Film tearing mechanism for wafer film

Abstract

The utility model belongs to the technical field of semiconductor processing, and relates to a wafer film tearing mechanism, which comprises a first film pasting mechanism and a first film clamping mechanism, and is characterized in that the first film pasting mechanism pastes a hot melt adhesive film on a wafer film of a wafer on a wafer adsorption chuck; and the first film clamping mechanism clamps the hot melt adhesive film and moves the hot melt adhesive film to a preset position. After the structure is adopted, the full-automatic film tearing machine has the beneficial effects that film tearing can be fully automatically carried out, manual film tearing is not needed, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor processing, and specifically relates to a wafer film tearing mechanism. BACKGROUND

[0002] With the progress of semiconductor technology, the requirement for product performance is higher and higher, and new packaging processes are emerging continuously. When wafers come out of a wafer manufacturing plant, the thickness is relatively thick. Due to the requirement for packaging size, the wafers are thinned during packaging to adapt to smaller packaging sizes. In order to protect the circuit layer of the wafer during thinning, a film is pasted on the circuit layer of the wafer to protect the wafer from being scratched and contaminated during thinning and grinding. After the wafer is thinned, the protective film needs to be removed, and the wafer cannot be damaged during removal.

[0003] There are many ways to tear the film. The traditional solution is to adsorb the wafer on a platform, manually peel off one edge with tweezers, and then manually pull the film to remove the thinning film of the wafer by external force. This solution is a pure manual mode, and there are too many human factors, which is difficult to control. Moreover, the tweezers are easy to pierce the wafer, and the manual tearing force is difficult to control, which is easy to cause the wafer to break. Therefore, it is necessary to improve. UTILITY MODEL CONTENT

[0004] In order to solve the above problems of the prior art, the utility model provides a wafer film tearing mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] As one aspect of the utility model, a wafer film tearing mechanism is provided, which comprises: a first film pasting mechanism and a first film clamping mechanism, the first film pasting mechanism pastes a hot melt adhesive film on the wafer film of the wafer on the wafer adsorption chuck; the first film clamping mechanism clamps and moves the hot melt adhesive film to a preset position;

[0007] The first film pasting mechanism comprises a first film pasting base, a first film winding roller is rotatably connected to the first film pasting base, a first film pasting motor is connected to the first film pasting base, and the movable end of the first film pasting motor is connected with the first film winding roller; the hot melt adhesive film is connected to the first film winding roller; a first leading-out channel is formed in the first film pasting base,

[0008] A first film cutting assembly is arranged on the first film pasting base, and the first film cutting assembly cuts the hot melt adhesive film;

[0009] The first film clamping mechanism is located below the first film pasting mechanism; the first film clamping mechanism comprises a first film feeding roller shaft rotatably connected to a rack, a first film feeding roller shaft motor is arranged on the rack, and the movable end of the first film feeding roller shaft motor is connected with the first film feeding roller shaft.

[0010] The first film clamping mechanism further comprises a first film feeding roller shaft movably connected to the frame, the first film feeding roller shaft being rotatably connected to a first film feeding support, the first film feeding support being slidably connected to the frame; the frame is provided with a first film feeding roller shaft air cylinder, the movable end of the first film feeding roller shaft air cylinder being connected to the first film feeding support;

[0011] The first film clamping mechanism further comprises a first clamping assembly movably connected to the frame.

[0012] Optionally, the first film pasting base is rotatably connected with a first winding driven roller and a second winding driven roller, and the movable end of the hot melt adhesive film sequentially winds the first winding driven roller and the second winding driven roller and passes through the first leading channel.

[0013] Optionally, the center of the first winding driven roller is located below and to the right of the center of the first film winding roller, and the center of the second winding driven roller is located below and to the left of the center of the first winding driven roller.

[0014] Optionally, the first film pasting base is provided with a first side pushing air cylinder, the movable end of the first side pushing air cylinder is connected with a first side pushing plate, and the first side pushing plate movably penetrates into the first leading channel.

[0015] Optionally, the first leading channel comprises a first leading groove provided on the first film pasting base; the upper portion of the first leading groove is provided with a first groove pressing block, the movable end of a first groove pressing air cylinder provided on the first film pasting base is connected to the first groove pressing block, and the first groove pressing block is pressed on the groove opening of the first leading groove.

[0016] Optionally, the first film pasting base is provided with a first film pressing air cylinder, the movable end of the first film pressing air cylinder is connected with a first film pressing block.

[0017] Optionally, the first film pasting base is provided with a first heating lifting air cylinder, the movable end of the first heating lifting air cylinder is connected with a first heater.

[0018] Optionally, the first film cutting assembly comprises a first film cutting air cylinder connected to the first film pasting base, the movable end of the first film cutting air cylinder is connected with a first blade.

[0019] The first film pressing block and the first film pasting base are respectively provided with a cutting accommodation groove for the first blade when cutting.

[0020] Optionally, the frame is provided with a first cleaning member.

[0021] Optionally, the first clamping assembly comprises a first clamping support, which is slidingly connected to the frame; the first clamping support is connected to a movable end of a moving power part arranged on the frame; a first clamping groove is formed on the first clamping support, and a first clamping cylinder is connected in the first clamping groove; a first clamping block is connected to a movable end of the first clamping cylinder, and the first clamping block is matched with the first clamping groove.

[0022] The wafer film tearing mechanism has the advantages that film tearing can be automatically performed without manual film tearing, and work efficiency is improved; film tearing is uniform, and the wafer surface is not damaged or residual glue is left. BRIEF DESCRIPTION OF DRAWINGS

[0023] The description and the accompanying drawings of the specification form part of this application and are included to further provide a general understanding of the application. The application illustratively disclosed provides one or more best modes contemplated for carrying out the application across various its embodiments.

[0024] Figure 1 FIG. 1 is a structure perspective view of a wafer film tearing mechanism of the present application;

[0025] Figure 2 FIG. 2 is a structure front view of the wafer film tearing mechanism of the present application;

[0026] Figure 3 FIG. 3 is a structure side view of the wafer film tearing mechanism of the present application;

[0027] Figure 4 FIG. 4 is a structure front view of a first film pasting mechanism of the present application;

[0028] Figure 5 FIG. 5 is a structure side view of the first film pasting mechanism of the present application;

[0029] Figure 6 FIG. 6 is a structure back view of the first film pasting mechanism of the present application;

[0030] Figure 7 FIG. 7 is a structure front view of a first film clamping mechanism of the present application;

[0031] Figure 8 FIG. 8 is a structure bottom view of the first film clamping mechanism of the present application;

[0032] Figure 9 FIG. 9 is a structure schematic view of a first cleaning piece of the present application;

[0033] Figure 10 FIG. 10 is a structure schematic view of the first cleaning piece of the present application. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0035] A wafer film tearing mechanism according to an embodiment of the present application is as follows: Figures 1-3 As shown, it includes: a first film sticking mechanism 501 and a first film clamping mechanism 502. The first film sticking mechanism 501 sticks a hot melt adhesive film on the wafer film of the wafer on the wafer adsorption chuck 4. It should be noted that the structure of the wafer adsorption chuck 4 is a prior art and will not be described here. The first film clamping mechanism 502 clamps the hot melt adhesive film and moves it to a preset position to tear off the wafer film of the wafer.

[0036] Furthermore, if Figures 4-6 As shown, the first film laminating mechanism 501 includes a first film laminating base 5011, a first film rolling roller 5012 is rotatably connected to the first film laminating base 5011, a first film laminating motor 5013 is connected to the first film laminating base 5011, a movable end of the first film laminating motor 5013 is connected to a first film laminating driving wheel 5014, one end of the first film laminating roller 5012 is connected to a first film laminating driven wheel 5015, and the first film laminating driving wheel 5014 and the first film laminating driven wheel 5015 are connected by a first film laminating synchronous belt; a hot melt adhesive film is connected to the first film rolling roller 5012, and the first film laminating motor 5013 drives the first film rolling roller 5012 to release the hot melt adhesive film on the first film rolling roller 5012 at a preset speed;

[0037] A first winding driven roller 5016 and a second winding driven roller 5017 are rotatably connected to the first film laminating base 5011. The center of the first winding driven roller 5016 is located to the lower right of the center of the first film winding roller 5012, and the center of the second winding driven roller 5017 is located to the lower left of the center of the first winding driven roller 5016.

[0038] A first outlet channel 5018 is formed on the first film-applying base 5011. The movable end of the hot-melt adhesive film is sequentially wound around a first winding driven roller 5016 and a second winding driven roller 5017, and moves through the first outlet channel 5018. A first side-pushing cylinder 5019 is provided on the first film-applying base 5011. The movable end of the first side-pushing cylinder 5019 is connected to a first side-pushing plate 50110. The first side-pushing plate 50110 is movably arranged in the first outlet channel 5018 to push the hot-melt adhesive film in the first outlet channel 5018 to a preset position.

[0039] The first guide channel 5018 comprises a first guide groove 50181 arranged on the first film pasting base 5011; a first pressing groove block 50182 is arranged above the first guide groove 50181, and the first pressing groove block 50182 is connected with a movable end of a first pressing groove cylinder 50183 arranged on the first film pasting base 5011; the first pressing groove block 50182 is pressed on a groove opening of the first guide groove 50181, so that the hot melt adhesive film is conveniently installed and limited in the first guide groove 50181.

[0040] Further, the first film pasting base 5011 is provided with a first film pressing cylinder 50111, and a movable end of the first film pressing cylinder 50111 is connected with a first film pressing block 50112,

[0041] The first film pasting base 5011 is provided with a first film cutting assembly, which cuts the hot melt adhesive film; the first film cutting assembly comprises a first film cutting cylinder 50115 connected with the first film pasting base 5011, a movable end of the first film cutting cylinder 50115 is connected with a first blade 50116, and the first film pressing block 50112 and the first film pasting base 5011 are respectively provided with a cutting allowance groove 50117 for the first blade 50116 to cut; after the hot melt adhesive film is firmly adhered, the first heating lifting cylinder 50113 is upwardly lifted, the first blade 50116 is ejected through the first film cutting cylinder 50115, and the hot melt adhesive film is cut;

[0042] The first film pressing block 50112 presses the hot melt adhesive film coming out of the first guide channel 5018 on the cutting allowance groove 50117, so as to facilitate the first blade 50116 to cut the hot melt adhesive film.

[0043] Before the first film pressing block 50112 acts, the hot melt adhesive film needs to be heated to increase its viscosity; the first film pasting base 5011 is provided with a first heating lifting cylinder 50113, a movable end of the first heating lifting cylinder 50113 is connected with a first heater 50114, the first heater 50114 heats the hot melt adhesive film coming out of the first guide channel 5018, fixes the hot melt adhesive film on the wafer film, and heats the hot melt adhesive film to make it adhere to the wafer film; when the hot melt adhesive film is heated, the first film pressing block 50112 is ejected downwardly by the first film pressing cylinder 50111 to press the hot melt adhesive film.

[0044] Specifically, as Figures 7-8The first film clamping mechanism 502 is located below the first film pasting mechanism 501. The first film clamping mechanism 502 comprises a first film feeding roller shaft 5021 rotatably connected to the rack. One end of the first film feeding roller shaft 5021 is connected with a first film feeding roller shaft driven wheel 5022. The rack is provided with a first film feeding roller shaft motor 5023. The movable end of the first film feeding roller shaft motor 5023 is connected with a first film feeding roller shaft driving wheel 5024. The first film feeding roller shaft driven wheel 5022 and the first film feeding roller shaft driving wheel 5024 are connected through a first film feeding roller shaft synchronous belt 5025.

[0045] The first film clamping mechanism 502 further comprises a first film feeding roller shaft 5026 movably connected to the rack. The first film feeding roller shaft 5026 is rotatably connected to a first film feeding support 5027. The first film feeding support 5027 is slidably connected to the rack through the cooperation of a slide rail and a slide block. The rack is provided with a first film feeding roller shaft air cylinder 5028. The movable end of the first film feeding roller shaft air cylinder 5028 is connected with the first film feeding support 5027. The first film feeding roller shaft air cylinder 5028 drives the first film feeding support 5027 to move towards or away from the first film feeding roller shaft 5021, so that the cut hot melt adhesive film is pressed tightly under the cooperation of the first film feeding roller shaft 5021 and the first film feeding roller shaft 5026. In the rotating process of the first film feeding roller shaft 5021, the cut hot melt adhesive film is rolled up. The first film feeding roller shaft 5021 and the first film feeding roller shaft 5026 form a gap through which the wafer film passes, facilitating the passing of the wafer film.

[0046] The first film clamping mechanism 502 further comprises a first clamping assembly movably connected to the rack. The first clamping assembly clamps the hot melt adhesive film and pulls it out of the first leading channel 5018. Then the first heater 50114 presses the hot melt adhesive film downward to heat and adhere to the wafer film. Then the first film pressing block 50112 presses the hot melt adhesive film. After heating is completed, the first heater 50114 rises. The first blade 50116 cuts the hot melt adhesive film. Then the first film feeding roller shaft 5026 moves towards the first film feeding roller shaft 5021 to press the cut hot melt adhesive film. The first clamping assembly moves to the right, and the wafer chuck 4 moves to the left to tear the film, realizing the tearing operation of the hot melt adhesive film adhering to the wafer film. At the same time of tearing the film, the first cleaning piece 5029 on the rack cleans the surface of the wafer.

[0047] Further, as shown in FIG. 1, the wafer film pasting device 1 comprises a first film pasting mechanism 501 and a first film clamping mechanism 502. Figure 9 and Figure 10As shown, the first cleaning member 5029 comprises a cleaning member body 50291 connected to the rack; the bottom of the cleaning member body 50291 is provided with a suction cavity 50292, the cavity opening of the suction cavity 50292 is matched with the surface of the wafer, the cleaning member body 50291 is provided with an air inlet channel 50293 and an air outlet channel 50294, the air outlet channel 50294 is communicated with the inner bottom of the suction cavity 50292; the air inlet channel 50293 penetrates through the cleaning member body 50291, the air outlet of the air inlet channel 50293 forms a preset angle with the horizontal plane, in use, the air inlet channel 50293 blows air to blow up the dust on the surface of the wafer; the air outlet channel 50294 inhales air to suck out the blown-up dust from the suction cavity 50292, so as to achieve the cleaning work on the surface of the wafer.

[0048] Further, the first clamping assembly comprises a first clamping support 50210, the first clamping support 50210 is slidably connected to the rack through the cooperation of the slide rail and the slide block; the first clamping support 50210 is connected with the movable end of the moving power part provided on the rack; the moving power part is a gas cylinder or a motor, which will not be described again; the first clamping support 50210 is formed with a first clamping groove 50211, the first clamping groove 50211 is connected with a first clamping cylinder 50212, the movable end of the first clamping cylinder 50212 is connected with a first clamping block 50213, the first clamping block 50213 is matched with the first clamping groove 50211, the film tearing action of the first film pasting mechanism 501 is as follows: the first clamping block 50213 of the first clamping assembly is matched with the first clamping groove 50211, first clamps the hot melt adhesive film and pulls it out from the first leading-out channel 5018, then the first heater 50114 presses the hot melt adhesive film downward to heat and adhere it to the wafer film, then the first film pressing block 50112 presses the hot melt adhesive film, after the heating is completed, the first heater 50114 rises, the first blade 50116 cuts the hot melt adhesive film, then the first film feeding roller shaft 5026 approaches the first film feeding roller shaft 5021 to press the cut hot melt adhesive film, the first clamping assembly moves to the right, and the wafer suction chuck moves to the left to tear the film; after the film tearing is completed, the first clamping block 50213 releases the waste film, the waste film falls into the waste film box provided on the rack, then the first film pasting mechanism 502 returns to the initial position, and the wafer suction chuck 4 carries the wafer to the next process.

[0049] The wafer film tearing mechanism of the present application has the advantages that: it can automatically tear the film without manual tearing, improving the work efficiency. The film is torn evenly without damaging the wafer surface or leaving residual glue. After the film is torn, the cleaning device cleans the wafer surface after the film tearing to prevent dust from remaining on the wafer surface.

[0050] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0051] The relative arrangement of components and steps, numerical expressions, and numerical values set forth in the examples are not intended to limit the scope of the application unless otherwise specifically stated. It is to be understood that the drawings are not necessarily to scale of the actual proportions used in the fabrication, assembly, and operation of the example embodiments. Techniques, methods, and apparatus known to those of ordinary skill can not be discussed in detail herein. However, the techniques, methods, and apparatus are to be considered as part of the description of the application. In all examples shown and discussed herein, any specific values are to be interpreted as being exemplary only and not as a limitation on the scope of the example embodiments. Thus, other example embodiments can have different values. It is to be noted that like reference numerals and letters refer to like items in the drawings, and once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0052] In the description of the present application, it is to be understood that the orientation or positional relationships indicated by orientation words such as "front, back, upper, lower, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without the opposite indication, these orientation words do not indicate and imply that the indicated device or element must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application. The orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0053] For purposes of the description hereinafter, spatial terms, such as "above", "below", "upper", "lower", and the like, can be used with reference to the illustrated embodiment. It will be understood, however, that spatial terms are used herein as a convenience to describe the orientation of the device or component as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. For example, if the device in the figures is turned over, so that the bottom surface faces the viewer, the device described as "above" or "up" other devices or structures would then be oriented "below" or "down" the other devices or structures. Accordingly, the exemplary term "above" can encompass both an "above" and "below" orientation. The devices can also be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0054] In addition, it should be noted that the use of "first", "second", and the like words of distinction do not connote any actual physical or logical relationship between the components. Such words are merely used to distinguish one component from another.

[0055] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connected" and the like should be interpreted in a broad sense, for example, "connected" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] The above is only the preferred embodiment of the present application, and any changes and modifications made within the scope of the application should be included in the scope of the present application.

Claims

1. A wafer film tearing mechanism, characterized in that: It includes: The first film pasting mechanism and the first film clamping mechanism, the first film pasting mechanism pastes the wafer film on the wafer of the wafer chuck; The first film clamping mechanism clamps the hot melt adhesive film and moves to a preset position; The first film pasting mechanism includes a first film pasting base, a first film winding roller is rotatably connected to the first film pasting base, a first film pasting motor is connected to the first film pasting base, and a movable end of the first film pasting motor is connected to the first film winding roller; The hot melt adhesive film is connected to the first film winding roller; The first film pasting base is formed with a first leading-out channel, The first film pasting base is provided with a first film cutting assembly, and the first film cutting assembly cuts the hot melt adhesive film; The first film clamping mechanism is located below the first film pasting mechanism; The first film clamping mechanism includes a first film feeding roller shaft rotatably connected to the rack, and a first film feeding roller shaft motor is arranged on the rack, and a movable end of the first film feeding roller shaft motor is connected to the first film feeding roller shaft; The first film clamping mechanism further includes a first film feeding roller shaft movably connected to the rack, the first film feeding roller shaft is rotatably connected to a first film feeding support, and the first film feeding support is slidably connected to the rack; A first film feeding roller shaft cylinder is arranged on the rack, and a movable end of the first film feeding roller shaft cylinder is connected to the first film feeding support; The first film clamping mechanism further includes a first clamping assembly movably connected to the rack.

2. The wafer film tearing mechanism according to claim 1, wherein The first film pasting base is rotatably connected with a first winding driven roller and a second winding driven roller, and a movable end of the hot melt adhesive film is sequentially wound around the first winding driven roller and the second winding driven roller and passes through the first leading-out channel.

3. The wafer film tearing mechanism according to claim 2, wherein The center of the first winding driven roller is located below the center of the first film winding roller, and the center of the second winding driven roller is located below the center of the first winding driven roller.

4. The wafer film tearing mechanism according to claim 1, wherein The first film pasting base is provided with a first side pushing cylinder, a movable end of the first side pushing cylinder is connected with a first side pushing plate, and the first side pushing plate movably penetrates into the first leading-out channel.

5. The wafer film tearing mechanism according to claim 4, wherein The first leading-out channel includes a first leading-out groove arranged on the first film pasting base; A first pressing groove block is arranged above the first leading-out groove, a movable end of a first pressing groove cylinder arranged on the first film pasting base is connected with the first pressing groove block, and the first pressing groove block is pressed on the groove of the first leading-out groove.

6. The wafer film tearing mechanism according to claim 1, wherein The first film pasting base is provided with a first film pressing cylinder, and a movable end of the first film pressing cylinder is connected with a first film pressing block.

7. The wafer film tearing mechanism according to claim 1, wherein The first film pasting base is provided with a first heating lifting cylinder, and a movable end of the first heating lifting cylinder is connected with a first heater.

8. The wafer film tearing mechanism according to claim 6, wherein The first film cutting assembly includes a first film cutting cylinder connected to the first film pasting base, and a movable end of the first film cutting cylinder is connected with a first blade; The first film pressing block and the first film pasting base are respectively provided with a cutting accommodation groove for the first blade when cutting.

9. The wafer film tearing mechanism according to claim 1, wherein The rack is provided with a first cleaning member.

10. The wafer film tearing mechanism of claim 1, wherein, The first clamping assembly comprises a first clamping support which is slidingly connected to the frame; the first clamping support is connected to the moving end of the moving power part arranged on the frame; a first clamping groove is formed on the first clamping support; a first clamping cylinder is connected in the first clamping groove; the moving end of the first clamping cylinder is connected with a first clamping block; and the first clamping block is matched with the first clamping groove.

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