Hot melting structure of supporting foot pad, supporting foot pad and notebook computer

Abstract

The utility model belongs to the technical field of electronic products, and provides a hot melting structure of a supporting foot pad, the supporting foot pad and a notebook computer, and the hot melting structure of the supporting foot pad comprises a hot melting hole which is formed in a shell of the notebook computer; the first mounting position is communicated with the hot melting hole, a glue overflowing groove is formed in the first mounting position, at least part of the head of the supporting foot pad is arranged on the first mounting position, and during hot melting, the head of the supporting foot pad is melted and overflows into the glue overflowing groove to clamp the supporting foot pad; the second mounting position is communicated with the hot melting hole, the second mounting position and the first mounting position are arranged on the two opposite sides of the shell respectively, and at least part of the tail of the supporting foot pad is arranged on the second mounting position; after hot melting cooling, gapless combination can be formed between the supporting foot pad and the hot melting structure, the supporting foot pad has no loosening space, and it is ensured that the supporting foot pad is not prone to loosening.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a hot-melt structure of a support pad, a support pad, and a laptop computer. Background Art

[0002] As a portable computer, a laptop computer generally needs to be placed flat on a table when in use. Since the bottom of the laptop computer is in direct contact with the table, it is not conducive to the heat dissipation of the computer. In addition, the friction between the bottom of the laptop computer and the table is low. In order to prevent the laptop computer from sliding, the existing technology designs support pads on the bottom of the laptop computer to support the laptop computer. The pads can not only raise the laptop computer to form a space for heat dissipation between the bottom of the laptop computer and the table, but also increase the friction between the laptop computer and the table.

[0003] In the prior art, laptop support pads are mostly installed using adhesives such as adhesive tape. As the laptop is used, the adhesive tape loses its viscosity, and the adhesion between the support pads and the bottom of the laptop also gradually decreases, causing the support pads to loosen or even fall off, affecting the normal use of the laptop. Utility Model Content

[0004] In view of the above shortcomings of the prior art, the purpose of the present application is to provide a hot-melt structure of a support pad, a support pad and a laptop computer, so as to solve the problem that the support pad of the laptop computer in the prior art is easy to loosen.

[0005] To achieve the above-mentioned and other related purposes, the present application provides a hot-melt structure of a support pad, a support pad, and a laptop computer. The hot-melt structure of the support pad includes:

[0006] A hot melt hole is provided on the housing of the laptop computer;

[0007] a first mounting position, connected to the hot melt hole, having a glue overflow groove formed on the first mounting position, wherein the head portion of the support pad is at least partially disposed on the first mounting position, and during hot melting, the head portion of the support pad melts and overflows into the glue overflow groove to clamp the support pad;

[0008] The second mounting position is connected to the hot melt hole. The second mounting position and the first mounting position are respectively arranged on two opposite sides of the shell, and the tail of the supporting foot pad is at least partially arranged on the second mounting position.

[0009] Optionally, the glue overflow groove forms a circular convex structure in the circumference of the hot melt hole, and when the support pad is installed, the convex structure contacts the head of the support pad.

[0010] Optionally, a paint overflow groove is provided on the second mounting position, and the paint overflow groove is arranged along the circumference of the hot melt hole.

[0011] Optionally, the second mounting position has an opening for the support foot pad to enter, and the opening is in a gradually expanding trumpet shape.

[0012] Based on the same utility model concept, the present application also provides a support foot pad, which is installed on the housing of a laptop computer using the above-mentioned hot-melt structure, comprising:

[0013] a head portion, wherein the head portion is at least partially exposed from the first mounting position;

[0014] The tail portion is connected to the head portion, and the tail portion is at least partially exposed from the second installation position.

[0015] Optionally, the head is an I-shaped structure, and the head passes through the hot melt hole and is in contact with the first mounting position and the second mounting position at the same time.

[0016] Optionally, the head is configured to be a hot-melt material.

[0017] Optionally, the tail portion is made of anti-slip material.

[0018] Optionally, the head and the tail are an integrally connected structure.

[0019] Based on the same utility model concept, the present application also provides a laptop computer, comprising:

[0020] case;

[0021] And the supporting foot pad as described above, the supporting foot pad is arranged at the bottom of the shell.

[0022] In the hot melt structure of the support pad provided in the present application, the support pad is first inserted into the hot melt hole, the head of the support pad is in contact with the first mounting position, and the tail of the support pad is in contact with the second mounting position. During hot melting, the head of the support pad is melted by the heat, pressing the head of the support pad tightly. After the head of the support pad melts, it overflows into the overflow glue groove and fills the overflow glue groove. After cooling, a gap-free combination is formed between the support pad and the hot melt structure, and there is no loose space in the support pad, ensuring that the support pad is not easy to loosen. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the assembly of the support pad and the housing according to an embodiment of the present application;

[0024] Figure 2 for Figure 1 Cross-sectional view of AA;

[0025] Figure 3A cross-sectional view of a hot-melt structure of a support foot pad according to an embodiment of the present application;

[0026] Figure 4 This is a schematic structural diagram of a support foot pad according to an embodiment of the present application.

[0027] Part Number Description

[0028] 1-support pad; 2-shell; 3-head; 4-tail; 5-glue overflow groove; 6-first installation position; 7-opening; 8-hot melt hole; 9-paint overflow groove; 10-second installation position; 11-middle; 12-boss structure. DETAILED DESCRIPTION

[0029] The following describes the implementation of the present application through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0030] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "front", "back", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0031] See also Figures 1 to 4 , the present application exemplarily provides a hot melt structure for supporting a foot pad, comprising:

[0032] A hot melt hole 8 is provided on the housing 2 of the laptop computer;

[0033] The first mounting position 6 is connected to the hot melt hole 8. The first mounting position 6 is provided with a glue overflow groove 5. The head portion 3 of the support pad 1 is at least partially disposed on the first mounting position 6. During hot melting, the head portion 3 of the support pad 1 melts and overflows into the glue overflow groove 5 to clamp the support pad 1.

[0034] The second mounting position 10 is connected to the hot melt hole 8 . The second mounting position 10 and the first mounting position 6 are respectively arranged on opposite sides of the shell 2 . The tail portion 4 of the support pad 1 is at least partially arranged on the second mounting position 10 .

[0035] It is worth mentioning that when installing the support pads of a laptop computer, if hot melting is used, there is an assembly gap between the hot melting hole and the support column of the support pad. This will result in loose space after the pads are hot melted, which can easily cause the support pads to loosen and make abnormal noises.

[0036] In the hot melt structure of the support pad provided in the present application, the support pad 1 is first inserted into the hot melt hole 8, the head 3 of the support pad 1 is in contact with the first mounting position 6, and the tail 4 of the support pad 1 is in contact with the second mounting position 10. During hot melting, the head 3 of the support pad 1 is heated and melted, pressing the head 3 of the support pad 1. After the head 3 of the support pad 1 is melted, it overflows into the overflow glue groove 5 and fills the overflow glue groove 5. After cooling, a gap-free combination is formed between the support pad 1 and the hot melt structure, and there is no loose space for the support pad 1, ensuring that the support pad 1 is not easy to loosen.

[0037] In this embodiment, the glue overflow groove 5 forms a circular convex structure in the circumference of the hot melt hole 8. When the support pad 1 is installed, the convex structure contacts the head 3 of the support pad 1. During hot melting, the head 3 of the support pad 1 is melted by the heat and overflows into the glue overflow groove 5, which cooperates with the convex structure to enhance the stability of the support pad 1 after installation.

[0038] In some embodiments, a paint overflow groove 9 is provided on the second mounting position 10, and the paint overflow groove 9 is arranged along the circumference of the hot melt hole 8. The paint overflow groove 9 is used to prevent paint accumulation or accumulation of impurities such as dust at the corners when spraying paint on the laptop computer housing 2, which affects the assembly of the support foot pad 1. A boss structure 12 is provided between the paint overflow groove 9 and the hot melt hole 8. When the support foot pad 1 is assembled, the middle part 11 of the support foot pad 1 is close to the side of the paint overflow groove 9 and is in contact with the boss structure 12, thereby closing the paint overflow groove 9.

[0039] In some embodiments, the second mounting position 10 has an opening 7 for the supporting foot pad 1 to enter, and the opening 7 is a gradually expanding trumpet shape. The upper half of the tail 4 of the supporting foot pad 1 is a trapezoidal structure, which matches the opening 7. The lower half of the tail 4 of the supporting foot pad 1 surrounds the opening 7 along the circumference of the opening 7.

[0040] In another embodiment, the present application further provides a support foot pad 1, which is installed on the housing 2 of a laptop computer using the above-mentioned hot melt structure, comprising:

[0041] The head portion 3 is at least partially exposed from the first mounting position 6;

[0042] The tail portion 4 is connected to the head portion 3 , and at least a portion of the tail portion 4 is exposed from the second installation position 10 .

[0043] In this embodiment, the head 3 is an I-shaped structure. The head 3 passes through the hot melt hole 8 and is in contact with the first installation position 6 and the second installation position 10 at the same time.

[0044] In the above embodiment, the head 3 is set to a hot melt material and the tail 4 is set to an anti-slip material. Specifically, in this embodiment, the head 3 is a hot melt adhesive material and the tail 4 is a rubber material. The materials of the head 3 and the tail 4 are not specifically limited here.

[0045] In this embodiment, the head portion 3 and the tail portion 4 are an integrally connected structure, which facilitates the assembly of the support pad 1 and the hot-melt structure.

[0046] In another embodiment, the present application further provides a laptop computer, comprising:

[0047] Shell 2;

[0048] And the supporting foot pad 1 as above, which is arranged at the bottom of the shell 2.

[0049] In summary, in the hot melt structure of the support pad provided in the present application, the support pad 1 is first inserted into the hot melt hole 8, the head 3 of the support pad 1 is in contact with the first mounting position 6, and the tail 4 of the support pad 1 is in contact with the second mounting position 10. During hot melting, the head 3 of the support pad 1 is heated and melted, pressing the head 3 of the support pad 1. After the head 3 of the support pad 1 is melted, it overflows into the overflow glue groove 5 and fills the overflow glue groove 5. After cooling, a gap-free combination is formed between the support pad 1 and the hot melt structure, and there is no loose space for the support pad 1, ensuring that the support pad 1 is not easy to loosen.

[0050] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, any equivalent modifications or alterations accomplished by a person of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A hot melt structure for supporting foot pads, characterized in that: include: A hot melt hole is provided on the housing of the laptop computer; a first mounting position, connected to the hot melt hole, having a glue overflow groove formed on the first mounting position, wherein the head portion of the support pad is at least partially disposed on the first mounting position, and during hot melting, the head portion of the support pad melts and overflows into the glue overflow groove to clamp the support pad; The second mounting position is connected to the hot melt hole. The second mounting position and the first mounting position are respectively arranged on two opposite sides of the shell, and the tail of the supporting foot pad is at least partially arranged on the second mounting position.

2. The hot melt structure of the support foot pad according to claim 1, characterized in that: The glue overflow groove forms a circular convex structure in the circumference of the hot melt hole. When the support pad is installed, the convex structure contacts the head of the support pad.

3. The hot melt structure of the support foot pad according to claim 1, characterized in that: A paint overflow groove is provided on the second installation position, and the paint overflow groove is arranged along the circumference of the hot melt hole.

4. The hot melt structure of the support foot pad according to claim 1, characterized in that: The second installation position has an opening for the support pad to enter, and the opening is in a gradually expanding trumpet shape.

5. A support foot pad, mounted on a laptop computer housing using the hot melt structure according to any one of claims 1 to 4, characterized in that: include: a head portion, wherein the head portion is at least partially exposed from the first mounting position; The tail portion is connected to the head portion, and the tail portion is at least partially exposed from the second installation position.

6. The support foot pad according to claim 5, characterized in that: The head is an I-shaped structure, passes through the hot melt hole, and is in contact with the first installation position and the second installation position at the same time.

7. The support foot pad according to claim 5, characterized in that: The head is configured as a hot-melt material.

8. The support foot pad according to claim 5, characterized in that: The tail portion is made of anti-slip material.

9. The support foot pad according to claim 5, characterized in that: The head and the tail are an integrally connected structure.

10. A notebook computer, characterized in that: include: case; And the supporting foot pad according to any one of claims 5 to 9, wherein the supporting foot pad is arranged at the bottom of the shell.

Images