Electroplating coarsening regeneration tank and processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to an electroplating coarsening regeneration tank and processing equipment, which comprises an electroplating tank, a lifting structure and a backflow device, the backflow device comprises a lower tank body, a backflow channel and an auxiliary component, the lower tank body is fixedly connected with the electroplating tank, the backflow channel is arranged on the electroplating tank, and the auxiliary component is arranged on the lower tank body. In the process of using the equipment, the lower tank body is arranged on the outer surface of the electroplating tank, so that after liquid is added into the electroplating tank, the liquid can enter the lower tank body when overflowing from the upper edge of the electroplating tank, and then the liquid can enter the lower tank body when overflowing from the upper edge of the electroplating tank; therefore, the problems that the liquid in the electroplating bath is easy to overflow from the interior of the electroplating bath, the outer surface of the electroplating bath is damaged, the environment is polluted, the whole bath is damaged, the medicine leaks, and the electroplating bath cannot be used are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to an electroplating roughening regeneration tank and processing equipment. Background Art

[0002] Currently, in the electroplating process of semiconductor objects, an electroplating tank is required. The bottom of the electroplating tank is flat. The electroplated semiconductor is placed in the electroplating tank. The flat bottom of the electroplating tank cannot lift the semiconductor, making it inconvenient to clamp it.

[0003] The prior art CN220034711U discloses an electroplating processing equipment, including an electroplating tank, in which two connecting plates are provided, and two clamping components are provided on the side where the two connecting plates are close to each other, and a lifting component is provided at the bottom of the electroplating tank for lifting, and the lifting component includes an electric push rod fixedly connected to the electroplating tank, and the output shaft of the electric push rod is fixedly connected to the push plate, and a lifting structure is slidingly passed through both sides of the electroplating tank, and the lifting structure is composed of a motor, a gear, a rack, and a sliding frame. By pushing the output shaft of the electric push rod, the semiconductor at the same level as the bottom of the electroplating tank can be pushed up, thereby driving the semiconductor to move upward, which is more convenient for clamping semiconductors of any shape.

[0004] However, with the above method, the liquid in the electroplating tank is easy to overflow from the inside of the electroplating tank, causing damage to the outer surface of the electroplating tank, which not only pollutes the environment but also causes the entire tank to be damaged and leak, making it unusable. Utility Model Content

[0005] The purpose of the utility model is to provide an electroplating roughening regeneration tank and processing equipment, which can solve the problem that the liquid in the electroplating tank is easy to overflow from the inside of the electroplating tank, causing the outer surface of the electroplating tank to be damaged, which not only pollutes the environment but also causes the entire tank to be damaged and leak medicine, making it unusable.

[0006] To achieve the above-mentioned purpose, the utility model provides an electroplating roughening regeneration tank and processing equipment, comprising an electroplating tank and a lifting structure, wherein the lifting structure is arranged on the electroplating tank and further comprises a reflux device;

[0007] The reflux device includes a lower tank body, a reflux channel and an auxiliary component. The lower tank body is fixedly connected to the electroplating tank and is located on one side of the electroplating tank. The reflux channel is arranged on the electroplating tank. The reflux channel enables the electroplating tank and the lower tank body to communicate with each other. The auxiliary component is arranged on the outer surface of the electroplating tank.

[0008] Wherein, a PVC protective plate is provided on the outside of the lower trough body, and the PVC protective plate is located at the outermost side of the lower trough body.

[0009] Wherein, PVDF material is provided inside the lower tank body, and the PVDF material is located on the inner surface of the lower tank body away from the PVC guard plate.

[0010] Among them, thermal insulation cotton and glass fiber reinforced plastic liner are also provided on the lower trough body, and the PVC guard plate, the thermal insulation cotton, the glass fiber reinforced plastic liner and the PVDF material are connected in sequence.

[0011] Wherein, the auxiliary component includes a mounting seat and a protective pad, the mounting seat is fixedly connected to the electroplating tank and is located at the bottom of the electroplating tank; the protective pad is fixedly connected to the mounting seat and is located on one side of the mounting seat.

[0012] The utility model discloses an electroplating roughening regeneration tank and processing equipment, comprising an electroplating tank, a lifting structure and a reflux device, wherein the reflux device comprises a lower tank body, a reflux channel and an auxiliary component. In the process of using this equipment, by arranging the lower tank body on the outer surface of the electroplating tank, after the liquid is added into the electroplating tank, when the liquid overflows from the upper edge of the electroplating tank, it can enter the lower tank body and then flow back into the electroplating tank through the reflux channel, thereby solving the problem that the liquid in the electroplating tank is easy to overflow from the inside of the electroplating tank, causing the outer surface of the electroplating tank to be damaged, which not only pollutes the environment but also causes the entire tank to be damaged and leak medicine, making it unusable. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0014] Figure 1 It is a schematic diagram of the overall structure of the electroplating roughening regeneration tank and processing equipment of the first embodiment of the present utility model.

[0015] Figure 2 It is an overall front view of the electroplating roughening regeneration tank and processing equipment of the first embodiment of the present utility model.

[0016] Figure 3 It is a structural schematic diagram of the lower tank body of the first embodiment of the present utility model.

[0017] Figure 4 It is a schematic diagram of the overall structure of the electroplating roughening regeneration tank and processing equipment of the second embodiment of the present utility model.

[0018] In the figure: 101-electroplating tank, 102-lifting structure, 103-lower tank body, 104-reflux channel, 105-PVC guard plate, 106-PVDF material, 107-insulation cotton, 108-glass fiber reinforced plastic material, 201-mounting seat, 202-protective pad. DETAILED DESCRIPTION

[0019] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0020] The first embodiment of this application is:

[0021] See also Figures 1 to 3 ,in Figure 1 This is a schematic diagram of the overall structure of the electroplating roughening regeneration tank and processing equipment. Figure 2 This is the overall front view of the electroplating roughening regeneration tank and processing equipment. Figure 3 It is a schematic diagram of the structure of the lower tank body. The utility model provides an electroplating roughening regeneration tank and processing equipment: including an electroplating tank 101, a lifting structure 102 and a reflux device, the reflux device including a lower tank body 103, a reflux channel 104 and auxiliary components, a PVC protective plate 105 is provided on the outside of the lower tank body 103, a PVDF material 106 is provided on the inside of the lower tank body 103, and a heat-insulating cotton 107 and a fiberglass reinforced plastic material liner 108 are also provided on the lower tank body 103. The above-mentioned solution solves the problem that the liquid in the electroplating tank 101 is easy to overflow from the inside of the electroplating tank 101, causing the outer surface of the electroplating tank 101 to be damaged, which not only pollutes the environment but also causes the entire tank to be damaged and leak medicine, making it unusable. It can be understood that the above-mentioned solution can be used to avoid damage to the electroplating tank 101 when liquid overflows, and can also be used to recover the overflowed liquid.

[0022] For this specific embodiment, the lifting structure 102 is arranged on the electroplating tank 101, and two connecting plates are provided in the electroplating tank 101. Two clamping components are provided on the side where the two connecting plates are close to each other. A lifting component for lifting is provided at the bottom of the electroplating tank 101. The lifting component includes an electric push rod fixedly connected to the electroplating tank 101, and the output shaft of the electric push rod is fixedly connected to the push plate. The lifting structure 102 slides through both sides of the electroplating tank 101. The lifting structure 102 is composed of a motor, a gear, a rack, and a sliding frame. By pushing the output shaft of the electric push rod, the semiconductor at the same level as the bottom of the electroplating tank 101 can be pushed up, thereby driving the semiconductor to move upward, which is more convenient for clamping semiconductors of any shape. The above are all existing technologies.

[0023] Wherein, the lower tank body 103 is fixedly connected to the electroplating tank 101 and is located on one side of the electroplating tank 101, the reflux channel 104 is arranged on the electroplating tank 101, and the reflux channel 104 makes the electroplating tank 101 and the lower tank body 103 communicate with each other, the auxiliary component is arranged on the outer surface of the electroplating tank 101, and the lower tank body 103 is arranged on the outer side of the electroplating tank 101, and the lower tank body 103 is a box structure with a top opening, the lower tank body 103 extends 10-20mm outward through the upper section of the electroplating tank 101, and then extends upward to a certain height, and then the lower part of the tank is sat on it to form the lower tank body 103, the lower tank body 103 is communicated with the inside of the electroplating tank 101 through the reflux channel 104, so that when the liquid flows out from the upper edge of the electroplating tank 101, it can enter the lower tank body 103, and then be discharged by the reflux channel 104 flows back into the electroplating tank 101, and the special structural setting of the lower tank body 103 prevents the electroplating tank 101 from being damaged, saving costs. The auxiliary components are arranged at the four corners of the bottom outer surface of the electroplating tank 101. The setting of the auxiliary components can make the electroplating tank 101 more stable during use. In the process of using this equipment, by arranging the lower tank body 103 on the outer surface of the electroplating tank 101, after the liquid is added into the electroplating tank 101, when the liquid overflows from the upper edge of the electroplating tank 101, it can enter the lower tank body 103, and then flow back to the electroplating tank 101 through the reflux channel 104, thereby solving the problem that the liquid in the electroplating tank 101 is easy to overflow from the inside of the electroplating tank 101, causing the outer surface of the electroplating tank 101 to be damaged, which not only pollutes the environment but also causes the entire tank to be damaged and leak medicine, making it unusable.

[0024] Secondly, the PVC guard plate 105 is located at the outermost side of the lower tank body 103; the PVDF material 106 is located on the inner surface of the lower tank body 103 away from the PVC guard plate 105; the PVC guard plate 105, the thermal insulation cotton 107, the glass fiber reinforced plastic material liner 108 and the PVDF material 106 are connected in sequence, the outermost side of the lower tank body 103 is the PVC guard plate 105, the inner lining of the lower tank body 103 is made of the thermal insulation cotton 107 and the glass fiber reinforced plastic material liner 108, and the inner wall of the lower tank body 103 is composed of the PVDF material 106, so that the lower tank body 103 is composed of the PVC guard plate 1 05. The thermal insulation cotton 107, the fiberglass liner 108 and the PVDG material are composed of four layers of materials. The PVDF material 106 is corrosion-resistant, thereby avoiding the corrosion of the liquid overflowing from the electroplating tank 101, and the overall thickness of the tank wall of the lower tank body 103 is 60 mm. The lining is made of the PVDF material 106 through the upper section of the tank, extending outward by 10-20 mm, and then extending upward to a certain height, and then the lower part of the tank is raised, so that when the liquid overflows from the electroplating tank 101, it can enter the lower tank body 103 for collection, and the liquid is in contact with the PVDF material 106 to avoid corrosion to the equipment.

[0025] When using an electroplating roughening regeneration tank and processing equipment of the present embodiment, during the use of this equipment, by setting the lower tank body 103 on the outer surface of the electroplating tank 101, after the liquid is added into the electroplating tank 101, when the liquid overflows from the upper edge of the electroplating tank 101, it can enter the lower tank body 103, and then flow back to the electroplating tank 101 through the reflux channel 104, thereby solving the problem that the liquid in the electroplating tank 101 is easy to overflow from the inside of the electroplating tank 101, causing the outer surface of the electroplating tank 101 to be damaged, which not only pollutes the environment but also causes the entire tank to be damaged and leak medicine, making it unusable.

[0026] The second embodiment of the present application is:

[0027] Based on the first embodiment, please refer to Figure 4 , Figure 4 It is a schematic diagram of the overall structure of the electroplating roughening regeneration tank and processing equipment of the second embodiment. The auxiliary components of this embodiment include a mounting seat 201 and a protective pad 202.

[0028] According to this specific embodiment, the mounting seat 201 is fixedly connected to the electroplating tank 101 and is located at the bottom of the electroplating tank 101; the protective pad 202 is fixedly connected to the mounting seat 201 and is located on one side of the mounting seat 201. The mounting seat 201 is provided at the four corners of the bottom end of the outer surface of the electroplating tank 101. The mounting seat 201 is made of alloy material. The setting of the mounting seat 201 lowers the center of gravity of the electroplating tank 101, making the electroplating tank 101 more stable during use. The upper surface of each mounting seat 201 is provided with the protective pad 202. The protective pad 202 is made of soft rubber material, has the characteristics of anti-slip and wear-resistant, and has good toughness, so as to prevent the operator from being injured by the mounting seat 201. The protective pad 202 plays a certain protective role for the operator.

[0029] When using the electroplating roughening regeneration tank and processing equipment of this embodiment, the setting of the mounting seat 201 lowers the center of gravity of the electroplating tank 101, making the electroplating tank 101 more stable during use. The protective pad 202 can prevent the operator from being injured by being bumped by the mounting seat 201, and plays a certain protective role for the operator.

[0030] The above disclosure is merely one or more preferred embodiments of the present application and is not intended to limit the scope of the present application. A person skilled in the art will understand that all or part of the processes of the above embodiments and equivalent changes made in accordance with the claims of the present application are still within the scope of the present application.

Claims

1. An electroplating roughening regeneration tank and processing equipment, comprising an electroplating tank and a lifting structure, wherein the lifting structure is arranged on the electroplating tank, characterized in that: Also included is a reflux device; The reflux device includes a lower tank body, a reflux channel and an auxiliary component. The lower tank body is fixedly connected to the electroplating tank and is located on one side of the electroplating tank. The reflux channel is arranged on the electroplating tank. The reflux channel enables the electroplating tank and the lower tank body to communicate with each other. The auxiliary component is arranged on the outer surface of the electroplating tank.

2. The electroplating roughening regeneration tank and processing equipment according to claim 1, characterized in that: A PVC guard plate is provided outside the lower tank body, and the PVC guard plate is located at the outermost side of the lower tank body.

3. The electroplating roughening regeneration tank and processing equipment according to claim 2, characterized in that: PVDF material is provided inside the lower tank body, and the PVDF material is located on the inner surface of the lower tank body away from the PVC guard plate.

4. The electroplating roughening regeneration tank and processing equipment according to claim 3, characterized in that: The lower trough body is also provided with heat-insulating cotton and a fiberglass reinforced plastic liner, and the PVC guard plate, the heat-insulating cotton, the fiberglass reinforced plastic liner and the PVDF material are connected in sequence.

5. The electroplating roughening regeneration tank and processing equipment according to claim 1, characterized in that: The auxiliary component includes a mounting seat and a protective pad. The mounting seat is fixedly connected to the electroplating tank and is located at the bottom of the electroplating tank; the protective pad is fixedly connected to the mounting seat and is located on one side of the mounting seat.

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