Wafer bearing device

Abstract

The utility model discloses a wafer bearing device, which relates to the field of semiconductor processing equipment, and is characterized by comprising a fixed table and a bearing disc rotationally connected to the top end of the fixed table, a sealing cover is arranged at one end, far away from the fixed table, of the bearing disc, and a condensation net and a moisture absorption net are arranged in the sealing cover. The condensation net is arranged at the end, away from the bearing disc, of the moisture absorption net, a sealing groove corresponding to the sealing cover is formed in the fixing table, a plurality of ventilation holes are formed in the sealing groove, and the air guiding device is used for guiding airflow to flow from top to bottom so that the airflow can cool the bearing disc after sequentially passing through the condensation net and the moisture absorption net. The air guide device is arranged to trigger airflow to pass through the condensation net and the moisture absorption net in sequence, so that the cooled and dried airflow scours the surface of the bearing disc, the heat dissipation of the bearing disc is accelerated, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing equipment, and more specifically, to a wafer carrying device. Background Art

[0002] In semiconductor manufacturing, a wafer carrier (also known as a wafer carrier, wafer tray, or wafer clamp) is used to carry and position wafers so that they can be manipulated during various processing steps. A vacuum pump is usually provided to remove the air between the wafer and the carrier so that the wafer is firmly fixed on the carrier.

[0003] Wafers are usually processed on a carrier plate for post-photolithography baking, rapid thermal processing, and other processing procedures. These processes are all performed on the wafer carrier plate, resulting in the carrier plate heating up rapidly after the processing is completed. However, other wafer processing steps sometimes do not require a carrier plate with a higher temperature. Therefore, new solutions are needed to improve the cooling effect of the carrier plate. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a wafer carrying device, which has the advantage of fast cooling speed of the carrying plate.

[0005] The above technical purpose of the present utility model is achieved through the following technical solutions: a wafer carrying device, comprising a fixed table and a carrying plate rotatably connected to the top of the fixed table, a sealing cover is provided at the end of the carrying plate away from the fixed table, a condensation net and a moisture absorbing net are provided in the sealing cover, the condensation net is arranged at the end of the moisture absorbing net away from the carrying plate, a sealing groove corresponding to the sealing cover is provided on the fixed table, a plurality of ventilation holes are provided in the sealing groove, an air guide device is provided at the end of the fixed table away from the carrying plate, the air guide device is used to guide the airflow to flow from top to bottom so that the airflow passes through the condensation net and the moisture absorbing net in turn and then cools the carrying plate.

[0006] The utility model is further configured as follows: two connecting rods are provided on both sides of the carrying plate, the connecting rods are threadedly connected to the fixing platform, the sealing cover is slidably connected to the connecting rods through two connecting ears provided on the sides, and a limit knob is provided on the connecting ears.

[0007] The utility model is further configured as follows: two connecting ring grooves are provided in the sealing cover, and the condensation net and the moisture absorption net are detachably connected to the connecting ring grooves through elastic sheets provided on the sides.

[0008] The utility model is further configured as follows: a vacuum pump is provided at the lower end of the fixed table, an air suction hole connected to the air inlet of the vacuum pump is opened on the carrying plate, and the air guide device includes a rotating fan blade rotatably connected to the lower end of the fixed table, and the rotating fan blade is driven by a motor provided at the lower end of the fixed table.

[0009] The utility model is further configured as follows: the condensation net includes two mesh plates 1 with a distance therebetween, and a storage cavity 1 is formed between the two mesh plates 1.

[0010] The utility model is further configured as follows: the moisture-absorbing net includes three mesh plates 2 with a spacing therebetween, and two storage cavities 2 at different levels are formed between adjacent mesh plates 2.

[0011] To sum up, the utility model has the following beneficial effects: the utility model arranges a sealing cover at the upper end of the carrier plate and arranges a condensation net and a moisture-absorbing net inside the sealing cover. When the device is started, the air flow is caused by the air guide device arranged under the carrier plate to pass through the condensation net and the moisture-absorbing net, and the cooled and dry gas flushes the surface of the carrier plate, allowing the carrier plate to cool down quickly, thereby facilitating the processing of the next wafer and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural diagram of the utility model;

[0013] Figure 2 It is a cross-sectional view of the utility model;

[0014] Figure 3 for Figure 2 Enlarged schematic diagram of part A in the middle.

[0015] In the figure: 1. Fixing platform; 11. Ventilation hole; 2. Carrying plate; 3. Connecting rod; 4. Sealing cover; 41. Connecting ear; 411. Limit knob; 5. Condensation net; 51. Net plate 1; 52. Elastic sheet; 6. Moisture-absorbing net; 61. Net plate 2; 7. Air guide device; 71. Motor; 72. Rotating fan blade. DETAILED DESCRIPTION

[0016] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

[0017] Embodiment: A wafer carrier device, such as Figure 1-Figure 3As shown, it includes a fixed table 1 and a carrier plate 2 rotatably connected to the top of the fixed table 1, a vacuum pump is provided at the lower end of the fixed table 1, and an air suction hole connected to the air inlet of the vacuum pump is opened on the carrier plate 2. Referring to the prior art, after the wafer is placed on the carrier plate 2, the vacuum pump is started to evacuate the gas between the wafer and the carrier plate 2, so that the wafer can be tightly adsorbed on the carrier plate 2 under the action of atmospheric pressure, and a sealing cover 4 is provided at the end of the carrier plate 2 away from the fixed table 1. A condensation net 5 and a moisture absorption net 6 are provided in the sealing cover 4. The condensation net 5 is provided at the end of the moisture absorption net 6 away from the carrier plate 2, and a sealing groove corresponding to the sealing cover 4 is provided on the fixed table 1. A plurality of ventilation holes 11 are provided in the sealing groove. When the sealing cover 4 fits the sealing groove, the sealing cover 4 is located at the plurality of ventilation holes 11. The outside of the fixed platform 1 will not be blocked by the ventilation holes 11. An air guide device 7 is provided at the end of the fixed platform 1 away from the carrier plate 2. The air guide device 7 can guide the air flow from the end of the fixed platform 1 with the carrier plate 2 through the several ventilation holes 11 to the end of the fixed platform 1 away from the carrier plate 2. The sealing cover 4 is embedded in the sealing groove to surround the entire carrier plate 2 on the fixed platform 1. Then the air guide device 7 is started. The air flow will first pass through the condensation net 5 located on the outermost side to quickly cool down, and then the moisture-absorbing net 6 will absorb the cooled water vapor, and the dried cold air will flush the surface of the carrier plate 2, thereby quickly cooling down the carrier plate 2 that has been heated together after the wafer processing process such as rapid heat treatment, so that it can continue to quickly process the next wafer, thereby improving the wafer processing rate.

[0018] like Figure 1-Figure 3 As shown, two connecting rods 3 are provided on both sides of the supporting plate 2, and the connecting rods 3 are threadedly connected to the fixed platform 1. The sealing cover 4 is slidably connected to the connecting rod 3 through two connecting ears 41 arranged on the side. A limit knob 411 is provided on the connecting ear 41. The limit knob 411 can effectively fix the sealing cover 4 on the connecting rod 3 at a position relatively far away from the fixed platform 1, thereby improving the connection stability of the sealing cover 4 on the connecting rod 3. Two connecting ring grooves are provided in the sealing cover 4, and the condensation net 5 and the moisture absorption net 6 are detachably connected to the connecting ring groove through the elastic sheet 52 arranged on the side. The friction between the elastic sheet 52 and the wall of the connecting ring groove can fix the condensation net 5 and the moisture absorption net 6 in the sealing cover 4 more firmly, and can also be separated and disassembled more conveniently.

[0019] like Figure 1-Figure 3 As shown, the air guide device 7 includes a rotating fan blade 72 rotatably connected to the lower end of the fixed platform 1. The rotating fan blade 72 is driven by a motor 71 arranged at the lower end of the fixed platform 1. The motor 71 is arranged on the outside of the vacuum pump. The motor 71 drives the rotating fan blade 72 to rotate through gears, thereby forming a flowing airflow.

[0020] like Figure 1-Figure 3As shown, the condensation net 5 includes two mesh plates 51 with a distance therebetween. The two mesh plates 51 are interlocked with each other to form a storage cavity 1 between the two mesh plates 51. A sealed bag containing ice cubes can be placed in the storage cavity 1. The low temperature of the ice cubes can be used to quickly cool the air flow passing through the condensation net 5. At the same time, the cost of ice cubes is low and can be replaced at will.

[0021] like Figure 1-Figure 3 As shown, the moisture-absorbing net 6 includes three mesh plates 2 61 with a distance between each other. The three mesh plates 2 61 are interlocked with each other, and two storage cavities 2 at different levels are formed between adjacent mesh plates 2 61. The storage cavity 2 with a higher level is filled with compacted activated carbon. Through this structural design, the activated carbon will only fall into the storage cavity 2 in the lower layer after it is loosened, and will not fall through the lowest mesh plate 2 61 to the supporting plate 2 to cause pollution. The structural design is simple and reasonable.

[0022] Working principle: After the wafer undergoes rapid heat treatment and other processing and is separated from the wafer, force is applied to the limit knob 411 to loosen the sealing cover 4, and force is applied to the sealing cover 4 to move the sealing cover 4 from top to bottom so that it is tightly combined with the bottom of the sealing groove. When the sealing cover 4 is in contact with the sealing groove, the sealing cover 4 is located on the outside of several ventilation holes 11 in the sealing groove without blocking the ventilation holes 11. After starting the air guide device 7, the air guide device 7 guides the airflow to flow from top to bottom through the condensation net 5 and the moisture absorption net 6, and finally passes through the ventilation holes 11 to flow out to the bottom side of the air guide device 7. During the flow of air, the airflow is rapidly cooled by the action of low-temperature items such as the sealed bag with ice cubes in the condensation net 5, and then the cooled airflow passes through the moisture absorption net 6 and is absorbed by the activated carbon provided in the moisture absorption net 6. Finally, the cooled and dried gas is flushed to the surface of the carrier plate 2, so that the carrier plate 2 is quickly cooled, thereby facilitating the secondary processing of the wafer and improving production efficiency.

[0023] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, certain improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A wafer carrying device, comprising a fixed platform (1) and a carrying plate (2) rotatably connected to the top of the fixed platform (1), characterized in that: The end of the carrier plate (2) away from the fixed platform (1) is provided with a sealing cover (4), a condensation net (5) and a moisture absorption net (6) are provided in the sealing cover (4), the condensation net (5) is arranged at the end of the moisture absorption net (6) away from the carrier plate (2), the fixed platform (1) is provided with a sealing groove corresponding to the sealing cover (4), a plurality of ventilation holes (11) are provided in the sealing groove, and the end of the fixed platform (1) away from the carrier plate (2) is provided with an air guide device (7), the air guide device (7) is used to guide the air flow from top to bottom so that the air flow passes through the condensation net (5) and the moisture absorption net (6) in turn and then cools the carrier plate (2).

2. The wafer carrier according to claim 1, wherein: Two connecting rods (3) are provided on both sides of the carrier plate (2), and the connecting rods (3) are threadedly connected to the fixing platform (1). The sealing cover (4) is slidably connected to the connecting rods (3) through two connecting ears (41) provided on the sides, and a limit knob (411) is provided on the connecting ears (41).

3. The wafer carrier according to claim 1, wherein: Two connecting ring grooves are provided in the sealing cover (4), and the condensation net (5) and the moisture absorption net (6) are detachably connected to the connecting ring grooves via elastic sheets (52) arranged on the side.

4. The wafer carrier according to claim 1, wherein: A vacuum pump is provided at the lower end of the fixed platform (1); an air suction hole connected to an air inlet of the vacuum pump is provided on the carrier plate (2); the air guide device (7) includes a rotating fan blade (72) rotatably connected to the lower end of the fixed platform (1); and the rotating fan blade (72) is driven by a motor (71) provided at the lower end of the fixed platform (1).

5. The wafer carrier according to claim 1, wherein: The condensation net (5) comprises two mesh plates (51) with a distance therebetween, and a storage cavity (1) is formed between the two mesh plates (51).

6. The wafer carrier according to claim 1, wherein: The moisture-absorbing net (6) comprises three mesh panels (61) spaced apart from each other, and two storage cavities (61) at different levels are formed between adjacent mesh panels (61).

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