Wafer character OCR (Optical Character Recognition) equipment

Abstract

The utility model relates to the technical field of wafer manufacturing, in particular to wafer character OCR (Optical Character Recognition) equipment. The first driving part and the second driving part are both loaded by the rack. Power sources for the wafer edge data pickup unit and the OCR recognition unit to execute translational motion are first driving parts, and the first driving parts and the wafer edge data pickup unit and the OCR recognition unit are oppositely arranged. The power source for the wafer bearing table to execute the planar motion is the second driving part. The wafer edge data pick-up unit can easily and effectively judge whether a wafer circle center and a notch thereof meet expected design requirements or not by picking up edge contour data of a wafer, the controller sends a control signal to the second driving part accordingly, the wafer bearing table can execute planar motion, and meanwhile, the wafer edge data pick-up unit can be used for driving the wafer bearing table to move. The controller synchronously sends a control signal to the wafer bearing table, and the wafer follows the wafer bearing table to perform a micro-speed circumferential rotation motion until the center and the gap of the wafer circle meet the expected design requirements, so that a subsequent OCR (Optical Character Recognition) unit can accurately and quickly recognize wafer characters.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, in particular to a wafer character OCR recognition device. Background Art

[0002] During wafer production, optical character recognition (OCR) is required to identify the character number of each wafer for subsequent traceability. Traditionally, this process involved manual OCR character input, which was slow, inefficient, and prone to errors. To address this, major equipment manufacturers have developed a range of wafer character OCR recognition equipment.

[0003] For example, our company's first-generation wafer character OCR recognition equipment, developed a few years ago, consists primarily of a frame, a wafer stage, an OCR unit, and a power unit. The wafer stage is supported by the frame and held in a fixed position, receiving wafers transferred by a robotic arm. The OCR unit is located on one side of the wafer stage and directly driven by the power unit. Once the wafer is positioned relative to the wafer stage, the power unit activates, and the driving force gradually moves the OCR unit toward the stage until it occupies the correct reading position relative to the wafer. However, after nearly a year of market testing, user complaints regarding the equipment primarily focused on the following issues: extremely poor OCR accuracy, extremely slow recognition speed, and frequent recognition errors. This is because OCR technology primarily scans images and converts text into editable text. During this process, the quality of the captured image plays a crucial role in determining the recognition results. However, as far as the first generation of wafer character OCR recognition equipment is concerned, the wafer carrier only has the function of dropping the wafer, and does not have the pre-alignment function and circumferential micro-angle adjustment function. As a result, whether the relative position of the centroid of the wafer after dropping and the phase angle of the notch meet the expected design requirements depends on the movement accuracy of the robot. However, due to the limitations of manufacturing technology and procurement costs, the movement accuracy of the robot is difficult to reach the sub-micron level, and the movement repeatability error is even more difficult to control, which makes it difficult for the OCR recognition unit to pick up high-quality wafer character images. Therefore, it is urgent for those skilled in the art to solve the above problems. Utility Model Content

[0004] Therefore, in view of the above existing problems and defects, the research and development team of this utility model project collected relevant information, conducted multi-faceted evaluations and considerations, and continuously experimented and modified the project research and development team, which ultimately led to the emergence of the wafer character OCR recognition device.

[0005] In order to solve the above-mentioned technical problems, the present invention relates to a wafer character OCR recognition device, comprising a frame, a wafer carrier, a wafer edge profile data pickup unit, an OCR recognition unit, a first drive unit, and a second drive unit. The first drive unit and the second drive unit are both supported by the frame. The power source for the wafer edge data pickup unit and the OCR recognition unit to perform translational motion is the first drive unit, and the two are arranged opposite each other in the left-right direction. The power source for the wafer carrier to perform planar motion is the second drive unit. When OCR recognition operation needs to be performed on the wafer, the wafer carrier receives the wafer transferred by the robot, and then the wafer carrier is started, and the wafer is able to perform circumferential rotation. During this process, the wafer edge data pickup unit completely obtains the edge contour data of the wafer, and the second drive unit is started to drive the wafer carrier to perform planar motion until the centroid of the wafer is adjusted to the expected design position. At the same time, the wafer continues to rotate circumferentially at a low speed under the action of the rotational torque from the wafer carrier until the wafer notch meets the expected design position. Subsequently, the first drive unit is started, and the wafer edge contour data pickup unit and the OCR recognition unit perform translational motion towards each other until the OCR recognition unit occupies the correct position relative to the wafer and the wafer characters are recognized.

[0006] As a further improvement to the technical solution disclosed in the present invention, the main structure of the wafer edge contour data pickup unit is a high-precision laser transmission sensor. The main structure of the OCR recognition unit is a wafer OCR character sensor.

[0007] As a further improvement to the technical solution disclosed in the present invention, the frame includes a base, a support frame, and an outer cover. The outer cover covers the base. The support frame is concealed in a cavity of the outer cover and is removably fixed to the base.

[0008] As a further improvement of the technical solution disclosed in the present invention, a left-placed avoidance notch and a right-placed avoidance notch are simultaneously opened on the top wall of the outer cover shell, wherein the left-placed avoidance notch is used to allow the OCR recognition unit to freely perform translational movement and the wafer carrier to freely perform planar movement, while the right-placed avoidance notch is used to facilitate the wafer edge contour data picking unit to freely perform translational movement.

[0009] As a further improvement of the technical solution disclosed in the present invention, the first driving part is a screw rod and a left-right rotating linear guide electric module, which includes a first mounting frame, a first motor, a first screw rod, a first left-mounted bearing seat, a first right-mounted bearing seat, a first left-mounted slide and a first right-mounted slide. The first mounting frame is fixed to the frame as a whole. The first left-mounted bearing seat and the first right-mounted bearing seat can be detachably fixed on the first mounting frame, and cooperate with each other to jointly bear the first screw rod. The first motor is used to drive the first screw rod to perform circumferential rotational motion, and it also uses the first mounting frame as an installation base. The first left-mounted slide used as an installation base by the OCR recognition unit and the first right-mounted slide used as an installation base by the wafer edge contour data picking unit are both mounted on the first screw rod. When the first motor is in the starting state, the first left-mounted slide and the first right-mounted slide perform opposite / backward displacement motion due to the action of the reverse driving force.

[0010] As a further improvement to the technical solution disclosed in the present invention, the second drive unit includes a first linear lead screw module and a second linear lead screw module. The first linear lead screw module directly supports the wafer carrier and is used to drive the wafer carrier to perform translational motion in the front-to-back direction. The second linear lead screw module is used to directly support the first linear lead screw module and is used to drive the first linear lead screw module and the wafer carrier to perform translational motion in the left-to-right direction.

[0011] As a further improvement to the technical solution disclosed in the present invention, the first screw linear module includes a second mounting frame, a second screw, a front bearing seat, a rear bearing seat, an upper slide, and a first synchronous belt drive mechanism. The second mounting frame is supported by the second screw linear module. The front bearing seat and the rear bearing seat are both removably fixed to the second mounting frame and cooperate to jointly support the second screw. The first synchronous belt drive mechanism is used to drive the second screw to perform circumferential rotational motion, and its main structural body also uses the second mounting frame as a mounting base. The upper slide, which is used as a mounting base by the wafer carrier, is mounted on the second screw.

[0012] As a further improvement of the technical solution disclosed in the present invention, the second screw linear module includes a third mounting frame, a third screw, a second left-mounted bearing seat, a second right-mounted bearing seat, a lower slide, and a second motor. The third mounting frame is placed on the top wall of the base and is detachably connected to the base. The second left-mounted bearing seat and the second right-mounted bearing seat can both be detachably fixed to the third mounting frame and cooperate to jointly support the third screw. The second motor is used to drive the third screw to perform circumferential rotational motion, and it also uses the third mounting frame as an installation base. The lower slide, which is used as an installation base by the first screw linear module, is mounted on the third screw.

[0013] As a further improvement of the technical solution disclosed in the present invention, the wafer carrier includes a load-bearing frame, a spindle, a wafer drop column, an encoder and a second synchronous belt transmission mechanism. The load-bearing frame is loaded by the second driving unit. The spindle uses the load-bearing frame as an installation base, and it passes through the load-bearing frame longitudinally. The wafer drop column is used to drop and limit the wafer, and it is integrated with the spindle, and the two remain coaxial. The second synchronous belt transmission mechanism is used to drive the spindle to perform circumferential rotational motion, and its main structural body also uses the load-bearing frame as an installation base. The encoder is mounted on the spindle and performs follow-up circumferential rotational motion.

[0014] As a further improvement of the technical solution disclosed in the present invention, the wafer carrying platform further includes a vacuum suction cup. The vacuum suction cup uses a negative pressure effect to absorb the wafer, which is placed and fixed on the top wall of the wafer placement column.

[0015] In actual applications, when the wafer is transferred to the wafer carrier by the robot, the wafer carrier performs circumferential rotation due to the action of the rotational torque, and the wafer performs a follow-up circumferential rotation. At the same time, the wafer edge data picking unit gradually approaches the wafer carrier due to the driving force from the first driving part. Then, the wafer edge data picking unit completely obtains the edge contour data of the wafer, and the controller determines whether the centroid and notch orientation of the wafer meet the expected requirements based on this. When it is determined that the center point position of the wafer does not meet the expected requirements, the second drive unit is started due to the control signal sent by the controller, and the wafer carrier is able to perform planar motion. At the same time, the wafer continues to follow the wafer carrier to perform micro-speed circumferential rotation motion, and in this process, the controller makes real-time judgments based on the edge contour data of the wafer it obtains and continues to send control signals to the second drive unit and the wafer carrier until the center point of the wafer and the phase angle of the wafer notch meet the expected design requirements. Subsequently, the OCR recognition unit gradually approaches the wafer carrier due to the driving force from the first drive unit until it occupies the correct imaging orientation relative to the wafer, and the wafer characters can be accurately and quickly recognized.

[0016] After nearly a month of on-site trial operation, the results show that compared with the first-generation design, the wafer character OCR recognition device disclosed in this utility model can achieve at least the following beneficial technical effects in practical applications, specifically:

[0017] 1) The wafer edge data pickup unit can easily and effectively determine whether the wafer center and its notch meet the expected design requirements by picking up the edge contour data of the wafer. The controller sends a control signal to the second drive unit accordingly, allowing the wafer carrier to perform planar motion. At the same time, the controller synchronously sends a control signal to the wafer carrier, and the wafer follows the wafer carrier to perform micro-speed circumferential rotation until the wafer center and its notch meet the expected design requirements, which is beneficial for the subsequent OCR recognition unit to accurately and quickly recognize the wafer characters;

[0018] 2) Under the joint action of the wafer edge data pickup unit and the second drive unit, the wafer carrier has the functions of wafer placement, pre-alignment, and circumferential micro-angle adjustment. This helps to ensure that the relative position of the center of gravity of the wafer and the phase angle of the notch after placement meet the expected design requirements, thereby effectively relaxing the requirements for the robot's movement accuracy and movement repeatability error;

[0019] 3) The wafer edge data pickup unit and the OCR recognition unit are arranged opposite to each other in the left and right directions, and both are driven by the same power source (i.e., the first driving unit). Therefore, under the premise that the design functions of the wafer edge data pickup unit and the OCR recognition unit can be fully utilized, the wafer character OCR recognition device has a simpler design structure, which is conducive to subsequent manufacturing implementation, and the overall manufacturing cost is relatively controllable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the utility model.

[0022] Figure 2 It is also a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention (with the side panels belonging to the outer cover hidden).

[0023] Figure 3 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present utility model under one viewing angle (with the supporting frame and outer cover shell hidden at the same time).

[0024] Figure 4 It is a three-dimensional schematic diagram of the wafer character OCR recognition device disclosed in the present invention from another perspective (with the supporting frame and outer cover shell hidden).

[0025] Figure 5 It is a three-dimensional schematic diagram of a wafer carrying platform in the wafer character OCR recognition device disclosed in the present utility model.

[0026] Figure 6 yes Figure 5 Front view of .

[0027] Figure 7 yes Figure 6 AA cross-sectional view.

[0028] Figure 8 It is a three-dimensional schematic diagram of the first driving part in the wafer character OCR recognition device disclosed in the utility model.

[0029] Figure 9 yes Figure 8 Front view of .

[0030] Figure 10 This is a schematic diagram of the wafer carrying platform and the second driving part in the wafer character OCR recognition device disclosed in the present invention after assembly (the wafer carrying platform is shown by a double-dotted line).

[0031] Figure 11 It is a three-dimensional schematic diagram of the second driving part in the wafer character OCR recognition device disclosed in the utility model.

[0032] Figure 12 It is a three-dimensional schematic diagram of the first screw linear module in the wafer character OCR recognition device disclosed in the present utility model.

[0033] Figure 13 It is a three-dimensional schematic diagram of the second screw linear module in the wafer character OCR recognition device disclosed in the present utility model.

[0034] 1-Frame; 11-Base; 12-Supporting frame; 13-Outer cover; 131-Left avoidance gap; 132-Right avoidance gap; 2-Wafer carrier; 21-Load-bearing frame; 22-Spindle; 23-Wafer drop column; 24-Encoder; 25-Second synchronous belt drive mechanism; 26-Vacuum suction cup; 3-Wafer edge profile data pickup unit; 31-High-precision laser transmission sensor; 4-OCR recognition unit; 41-Wafer OCR character sensor; 5-First drive unit; 51-First mounting frame; 52-First motor; 53-First screw; 54 -First left-mounted bearing seat; 55-First right-mounted bearing seat; 56-First left-mounted slide; 57-First right-mounted slide; 6-Second driving unit; 61-First screw linear module; 611-Second mounting bracket; 612-Second screw; 613-Front bearing seat; 614-Rear bearing seat; 615-Upper slide; 616-First synchronous belt transmission mechanism; 62-Second screw linear module; 621-Third mounting bracket; 622-Third screw; 623-Second left-mounted bearing seat; 624-Second right-mounted bearing seat; 625-Lower slide; 626-Second motor. DETAILED DESCRIPTION

[0035] In the description of the present invention, it should be understood that the terms "left", "right", "up", "down", "front", "back", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0036] The following is a detailed description of the present invention in conjunction with specific embodiments. Figure 1-Figure 4The three-dimensional schematic diagrams of the wafer character OCR recognition device disclosed in the present invention in different states are respectively shown. It can be seen that it is mainly composed of several parts such as a frame 1, a wafer carrier 2, a wafer edge contour data pickup unit 3, an OCR recognition unit 4, a first drive unit 5 and a second drive unit 6. Among them, the first drive unit 5 and the second drive unit 6 are both supported by the frame 1. The power source for the wafer edge data pickup unit 3 and the OCR recognition unit 4 to perform translational motion is the first drive unit 5, and the two are arranged opposite to each other in the left and right directions. The power source for the wafer carrier 2 to perform planar motion is the second drive unit 6. When OCR recognition operation needs to be performed on the wafer, the wafer carrier 2 receives the wafer transferred by the robot, and then the wafer carrier 2 is started, and the wafer is able to perform circumferential rotation. During this process, the wafer edge data picking unit 3 completely obtains the edge contour data of the wafer, and the second drive unit 6 is started to drive the wafer carrier 2 to perform planar motion until the centroid of the wafer is adjusted to the expected design position. At the same time, the wafer continues to rotate circumferentially at a low speed under the action of the rotational torque from the wafer carrier 2 until the wafer notch meets the expected design position. Subsequently, the first drive unit 5 is started, and the wafer edge contour data picking unit 3 and the OCR recognition unit 4 perform translational motion in opposite directions until the OCR recognition unit 4 occupies the correct position relative to the wafer and the wafer characters are recognized.

[0037] The working principle of the wafer character OCR recognition equipment is roughly as follows: when the wafer is transferred to the wafer carrier 2 by the robot, the wafer carrier 2 performs circumferential rotation due to the action of the rotational torque, and the wafer performs a follow-up circumferential rotation. At the same time, the wafer edge data picking unit 3 gradually approaches the wafer carrier 2 due to the driving force from the first driving part 5. Then, the wafer edge data picking unit 3 completely obtains the edge contour data of the wafer, and the controller determines whether the centroid and notch orientation of the wafer meet the expected requirements based on this. When it is determined that the center point position of the wafer does not meet the expected requirements, the second drive unit 6 is started due to the control signal sent by the controller, and the wafer carrier 2 is able to perform planar motion. At the same time, the wafer continues to follow the wafer carrier 2 to perform micro-speed circumferential rotation motion, and in this process, the controller makes real-time judgments based on the edge contour data of the wafer it obtains and continues to send control signals to the second drive unit 6 and the wafer carrier 2 until the center point of the wafer and the phase angle of the wafer notch meet the expected design requirements. Subsequently, the OCR recognition unit 4 gradually approaches the wafer carrier 2 due to the driving force from the first drive unit 5 until it occupies the correct imaging orientation relative to the wafer, and the wafer characters can be accurately and quickly recognized.

[0038] In practical applications, the wafer character OCR recognition device disclosed in the present utility model can achieve at least the following beneficial technical effects in practical applications, specifically:

[0039] 1) The wafer edge data picking unit 3 can easily and effectively determine whether the wafer center and its notch meet the expected design requirements by picking up the edge contour data of the wafer, and the controller sends a control signal to the second drive unit 6 accordingly, so that the wafer carrier 2 can perform planar motion. At the same time, the controller synchronously sends a control signal to the wafer carrier 2, and the wafer follows the wafer carrier 2 to perform a micro-speed circumferential rotation motion until the wafer center and its notch meet the expected design requirements, which is beneficial for the subsequent OCR recognition unit 4 to accurately and quickly recognize the wafer characters;

[0040] 2) Under the joint action of the wafer edge data pickup unit 3 and the second drive unit 6, the wafer carrier 2 has the functions of wafer placement, pre-alignment, and circumferential micro-angle adjustment (the wafer carrier 2 is self-powered to perform circumferential rotation), thereby ensuring that the relative position of the center of gravity of the wafer after placement and the phase angle of the notch meet the expected design requirements, thereby effectively relaxing the requirements for the robot's movement accuracy and movement repeatability error;

[0041] It should also be emphasized here that the wafer edge data picking unit 3 and the OCR recognition unit 4 are arranged opposite to each other in the left and right directions, and both are driven by the same power source (i.e., the first driving unit 5). Therefore, under the premise that the design functions of the wafer edge data picking unit 3 and the OCR recognition unit 4 can be fully utilized, the wafer character OCR recognition device has a simpler design structure, which is conducive to subsequent manufacturing implementation, and the overall manufacturing cost is relatively controllable.

[0042] As is known to all, the wafer edge profile data acquisition unit 3 can employ various design concepts to acquire wafer edge profile data. However, in this embodiment, a high-precision laser transmission sensor 31 is preferably used. The high-precision laser transmission sensor 31 comprises a transmitter and a receiver. The transmitter emits a laser beam, and the receiver receives a light intensity signal. The wafer is placed between the transmitter and receiver, which affects the proper transmission of the laser beam. The high-precision laser transmission sensor 31 uses a sampling frequency much higher than that of a traditional linear CCD camera. This increases the number of sampling points around the wafer edge within the same time period, thereby improving the speed and accuracy of wafer centroid determination. The wafer sampling data is then subjected to the step-and-drop method to determine the initial estimated position of the notch's lowest point. The high-precision laser transmission sensor 31 is then used to perform fine sampling of a small area along the notch edge. The fine sampling data is then used to determine the position of the wafer's lowest point using the step-and-drop method. The sampled data within the notch area is then removed from the wafer edge sampling data. The wafer centroid is then fitted using the least squares method on the wafer edge sampling data after the notch is removed. In the process of picking up the edge profile data of the wafer, in addition to collecting the analog output signal of the high-precision laser transmission sensor 31, the controller also synchronously collects its Low digital output signal and searches the Low digital output signal data. The inflection point from 1 to 0 is the starting point of the gap, and the inflection point from 0 to 1 is the end point of the gap, thereby clearly identifying the wafer gap.

[0043] In the rapidly developing semiconductor industry, accurate reading of wafer IDs is a key link in ensuring efficient and accurate production processes. In view of this, in this embodiment, the main structure of the OCR recognition unit 4 is preferably a wafer OCR character sensor 41. The wafer OCR character sensor 41 integrates RGB three-color lighting technology. This design can not only effectively cope with various complex lighting environments, but also automatically adjust the light intensity and color combination according to the surface characteristics of the detected wafer characters, thereby ensuring that the clarity and contrast of the character image are optimal, laying a solid foundation for subsequent recognition processing. Furthermore, the wafer OCR character sensor 41 adopts Hejie's patented intelligent image algorithm. This series of sensors performs well in character recognition, especially for clearly printed characters, with a recognition rate of up to 99.99%. In addition, the wafer OCR character sensor 41 also has an intelligent code shift compensation function, which can automatically correct the character position offset caused by wafer movement or jitter to ensure that every reading is accurate.

[0044] Depend on Figure 1 、 2As shown in the figure, it can be clearly seen that the frame 1 is mainly composed of several parts, such as a base 11, a support frame 12 and an outer cover shell 13. The outer cover shell 13 covers the top of the base 11, and is composed of a plurality of side panels and a top plate. The support frame 12 is hidden in the cavity of the outer cover shell 13, and is detachable to achieve fixation with the base 11. A left-placed avoidance gap 131 and a right-placed avoidance gap 132 are also provided on the top plate. The left-placed avoidance gap 131 is used for the OCR recognition unit 4 to freely perform translational movement and for the wafer carrier 2 to freely perform planar movement, while the right-placed avoidance gap 132 is used to facilitate the wafer edge contour data picking unit 3 to freely perform translational movement. In this way, under the premise of ensuring that the wafer carrier 2, the wafer edge contour data picking unit 3 and the OCR recognition unit 4 have sufficient freedom of movement, not only the first driving part 5, the second driving part 6 and the lower hidden part of the wafer carrier 2, the wafer edge contour data picking unit 3 and the OCR recognition unit 4 are effectively prevented from being affected by external dust and debris, but also the occurrence of workers' personal safety being endangered due to accidents or misoperations can be effectively avoided.

[0045] As is known, according to common sense in design, the first driving unit 5 can adopt a variety of design structures to achieve simultaneous driving of the wafer edge data picking unit 3 and the OCR recognition unit 4. However, here we recommend a solution with a simple design structure, easy manufacturing and implementation, convenient for subsequent maintenance and repair operations, extremely high action accuracy, and extremely fast action response speed, specifically: Figure 8 、 9 As shown in the figure, the first driving part 5 is preferably a screw-rotating left-handed linear guide electric module, which is mainly composed of several parts such as the first mounting frame 51, the first motor 52, the first screw 53, the first left-mounted bearing seat 54, the first right-mounted bearing seat 55, the first left-mounted slide 56 and the first right-mounted slide 57. The first mounting frame 51 is fixed to the frame 1 as an integral whole. The first left-mounted bearing seat 54 and the first right-mounted bearing seat 55 can be detachably fixed to the first mounting frame 51 and cooperate to jointly support the first screw 53. Along its length, the first screw 53 is provided with a left-handed screw segment and a right-handed screw segment in sequence. The first motor 52 is used to drive the first screw 53 to perform circumferential rotational motion, and it also uses the first mounting frame 51 as an installation base. The first left-mounted slide 56 used as an installation base by the wafer OCR character sensor 41 and the first right-mounted slide 57 used as an installation base by the high-precision laser transmission sensor 31 are respectively mounted on the left-handed screw segment and the right-handed screw segment in a one-to-one correspondence. When the first motor 52 is in the starting state, the first left slide 56 and the first right slide 57 are moved closer / away due to the reverse driving force, and the wafer OCR character sensor 41 and the high-precision laser transmission sensor 31 are able to move closer / away from the wafer carrier 2 at the same time.

[0046] In order to achieve the same design purpose as above, in view of this, Figure 10 、 11 As shown in , the second drive unit 6 is mainly composed of a first screw linear module 61 and a second screw linear module 62. Among them, the first screw linear module 61 directly loads the wafer carrier 2 and is used to drive the wafer carrier 2 to perform translational motion along the front-to-back direction. The second screw linear module 62 is used to directly load the first screw linear module 61 and is used to drive the first screw linear module 61 together with the wafer carrier 2 to perform translational motion along the left-right direction. In this way, under the coordinated action of the first screw linear module 61 and the second screw linear module 62, the wafer carrier 2 can accurately perform planar motion.

[0047] As a further refinement of the above technical solution, Figure 12 As shown in , the first screw linear module 61 is mainly composed of several parts such as the second mounting frame 611, the second screw 612, the front bearing seat 613, the rear bearing seat 614, the upper slide 615 and the first synchronous belt transmission mechanism 616. The second mounting frame 611 is supported by the second screw linear module 62. The front bearing seat 613 and the rear bearing seat 614 can be detachably fixed on the second mounting frame 611, and cooperate with each other to jointly bear the second screw 612. The first synchronous belt transmission mechanism 616 is used to drive the second screw 612 to perform circumferential rotational motion, and its main structure (including a rotating motor, an active synchronous wheel and a driven synchronous wheel, etc.) also uses the second mounting frame 611 as an installation base. The upper slide 615 used as an installation base by the wafer carrier 2 is mounted on the second screw 612. As shown Figure 13 As shown in , the second screw linear module 62 is mainly composed of several parts such as a third mounting frame 621, a third screw 622, a second left-mounted bearing seat 623, a second right-mounted bearing seat 624, a lower slide 625 and a second motor 626. The third mounting frame 621 is placed on the top wall of the base 11 and is detachably connected to the base 11. The second left-mounted bearing seat 623 and the second right-mounted bearing seat 624 are both detachably fixed to the third mounting frame 621 and cooperate to jointly bear the third screw 622. The second motor 626 is used to drive the third screw 622 to perform circumferential rotational motion, and it also uses the third mounting frame 621 as an installation base. The lower slide 625, which is used as an installation base by the first screw linear module 61, is mounted on the third screw 622.

[0048] Depend on Figure 5 、 6As shown in 7, it can be clearly seen that the wafer carrier 2 is mainly composed of several parts such as a load-bearing frame 21, a main shaft 22, a wafer drop column 23, an encoder 24 and a second synchronous belt transmission mechanism 25. The load-bearing frame 21 is loaded by the second driving unit 6. The main shaft 22 uses the load-bearing frame 21 as an installation base, and it passes through the load-bearing frame 21 longitudinally. The wafer drop column 23 is used to drop and limit the wafer, and it is integrated with the main shaft 22, and the two remain coaxial. The second synchronous belt transmission mechanism 25 is used to drive the main shaft 22 to perform circumferential rotation motion, and its structural body (including a rotating motor, an active synchronous wheel and a driven synchronous wheel, etc.) also uses the load-bearing frame 21 as an installation base. The encoder 24 is mounted on the main shaft 22 and performs a follow-up circumferential rotation motion. In this way, on the one hand, the wafer carrier 2 has an extremely simple design structure, which is conducive to manufacturing implementation; on the other hand, with the help of the second synchronous belt transmission mechanism 25 to apply rotational torque to the core shaft 22, the wafer that has been dropped can synchronously perform circumferential rotation motion following the wafer drop column 23, which is conducive to the wafer edge data picking unit 3 picking up the edge contour data of the wafer, and with the assistance of the encoder 24, it is more conducive to the precise adjustment of the wafer notch phase angle.

[0049] Finally, in order to ensure that the wafers have good position consistency after being placed and to avoid changes in their relative positions when subjected to excitation force or other external forces, as a further optimization of the above technical solution, Figure 5 、 6 As described in FIG. 7 , the wafer carrying platform 2 is further equipped with a vacuum chuck 26 . The vacuum chuck 26 absorbs the wafer by means of a negative pressure effect, and the wafer is placed and fixed on the top wall of the wafer placement column 23 .

[0050] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer character OCR recognition device, characterized in that: The machine comprises a frame, a wafer carrying platform, a wafer edge contour data pickup unit, an OCR recognition unit, a first driving unit and a second driving unit; the first driving unit and the second driving unit are both supported by the frame; the power source for the wafer edge contour data pickup unit and the OCR recognition unit to perform translational motion is the first driving unit, and the two are arranged opposite to each other along the left and right directions; the wafer carrying platform is used to receive the wafer transferred by the robot, and the power source for performing planar motion is the second driving unit; when the wafer carrying platform drives the wafer to perform circumferential rotational motion, the wafer edge contour data pickup unit obtains wafer edge contour data, the second driving unit is used to drive the wafer carrying platform to perform planar motion, and under the action of the rotational torque from the wafer carrying platform, when the wafer notch is in the expected design position, the first driving unit is used to drive the wafer edge contour data pickup unit and the OCR recognition unit to perform translational motion towards each other, and the OCR recognition unit recognizes wafer characters; The wafer carrier includes a load-bearing frame, a core shaft, a wafer dropping column, an encoder and a second synchronous belt transmission mechanism; the load-bearing frame is loaded by the second driving part; the core shaft uses the load-bearing frame as an installation base, and it passes through the load-bearing frame longitudinally; the wafer dropping column is used to drop and limit the wafer, and it is integrated with the core shaft, and the two remain coaxial; the second synchronous belt transmission mechanism is used to drive the core shaft to perform circumferential rotation motion, and its main structure also uses the load-bearing frame as an installation base; the encoder is mounted on the core shaft and performs follow-up circumferential rotation motion.

2. The wafer character OCR recognition device according to claim 1, characterized in that: The main structure of the wafer edge contour data picking unit is a high-precision laser transmission sensor; the main structure of the OCR recognition unit is a wafer OCR character sensor.

3. The wafer character OCR recognition device according to claim 1, characterized in that: The frame includes a base, a supporting frame and an outer cover; the outer cover covers the top of the base; The support frame is hidden in the cavity of the outer cover shell and is fixed to the base in a detachable manner.

4. The wafer character OCR recognition device according to claim 3, characterized in that: A left-placed avoidance notch and a right-placed avoidance notch are simultaneously provided on the top wall of the outer cover shell; wherein, the left-placed avoidance notch is used to allow the OCR recognition unit to freely perform translational movement and the wafer carrier to freely perform planar movement, while the right-placed avoidance notch is used to facilitate the wafer edge contour data picking unit to freely perform translational movement.

5. The wafer character OCR recognition device according to any one of claims 1 to 4, characterized in that: The first driving part is a lead screw left-right rotating linear guide electric module, which includes a first mounting frame, a first motor, a first lead screw, a first left-mounted bearing seat, a first right-mounted bearing seat, a first left-mounted slide and a first right-mounted slide; the first mounting frame is fixed to the frame as a whole; the first left-mounted bearing seat and the first right-mounted bearing seat can be detachably fixed on the first mounting frame, and cooperate with each other to jointly bear the first lead screw; the first motor is used to drive the first lead screw to perform circumferential rotational motion, and it also uses the first mounting frame as an installation base; the first left-mounted slide used as an installation base by the OCR recognition unit and the first right-mounted slide used as an installation base by the wafer edge contour data picking unit are both mounted on the first lead screw; when the first motor is in the starting state, the first left-mounted slide and the first right-mounted slide perform opposite / backward displacement motion due to the action of the reverse driving force.

6. The wafer character OCR recognition device according to any one of claims 3-4, characterized in that: The second driving unit includes a first lead screw linear module and a second lead screw linear module; the first lead screw linear module directly loads the wafer carrier and is used to drive the wafer carrier to perform translational movement along the front-back direction; and the second lead screw linear module is used to directly load the first lead screw linear module and is used to drive the first lead screw linear module together with the wafer carrier to perform translational movement along the left-right direction.

7. The wafer character OCR recognition device according to claim 6, characterized in that: The first screw linear module includes a second mounting frame, a second screw, a front bearing seat, a rear bearing seat, an upper slide and a first synchronous belt transmission mechanism; the second mounting frame is supported by the second screw linear module; the front bearing seat and the rear bearing seat can be detachably fixed to the second mounting frame, and cooperate with each other to jointly bear the second screw; the first synchronous belt transmission mechanism is used to drive the second screw to perform circumferential rotational motion, and its main structure also uses the second mounting frame as an installation base; the upper slide, which is used as an installation base by the wafer carrier, is mounted on the second screw.

8. The wafer character OCR recognition device according to claim 7, characterized in that: The second screw linear module includes a third mounting frame, a third screw, a second left-mounted bearing seat, a second right-mounted bearing seat, a lower slide and a second motor; the third mounting frame is placed on the top wall of the base and is detachably connected to the base; the second left-mounted bearing seat and the second right-mounted bearing seat can be detachably fixed to the third mounting frame and cooperate with each other to jointly bear the third screw; the second motor is used to drive the third screw to perform circumferential rotational motion, and it also uses the third mounting frame as an installation base; the lower slide used as an installation base by the first screw linear module is mounted on the third screw.

9. The wafer character OCR recognition device according to claim 1, characterized in that: The wafer carrying platform also includes a vacuum suction cup; the vacuum suction cup uses the negative pressure effect to absorb the wafer, which is placed and fixed on the top wall of the wafer placement column.

Images