Double-sided electroplating clamp and dismounting device of double-sided electroplating clamp

Abstract

The utility model belongs to the technical field of semiconductor packaging, and discloses a double-sided electroplating clamp and a dismounting device of the double-sided electroplating clamp, the double-sided electroplating clamp comprises a substrate and a cover plate, the substrate is provided with a first through hole, and the cover plate is provided with a second through hole. According to the utility model, the wafer is clamped by the double-sided electroplating clamp, the conductive structure can be sealed, and the front and back surfaces of the wafer can be exposed out of the clamp, so that the front and back surfaces of the wafer can be electroplated at the same time. Moreover, the front and back surfaces of the wafer can be exposed out of the double-sided electroplating clamp, so that the double-sided electroplating clamp only needs to be disassembled and assembled once, the whole process is relatively simple and convenient, and the working efficiency of electroplating operation can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a double-sided electroplating fixture and a disassembly and assembly device of the double-sided electroplating fixture. Background Art

[0002] Currently, semiconductor packaging technology has evolved from traditional wire bonding to three-dimensional packaging technology. Compared with traditional wire bonding, 3D packaging technology has advantages such as better conductivity, lower power consumption, and smaller packaging volume.

[0003] Moreover, as electronic products develop towards being lighter, thinner and smaller, semiconductors are also developing towards miniaturization and high integration accordingly. Wafer electroplating has also developed from single-sided electroplating to double-sided electroplating, that is, both the front and back sides of the wafer need to be electroplated. Therefore, there is an urgent need for a double-sided electroplating fixture to assist in double-sided electroplating of the wafer. Utility Model Content

[0004] The purpose of the utility model is to provide a double-sided electroplating fixture and a disassembly and assembly device of the double-sided electroplating fixture to assist in double-sided electroplating of a wafer.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] The present invention provides a double-sided electroplating fixture, comprising:

[0007] A substrate and a cover plate, wherein the substrate is provided with a first through hole and a first sealing structure, and the cover plate is provided with a second through hole and a second sealing structure, wherein the first through hole and the second through hole are provided correspondingly, the first sealing structure surrounds the outer periphery of the first through hole, and the second sealing structure surrounds the outer periphery of the second through hole, and the first sealing structure and the second sealing structure are provided correspondingly, and the cover plate has a first working position in which it is provided on the substrate, and a second working position in which it is separated from the substrate;

[0008] A conductive module, comprising a first conductive ring and a second conductive ring, wherein the first conductive ring is disposed on the substrate and surrounds the outer periphery of the first through-hole, and the second conductive ring is disposed on the cover plate and surrounds the outer periphery of the second through-hole. When the cover plate is located in the first working position, the first sealing structure and the second sealing structure form a sealed cavity, and the first conductive ring and the second conductive ring are both located in the sealed cavity. A sheet to be electroplated can be clamped between the substrate and the cover plate, with the front and back surfaces of the sheet exposed through the first through-hole and the second through-hole, respectively, and an edge of the sheet extending into the sealed cavity; and

[0009] The fixing module is configured to keep the cover plate at the first working position.

[0010] Preferably, the fixing module includes a first magnet and a second magnet, the first magnet and the second magnet are respectively arranged on the base plate and the cover plate, and when the cover plate is located at the first working position, the first magnet and the second magnet are attracted to each other.

[0011] Preferably, the fixing module includes a plurality of first magnets and a plurality of second magnets, wherein the plurality of first magnets surround the outer circumference of the first through hole and are evenly arranged along the circumference of the first through hole, and the plurality of second magnets surround the outer circumference of the second through hole and are evenly arranged along the circumference of the second through hole.

[0012] Preferably, the first sealing structure includes a first sealing ring and a second sealing ring, the first sealing ring surrounds the outer circumference of the first through hole, and the second sealing ring surrounds the outer circumference of the first sealing ring, the second sealing structure includes a third sealing ring and a fourth sealing ring, the third sealing ring surrounds the outer circumference of the second through hole, and the fourth sealing ring surrounds the outer circumference of the third sealing ring, the first sealing ring and the third sealing ring are arranged correspondingly, and the second sealing ring and the fourth sealing ring are arranged correspondingly, when the sheet is clamped between the substrate and the cover plate, the first sealing ring and the third sealing ring are pressed against the front and back sides of the sheet respectively, and the second sealing ring and the fourth sealing ring are pressed against each other.

[0013] Preferably, a plurality of first positioning posts are provided on the substrate, the plurality of first positioning posts are located between the first sealing ring and the second sealing ring and surround the outer circumference of the first through hole, the plurality of first positioning posts define the loading area of ​​the sheet, the plurality of first positioning holes are provided on the cover plate, the plurality of first positioning holes are located between the third sealing ring and the fourth sealing ring and surround the outer circumference of the second through hole, and the plurality of first positioning posts correspond one-to-one to the plurality of first positioning holes.

[0014] Preferably, one of the substrate and the cover plate is provided with a plurality of second positioning pillars, and the other of the substrate and the cover plate is provided with a plurality of second positioning holes, the plurality of second positioning pillars correspond one-to-one to the plurality of second positioning holes, and the plurality of second positioning pillars can be inserted one by one into the plurality of second positioning holes.

[0015] On the other hand, the present invention further provides a disassembly device for a double-sided electroplating fixture, which is used to disassemble and assemble the double-sided electroplating fixture. The disassembly device for the double-sided electroplating fixture includes:

[0016] a stage configured to carry the substrate;

[0017] a lifting mechanism, comprising a first driving member and a lifting rod, wherein the first driving member is configured to drive the lifting rod to move upward and downward, and the lifting rod supports the cover plate; and

[0018] The pressing mechanism includes a second driving member and a pressing head. The second driving member is configured to drive the pressing head to move up and down, and the pressing head can press the substrate.

[0019] Preferably, at least two first ear plates are provided on the periphery of the cover plate, and at least two first ear plates surround the periphery of the cover plate. The lifting mechanism includes at least two lifting rods, and at least two lifting rods correspond one-to-one to at least two first ear plates, and the lifting rods can abut against the bottom of the first ear plates.

[0020] Preferably, a receiving groove is provided at the bottom of the first ear plate, and the lifting rod can extend into the receiving groove.

[0021] Preferably, a guide sleeve is installed on the carrier, and the guide sleeve is sleeved on the outer periphery of the lifting rod.

[0022] Beneficial effects of the utility model:

[0023] In the present invention, the wafer to be plated can be clamped between the base plate and the cover plate, with the front and back surfaces of the wafer exposed through the first and second through holes, respectively. That is, the present invention clamps the wafer using a double-sided plating fixture, while achieving a sealed conductive structure. Both the front and back surfaces of the wafer can be exposed through the fixture, allowing simultaneous plating on both sides of the wafer.

[0024] Moreover, the utility model disassembles and assembles the double-sided electroplating fixture through the disassembly and assembly device of the double-sided electroplating fixture. Since both the front and back sides of the chip can be exposed to the double-sided electroplating fixture, the utility model only needs to disassemble and assemble the double-sided electroplating fixture once. The whole process is relatively simple, thereby improving the work efficiency of the electroplating operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is one of the exploded views of the double-sided electroplating fixture in the embodiment of the present utility model;

[0026] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle;

[0027] Figure 3 This is the second exploded view of the double-sided electroplating fixture in the embodiment of the present utility model;

[0028] Figure 4 yes Figure 3 A partial enlarged view of point B in the middle;

[0029] Figure 5 This is one of the structural schematic diagrams of the double-sided electroplating fixture and the disassembly and assembly device of the double-sided electroplating fixture in the embodiment of the present utility model;

[0030] Figure 6 This is the second structural diagram of the double-sided electroplating fixture and the disassembly and assembly device of the double-sided electroplating fixture in the embodiment of the present utility model;

[0031] Figure 7 It is a structural schematic diagram of the disassembly and assembly device of the double-sided electroplating fixture in an embodiment of the present invention, excluding the carrier and the pressing mechanism.

[0032] In the picture:

[0033] 1. Double-sided electroplating fixture; 11. Substrate; 111. First through-hole; 112. First sealing structure; 1121. First sealing ring; 1122. Second sealing ring; 113. First positioning post; 114. Second positioning post; 115. First interface; 116. Second ear plate; 12. Cover plate; 121. Second through-hole; 122. Second sealing structure; 1221. Third sealing ring; 1222. Fourth sealing ring; 123. First positioning hole; 124. Second positioning hole; 125 , first ear plate; 1251, accommodating groove; 126, second interface; 131, first conductive ring; 1311, first contact; 132, second conductive ring; 1321, second contact; 141, first magnet; 142, second magnet; 21, carrier; 211, guide sleeve; 22, lifting mechanism; 221, first driving member; 222, lifting rod; 223, first mounting plate; 224, second mounting plate; 23, pressing mechanism; 231, second driving member; 232, pressure head. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0035] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0038] As mentioned above, semiconductor packaging technology has evolved from traditional wire bonding to 3D packaging. Compared to traditional wire bonding, 3D packaging offers advantages such as improved conductivity, lower power consumption, and a smaller package size.

[0039] Moreover, as electronic products develop towards being lighter, thinner and smaller, semiconductors are also developing towards miniaturization and high integration accordingly, and wafer electroplating has also developed from single-sided electroplating to double-sided electroplating.

[0040] To assist in double-sided electroplating of the wafer, this embodiment provides a double-sided electroplating fixture, see Figures 1 to 4 The double-sided electroplating fixture 1 includes a substrate 11 and a cover plate 12, wherein the substrate 11 is provided with a first through hole 111 and a first sealing structure 112, and the cover plate 12 is provided with a second through hole 121 and a second sealing structure 122. The first through hole 111 and the second through hole 121 are provided correspondingly, and the first sealing structure 112 surrounds the outer periphery of the first through hole 111, and the second sealing structure 122 surrounds the outer periphery of the second through hole 121. The first sealing structure 112 and the second sealing structure 122 are provided correspondingly. The cover plate 12 has a first working position in which it is covered on the substrate 11, and a second working position separated from the substrate 11. When the cover plate 12 is in the first working position, the wafer to be electroplated, which is a sheet material, can be clamped between the substrate 11 and the cover plate 12, and the front and back surfaces of the sheet material are exposed through the first through hole 111 and the second through hole 121 respectively, so that the front and back surfaces of the wafer can be electroplated at the same time. After the electroplating is completed, the cover plate 12 is switched to the second working position so that the wafer can be taken out.

[0041] In addition, the double-sided electroplating fixture 1 also includes a conductive module and a fixing module, wherein the conductive module includes a first conductive ring 131 and a second conductive ring 132, the first conductive ring 131 is arranged on the substrate 11 and surrounds the outer periphery of the first through hole 111, and the second conductive ring 132 is arranged on the cover plate 12 and surrounds the outer periphery of the second through hole 121. It can be understood that the first conductive ring 131 and the second conductive ring 132 together constitute a conductive structure, and the first conductive ring 131 and the second conductive ring 132 are both electrically connected to the negative power supply. When the cover plate 12 is in the first working position, the first sealing structure 112 and the second sealing structure 122 form a sealed cavity, and the first conductive ring 131 and the second The conductive rings 132 are all located in the sealed cavity, and the edge of the sheet extends into the sealed cavity. The part of the sheet extending into the sealed cavity can contact the first conductive ring 131 and the second conductive ring 132, so that both the front and back sides of the sheet are electrically connected to the negative power supply, and then the front and back sides of the chip can be electroplated at the same time. Moreover, since the first conductive ring 131 and the second conductive ring 132 are both located in the sealed cavity, during the electroplating process, the first conductive ring 131 and the second conductive ring 132 will not contact the plating solution, thereby ensuring that the electroplating operation can be carried out accurately, and the fixing module is configured to keep the cover plate 12 in the first working position, thereby ensuring that the chip will not fall off during the electroplating process.

[0042] Based on the above, this embodiment clamps the chip through the double-sided electroplating fixture 1 and can achieve sealing of the conductive structure, and both the front and back sides of the chip can be exposed to the fixture, so that both the front and back sides of the chip can be electroplated at the same time.

[0043] It is worth noting that, in this embodiment, a plurality of first contacts 1311 are provided on the first conductive ring 131, and the plurality of first contacts 1311 are evenly arranged along the circumference of the first through hole 111; a plurality of second contacts 1321 are provided on the second conductive ring 132, and the plurality of second contacts 1321 are evenly arranged along the circumference of the second through hole 121; when the cover plate 12 is located in the first working position, the plurality of first contacts 1311 are in contact with the back side of the chip, and the plurality of second contacts 1321 are in contact with the front side of the chip, thereby ensuring that parameters such as the uniformity and thickness of the coating on both sides of the chip meet the requirements.

[0044] Furthermore, in this embodiment, a first interface 115 and a second interface 126 are respectively provided on the substrate 11 and the cover plate 12. The first conductive ring 131 is electrically connected to the negative power supply through the first interface 115, and the second conductive ring 132 is electrically connected to the negative power supply through the second interface 126.

[0045] In addition, it is worth noting that in this embodiment, the first through hole 111 and the second through hole 121 are both square holes, so that they can be suitable for clamping square chips. Of course, in other optional embodiments, for chips of other shapes, the first through hole 111 and the second through hole 121 can also be set to be circular or other shapes accordingly, and this embodiment does not impose specific restrictions on this.

[0046] Based on the above mentioned content, Figures 5 to 7 As shown, combined with Figures 1 to 4 This embodiment also provides a disassembly and assembly device for a double-sided electroplating fixture, which is used to disassemble and assemble the double-sided electroplating fixture 1 mentioned above, so that the cover plate 12 can be switched between the first working position and the second working position, that is, the disassembly and assembly device can enable the double-sided electroplating fixture 1 to clamp the sheet to be electroplated, and can remove the sheet from the double-sided electroplating fixture 1 after the electroplating is completed. Specifically, in this embodiment, the disassembly and assembly device of the double-sided electroplating fixture includes a carrier 21, a lifting mechanism 22 and a pressing mechanism 23, wherein the carrier 21 is configured to carry the substrate 11, the lifting mechanism 22 includes a first driving member 221 and a lifting rod 222, the first driving member 221 is configured to drive the lifting rod 222 to rise and fall, and the lifting rod 222 supports the cover plate 12, and the pressing mechanism 23 includes a second driving member 231 and a pressure head 232, the second driving member 231 is configured to drive the pressure head 232 to rise and fall, and the pressure head 232 can press the substrate 11.

[0047] Based on the above, the sheet to be electroplated is first placed on the substrate 11, and the lifting rod 222 supports the cover plate 12 and drives the cover plate 12 downward to cover the cover plate 12 on the substrate 11, thereby clamping the sheet. After the electroplating is completed, the double-sided electroplating fixture 1 is placed back on the carrier 21. Thereafter, the pressure head 232 can press the substrate 11 onto the carrier 21, and the lifting rod 222 can support the cover plate 12 and drive the cover plate 12 to rise in the vertical direction, thereby separating the substrate 11 and the cover plate 12, and then the sheet can be taken out.

[0048] As described above, since both the front and back sides of the chip can be exposed to the double-sided electroplating fixture 1, this embodiment only requires one disassembly and assembly operation of the double-sided electroplating fixture 1. The whole process is relatively simple, thereby improving the work efficiency of the electroplating operation.

[0049] Please continue reading Figures 1 to 4 , and combined with Figures 5 to 7In this embodiment, the fixing module includes a first magnet 141 and a second magnet 142. The first magnet 141 and the second magnet 142 are respectively arranged on the substrate 11 and the cover 12. When the cover 12 is located in the first working position, the first magnet 141 and the second magnet 142 attract each other. That is, this embodiment maintains the cover 12 in the first working position by magnetic attraction, so that the cover 12 can be automatically fixed when the cover 12 is placed on the substrate 11, thereby further improving work efficiency.

[0050] Based on the above, after the electroplating is completed, the double-sided electroplating fixture 1 is placed back on the carrier 21. After that, the pressure head 232 can press the substrate 11 onto the carrier 21, and the lifting rod 222 can support the cover plate 12 and drive the cover plate 12 to rise in the vertical direction, thereby separating the first magnet 141 and the second magnet 142, and then separating the substrate 11 and the cover plate 12 to take out the sheet.

[0051] Furthermore, the fixing module includes a plurality of first magnets 141 and a plurality of second magnets 142. The plurality of first magnets 141 surround the outer circumference of the first through hole 111 and are evenly arranged along the circumference of the first through hole 111. The plurality of second magnets 142 surround the outer circumference of the second through hole 121 and are evenly arranged along the circumference of the second through hole 121, thereby ensuring that the cover plate 12 can be stably maintained in the first working position.

[0052] When the cover plate 12 is located at the first working position, the first sealing structure 112 and the second sealing structure 122 form a sealed cavity to seal the conductive structure. Specifically, the first sealing structure 112 includes a first sealing ring 1121 and a second sealing ring 1122. The first sealing ring 1121 surrounds the outer periphery of the first through hole 111, and the second sealing ring 1122 surrounds the outer periphery of the first sealing ring 1121. The second sealing structure 122 includes a third sealing ring 1221 and a fourth sealing ring 1222. The third sealing ring 1221 surrounds the outer periphery of the second through hole 121, and the fourth sealing ring 1222 surrounds the outer periphery of the third sealing ring 1221. The first sealing ring 1121 is corresponding to the third sealing ring 1221, and the second sealing ring 1122 is corresponding to the fourth sealing ring 1222. The ring 1222 is correspondingly arranged. When the sheet is clamped between the substrate 11 and the cover plate 12, the first sealing ring 1121 and the third sealing ring 1221 are pressed against the front and back sides of the sheet respectively, and the second sealing ring 1122 and the fourth sealing ring 1222 are pressed against each other, thereby forming a sealed cavity between the substrate 11 and the cover plate 12. It can be understood that in this embodiment, the first conductive ring 131 is located between the first sealing ring 1121 and the second sealing ring 1122, and the second conductive ring 132 is located between the third sealing ring 1221 and the fourth sealing ring 1222, so that when the cover plate 12 is in the first working position, the first conductive ring 131 and the second conductive ring 132 are both located in the sealed cavity, thereby sealing the first conductive ring 131 and the second conductive ring 132.

[0053] Based on the above, in the process of clamping the sheet, the sheet to be electroplated is first placed on the substrate 11, and the sheet is covered on top of the first sealing ring 1121. The lifting rod 222 supports the cover plate 12 and drives the cover plate 12 to descend. The cover plate 12 is covered on the substrate 11 by its own gravity and the suction force of the first magnet 141 and the second magnet 142, thereby achieving clamping of the sheet.

[0054] It is worth noting that the first magnet 141 is also located between the first sealing ring 1121 and the second sealing ring 1122, and the second magnet 142 is also located between the third sealing ring 1221 and the fourth sealing ring 1222. That is, in this embodiment, when the cover plate 12 is located in the first working position, the first magnet 141 and the second magnet 142 are also located in the sealed cavity, thereby preventing the plating liquid from affecting the adsorption of the first magnet 141 and the second magnet 142.

[0055] Furthermore, the substrate 11 is provided with a plurality of first positioning posts 113, which are located between the first sealing ring 1121 and the second sealing ring 1122 and surround the outer circumference of the first through hole 111. The plurality of first positioning posts 113 define the loading area of ​​the sheet. That is, this embodiment uses the plurality of first positioning posts 113 to position the sheet, thereby ensuring that the sheet is placed on the substrate 11 accurately, and the cover plate 12 is provided with a plurality of first positioning holes 123, which are located between the third sealing ring 1221 and the fourth sealing ring 1222 and surround the outer circumference of the second through hole 121. The plurality of first positioning posts 113 correspond one-to-one to the plurality of first positioning holes 123. When the cover plate 12 is in the first working position, the plurality of first positioning posts 113 are inserted one by one into the plurality of first positioning holes 123, thereby ensuring that the cover plate 12 can be covered on the substrate 11 and effectively clamp the sheet.

[0056] In addition, one of the substrate 11 and the cover plate 12 is provided with a plurality of second positioning columns 114, and the other of the substrate 11 and the cover plate 12 is provided with a plurality of second positioning holes 124. The plurality of second positioning columns 114 correspond one-to-one to the plurality of second positioning holes 124, and the plurality of second positioning columns 114 can be inserted one by one into the plurality of second positioning holes 124, thereby aligning the cover plate 12 and the substrate 11 in the process of moving the cover plate 12 toward the substrate 11 to clamp the sheet.

[0057] Furthermore, six first ear plates 125 are provided on the periphery of the cover plate 12, and the six first ear plates 125 surround the periphery of the cover plate 12. For example, three first ear plates 125 are provided on both sides of the cover plate 12, and the lifting mechanism 22 includes six lifting rods 222, and the six lifting rods 222 correspond one-to-one to the six first ear plates 125. The lifting rods 222 can abut against the bottom of the first ear plates 125, so as to support the cover plate 12 and drive the cover plate 12 to rise and fall together.

[0058] It is understandable that in other optional embodiments, two, three or other numbers of first ear plates 125 may be provided on the periphery of the cover plate 12, as long as the number of the first ear plates 125 is greater than or equal to two. Correspondingly, the lifting rods 222 may also be provided with two, three or other numbers, and this embodiment does not impose any specific restrictions on this.

[0059] Since more than two first ear plates 125 are provided on the outer periphery of the cover plate 12 and the lifting mechanism 22 includes more than two lifting rods 222 , the lifting mechanism 22 can more stably drive the cover plate 12 to move up and down.

[0060] Based on the above, in this embodiment, the first driving member 221 is installed below the carrier 21 through the first mounting plate 223, the movable end of the first driving member 221 is transmission-connected to the second mounting plate 224, the lifting rod 222 is installed on the second mounting plate 224, and the lifting rod 222 passes through the carrier 21. The first driving member 221 can drive the second mounting plate 224 to rise and fall, thereby driving the lifting rod 222 to rise and fall.

[0061] It is understandable that, in this embodiment, the first driving member 221 is a servo motor, so that the moving speed and stroke of the lifting rod 222 can be accurately controlled, thereby preventing the cover plate 12 from damaging the sheet material.

[0062] Of course, in other optional embodiments, the first driving member 221 may also be other linear driving structures such as a cylinder or an electric push rod, and this embodiment does not impose any specific limitation on this.

[0063] Furthermore, a receiving groove 1251 is provided at the bottom of the first ear plate 125 , and the lifting rod 222 can extend into the receiving groove 1251 , thereby further ensuring that the lifting mechanism 22 can more stably drive the cover plate 12 to rise and fall.

[0064] Furthermore, a guide sleeve 211 is installed on the carrier 21, and the guide sleeve 211 is sleeved on the outer periphery of the lifting rod 222, thereby guiding the movement of the lifting rod 222, thereby further ensuring that the lifting mechanism 22 can more stably drive the cover plate 12 to rise and fall.

[0065] In addition, a second ear plate 116 is provided on the substrate 11 , and the pressing head 232 can press the substrate 11 onto the stage 21 by pressing the second ear plate 116 .

[0066] It can be understood that in this embodiment, the second driving member 231 is a cylinder. Of course, in other optional embodiments, the second driving member 231 can also be selected as other linear driving structures such as an electric cylinder or an electric push rod, and this embodiment does not impose specific restrictions on this.

[0067] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Double-sided electroplating fixture, characterized in that, include: A substrate (11) and a cover plate (12), wherein the substrate (11) is provided with a first through hole (111) and a first sealing structure (112), and the cover plate (12) is provided with a second through hole (121) and a second sealing structure (122), the first through hole (111) and the second through hole (121) are arranged correspondingly, the first sealing structure (112) surrounds the outer periphery of the first through hole (111), and the second sealing structure (122) surrounds the outer periphery of the second through hole (121), the first sealing structure (112) and the second sealing structure (122) are arranged correspondingly, and the cover plate (12) has a first working position in which it is covered on the substrate (11), and a second working position in which it is separated from the substrate (11); A conductive module, comprising a first conductive ring (131) and a second conductive ring (132), wherein the first conductive ring (131) is arranged on the substrate (11) and surrounds the outer periphery of the first through hole (111), and the second conductive ring (132) is arranged on the cover plate (12) and surrounds the outer periphery of the second through hole (121); when the cover plate (12) is located at the first working position, the first sealing structure (112) and the second sealing structure (122) form a sealed cavity, the first conductive ring (131) and the second conductive ring (132) are both located in the sealed cavity, a sheet to be electroplated can be clamped between the substrate (11) and the cover plate (12), the front and back surfaces of the sheet are exposed through the first through hole (111) and the second through hole (121) respectively, and the edge of the sheet extends into the sealed cavity; and The fixing module is configured to keep the cover plate (12) in the first working position.

2. The double-sided electroplating fixture according to claim 1, characterized in that: The fixing module comprises a first magnet (141) and a second magnet (142), wherein the first magnet (141) and the second magnet (142) are respectively arranged on the base plate (11) and the cover plate (12), and when the cover plate (12) is located at the first working position, the first magnet (141) and the second magnet (142) attract each other.

3. The double-sided electroplating fixture according to claim 2, characterized in that: The fixing module comprises a plurality of first magnets (141) and a plurality of second magnets (142), wherein the plurality of first magnets (141) surround the outer circumference of the first through hole (111) and are evenly arranged along the circumference of the first through hole (111), and the plurality of second magnets (142) surround the outer circumference of the second through hole (121) and are evenly arranged along the circumference of the second through hole (121).

4. The double-sided electroplating fixture according to claim 1, characterized in that: The first sealing structure (112) includes a first sealing ring (1121) and a second sealing ring (1122), wherein the first sealing ring (1121) surrounds the outer periphery of the first through hole (111), and the second sealing ring (1122) surrounds the outer periphery of the first sealing ring (1121), and the second sealing structure (122) includes a third sealing ring (1221) and a fourth sealing ring (1222), wherein the third sealing ring (1221) surrounds the outer periphery of the second through hole (121), and the fourth sealing ring (1222) surrounds the outer periphery of the first through hole (121). The first sealing ring (1121) and the third sealing ring (1221) are arranged correspondingly around the outer circumference of the third sealing ring (1221), and the second sealing ring (1122) and the fourth sealing ring (1222) are arranged correspondingly. When the sheet is clamped between the substrate (11) and the cover plate (12), the first sealing ring (1121) and the third sealing ring (1221) are pressed against the front and back sides of the sheet respectively, and the second sealing ring (1122) and the fourth sealing ring (1222) are pressed against each other.

5. The double-sided electroplating fixture according to claim 4, characterized in that: A plurality of first positioning posts (113) are provided on the substrate (11), and the plurality of first positioning posts (113) are located between the first sealing ring (1121) and the second sealing ring (1122), and surround the outer periphery of the first through hole (111). The plurality of first positioning posts (113) define the loading area of ​​the sheet material. A plurality of first positioning holes (123) are provided on the cover plate (12), and the plurality of first positioning holes (123) are located between the third sealing ring (1221) and the fourth sealing ring (1222), and surround the outer periphery of the second through hole (121). The plurality of first positioning posts (113) correspond one-to-one to the plurality of first positioning holes (123).

6. The double-sided electroplating fixture according to claim 1, characterized in that: One of the substrate (11) and the cover plate (12) is provided with a plurality of second positioning columns (114), and the other of the substrate (11) and the cover plate (12) is provided with a plurality of second positioning holes (124). The plurality of second positioning columns (114) correspond one-to-one to the plurality of second positioning holes (124), and the plurality of second positioning columns (114) can be inserted one-to-one into the plurality of second positioning holes (124).

7. A disassembly and assembly device for a double-sided electroplating fixture, used for disassembling and assembling the double-sided electroplating fixture according to any one of claims 1 to 6, characterized in that: The disassembly and assembly device of the double-sided electroplating fixture includes: a carrier (21) configured to carry the substrate (11); A lifting mechanism (22) comprises a first driving member (221) and a lifting rod (222), wherein the first driving member (221) is configured to drive the lifting rod (222) to move upward and downward, and the lifting rod (222) supports the cover plate (12); and The pressing mechanism (23) comprises a second driving member (231) and a pressing head (232), wherein the second driving member (231) is configured to drive the pressing head (232) to rise and fall, and the pressing head (232) can press the substrate (11).

8. The disassembly and assembly device of the double-sided electroplating fixture according to claim 7, characterized in that: At least two first ear plates (125) are provided on the periphery of the cover plate (12), and the at least two first ear plates (125) surround the periphery of the cover plate (12); the lifting mechanism (22) includes at least two lifting rods (222), and the at least two lifting rods (222) correspond one-to-one to the at least two first ear plates (125); the lifting rods (222) can abut against the bottom of the first ear plates (125).

9. The disassembly and assembly device of the double-sided electroplating fixture according to claim 8, characterized in that: The bottom of the first ear plate (125) is provided with a receiving groove (1251), and the lifting rod (222) can extend into the receiving groove (1251).

10. The disassembly and assembly device of the double-sided electroplating fixture according to claim 7, characterized in that: A guide sleeve (211) is installed on the carrier (21), and the guide sleeve (211) is sleeved on the outer periphery of the lifting rod (222).

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