Immersion cooling heat exchange device and immersion cooling heat exchange system

Abstract

The utility model discloses an immersion cooling heat exchange device which comprises an immersion cavity used for storing cooling fluid and provided with an inlet and an outlet; the accelerating pump is arranged in the immersion cavity and used for accelerating flowing of cooling fluid in a local area of the immersion cavity, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion cavity, and the pressurized heat exchange area and the normal heat exchange area are formed in the immersion cavity. And the liquid inlet side flow speed of the pressurized heat exchange area is higher than that of the normal heat exchange area. Through the arrangement of the acceleration pump, the flowing resistance of the cooling fluid at the high heating part can be overcome, namely, the flowing speed of the cooling fluid in the local area is changed, the high heating part is arranged in the local area, and normally, the heat exchange efficiency is increased due to fluid acceleration; therefore, the problem that the temperature of the local area of the to-be-cooled equipment is too high can be effectively solved. The utility model further discloses an immersion cooling heat exchange system comprising the immersion cooling heat exchange device.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment heat dissipation, and more specifically, to an immersion cooling heat exchange device, and also to an immersion cooling heat exchange system comprising the immersion cooling heat exchange device. Background Art

[0002] Compared to traditional air cooling, immersion cooling primarily improves the system's heat dissipation capabilities by increasing the convective heat transfer coefficient between the fluid and the heat transfer surface. However, within electronic devices like servers, high-power and low-power components generate heat at different rates, resulting in varying heat dissipation within the immersion area. This can lead to excessively high temperatures in certain areas.

[0003] In the process of realizing the invention of the present utility model, the inventor discovered that there are at least the following problems in the prior art: the temperature in a local area of ​​the device to be cooled is too high. Utility Model Content

[0004] In view of this, the first object of the present invention is to provide an immersion cooling heat exchange device, which can effectively solve the problem of excessive temperature in local areas of the heat dissipation equipment. The second object of the present invention is to provide an immersion cooling heat exchange system including the immersion cooling heat exchange device.

[0005] In order to achieve the above first purpose, the present invention provides the following technical solutions:

[0006] An immersion cooling heat exchange device, comprising:

[0007] an immersion chamber for storing a cooling fluid and having an inlet and an outlet;

[0008] An acceleration pump is provided in the immersion chamber to accelerate the flow of cooling fluid in a local area of ​​the immersion chamber, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion chamber, and the flow rate on the liquid inlet side of the pressurized heat exchange area is higher than the flow rate on the liquid inlet side of the normal heat exchange area.

[0009] In the above-mentioned immersion cooling heat exchange device, when in use, the immersion chamber is filled with cooling fluid, the filling level is set as needed, and at least the heat-generating part of the device to be cooled is immersed in the cooling fluid, and the high-heating part is set corresponding to the pressurized heat exchange area of ​​the acceleration pump, while the low-heating part is located in the normal heat exchange area. In the above-mentioned immersion cooling heat exchange device, the flow resistance of the cooling fluid at the high-heating part can be overcome by setting the acceleration pump, that is, the flow rate of the cooling fluid in the local area is changed. Moreover, the high-heating part is set in this local area. Due to the acceleration of the fluid, the heat exchange efficiency will normally increase, so that the temperature of the high-heating part can be closer to the low-heating part, effectively avoiding the problem of excessive temperature of the high-heating part. Moreover, only the local cooling fluid flow rate is accelerated, making the operation simple and convenient, and the cost is low. In summary, the immersion cooling heat exchange device can effectively solve the problem of excessive temperature in the local area of ​​the device to be cooled.

[0010] In some technical solutions, a drainage device is further included in the immersion chamber, and the drainage device includes a heat dissipation chamber and a drainage channel. The heat dissipation chamber is used to dissipate heat from the high-heating part of the heat dissipation equipment. One end of the drainage channel is connected to the heat dissipation chamber and the other end is connected to the outlet of the acceleration pump. The inlet of the acceleration pump corresponds to the cavity in the immersion chamber located outside the drainage device.

[0011] In some technical solutions, at least two entrances and exits are provided, one of the two entrances and exits being an inlet and the other being an outlet.

[0012] In some technical solutions, a flow equalizing plate extending along the inlet direction is further included, and the flow equalizing plate is used to separate the immersion chamber into a guide chamber and a working chamber, and the acceleration pump and the drainage device are both arranged in the working chamber.

[0013] In some technical solutions, the drainage channels of the multiple drainage devices are all connected to a main channel, and the main channel is connected to the acceleration pump; along the inlet direction of the inlet, the acceleration pump is provided on the side of the immersion chamber away from the inlet.

[0014] In some technical solutions, each of the plurality of drainage devices is provided with an acceleration pump; the inlet of each acceleration pump is aligned with the liquid outlet corresponding to the flow balancing plate.

[0015] In some technical solutions, a circulation pump is further included, and the outlet and / or the inlet are connected to the circulation pump.

[0016] In some technical solutions, a heat exchanger is provided between the inlet and the outlet.

[0017] In some technical solutions, the outlet is located at the upper part of the immersion chamber and is an overflow port, and the inlet is located at the lower part of the immersion chamber and extends in a horizontal direction.

[0018] To achieve the second objective, the present invention further provides an immersion cooling heat exchange system, comprising any of the aforementioned immersion cooling heat exchange devices, and also comprising a device to be dissipated heat, wherein the device to be dissipated heat comprises a high-heating portion and a low-heating portion, and when the device to be dissipated heat is in operation, the heating power of the low-heating portion is lower than the heating power of the high-heating portion; the immersion cooling heat exchange device is configured to accelerate the flow of cooling fluid at the high-heating portion. Since the aforementioned immersion cooling heat exchange device has the aforementioned technical effects, an immersion cooling heat exchange system having the immersion cooling heat exchange device should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic structural diagram of an immersion cooling heat exchange device provided in an embodiment of the present utility model;

[0021] Figure 2 This is a schematic structural diagram of another immersion cooling heat exchange device provided in an embodiment of the present utility model.

[0022] The following are marked in the accompanying drawings:

[0023] Immersion chamber 1, acceleration pump 2, circulation pump 3, heat exchanger 4, external pipeline 5, drainage device 6, equipment to be cooled 7, inlet 8, outlet 9;

[0024] Flow balancing plate 11, working chamber 12, flow guide chamber 13, normal heat exchange area 14, pressurized heat exchange area 15, liquid outlet 111;

[0025] Heat dissipation cavity 61, drainage channel 62, main channel 63;

[0026] The high heat generating portion 71 and the low heat generating portion 72 . DETAILED DESCRIPTION

[0027] The embodiment of the utility model discloses an immersion cooling heat exchange device, which can effectively solve the problem of excessively high temperature in a local area of ​​a device to be radiated.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 2 , Figure 1 A schematic structural diagram of an immersion cooling heat exchange device provided in an embodiment of the present utility model; Figure 2 This is a schematic structural diagram of another immersion cooling heat exchange device provided in an embodiment of the present utility model.

[0030] In some embodiments, an immersion cooling heat exchange device is provided, which may specifically be a single-phase immersion liquid cooling device, mainly including an immersion chamber 1 and an acceleration pump 2.

[0031] The immersion chamber 1, when in use, stores cooling fluid, and the heat dissipation device 7 can be fully or partially placed in the immersion chamber 1. Fully placed means that the heat dissipation device 7 is completely immersed in the cooling fluid in the immersion chamber 1; partially placed means that only a portion of the heat dissipation device 7 (especially the heat-generating portion) is immersed in the cooling fluid in the immersion chamber 1. The heat-generating portion of the heat dissipation device 7 is immersed in the cooling fluid in the immersion chamber 1, that is, surrounded by the cooling fluid, so that the heat-generating portion is fully in contact with the cooling fluid, thereby efficiently exchanging heat between the heat-generating portion and the cooling fluid.

[0032] When considering the specific type of cooling fluid, liquids are generally used, although gases, flowable solids, or solid-liquid mixtures can also be used. When using liquids, high-heat-conductivity liquids are generally used, typically aqueous solutions or water mixtures. This is achieved by dissolving liquid water (which can be pure water) into some substance to form an aqueous solution or water mixture. For specific materials used in immersion heat exchange, reference can be made to existing technologies.

[0033] The shape of the immersion chamber 1 is not limited and is generally determined based on the number and type of devices 7 to be cooled. The smoothness of the cooling fluid flow and the required clearance between the devices 7 to be cooled should also be considered. For simplicity, the immersion chamber 1 can have a generally rectangular outline, with multiple mounting locations evenly spaced within for mounting each device 7 to be cooled. The mounting locations can be arranged in an array, such as a simple linear arrangement, i.e., along a straight line. In particular, the mounting locations can be arranged sequentially along the narrower side of the devices 7 to be cooled.

[0034] Immersion chamber 1 has inlets and outlets for replacing the cooling fluid inside. There are two main types of inlet and outlet configurations: one with only one, alternating between introducing and removing the cooling fluid, with the pressure balanced by the external air pressure; the other with at least two inlets and outlets, one serving as an inlet 8 and the other as an outlet 9. Inlet 8 is used to introduce the cooling fluid, while outlet 9 is used to remove the cooling fluid. This allows for continuous or periodic replacement of the cooling fluid inside immersion chamber 1, ensuring a consistently low temperature.

[0035] The acceleration pump 2 is provided in the immersion chamber 1 to accelerate the flow of the cooling fluid in a part of the immersion chamber 1. The acceleration pump 2 can also be called an acceleration device. As for the specific structure of the acceleration pump 2, as long as it can actively accelerate the flow of the cooling fluid in a part of the immersion chamber 1, it is acceptable, and is not limited to the method of being driven by an impeller, and can also be blowing, pulling, etc. The accelerated flow of the cooling fluid in a part of the immersion chamber 1 means that, on the one hand, the flow speed of the cooling fluid in this part of the immersion chamber 1 is accelerated, and the flow speed of the cooling fluid in another part of the immersion chamber 1 is not accelerated; on the other hand, it can also be understood that the flow speed of the cooling fluid in this part of the immersion chamber 1 is faster than the flow speed of the cooling fluid in another part of the immersion chamber 1; by accelerating the flow speed of this part of the fluid, the heat exchange efficiency of the corresponding area is improved.

[0036] To explain more specifically, the action of the accelerator pump 2 causes the cooling fluid in one area of ​​the immersion chamber 1 to flow faster than in another area. These two areas can be appropriately separated by barriers, but they should still be interconnected, and of course, they can also be unseparated. Without this separation, the outlet of the accelerator pump 2 can be directed toward the corresponding area, thereby increasing the fluid flow rate in that area. For ease of explanation, the area where the accelerator pump 2 accelerates is referred to as the pressurized heat exchange area 15, while the area where the accelerator pump 2 is not accelerating but is performing heat exchange is referred to as the normal heat exchange area 14. Of course, other areas may or may not be formed within the immersion chamber in addition to the pressurized heat exchange area 15 and the normal heat exchange area 14. Of course, the acceleration of the accelerator pump 2 also causes the flow rate in the normal heat exchange area 14 to increase when the accelerator pump 2 is accelerating compared to when it is not accelerating.

[0037] During use, some high-heating components 71 of the device to be cooled 7, which have higher heat output, are located in the pressurized heat exchange area 15, while some low-heating components 72 of the device to be cooled 7, which have lower heat output, are located in the normal heat exchange area 14. The low-heating components 72 have lower heat output than the high-heating components 71. In actual use, the accelerator pump 2 should be positioned according to the relative position of the high-heating components 71 of the device to be cooled 7 within the entire device to be cooled 7.

[0038] In the aforementioned immersion cooling heat exchange device, during use, the immersion chamber 1 is filled with cooling fluid, the filling level being adjusted as needed, and at least the heat-generating portion of the heat-dissipating device 7 is immersed in the cooling fluid. The high-heating portion 71 is positioned corresponding to the pressurized heat exchange area 15 of the acceleration pump 2, while the low-heating portion 72 is located in the normal heat exchange area 14. In the aforementioned immersion cooling heat exchange device, the acceleration pump 2 overcomes the flow resistance of the cooling fluid in the high-heating portion 71, thereby changing the cooling fluid flow rate in that local area. Furthermore, the high-heating portion 71 is positioned in this local area. Due to the fluid acceleration, the heat exchange efficiency is generally increased, bringing the temperature of the high-heating portion 71 closer to that of the low-heating portion 72, effectively avoiding the problem of excessively high temperatures in the high-heating portion 71. Furthermore, since only the flow rate of the cooling fluid is accelerated locally, operation is simple, convenient, and cost-effective. In summary, the immersion cooling heat exchange device can effectively resolve the problem of excessively high temperatures in local areas of the heat-dissipating device 7.

[0039] In some embodiments, considering that the high-heat-generating portion 71 is generally located at the center of the entire device to be dissipated 7, the cooling fluid generally cannot effectively and directly contact the high-heat-generating portion 71. Based on this, it is preferred that a drainage device 6 is provided in the immersion cooling heat exchange device. The drainage device 6 is provided in the immersion chamber 1, so that the immersion chamber 1 is divided into an internal area of ​​the drainage device 6 and an external area of ​​the drainage device 6. The drainage device 6 mainly includes a heat dissipation cavity 61 and a drainage channel 62. The heat dissipation cavity 61 is used to dissipate heat from the high-heat-generating portion 71 of the device to be dissipated 7, while the external area of ​​the drainage device 6 can be used to dissipate heat from the low-heat-generating portion 72 of the device to be dissipated.

[0040] One end of the drainage channel 62 is connected to the heat dissipation chamber 61, and the other end is connected to the outlet of the acceleration pump 2. The inlet of the acceleration pump 2 corresponds to the cavity portion of the immersion chamber 1 located outside the drainage device 6. In other words, the inlet of the acceleration pump 2 corresponds to the area outside the drainage device 6, while the outlet of the acceleration pump 2 corresponds to the area inside the drainage device 6. This accelerates the cooling fluid in the area outside the drainage device 6 and supplies it to the interior of the drainage device 6, i.e., the heat dissipation chamber 61.

[0041] The heat dissipation cavity 61 area is the main area of ​​the pressurized heat exchange area 15, that is, it corresponds to the high heat generation part 71. Therefore, the size and shape of the heat dissipation cavity 61 are preferably set corresponding to the high heat generation part 71, such as being set close to the high heat generation part 71 or surrounding the high heat generation part 71. The setting surrounding the high heat generation part 71 is generally a semi-enclosed setting.

[0042] The drainage channel 62 is mainly used to guide the fluid in the lower temperature area outside the drainage device 6 into the heat dissipation cavity 61. The area outside the drainage device 6 is generally divided into a heat dissipation area, a liquid inlet area, and a liquid outlet area. The heat dissipation area is set corresponding to the device 7 to be dissipated, especially the low-heating device in the area to be dissipated. The liquid inlet area and the liquid outlet area are respectively located at the two ends of the heat dissipation area, the liquid inlet area corresponds to the liquid inlet, and the liquid outlet area corresponds to the liquid outlet. The drainage channel 62 can then drain the cooling fluid in the liquid inlet area to the heat dissipation cavity 61, and the outlet of the heat dissipation cavity 61 can correspond to the heat dissipation area, the liquid outlet area, or even the liquid inlet area.

[0043] In some embodiments, two inlets and outlets are generally provided, one of which is the outlet 9 and the other is the inlet 8. Preferably, the outlet 9 and the inlet 8 are arranged in parallel and in the same direction as the inlet and outlet direction of the heat dissipation cavity 61. For example, if the outlet 9 is at the top and the inlet 8 is at the bottom, then the inlet of the heat dissipation cavity 61 is at the bottom and the outlet of the heat dissipation cavity 61 is at the top.

[0044] In some embodiments, a flow equalizing plate 11 extending along the inlet direction of the inlet 8 is further included. The flow equalizing plate 11 is used to separate the immersion chamber 1 into a flow guide chamber 13 and a working chamber 12. The accelerator pump 2 and the flow guide device 6 are both disposed in the working chamber 12, and the corresponding heat dissipation area also belongs to the working chamber 12. When dissipating heat from multiple devices 7 to be cooled, the heat dissipation area is provided with multiple heat dissipation stations, each corresponding to each device 7 to be cooled.

[0045] The flow balancing plate 11 is provided with a plurality of liquid outlet holes 111 , and preferably each liquid outlet hole 111 is provided in one-to-one correspondence with each device 7 to be cooled, that is, the liquid outlet holes 111 and the cooling stations are provided in one-to-one correspondence.

[0046] The flow balancing plate 11 primarily serves as a drainage channel, distributing the fluid introduced from the inlet 8 as evenly as possible to each heat dissipation station. The flow balancing plate 11 primarily distributes the fluid through the liquid outlet holes 111. Furthermore, the extension direction of the flow balancing plate 11 aligns with the direction of the inlet 8, preventing the flow balancing plate 11 from interfering with the fluid introduced from the inlet 8, thereby achieving a good drainage effect.

[0047] In some embodiments, when multiple heat dissipation stations are provided, multiple heat dissipation cavities 61 need to be provided accordingly, and multiple drainage devices 6 can be provided accordingly. It should be noted that any heat dissipation station may be provided with one or more heat dissipation cavities 61, or may not be provided with any heat dissipation cavity 61, but at least one heat dissipation station is provided with at least one heat dissipation cavity 61, that is, at least one drainage device 6 is provided.

[0048] In some embodiments, when a plurality of drainage devices 6 are provided, a plurality of acceleration pumps 2 may be provided correspondingly, and the inlet of each acceleration pump 2 is provided correspondingly to the corresponding liquid outlet 111 .

[0049] For example, each heat dissipation station is provided with an accelerator pump 2, and the flow equalizing plate 11 is provided with a liquid outlet 111 corresponding to each heat dissipation station. The inlet of the accelerator pump 2 faces the liquid outlet 111. Part of the fluid flowing out of the liquid outlet 111 is drawn away by the corresponding accelerator pump 2, while the remaining part flows toward the heat dissipation station and into the cavity outside the heat dissipation station's drainage device 6. The drainage channel 62 extends in the same direction as the liquid outlet 111 and is arranged in parallel.

[0050] In some embodiments, when multiple drainage devices 6 are provided, the drainage channels 62 of the multiple drainage devices 6 can be connected to the main channel 63, and the main channel 63 is connected to the acceleration pump 2, so that one acceleration pump 2 can simultaneously accelerate the supply of cooling fluid to multiple drainage devices 6.

[0051] The main channel 63 preferably extends along the direction of introduction of the inlet 8, and the direction of fluid flow in the main channel 63 is preferably opposite to that of the inlet 8. In this case, the accelerator pump 2 is located at the end of the main channel 63 away from the inlet 8. The accelerator pump 2 primarily directs fluid from the side of the immersion chamber 1 away from the inlet 8 into the main channel 63. The side of the immersion chamber 1 away from the inlet 8 refers to the side in the direction of introduction of the inlet 8. This arrangement facilitates the movement of fluid at the flow equalizing plate 11 away from the inlet 8, thereby improving fluid dispersion.

[0052] In some embodiments, a circulation pump 3 is generally provided to ensure orderly flow of the internal fluid. Specifically, a circulation pump 3 is connected upstream of the inlet 8 to accelerate the inflow of the cooling fluid, and / or a circulation pump 3 is connected downstream of the outlet 9 to accelerate the outflow of the cooling fluid. Specifically, a circulation pump 3 is connected upstream of the inlet 8 or another circulation pump 3 is connected downstream of the outlet 9; alternatively, a circulation pump 3 is connected upstream of the inlet 8 and another circulation pump 3 is connected downstream of the outlet 9.

[0053] In some embodiments, a heat exchanger 4 is generally provided between the inlet 8 and the outlet 9 to allow the cooling fluid to circulate. That is, the cooling fluid flows out of the outlet 9 and enters the heat exchanger 4, where it dissipates heat. After dissipating heat, the cooling fluid flows into the inlet 8 again, enters the immersion chamber 1, absorbs heat from the device to be cooled 7, and then is discharged from the outlet 9, thus forming a circulating flow. The cooling fluid flows in the immersion chamber 1 due to the action of the circulation pump 3, but the acceleration pump 2 further accelerates the movement on this basis. Generally speaking, the circulation pump 3 can be provided between the heat exchanger 4 and the inlet 8 at this time.

[0054] In some embodiments, the outlet 9 can be located at the top of the immersion chamber 1 and serve as an overflow port, while the inlet 8 can be located at the bottom of the immersion chamber 1 and extend horizontally. Positioning the outlet 9 at the top and the inlet 8 at the bottom facilitates the upward flow of the heated cooling fluid. Accordingly, the heat dissipation chamber 61, drainage channel 62, and accelerator pump 2 can be arranged in order from top to bottom, with the outlet of the heat dissipation chamber 61 facing upward. It should be noted that the term "up and down" here refers to the direction of gravity.

[0055] In some embodiments, the device to be cooled 7 is primarily an electronic device, such as a server or switch. The electronic device includes high-power device chips, such as CPU chips, GPU chips, and ASIC chips, as well as other low-power devices. The high-power devices are generally high-heat generating components 71, while the low-power devices are generally low-heat generating components 72.

[0056] In some embodiments, when an acceleration pump 2 is provided to supply fluid to multiple drainage devices 6 at the same time, the flow rate provided by the acceleration pump 2 needs to be under a certain temperature difference (the certain temperature difference refers to the difference between the allowable temperature of the high-heat-generating portion 71 and the inlet temperature of the immersion chamber 1) ΔT = T max -T in Among them, T max is the allowable temperature of high power devices, where T in It is the liquid inlet temperature in the immersion chamber 1, that is, the temperature of the inlet 8, which carries away the heat from the high-power device.

[0057] The convective heat transfer calculation formula Q = hAΔT, where Q is the power consumption of the power device, h is the convective heat transfer coefficient, A is the contact area between the fluid and the heat transfer surface, and ΔT is the temperature difference between the heat transfer surface and the fluid, determines the required convective heat transfer coefficient for the heat sink 71 of the high-heat generating unit.

[0058] The required flow rate of each high-power device radiator is then calculated using the convective heat transfer coefficient formula. The convective heat transfer coefficient is related to the flow rate of the high-power device radiator h=a*(ρu*l / μ) b (μ*c p / λ) c(λ / l) where a, b, and c are constants; ρ is the density of the cooling fluid, l is the characteristic length of the heat transfer surface, μ is the viscosity of the cooling fluid, and c p is the specific heat capacity of the cooling fluid, λ is the thermal conductivity of the cooling fluid, and u is the flow rate of the cooling fluid. The flow rate q1 required for each high-power device radiator can be calculated based on the calculation formula of the convection heat transfer coefficient. The flow rate required by the secondary pump is Q pump2 =n*q1, where n is the number of devices 7 to be cooled.

[0059] Similarly, the flow rate q2 required by the low-power device in each electronic device to be radiated can be calculated. Part of the flow provided by the circulation pump 3 is delivered to the high-power device radiator through the acceleration pump 2, and part is delivered to the low-power device. The flow rate required by the circulation pump 3 is Q pump1 =n*q1+n*q2.

[0060] The flow resistance that the acceleration pump 2 needs to overcome is partly the flow resistance in the drainage channel 62 and partly the flow resistance in the heat dissipation cavity 61 at the high-power device.

[0061] Flow resistance in drainage channel 62 Where ΔP ll2 is the corresponding friction resistance in the drainage channel 62; λ1 is the friction coefficient of the inner wall of the drainage channel 62, L1 is the length of the drainage channel 62, D1 is the diameter of the drainage channel 62, u1 is the average flow velocity in the drainage channel 62, and g is the acceleration of gravity.

[0062] Flow resistance of heat dissipation cavity 61 at high power devices Where ΔP sp is the corresponding friction resistance in the heat dissipation cavity 61; λ2 is the friction coefficient of the inner wall of the heat dissipation cavity 61, L2 is the length of the heat dissipation cavity 61, D2 is the diameter of the heat dissipation cavity 61, u2 is the average flow velocity of the heat dissipation cavity 61, and g is the acceleration of gravity.

[0063] Then the lift of accelerator pump 2 is

[0064] Similarly, the flow resistance that the circulation pump 3 needs to overcome is partly the flow resistance in the external pipeline 5 and partly the flow resistance of the external heat exchanger 4 .

[0065] Flow resistance in external pipe 5 Where ΔP ll1 is the corresponding friction resistance in the external pipeline 5; λ3 is the friction coefficient of the external pipeline 5, L3 is the length of the external pipeline 5, and D3 is the diameter of the external pipeline 5.

[0066] Flow resistance of heat exchanger 4 Where ΔPhx is the corresponding friction resistance in the heat exchanger 4; λ4 is the friction coefficient of the inner wall of the heat exchanger 4, L4 is the length of the heat exchanger 4, and D4 is the hydraulic diameter of the heat exchanger 4.

[0067] Then the lift of circulating pump 3 is

[0068] In some embodiments, when each device to be cooled 7 is provided with an acceleration pump 2, first, according to the formula Q=mc p ΔT, determines the flow rate of the circulation pump 3. Where Q is the total heat of the electronic equipment in the immersion chamber 1, m is the mass flow rate in the circulation pump 3 and the external pipeline 5, c p is the specific heat capacity of the coolant, ΔT is the temperature difference between the inlet and outlet of the immersion chamber 1, and the temperature difference is usually set to 5 degrees Celsius.

[0069] Next, the average temperature in the immersion chamber 1 is determined to be (Tin (liquid inlet temperature) + Tin (liquid outlet temperature)) / 2.

[0070] The convective heat transfer calculation formula Q = hAΔT, where Q is the power consumption of the power device, h is the convective heat transfer coefficient, A is the contact area between the fluid and the heat transfer surface, and ΔT is the temperature difference between the heat transfer surface and the fluid, can be used to determine the required convective heat transfer coefficient for high-power device heat sinks.

[0071] The required flow rate of each high-power device radiator is then calculated using the convective heat transfer coefficient formula. The convective heat transfer coefficient is related to the flow rate of the high-power device radiator h=a*(ρu*l / μ) b (μ*c p / λ) c (λ / l) where a, b, and c are constants; ρ is the density of the coolant, l is the specific length of the heat transfer surface, m is the viscosity of the coolant, cp is the specific heat capacity of the coolant, λ is the thermal conductivity of the coolant, and μ is the flow rate of the coolant. The flow rate q1 required for each high-power device radiator can be calculated based on the calculation formula for the convective heat transfer coefficient. The flow rate required by accelerator pump 2 is Q pump2 =n*q1, where n is the number of devices 7 to be cooled.

[0072] At this time, the flow rate of the circulation pump 3 does not need to be greater than the flow rate of the acceleration pump 2, which can avoid a large flow rate in the external pipeline 5, a large flow resistance in the external pipeline 5, and reduce the system energy consumption of the circulation pump 3.

[0073] In some embodiments, the flow rate and speed of accelerator pump 2 or circulation pump 3 are regulated based on the real-time temperature using PID negative feedback. When the real-time chip temperature is lower than the chip temperature, the speed or flow rate of accelerator pump 2 or circulation pump 3 can be reduced. When the real-time chip temperature is higher than the chip's allowable temperature, the speed and flow rate of accelerator pump 2 or circulation pump 3 can be increased. The speed of circulation pump 3 is primarily based on the operating temperature of the low-power chip, while the speed of accelerator pump 2 is primarily based on the operating temperature of the high-power chip.

[0074] Based on the immersion cooling heat exchange device provided in the above embodiments, the present invention further provides an immersion cooling heat exchange system, which includes any one of the immersion cooling heat exchange devices in the above embodiments, and further includes a device 7 to be cooled, wherein the device 7 to be cooled includes a high-heating portion 71 and a low-heating portion 72. When the device 7 to be cooled is in an operating state, the heating power of the low-heating portion 72 is lower than the heating power of the high-heating portion 71. The immersion cooling heat exchange device is used to accelerate the flow of the cooling fluid at the high-heating portion 71. Since the immersion cooling heat exchange system adopts the immersion cooling heat exchange device in the above embodiments, please refer to the above embodiments for the beneficial effects of the immersion cooling heat exchange system.

[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An immersion cooling heat exchange device, characterized in that: include: an immersion chamber for storing a cooling fluid and having an inlet and an outlet; An acceleration pump is arranged in the immersion chamber to accelerate the flow of cooling fluid in a local area of ​​the immersion chamber, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion chamber, and the flow rate on the liquid inlet side of the pressurized heat exchange area is higher than the flow rate on the liquid inlet side of the normal heat exchange area.

2. The immersion cooling heat exchange device according to claim 1, characterized in that: It also includes a drainage device arranged in the immersion chamber, the drainage device includes a heat dissipation chamber and a drainage channel, the heat dissipation chamber is used to dissipate heat from the high-heating part of the heat dissipation device, one end of the drainage channel is connected to the heat dissipation chamber, and the other end is connected to the outlet of the acceleration pump, and the inlet of the acceleration pump corresponds to the cavity in the immersion chamber located outside the drainage device.

3. The immersion cooling heat exchange device according to claim 2, characterized in that: At least two inlets and outlets are provided, one of the two inlets and outlets being an inlet and the other being an outlet.

4. The immersion cooling heat exchange device according to claim 3, characterized in that: It also includes a flow equalizing plate extending along the inlet direction, the flow equalizing plate is used to separate the immersion chamber into a guide chamber and a working chamber, and the acceleration pump and the drainage device are both arranged in the working chamber.

5. The immersion cooling heat exchange device according to claim 4, characterized in that: The drainage channels of the plurality of drainage devices are all connected to a main channel, and the main channel is connected to the acceleration pump; along the inlet direction, the acceleration pump is provided on a side of the immersion chamber away from the inlet.

6. The immersion cooling heat exchange device according to claim 4, characterized in that: The plurality of drainage devices are respectively provided with the acceleration pumps; the inlet of each acceleration pump is respectively aligned with the liquid outlet hole corresponding to the flow balancing plate.

7. The immersion cooling heat exchange device according to any one of claims 3 to 6, characterized in that: It also includes a circulation pump, and the outlet and / or the inlet are connected to the circulation pump.

8. The immersion cooling heat exchange device according to claim 7, characterized in that: A heat exchanger is provided between the inlet and the outlet.

9. The immersion cooling heat exchange device according to claim 8, characterized in that: The outlet is located at the upper part of the immersion chamber and is an overflow port, and the inlet is located at the lower part of the immersion chamber and extends in a horizontal direction.

10. An immersion cooling heat exchange system, comprising a device to be cooled, the device to be cooled comprising a high-heating portion and a low-heating portion, wherein when the device to be cooled is in operation, the heating power of the low-heating portion is lower than the heating power of the high-heating portion; characterized in that: It comprises the immersion cooling heat exchange device according to any one of claims 1 to 9; the immersion cooling heat exchange device is used to accelerate the flow of cooling fluid at the high heat generation part.

Images