High-current probe mechanism

Abstract

The utility model relates to the technical field of laser chip detection, in particular to a high-current probe mechanism, which comprises a mounting block, and a sliding assembly, a probe and a terminal which are arranged on two sides of the mounting block in a mirroring manner, the sliding component is fixedly arranged on the mounting block; one end of the probe is slidably connected with the sliding assembly in the first direction. The other ends of the paired probes are close to each other, and the end surfaces of the two probes are power-up surfaces; and the terminal is connected with the probe. Compared with a traditional point pin type power-up mode, the end face of the probe is the power-up face, the power-up face abuts against the chip face, the maximum detection current which can be applied to the chip by the probe is effectively increased, the current can reach 100 A or above and far exceeds 40 A current of point pin type power-up, and the adaptability of the high-current probe mechanism to chips with different current detection requirements is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser chip detection, in particular to a high current probe mechanism. Background Art

[0002] In the laser semiconductor industry, the performance testing of laser chips requires applying current to the chip to make the chip emit light, and then performing performance testing on the light-emitting chip.

[0003] When powering a chip, the probes make contact with the chip, energizing it. The probes apply power through point-to-surface contact, and the maximum current currently available on the market is generally around 40A. For chips that require high currents to emit light, existing probe testing mechanisms struggle to meet these requirements. Utility Model Content

[0004] (1) Technical issues to be resolved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a high-current probe mechanism, which solves the technical problem that the maximum detection current that the existing probe detection mechanism can apply to the chip is relatively small.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned object, the high current probe mechanism of the utility model comprises a mounting block and a sliding assembly, a probe and a terminal mirror-imaged on both sides of the mounting block;

[0008] The sliding assembly is fixedly arranged on the mounting block;

[0009] One end of the probe is slidably connected to the sliding assembly along a first direction; the other ends of the paired probes are close to each other, and the end surfaces of the two probes are powered surfaces;

[0010] The terminal is connected to the probe.

[0011] Optionally, the sliding assembly includes a base, a slider and a spring;

[0012] The base is connected to the mounting block;

[0013] The slider is slidably connected to the base along the first direction;

[0014] One end of the spring is connected to the base, and the other end is connected to the slider; the axial direction of the spring is parallel to the first direction.

[0015] Optionally, a U-shaped limiting groove is provided inside the base;

[0016] The sliding block can abut against the U-shaped limiting groove to limit the sliding of the sliding block along the first direction.

[0017] Optionally, the base has built-in cross rails;

[0018] The slider is slidably connected to the cross guide rail along the first direction; and the probe is connected to the slider.

[0019] Optionally, the probe includes a connecting section and a curved section;

[0020] One end of the connecting section is connected to the sliding assembly, and the other end is connected to the bending section; the free end of the bending section is bent toward the mounting block;

[0021] The powered surface is perpendicular to the first direction.

[0022] Optionally, the probe further comprises a connecting piece;

[0023] A waist-shaped hole is provided on the curved section; the connecting section and the waist-shaped hole are detachably connected via the connecting piece so as to be able to adjust the distance between a pair of the curved sections.

[0024] Optionally, a thermistor is provided on the probe.

[0025] Optionally, the mounting block is an insulating block.

[0026] (3) Beneficial effects

[0027] The beneficial effects of the utility model are:

[0028] Compared with the traditional point-needle power-on method, the end face of the probe of the utility model is the power-on surface, and the power-on surface is in surface contact with the chip, which effectively increases the maximum detection current that the probe can apply to the chip. The current in this embodiment can reach more than 100A, far exceeding the 40A current of the point-needle power-on, thereby improving the adaptability of the high-current probe mechanism to chips with different current detection requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a top view of the high current probe mechanism of the utility model;

[0030] Figure 2 A three-dimensional diagram of the high current probe mechanism of the present invention from one perspective;

[0031] Figure 3 A three-dimensional diagram of the high current probe mechanism of the present invention from another perspective;

[0032] Figure 4 It is a structural schematic diagram of the bending section of the utility model.

[0033] [Description of Reference Numerals]

[0034] 1: Install the block;

[0035] 2: Sliding assembly; 21: Base; 211: Cross guide rail; 22: Slider; 23: Spring;

[0036] 3: probe; 31: connecting section; 32: bending section; 321: waist-shaped hole;

[0037] 4: terminal;

[0038] 5: Thermistor;

[0039] 6: Chip. DETAILED DESCRIPTION

[0040] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation methods in conjunction with the accompanying drawings.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0043] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can refer to fixed connection, detachable connection, or integration; "connection" can refer to mechanical connection or electrical connection; it can refer to direct connection or indirect connection through an intermediate medium; it can refer to internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0044] See also Figure 1 and Figure 2The present invention provides a high-current probe mechanism, which includes a mounting block 1 and a sliding assembly 2, a probe 3, and a terminal 4 mirror-imaged on both sides of the mounting block 1; the sliding assembly 2 is fixedly mounted on the mounting block 1; one end of the probe 3 is slidably connected to the sliding assembly 2 along a first direction; the other ends of the paired probes 3 are close to each other, and the end faces of both are powered surfaces; and the terminal 4 is connected to the probe 3. The first direction is the sliding direction of the sliding assembly 2, which is also a direction perpendicular to the functional surface of the chip 6. The other ends of the paired probes 3 are close to each other, and the spacing between the pair of powered surfaces can be set according to the position of the inlet and outlet ports of the chip 6.

[0045] In this embodiment, terminals 4 are silver-plated. The wires pass through terminals 4 and press against probes 3, energizing both probes 3 and the powered surfaces. The high-current probe mechanism then moves over the functional surface of chip 6, pressing against it. After power is applied until chip 6 emits light, performance testing is performed.

[0046] The probes 3 are slidably connected to the sliding assembly 2 along a first direction, allowing the pair of probes 3 to extend and retract relative to the functional surface of the chip 6, thereby powering the chip 6. Compared to the traditional point-probe powering method, the end faces of the probes 3 of the present utility model serve as the powering surface, and the powering surface abuts the chip 6 surface-to-surface, effectively increasing the maximum detection current that the probes 3 can apply to the chip 6. In this embodiment, the current can reach over 100A, far exceeding the 40A current of the point-probe powering method, improving the adaptability of the high-current probe mechanism to chips 6 with different current detection requirements.

[0047] like Figure 3 As shown, the sliding assembly 2 includes a base 21, a slider 22 and a spring 23; the base 21 is connected to the mounting block 1; the slider 22 is slidably connected to the base 21 along a first direction; one end of the spring 23 is connected to the base 21, and the other end is connected to the slider 22; the axial direction of the spring 23 is parallel to the first direction. Specifically, the mounting block 1 includes a T-shaped block and a mounting plate, and the T-shaped block includes a horizontal plate and a vertical plate; a pair of bases 21 are correspondingly arranged on both sides of the T-shaped block; the spring 23 is connected to the bottom surface of the horizontal plate to achieve buffering of the slider 22 in the first direction, improve safety when docking with the chip 6, and avoid damage to the chip 6; the mounting plate is connected to the top surface of the horizontal plate for fixing with an external tooling. The sliding direction of the slider 22 is guided by the base 21, and by setting the axial direction of the spring 23 along the first direction, the stability of the slider 22 sliding along the first direction is effectively improved, thereby improving the docking accuracy between the powered surface and the chip 6, and improving the maximum detection current that the probe 3 can apply to the chip 6.

[0048] Furthermore, a U-shaped limiting groove is formed inside the base 21; the slider 22 can abut against the U-shaped limiting groove to limit the sliding movement of the slider 22 in the first direction. The U-shaped limiting groove and the horizontal plate (spring 23) limit the sliding movement of the slider 22 in the first direction, effectively restricting the sliding path of the slider 22 within the base 21, preventing the slider 22 from colliding with the chip 6 with excessive force and damaging the chip 6, or preventing the slider 22 from falling out of the base 21, thereby improving the reliability of the high-current probe mechanism.

[0049] Secondly, the base 21 has a built-in cross rail 211; the slider 22 is slidably connected to the cross rail 211 along the first direction; and the probe 3 is connected to the slider 22. Specifically, the cross rail 211, also known as a cross roller guide, can withstand loads in all directions, achieving high-precision and smooth linear motion, further improving the stability of the slider 22 sliding along the first direction.

[0050] Furthermore, probe 3 includes a connecting section 31 and a curved section 32. One end of connecting section 31 is connected to sliding assembly 2, and the other end is connected to curved section 32. The free end of curved section 32 curves toward mounting block 1. The powered surface is perpendicular to the first direction. Since the functional surface of chip 6 is generally smaller than the high-current probe mechanism, the addition of curved section 32 completes the transition from connecting section 31 to the powered surface, ensuring that the contacts corresponding to the powered surface and the functional surface of chip 6 overlap in the first direction. This eliminates the need for a sliding mechanism in probe 3, simplifies the structure of the high-current probe mechanism, and improves chip 6 detection efficiency.

[0051] See also Figure 4 , the probe 3 also includes a connector; a waist-shaped hole 321 is provided on the curved section 32; the connecting section 31 and the waist-shaped hole 321 are detachably connected through the connector so as to be able to adjust the spacing between a pair of curved sections 32. The connector can be a screw or a pin, which can realize the detachable connection between the connecting section 31 and the curved section 32. Taking the connector as a screw as an example, after the connector is loosened, the curved section 32 can slide along the length direction of the waist-shaped hole 321 through the waist-shaped hole 321, thereby realizing the adjustment of the spacing between a pair of powered surfaces, and the connector can be tightened after the adjustment. The effective cooperation between the waist-shaped hole 321 and the connector improves the docking accuracy between a pair of powered surfaces and a pair of contacts of the chip 6, and the adjustment method is simple and practical.

[0052] Furthermore, the probe 3 is provided with a thermistor 5. The thermistor 5 can monitor the temperature of the probe 3 in real time and promptly feed back to the external cooling system for linkage, so that the working temperature of the probe 3 can be controlled, effectively protecting the chip 6 during the detection process and preventing the chip 6 from being damaged by high temperature.

[0053] Secondly, the mounting block 1 is an insulating block. The insulating block can prevent the high current during the detection process from being conducted to the external device through the mounting block 1, effectively preventing the high current probe mechanism from affecting the performance of the external device after being installed on the external device, and reducing the installation requirements of the high current probe mechanism.

[0054] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high current probe mechanism, characterized in that: The high current probe mechanism comprises a mounting block (1), and a sliding assembly (2), a probe (3), and a terminal (4) arranged in a mirror image on both sides of the mounting block (1); The sliding assembly (2) is fixedly arranged on the mounting block (1); One end of the probe (3) is slidably connected to the sliding assembly (2) along a first direction; the other ends of the paired probes (3) are close to each other, and the end surfaces of the two probes are powered surfaces; The terminal (4) is connected to the probe (3).

2. The high current probe mechanism according to claim 1, wherein: The sliding assembly (2) comprises a base (21), a slider (22) and a spring (23); The base (21) is connected to the mounting block (1); The slider (22) is slidably connected to the base (21) along the first direction; One end of the spring (23) is connected to the base (21), and the other end is connected to the slider (22); the axial direction of the spring (23) is parallel to the first direction.

3. The high current probe mechanism according to claim 2, characterized in that: A U-shaped limiting groove is provided inside the base (21); The slider (22) can abut against the U-shaped limiting groove to limit the sliding of the slider (22) along the first direction.

4. The high current probe mechanism according to claim 2, wherein: The base (21) has a built-in cross guide rail (211); The slider (22) is slidably connected to the cross guide rail (211) along the first direction; and the probe (3) is connected to the slider (22).

5. The high current probe mechanism according to any one of claims 1 to 4, characterized in that: The probe (3) comprises a connecting section (31) and a bending section (32); One end of the connecting section (31) is connected to the sliding assembly (2), and the other end is connected to the bending section (32); the free end of the bending section (32) is bent toward the mounting block (1); The powered surface is perpendicular to the first direction.

6. The high current probe mechanism according to claim 5, characterized in that: The probe (3) further comprises a connecting piece; A waist-shaped hole (321) is provided on the curved section (32); the connecting section (31) and the waist-shaped hole (321) are detachably connected via the connecting piece so as to be able to adjust the spacing between a pair of the curved sections (32).

7. The high current probe mechanism according to any one of claims 1 to 4, characterized in that: The probe (3) is provided with a thermistor (5).

8. The high current probe mechanism according to any one of claims 1 to 4, characterized in that: The mounting block (1) is an insulating block.

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