, and a dust removal pump 6 is fixedly installed in the middle of the bracket 3, and the air intake of the dust removal pump 6 is connected to the dust removal cover 5 through an air guide hose 7. Slicing processing is performed by installing a cutting tool 2 in the processing box 1. At the same time, the structure of the cutting tool 2 is set to ensure that the cutting motor and the blade 22 can be controlled by the control arm 21 to perform lifting and cutting operations during use. At the same time, a bracket 3 is installed in the processing box 1, and the lifting frame 4 is supported and installed by the bracket 3. Finally, the dust cover 5 is installed by the lifting frame 4. In this way, the lifting frame 4 and the control arm 21 are fixed together during the actual cutting process. In this way, the dust cover 5 and the blade 22 can be lifted and lowered synchronously. During the rotation and cutting process of the blade 22, the dust cover 5 can be put on the blade 22 to collect powder in real time, and the powder can be discharged to the outside through the dust removal pump 6 and the air guide hose 7.

[0023] Reference Figure 3As shown, the bracket 3 includes a seat block 31 and a bent bracket 32. The bent bracket 32 ​​is mounted on both sides of the seat block 31 and is fixedly connected to the seat block 31. The structural arrangement of the bracket 3 ensures that the seat block 31 can be fixedly mounted in the processing box 1 by the bent brackets 32 at both ends during use, ensuring the stable use of the bracket 3 and the stable sliding installation of the lifting frame 4 on the seat block 31.

[0024] Reference Figure 3 、 Figure 4 and Figure 5 As shown, the lifting frame 4 includes a main frame 41 and a longitudinal slide 42. The main frame 41 is fixedly mounted on the rear end surface of the dust cover 5. The longitudinal slide 42 is vertically mounted at both ends of the main frame 41, and the longitudinal slide 42 is fixedly connected to the main frame 41. The structural setting of the lifting frame 4 ensures that the main frame 41 can be slidably mounted on the seat block 31 through the longitudinal slide 42 during use, thereby ensuring that it can be raised and lowered synchronously with the blade 22 during the slicing process. The main frame 41 includes a camber plate 411 and a side rod 412. The side rod 412 is arranged at both ends of the camber plate 411, and the side rod 412 is fixedly connected to the camber plate 411. By designing the main frame 41 as a connection in which the camber plate 411 and the side rod 412 cooperate, the dust cover 5 can be installed through the camber plate 411 during installation, and the longitudinal slide 42 can be fixedly installed through the side rod 412.

[0025] Reference Figure 4 As shown, the dust cover 5 includes an arc-shaped sleeve 51 and an arc-shaped clamping plate 52. The arc-shaped clamping plate 52 is arranged at both ends of the arc-shaped sleeve 51, and the arc-shaped clamping plate 52 and the arc-shaped sleeve 51 are integrally formed. The structure of the dust cover 5 is set to ensure that the two arc-shaped clamping plates 52 of the arc-shaped sleeve 51 form a shell structure. In this way, when the sleeve is set on the blade 22, the outermost circle of the blade can be placed in the arc-shaped sleeve 51. The size of the arc-shaped sleeve 51 is large, so even if the blade is deformed, it will not affect the normal dust removal. It can be clamped on both sides of the blade 22 by the two arc-shaped clamping plates 52. A shielding cover 53 is installed at one end of the dust cover 5. One end of the shielding cover 53 is rotatably connected to the arc-shaped sleeve 51, and the other end of the shielding cover 53 is connected to the arc-shaped clamping plate 52 by screws. By installing a shielding cover 53 at one end of the dust hood 5, powder can be better collected in the dust hood 5. The shielding cover 53 is also reversible and can be opened, making it easier to clean the interior of the dust hood 5 later. A connecting screw 521 is welded to the outer surface of the curved clamping plate 52, which is connected to the curved plate 411. The connecting screw 521 is mounted with a matching lock nut 522. The arrangement of the connecting screw 521 and the lock nut 522 ensures that the curved plate 411 can be inserted through the connecting screw 521 for fixation.

[0026] Working principle: Before slicing, first lift and adjust the dust hood 5 to put the dust hood 5 on the blade 22, then fix the lifting frame 4 to the control arm 21, and then connect the dust pump 6 to the dust hood 5 through the air guide hose 7. After starting the dust pump 6, you can start the cutting motor to drive the blade 22 to rotate, and then drive the blade 22 and the dust hood 5 to descend synchronously through the control arm to perform slicing. The powder generated during the processing will be discharged into the dust hood 5 in the direction of rotation of the blade 22, and then the dust will enter the dust pump 6 from the dust hood 5, and finally it can be stably discharged into the external dust bag for collection.

[0027] The above is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A slicing device for semiconductor processing, comprising a processing box (1) and a cutting tool (2) installed in the processing box (1), wherein the cutting tool (2) comprises a control arm (21) and a blade (22), a cutting motor is installed at the head of the control arm (21), and the blade (22) is installed on the output shaft of the cutting motor, characterized in that: A bracket (3) is also installed in the processing box (1), and the bracket (3) is fixedly installed on the inner side of the bottom surface of the processing box (1). The head of the bracket (3) is slidably installed with a lifting frame (4), and the head of the lifting frame (4) is fixedly installed with a dust cover (5), and the dust cover (5) is sleeved on the blade (22). A dust removal pump (6) is fixedly installed in the middle of the bracket (3), and the air intake of the dust removal pump (6) is connected to the dust cover (5) through an air guide hose (7).

2. A semiconductor processing slicing device according to claim 1, characterized in that: The bracket (3) comprises a seat block (31) and a bending bracket (32), wherein the bending bracket (32) is mounted on both sides of the seat block (31), and the bending bracket (32) is fixedly connected to the seat block (31).

3. A semiconductor processing slicing device according to claim 2, characterized in that: The lifting frame (4) includes a main frame (41) and a longitudinal slide bar (42), wherein the main frame (41) is fixedly mounted on the rear end surface of the dust removal cover (5), and the longitudinal slide bar (42) is vertically mounted on both ends of the main frame (41), and the longitudinal slide bar (42) is fixedly connected to the main frame (41).

4. A semiconductor processing slicing device according to claim 3, characterized in that: The main frame (41) comprises a radian plate (411) and side rods (412). The side rods (412) are arranged at both ends of the radian plate (411), and the side rods (412) are fixedly connected to the radian plate (411).

5. The semiconductor processing slicing device according to claim 4, wherein: The dust removal cover (5) comprises an arc-shaped sleeve (51) and an arc-shaped clamping plate (52), wherein the arc-shaped clamping plate (52) is arranged at both ends of the arc-shaped sleeve (51), and the arc-shaped clamping plate (52) and the arc-shaped sleeve (51) are integrally formed.

6. The semiconductor processing slicing device according to claim 5, characterized in that: A shielding cover (53) is installed at one end of the dust removal cover (5), one end of the shielding cover (53) is rotatably connected to the arc sleeve (51), and the other end of the shielding cover (53) is connected to the arc clamping plate (52) through a screw.

7. The semiconductor processing slicing device according to claim 6, characterized in that: A connecting screw (521) connected to the radian plate (411) is welded and fixed on the outer surface of the arc-shaped clamping plate (52), and a matching locking nut (522) is installed on the connecting screw (521).

Citation Information

Patent Citations

  • Semiconductor slice device

    CN204585582U