Packaging device of semiconductor chip

Abstract

The utility model relates to the technical field of semiconductor device packaging, in particular to a semiconductor chip packaging device, which comprises a device body, a conveying device, a pushing piece, an adsorption piece and a gluing piece, and is characterized in that the conveying device is arranged on the device body and is used for conveying a substrate, a placing plate and a clamping assembly, and the placing plate is provided with a semiconductor chip; the pushing piece is arranged on the device body in a lifting mode and located above the conveying belt. The adsorption part is arranged on the pushing part in a sliding manner and is used for adsorbing a semiconductor chip; the gluing piece is arranged on the pushing piece, and the gluing piece is used for gluing the substrate; the clamping assembly is arranged on the device body, is in transmission connection with the pushing piece and is used for clamping the containing plate and the base plate. According to the utility model, the gluing piece is used for gluing the substrate, the adsorption piece is used for transferring the semiconductor chip on the placing plate to the substrate, and the clamping assembly can clamp the substrate and the placing plate, so that the automation degree is high, the manual participation is less, and the packaging efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device packaging, in particular to a packaging device for a semiconductor chip. Background Art

[0002] Semiconductor packaging refers to the process of converting tested wafers into individual chips according to product model and functional requirements. The packaging process involves dicing wafers from the front-end wafer processing process into small chips. These chips are then glued onto the corresponding islands on the substrate (lead frame). Ultra-fine metal wires or conductive resin are then used to connect the chip's bonding pads to the corresponding pins on the substrate, forming the required circuit. The individual chips are then encapsulated and protected in a plastic casing.

[0003] However, when packaging semiconductor chips in the prior art, the substrate cannot be automatically positioned and fixed. Workers are required to position the substrate before it can be fixed, which affects the packaging efficiency of the packaging device. In addition, the packaging glue cannot be pre-coated in advance, which affects the packaging efficiency of the semiconductor chip. Utility Model Content

[0004] In order to solve the problem of low packaging efficiency in the prior art, the utility model provides a semiconductor chip packaging device with improved packaging efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A semiconductor chip packaging device, comprising:

[0007] device body,

[0008] A conveying device is provided on the device body, and is used to convey the substrate and the placement plate, wherein the placement plate is provided with semiconductor chips;

[0009] A pusher, the pusher being mounted on the main body of the lifting device and positioned above the conveyor belt;

[0010] An adsorption member, which is slidably disposed on the pushing member and is used to adsorb the semiconductor chip;

[0011] A glue coating member, which is arranged on the pushing member and is used to coat glue on the substrate;

[0012] The clamping assembly is arranged on the device body and is transmission-connected with the pushing member. The clamping assembly is used for clamping the placement plate and the substrate.

[0013] Furthermore, a motor is installed on the pushing member, the motor is connected to a first screw rod, and the adsorption member is threadedly connected to the first screw rod.

[0014] Furthermore, the clamping assembly includes a clamping piece, the device body is provided with a guide groove, and the clamping piece slides along the guide groove.

[0015] Furthermore, the clamping assembly also includes a second screw rod, a plurality of sliders are threadedly connected to the second screw rod, the sliders are slidably connected to the device body, a sliding rod is fixed on the slider, and the clamp is slidably set on the sliding rod.

[0016] Furthermore, the second screw rod is fixedly connected to a gear, and the pushing member is fixedly connected to a rack for meshing with the gear.

[0017] Furthermore, the pushing member is connected to an electric push rod for driving the pushing member to rise and fall.

[0018] Furthermore, the conveying device includes a conveyor belt, and the placement plate and the base plate are transported parallel to each other and synchronously.

[0019] Furthermore, the second screw rod is provided with a plurality of thread segments with opposite rotation directions to realize the toward or away movement of the slider.

[0020] Furthermore, each placement plate or substrate is provided with four clamping members, and the guide grooves are provided to diverge outwards along the four corners of the placement plate or substrate, and the clamping members are in a right angle shape adapted to the corners of the prevention plate or substrate.

[0021] Furthermore, the glue coating component includes a glue coating robot arm.

[0022] Beneficial effects:

[0023] (1) The utility model is provided with a conveying device on the device body for conveying the substrate and the placement plate, and the glue is applied on the substrate by the glue coating member on the pushing member, and the semiconductor chip on the placement plate is transferred to the substrate by the adsorption member on the pushing member. At the same time, the clamping component can clamp the substrate and the placement plate, which has a high degree of automation, less manual participation, and high packaging efficiency;

[0024] (2) The pusher and the clamping assembly of the utility model are connected by a rack and a gear, and the clamping member slides along the guide groove to clamp and release the placement plate or base plate, making the structure more integrated. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 This is a schematic diagram of the overall structure of the semiconductor chip packaging device of the present invention;

[0027] Figure 2 A partial cross-sectional view of the semiconductor chip packaging device of the present invention;

[0028] Figure 3 for Figure 2 A partial enlarged view of point A in the middle.

[0029] 1. Device body, 2. Electric push rod, 3. Pushing member, 4. First screw rod, 5. Adsorption member, 6. Gluing robot arm, 7. Rack, 8. Gear, 9. Second screw rod, 10. Slider, 11. Sliding rod, 12. Clamp, 13. Guide groove, 14. Placement plate, 15. Base plate, 16. Conveyor belt, DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0032] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0033] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0034] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0035] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0036] like Figures 1 to 3 , which is a semiconductor chip packaging device of the present invention, includes a device body 1, a conveying device, a pushing member 3, an adsorption member 5, and a glue coating member. The conveying device is arranged on the device body 1, and the conveying device is used to convey the substrate 15 and the placement plate 14, and a clamping assembly. The placement plate 14 is provided with a semiconductor chip; the pushing member 3 is raised and lowered on the device body 1 and is located above the conveyor belt 16; the adsorption member 5 is slidably arranged on the pushing member 3, and the adsorption member 5 is used to adsorb the semiconductor chip; the glue coating member is arranged on the pushing member 3, and the glue coating member is used to glue the substrate 15; the clamping assembly is arranged on the device body 1 and is transmission-connected to the pushing member 3, and the clamping assembly is used to clamp the placement plate 14 and the substrate 15.

[0037] The pusher 3 is connected to the electric push rod 2, which drives it up and down. The electric push rod 2 is fixedly mounted inside the device body 1, and the pusher 3 is fixedly connected to the bottom of the electric push rod 2. The pusher 3 is mounted on the pusher 3, which is connected to the first screw 4. The suction member 5 is threadedly connected to the first screw 4. Specifically, the suction member 5 is slidably connected to the inside of the pusher 3, and the first screw 4 is rotatably connected to the inside of the pusher 3. The suction member 5 is threadedly connected to the outer wall of the first screw 4.

[0038] The conveying device includes a conveyor belt 16, and the placement plate 14 and the base plate 15 are transported in parallel and synchronously. Figure 1 A placement plate 14 and a base plate 15 are respectively provided on both sides of the device body 1 , and a conveyor belt 16 is provided at the bottom of the placement plate 14 and the base plate 15 , and the conveyor belt 16 is provided inside the device body 1 .

[0039] The clamping assembly includes a clamping member 12, and the device body 1 is provided with a guide groove 13, and the clamping member 12 slides along the guide groove 13. The clamping assembly also includes a second screw rod 9, and a plurality of sliders 10 are threadedly connected to the second screw rod 9. The sliders 10 are slidably connected to the device body 1. A slide rod 11 is fixed on the slider 10, and the clamping member 12 is slidably set on the slide rod 11. The second screw rod 9 is fixedly connected to the gear 8, and the pushing member 3 is fixedly connected to the rack 7 for engaging with the gear 8. The second screw rod 9 is provided with a plurality of threaded sections with opposite rotation directions to realize the toward or away movement of the slider 10. Specifically, the outer wall of the pushing member 3 is fixedly connected to the rack 7, and the rack 7 is slidably connected to the inside of the device body 1, see for details. Figure 3The inside of the device body 1 is rotatably connected to a gear 8, and one side of the gear 8 is fixedly connected to a second screw rod 9, which is composed of two bidirectional threaded rods. The second screw rod 9 is rotatably connected to the inside of the device body 1, and the outer wall of the second screw rod 9 is connected to multiple sliders 10 through threads. The sliders 10 are slidably connected to the inside of the device body 1. The outer wall of the slider 10 is fixedly connected to a slide rod 11, and the slide rod 11 is slidably connected to the inside of the device body 1. The outer wall of the slide rod 11 is slidably connected to multiple clips 12, and a plurality of guide grooves 13 are opened on one side of the device body 1, and the clips 12 are slidably connected to the inside of the guide grooves 13.

[0040] As an embodiment of the present invention, four clips 12 are correspondingly provided for each placement plate 14 or base plate 15, and the guide grooves 13 are arranged to diverge outward along the four corners of the placement plate 14 or base plate 15, and the clips 12 are in a right angle shape that is adapted to the corners of the prevention plate or base plate 15.

[0041] The gluing member includes a gluing robot arm 6. Specifically, the gluing robot arm 6 is fixedly installed inside the pushing member 3.

[0042] Working principle:

[0043] When the staff needs to package the semiconductor chip, they first start the packaging device, so that the motor inside the packaging device first drives the conveyor belt 16 to work, and then the conveyor belt 16 drives the placement plate 14 and the substrate 15 to move, so that the placement plate 14 and the substrate 15 move to the bottom of the pusher 3. At this time, the electric push rod 2 works to drive the pusher 3 to descend, so that the pusher 3 drives the adsorption member 5 and the glue coating robot arm 6 to descend, and then the adsorption member 5 drives the semiconductor chip to descend to the top of the substrate 15, so that the semiconductor chip is mounted on the substrate 15, and the glue coating robot arm 6 descends to reach the top of another substrate 15. The glue coating robot arm 6 works according to the program to apply packaging glue to the semiconductor chip mounting position of the substrate 15. After the glue coating robot arm 6 has applied the packaging glue, the electric push rod 2 is retracted to drive the pusher 3 to rise and reset, so that the pusher 3 drives the adsorption member 5 and the glue coating robot arm 6 to reset (the adsorption member 5 will stop adsorbing the semiconductor chip before it rises). Then the conveyor belt 16 works to remove the substrate 15 with the semiconductor chip mounted thereon (the placement plate 14 and the substrate 15 will be driven synchronously by the conveyor belt 16), and move the substrate 15 coated with packaging glue to the bottom of the adsorption member 5, and place the new substrate 15 Move to the bottom of the glue coating robot arm 6, then the motor inside the pusher 3 will drive the first screw rod 4 to work, so that the first screw rod 4 drives the adsorption part 5 to move to the top of the placement plate 14, and then the electric push rod 2 will work to drive the adsorption part 5 to descend to the top of the placement plate 14 through the pusher 3, so that the adsorption part 5 can adsorb the semiconductor chip placed inside the placement plate 14. When the adsorption part 5 completes the adsorption of the semiconductor chip, the electric push rod 2 will drive the adsorption part 5 to rise and reset through the pusher 3, and the motor inside the pusher 3 will drive the adsorption part 5 to move to the top of the substrate 15 through the first screw rod 4, and repeat this process. In the previous step, the adsorbent 5 descends to mount the semiconductor chip on the top of the substrate 15 coated with packaging glue, and the glue-applying robot arm 6 applies packaging glue to the new substrate 15. This is repeated to achieve the effect of pre-coating the substrate 15 with packaging glue in advance, thereby improving the efficiency of semiconductor chip packaging and the packaging efficiency of the packaging device (it should be noted that when the adsorbent 5 descends for the first time, it cannot adsorb and mount the semiconductor chip. Only after the adsorbent 5 completes the initial descent and rises and resets, the substrate 15 coated with packaging glue and the placement plate 14 with the semiconductor chip will move to the bottom of the adsorbent 5);

[0044] When the push rod 2 is pushed down, the push member 3 will drive the rack 7 to move down together, until the rack 7 drops to a certain distance and meshes with the gear 8 and drives the gear 8 to rotate, so that the gear 8 drives the second screw rod 9 to rotate, and then the slider 10 moves along the corresponding thread on the second screw rod 9, so that the slider 10 drives the slide bar 11 to move together, and the movement of the slide bar 11 will drive the card 12 to slide along the inside of the guide groove 13 (at this time the card 12 will also slide on the slide bar 11), so that the guide groove 13 can position and fix the placement plate 14 and the base plate 15, so as to achieve the effect of automatically positioning and fixing the placement plate 14 and the base plate 15, without the need for manual positioning and fixing by the staff, which is convenient for the staff to use. When the electric push rod 2 drives the push member 3 to rise and reset, the push member 3 will drive the rack 7 to rise together, so that the rack 7 drives the gear 8 to rotate in the opposite direction, and finally the card 12 slides back along the inside of the guide groove 13 and stops fixing the placement plate 14 and the base plate 15, so that the placement plate 14 and the base plate 15 can be driven and moved by the conveyor belt 16.

[0045] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to them. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip packaging device, characterized in that: include: Device body (1), A conveying device, the conveying device is arranged on the device body (1), and the conveying device is used to convey the substrate (15) and the placement plate (14), and the placement plate (14) is provided with a semiconductor chip; A pushing member (3), wherein the pushing member (3) is lifted and arranged on the device body (1) and is located above the conveyor belt (16); An adsorption member (5), wherein the adsorption member (5) is slidably arranged on the pushing member (3), and the adsorption member (5) is used to adsorb the semiconductor chip; A glue coating member, the glue coating member is arranged on the pushing member (3), and is used to coat glue on the substrate (15); A clamping assembly is provided on the device body (1) and is transmission-connected to the pusher (3). The clamping assembly is used for clamping the placement plate (14) and the base plate (15).

2. The semiconductor chip packaging device according to claim 1, wherein: A motor is installed on the pushing member (3), the motor is connected to a first screw rod (4), and the adsorption member (5) is threadedly connected to the first screw rod (4).

3. The semiconductor chip packaging device according to claim 1, wherein: The clamping assembly comprises a clamping member (12), the device body (1) is provided with a guide groove (13), and the clamping member (12) slides along the guide groove (13).

4. The semiconductor chip packaging device according to claim 3, wherein: The clamping assembly also includes a second screw rod (9), a plurality of sliders (10) are threadedly connected to the second screw rod (9), the sliders (10) are slidably connected to the device body (1), a slide rod (11) is fixed on the slider (10), and the clamping member (12) is slidably arranged on the slide rod (11).

5. The semiconductor chip packaging device according to claim 4, wherein: The second screw rod (9) is fixedly connected to a gear (8), and the pushing member (3) is fixedly connected to a rack (7) for meshing with the gear (8).

6. The semiconductor chip packaging device according to claim 1, wherein: The pushing member (3) is connected to an electric push rod (2) for driving the pushing member to rise and fall.

7. The semiconductor chip packaging device according to claim 4, wherein: The conveying device comprises a conveying belt (16), and the placement plate (14) and the base plate (15) are transmitted in parallel and synchronously with each other.

8. The semiconductor chip packaging device according to claim 7, wherein: The second screw rod is provided with a plurality of thread segments with opposite rotation directions to realize the toward or away movement of the slider (10).

9. The semiconductor chip packaging device according to claim 7, wherein: Four clamping members (12) are correspondingly provided on each placement plate (14) or base plate (15), and the guide grooves (13) are divergently provided along the four corners of the placement plate (14) or base plate (15), and the clamping members (12) are in a right-angled shape adapted to the corners of the prevention plate or base plate (15).

10. The semiconductor chip packaging device according to claim 1, wherein: The glue coating part includes a glue coating mechanical arm (6).

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