Integrated water-cooling heat dissipation module

Abstract

The utility model belongs to the technical field of graphics card heat dissipation, particularly relates to an integrated water-cooling heat dissipation module, and provides the following scheme aiming at the problems that the water-cooling heat dissipation of the conventional graphics card is generally realized by an external water-cooling heat dissipation system, so that the extra space in a case is occupied and a video memory element is not cooled during installation. Comprising a bottom plate and a graphics card body, the graphics card body is fixedly arranged at the top of the bottom plate, the integrated water-cooling heat dissipation assembly is arranged, heat dissipation of the graphics card is achieved, the occupied excessive space in a machine case during installation is reduced, heat dissipation can be conducted on a GPU of the graphics card body through a heat conduction plate, and the heat dissipation efficiency is improved. The water-cooling heat dissipation assembly can also dissipate heat of a video memory element on the water-cooling heat dissipation assembly, the efficiency is improved, the supporting plate, the bottom plate and the side plates are fixed through the fixing bolts, shaking of the water-cooling heat dissipation assembly is avoided, the overall stability and reliability are improved, and mounting and dismounting are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of graphics cards, in particular to an integrated water-cooling heat dissipation module. Background Art

[0002] With the rapid development of computer technology, graphics cards, as important graphics processing components in computers, have seen their performance continuously improved, while power consumption and heat generation have also increased. In order to maximize the performance of graphics cards and avoid damage caused by excessive temperatures, water cooling systems have become the preferred method for graphics card heat dissipation.

[0003] Water cooling for traditional graphics cards usually requires an external water-cooling system. This means a separate water-cooling system is required. This takes up extra space in the chassis during installation, reducing the available space. Furthermore, the system only dissipates heat for the graphics card's GPU, while the video memory also generates a significant amount of heat. Therefore, we propose an all-in-one water-cooling module to address this issue. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art that water cooling of traditional graphics cards usually requires an external water cooling system to be implemented, resulting in extra space being occupied in the chassis during installation and no heat dissipation of the video memory components, and to propose an integrated water cooling module.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An integrated water-cooling heat dissipation module includes a base plate and a graphics card body, wherein the graphics card body is fixedly mounted on the top of the base plate, a side plate is fixedly mounted on the top of the base plate on one side of the graphics card body, and a support plate is mounted on the top of the base plate above the graphics card body. The support plate has a through opening. The water-cooling heat dissipation module further includes:

[0007] The water-cooling heat dissipation component is arranged on the support plate and is used to dissipate heat from the graphics card body.

[0008] In one possible design, the water-cooled heat dissipation component includes heat dissipation fins, a heat pipe is fixedly passed through the heat dissipation fins, a water cooling head is arranged in the through opening, the water outlet of the water cooling head is connected to the water inlet of the heat pipe, and the water inlet of the water cooling head is connected to the water outlet of the heat pipe. The heat dissipation efficiency is improved by increasing the surface area by conducting heat out of the heat pipe through the provided heat dissipation fins.

[0009] In one possible design, a protective shell is fixedly installed on the top of the support plate, and a water pump is fixedly installed inside the protective shell. The water inlet and water outlet of the water pump are respectively connected to the water outlet of the heat pipe and the water inlet of the water cooling head. The coolant in the heat pipe is circulated by the installed water pump to realize the heat dissipation of the heat generated by the graphics card body.

[0010] In one possible design, a heat conducting plate is fixedly provided on the top of the graphics card body at the position of the GPU and video memory components. The top of the heat conducting plate is fixedly connected to the water-cooling contact surface of the water cooling head. The heat conducting plate can not only dissipate heat from the graphics card body GPU but also from the video memory components thereon.

[0011] In a possible design, the support plate is provided with two heat dissipation openings on both sides of the through opening, and heat dissipation fans are fixedly installed inside the two heat dissipation openings. The two heat dissipation fans are used to blow air to the heat dissipation fins to accelerate heat dissipation.

[0012] In a possible design, two through holes are provided on one side of the bottom plate and the side plate, and fixing bolts are provided in the four through holes. Threaded holes corresponding to the through holes are provided on both sides of the support plate, and the four fixing bolts are threadedly connected to the corresponding threaded holes respectively. The four fixing bolts are provided to fix the support plate to the bottom plate and the side plate to prevent the water-cooling heat dissipation components thereon from shaking.

[0013] In this application, first, when the graphics card body is working, its GPU and video memory components will generate a lot of heat; at this time, the heat conduction plate transfers the heat from the graphics card body to the water cooling contact surface of the water cooling head;

[0014] Next, the water pump starts, and the coolant flows from the outlet of the heat pipe into the water inlet of the water cooling head. After being cooled by the water cooling head, it flows out from the outlet of the water cooling head and then flows back to the water inlet of the heat pipe, forming a coolant cycle. During the circulation process, the coolant continuously absorbs and takes away the heat conducted from the heat conducting plate.

[0015] Then, the coolant in the heat pipe transfers the heat to the cooling fins. The cooling fins improve the heat dissipation efficiency by increasing the surface area. At the same time, the cooling fan blows air to the cooling fins, accelerating the air flow around the cooling fins, taking away the heat and dissipating it into the air.

[0016] The support plate is fixed to the bottom plate and side plates by fixing bolts to ensure the stability of the water-cooling heat dissipation component, which not only prevents its shaking from affecting the heat dissipation effect, but also facilitates installation and disassembly.

[0017] Beneficial effects:

[0018] In the present invention, the integrated water-cooling heat dissipation module, by providing an integrated water-cooling heat dissipation component, not only achieves heat dissipation for the graphics card, but also reduces the space occupied by the water cooling system in the chassis during installation;

[0019] In the present invention, the integrated water-cooling heat dissipation module can not only dissipate heat for the GPU of the graphics card body, but also dissipate heat for the memory components thereon through the heat conduction plate, thereby achieving comprehensive heat dissipation for the graphics card and improving heat dissipation uniformity and efficiency.

[0020] In the present invention, the integrated water-cooling heat dissipation module fixes the support plate to the bottom plate and the side plates by fixing bolts, thereby avoiding the shaking of the water-cooling heat dissipation component, which not only improves the overall stability and reliability, but also facilitates installation and disassembly.

[0021] In the present invention, an integrated water-cooling heat dissipation assembly is provided, which not only realizes the heat dissipation of the graphics card, but also reduces the excessive space occupied in the chassis during installation. The heat conduction plate can not only dissipate heat for the GPU of the graphics card body, but also dissipate heat for the memory components thereon, thereby improving efficiency. The fixing bolts fix the support plate to the bottom plate and the side plates, thereby avoiding the shaking of the water-cooling heat dissipation assembly, which not only improves the overall stability and reliability, but also facilitates installation and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional structural diagram of an integrated water-cooling heat dissipation module proposed in the present invention;

[0023] Figure 2 This is a schematic diagram of the exploded three-dimensional structure of an integrated water-cooling heat dissipation module proposed in the present invention;

[0024] Figure 3 This is a schematic diagram of the partial explosion structure of an integrated water-cooling heat dissipation module proposed by the present invention.

[0025] In the figure: 1. Base plate; 2. Graphics card body; 3. Side panel; 4. Support plate; 5. Water cooling head; 6. Heat pipe; 7. Heat conducting plate; 8. Heat dissipation fins; 9. Fixing bolts; 10. Cooling fan; 11. Protective shell; 12. Water pump. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] Example 1

[0028] Reference Figure 1-3A water-cooling heat dissipation module includes a base plate 1, a graphics card body 2, side plates 3, and a support plate 4. The graphics card body 2 is fixedly mounted at the top center of the base plate 1, while the side plates 3 are fixedly mounted on one side of the top of the base plate 1, adjacent to the graphics card body 2. The support plate 4 is mounted on top of the base plate 1, above the graphics card body 2, and has a through opening.

[0029] In order to achieve efficient heat dissipation, this module also includes a water-cooled heat dissipation component. The water-cooled heat dissipation component is specifically arranged on the support plate 4 and is used to dissipate heat from the graphics card body 2. Specifically, the water-cooled heat dissipation component includes heat dissipation fins 8, heat pipes 6, and a water-cooled head 5. The heat dissipation fins 8 are fixedly penetrated by the heat pipes 6. These heat dissipation fins improve the heat dissipation efficiency by increasing the surface area. A water-cooled head 5 is provided in the through-hole. The water outlet of the water-cooled head 5 is connected to the water inlet of the heat pipe 6. At the same time, the water inlet of the water-cooled head 5 is also connected to the water outlet of the heat pipe 6. In this way, the coolant can circulate between the water-cooled head 5 and the heat pipe 6 to conduct the heat generated by the graphics card body 2.

[0030] Furthermore, a protective housing 11 is fixedly mounted on the top of the support plate 4, and a water pump 12 is fixedly mounted inside the protective housing 11. The water inlet of the water pump 12 is connected to the water outlet of the heat pipe 6, and the water outlet of the water pump 12 is connected to the water inlet of the water cooling head 5. By providing the water pump 12, the coolant can be driven to circulate between the heat pipe 6 and the water cooling head 5, thereby dissipating the heat generated by the graphics card body 2.

[0031] To provide more comprehensive heat dissipation, a heat conducting plate 7 is fixedly mounted on the top of the graphics card body 2, particularly near the GPU and memory components. The top of the heat conducting plate 7 is fixedly connected to the water-cooling contact surface of the water-cooling block 5. This allows the heat conducting plate 7 to dissipate heat not only from the graphics card body 2's GPU but also from the memory components, further enhancing the heat dissipation effect.

[0032] This application can be used in the field of graphics card heat dissipation technology, and can also be used in other fields applicable to this application.

[0033] Example 2

[0034] refer to Figure 2-3 Based on the first embodiment, an integrated water-cooling heat dissipation module is improved and applied to the field of graphics card heat dissipation technology. In addition, to accelerate the heat dissipation process, support plate 4 is provided with two heat dissipation ports on both sides of the opening. Heat dissipation fans 10 are fixedly installed inside these heat dissipation ports. When heat dissipation fans 10 are in operation, they can blow air to heat dissipation fins 8, thereby accelerating the heat dissipation process and improving heat dissipation efficiency.

[0035] Finally, to secure the support plate 4 and the water-cooling heat sink components thereon, two through-holes are provided on one side of each of the bottom plate 1 and the side plate 3. These four through-holes are each fitted with fixing bolts 9. Threaded holes corresponding to the through-holes are provided on both sides of the support plate 4. By tightening the four fixing bolts 9, they are threadedly connected to the corresponding threaded holes, firmly securing the support plate 4 between the bottom plate 1 and the side plate 3, preventing the water-cooling heat sink components thereon from shaking or falling off.

[0036] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An integrated water-cooling heat dissipation module, comprising a base plate (1) and a graphics card body (2), wherein the graphics card body (2) is fixedly arranged on the top of the base plate (1), a side plate (3) is fixedly arranged on the top of the base plate (1) on one side of the graphics card body (2), a support plate (4) is arranged on the top of the base plate (1) above the graphics card body (2), and a through opening is opened on the support plate (4), characterized in that: The water cooling module also includes: A water-cooling heat dissipation component is arranged on the support plate (4) and is used to dissipate heat from the graphics card body (2).

2. The integrated water-cooling heat dissipation module according to claim 1, characterized in that: The water-cooled heat dissipation component includes a heat dissipation fin (8), a heat conduction pipe (6) is fixedly passed through the heat dissipation fin (8), a water cooling head (5) is arranged in the through opening, a water outlet of the water cooling head (5) is connected to a water inlet of the heat conduction pipe (6), and the water inlet of the water cooling head (5) is connected to a water outlet of the heat conduction pipe (6), and the heat dissipation efficiency is improved by increasing the surface area by dissipating the heat from the heat conduction pipe (6) through the provided heat dissipation fin (8).

3. The integrated water-cooling heat dissipation module according to claim 2, characterized in that: A protective shell (11) is fixedly provided on the top of the support plate (4), and a water pump (12) is fixedly provided inside the protective shell (11). The water inlet and the water outlet of the water pump (12) are respectively connected to the water outlet of the heat pipe (6) and the water inlet of the water cooling head (5). The cooling liquid of the heat pipe (6) is circulated by the provided water pump (12), thereby realizing the heat dissipation generated by the graphics card body (2).

4. The integrated water-cooling heat dissipation module according to claim 2, characterized in that: A heat conducting plate (7) is fixedly provided on the top of the graphics card body (2) at the position of the GPU and the video memory components. The top of the heat conducting plate (7) is fixedly connected to the water-cooling contact surface of the water-cooling head (5). The heat conducting plate (7) can not only dissipate heat from the graphics card body (2) GPU but also dissipate heat from the video memory components thereon.

5. The integrated water-cooling heat dissipation module according to claim 2, characterized in that: The support plate (4) is provided with two heat dissipation openings on both sides of the through opening, and heat dissipation fans (10) are fixedly arranged inside the two heat dissipation openings. The two heat dissipation fans (10) are used to blow air to the heat dissipation fins (8) to accelerate heat dissipation.

6. The integrated water-cooling heat dissipation module according to claim 1, characterized in that: Two through holes are provided on one side of the bottom plate (1) and the side plate (3), and fixing bolts (9) are provided in the four through holes. Threaded holes corresponding to the through holes are provided on both sides of the support plate (4), and the four fixing bolts (9) are respectively threadedly connected to the corresponding threaded holes. The support plate (4) is fixed to the bottom plate (1) and the side plate (3) by the four fixing bolts (9), thereby preventing the water-cooling heat dissipation components thereon from shaking.

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