Liquid cooling packaging module

Abstract

The utility model relates to the technical field of semiconductor packaging, and particularly discloses a liquid cooling packaging module which comprises a substrate, a chip and a packaging shell. The chip is attached to the substrate, the packaging shell is provided with an attaching part arranged in a surrounding mode in the circumferential direction of the chip, and the attaching part is connected with the substrate in a sealed mode; a containing cavity used for containing the chip is formed between the packaging shell and the substrate, and the surface, away from the substrate, of the chip is attached to the packaging shell. The packaging shell forms a hollow area within the surrounding range of the attaching part, and a bionic heat dissipation structure is arranged in the hollow area. A liquid inlet and a liquid outlet are formed in the two opposite sides of the surface, away from the substrate, of the packaging shell. One end of the bionic micro-channel is communicated with the liquid inlet, and the other end of the bionic micro-channel is communicated with the liquid outlet. The liquid cooling channel is integrated in the packaging shell, so that the heat conduction path is shortened, and the heat dissipation efficiency is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a liquid-cooled packaging module. Background Art

[0002] As electronic devices continue to increase in integration and power density, heat dissipation becomes increasingly challenging. Traditional heat dissipation methods such as air cooling and natural convection are no longer sufficient to meet the heat dissipation requirements of high-power electronic components. Liquid cooling technology, due to its efficient heat transfer performance, has become an important means of solving the heat dissipation problem of high-power electronic devices. However, existing liquid cooling technology has certain limitations in its microstructural design, making it difficult to fully utilize the heat dissipation capacity of the fluid.

[0003] Currently, heat is typically dissipated through a cold plate-type liquid cooling module in contact with the CPU chip's package. Heat is transferred from the chip's heat-generating wafer to the chip's package, and then from the package to the liquid cooling module, where it is then carried away by the refrigerant in the liquid cooling module. This heat dissipation method has a long heat conduction path and involves multiple interfaces, resulting in high overall thermal resistance and low heat dissipation efficiency. Utility Model Content

[0004] The purpose of this application is to provide a liquid-cooling packaging module, which integrates the liquid cooling channel inside the packaging shell, shortens the heat conduction path, and effectively improves the heat dissipation efficiency.

[0005] The embodiment of the present application is implemented as follows:

[0006] An embodiment of the present application provides a liquid-cooling packaging module, including a substrate, a chip and a packaging shell; the chip is attached to the substrate, and the packaging shell has a bonding portion circumferentially arranged around the chip, and the bonding portion is sealed to the substrate; a receiving cavity for accommodating the chip is formed between the packaging shell and the substrate, and the surface of the chip facing away from the substrate is bonded to the packaging shell; a hollow area is formed in the packaging shell within the range surrounding the bonding portion, and a bionic heat dissipation structure is provided in the hollow area; a liquid inlet and a liquid outlet are provided on opposite sides of the surface of the packaging shell facing away from the substrate; the bionic heat dissipation structure has a bionic microchannel with one end connected to the liquid inlet and the other end connected to the liquid outlet.

[0007] As an optional embodiment, the bionic heat dissipation structure includes a plurality of hexagonal prisms uniformly arranged in an array in the hollow area to form a honeycomb structure, and a first gap serving as a bionic microchannel is provided between adjacent hexagonal prisms.

[0008] As an optional embodiment, the bionic heat dissipation structure includes two groups of axisymmetrically arranged partition assemblies; each partition assembly includes a plurality of partitions arranged in parallel and at intervals, and a second gap is provided between adjacent partitions.

[0009] As an optional embodiment, there is a central flow channel extending along the axis of symmetry between the two groups of partition assemblies, and a side flow channel is provided on the side of the partition assembly away from the central flow channel; the second gap forms a leaf vein branch flow channel with one end connected to the central flow channel and the other end connected to the side flow channel; the central flow channel, the side flow channel and the leaf vein branch flow channel together serve as a bionic microchannel.

[0010] As an optional embodiment, the side flow channels and the middle flow channel are parallel to each other, and a preset angle is formed between the extension direction of the vein branch flow channel and the extension direction of the middle flow channel.

[0011] As an optional embodiment, two groups of baffle assemblies are surrounded by baffles to form a plurality of evenly spaced hexagonal rings; a circulation channel is formed between adjacent hexagonal rings; a column is set in the center of the hexagonal ring, and the corresponding two sides of the hexagonal ring are hollowed out to form a main flow channel located on both sides of the column and connected in series to the circulation channel; the circulation channel and the main flow channel together serve as a bionic microchannel.

[0012] As an optional implementation, the two main channels extend along a diagonal line of the hexagonal ring.

[0013] As an optional embodiment, the bionic heat dissipation structure includes at least two sub-units arranged at intervals along the axis of symmetry, and the sub-units overlap with the projection of the chip on the substrate; the bionic microchannels of adjacent sub-units are connected in series to form a series bionic heat dissipation structure with its two ends respectively connected to the liquid inlet and the liquid outlet.

[0014] As an optional embodiment, there are at least two serially connected bionic heat dissipation structures, which are arranged at intervals along a direction perpendicular to the symmetry axis.

[0015] As an optional embodiment, the width of the bionic microchannel is 0.1-0.25 mm; the height of the bionic microchannel is 3-5 mm.

[0016] As an optional implementation, an adhesive layer is laid on the substrate, and the bonding portion is connected to the substrate via the adhesive layer.

[0017] As an optional implementation, the surface of the chip facing away from the substrate is covered with a thermally conductive interface layer; the chip is in contact with the package shell through the thermally conductive interface layer.

[0018] As an optional embodiment, the inner wall of the bionic microchannel is coated with a nanocoating.

[0019] The beneficial effects of the embodiments of the present application include:

[0020] The liquid-cooling packaging module provided in an embodiment of the present application includes a substrate, a chip, and a packaging shell. The chip in the embodiment of the present application is attached to the substrate, and the packaging shell has a bonding portion circumferentially surrounding the chip, the bonding portion being sealed to the substrate. In the embodiment of the present application, a cavity for accommodating the chip is formed between the packaging shell and the substrate, and the surface of the chip facing away from the substrate is bonded to the packaging shell. The packaging shell in the embodiment of the present application forms a hollow area within the range surrounding the bonding portion, and a bionic heat dissipation structure is provided in the hollow area. A liquid inlet and a liquid outlet are provided on opposite sides of the surface of the packaging shell facing away from the substrate. The bionic heat dissipation structure includes a bionic microchannel with one end connected to the liquid inlet and the other end connected to the liquid outlet. In the embodiment of the present application, coolant enters the bionic microchannel through the liquid inlet and is discharged from the bionic microchannel through the liquid outlet. The surface of the chip facing away from the substrate is in direct contact with the packaging shell corresponding to the hollow area, so that heat generated by the chip can be directly transferred to the packaging shell in the hollow area, and then heat is dissipated by the flow of coolant within the bionic microchannel. Compared with the prior art, the embodiments of the present application greatly shorten the heat conduction path, reduce the conduction thermal resistance, achieve efficient heat transfer, and effectively improve the heat dissipation effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is one of the structural diagrams of the liquid cooling packaging module according to an embodiment of the present application;

[0023] Figure 2 This is the second structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0024] Figure 3 This is the third structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0025] Figure 4 This is the fourth structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0026] Figure 5 This is the fifth structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0027] Figure 6 This is the sixth structural diagram of the liquid cooling packaging module according to an embodiment of the present application;

[0028] Figure 7 This is the seventh structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0029] Figure 8 This is the eighth structural diagram of the liquid cooling packaging module according to the embodiment of the present application;

[0030] Figure 9 This is the pressure contour obtained by simulating the bionic microchannel of the honeycomb structure;

[0031] Figure 10 Velocity contour obtained by simulating the bionic microchannel with honeycomb structure;

[0032] Figure 11 This is the pressure cloud obtained by simulating the bionic microchannel of the leaf vein structure;

[0033] Figure 12 Velocity cloud obtained by simulating the bionic microchannel with leaf vein structure;

[0034] Figure 13 This is the pressure cloud obtained by simulating a bionic microchannel with a spider web-like structure;

[0035] Figure 14 This is the velocity cloud obtained by simulating a bionic microchannel with a spider web-like structure;

[0036] Figure 15 The pressure cloud diagram obtained by simulating the microchannel of the prior art;

[0037] Figure 16 This is a velocity cloud diagram obtained by simulating the microchannel of the prior art.

[0038] icon:

[0039] 100-substrate; 101-chip; 102-packaging shell; 103-fitting part; 104-accommodating cavity; 105-hollow area; 106-bionic heat dissipation structure; 107-liquid inlet; 108-liquid outlet; 109-hexagonal prism; 110-partition assembly; 111-partition; 112-middle flow channel; 113-lateral flow channel; 114-vein branch flow channel; 115-hexagonal ring; 116-column; 117-main flow channel; 119-subunit; 120-serial bionic heat dissipation structure; 121-adhesive layer; 122-thermal interface layer; 123-nanocoating. DETAILED DESCRIPTION

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0042] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," "third," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0043] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] With the continuous improvement of the integration and power density of electronic devices, the heat dissipation problem is becoming increasingly serious. Traditional heat dissipation methods such as air cooling and natural convection can no longer meet the heat dissipation needs of high-power electronic components. Liquid cooling technology has become an important means to solve the heat dissipation problem of high-power electronic equipment due to its efficient heat transfer performance. However, the existing liquid cooling technology has certain limitations in microstructure design, and it is difficult to fully utilize the heat dissipation capacity of the fluid. At present, heat is usually dissipated by contacting a cold plate liquid cooling module with the packaging shell of the CPU chip. The heat is transferred from the heat-generating wafer inside the chip to the chip packaging shell, and then from the packaging shell to the liquid cooling module. The heat is then carried away by the refrigerant in the liquid cooling module. This heat dissipation method has a long heat conduction path, in which there are multiple interface conductions, which makes the overall thermal resistance relatively large, resulting in low heat dissipation efficiency.

[0045] In order to solve the above technical problems, an embodiment of the present application provides a liquid cooling packaging module.

[0046] Reference Figure 1 、 Figure 2 as well as Figure 3As shown, an embodiment of the present application provides a liquid-cooling packaging module, including a substrate 100, a chip 101 and a packaging shell 102; the chip 101 is attached to the substrate 100, and the packaging shell 102 has a bonding portion 103 circumferentially arranged around the chip 101, and the bonding portion 103 is sealed to the substrate 100; a accommodating cavity 104 for accommodating the chip 101 is formed between the packaging shell 102 and the substrate 100, and the surface of the chip 101 facing away from the substrate 100 is bonded to the packaging shell 102; the packaging shell 102 forms a hollow area 105 within the range surrounding the bonding portion 103, and a bionic heat dissipation structure 106 is provided in the hollow area 105; a liquid inlet 107 and a liquid outlet 108 are provided on opposite sides of the surface of the packaging shell 102 facing away from the substrate 100; the bionic heat dissipation structure 106 has a bionic microchannel with one end connected to the liquid inlet 107 and the other end connected to the liquid outlet 108.

[0047] The liquid-cooling packaging module provided in the embodiment of the present application includes a substrate 100, a chip 101 and a packaging shell 102; the chip 101 in the embodiment of the present application is attached to the substrate 100, and the packaging shell 102 has a bonding portion 103 circumferentially arranged around the chip 101, and the bonding portion 103 is sealed and connected to the substrate 100.

[0048] The package housing 102 of the embodiment of the present application may be made of a metal structure. For example, the package housing 102 is made of copper or aluminum alloy.

[0049] It should be noted that, first, the metal package housing 102 has excellent thermal conductivity, which can quickly conduct heat generated by the chip 101 within the package module, helping to dissipate heat and improve device stability and extend its service life. Second, the metal package housing 102 can provide resistance to external mechanical impact and abrasion, protecting the sensitive electronic components within from damage. Third, the metal package housing 102 has excellent electromagnetic shielding properties, effectively preventing external electromagnetic fields from interfering with the device's internal circuitry.

[0050] In the embodiment of the present application, a receiving cavity 104 for accommodating the chip 101 is formed between the package shell 102 and the substrate 100 , and the surface of the chip 101 facing away from the substrate 100 is in contact with the package shell 102 .

[0051] Regarding the accommodating cavity 104, it should be noted that:

[0052] First, a recessed structure may be provided on the package shell 102 . When the package shell 102 is sealed and connected to the substrate 100 , the recessed structure is buckled on the surface of the substrate 100 to form an accommodating cavity 104 for arranging the chip 101 .

[0053] Second, a recessed structure may be provided on the substrate 100 . When the package shell 102 is sealed and connected to the substrate 100 , the package shell 102 is buckled on the recessed structure of the substrate 100 to form a receiving cavity 104 for arranging the chip 101 .

[0054] Third, recessed structures may be formed on both the substrate 100 and the package shell 102 , and the two recessed structures are buckled together to form a complete receiving cavity 104 .

[0055] The packaging shell 102 of the embodiment of the present application forms a hollow area 105 within the range surrounding the bonding portion 103 , and a bionic heat dissipation structure 106 is provided in the hollow area 105 .

[0056] It should be noted that the hollow area 105 is hollowed out inside the package shell 102 and corresponds to the accommodating cavity 104 in position. A solid bionic heat dissipation structure 106 is formed in the hollow area 105 .

[0057] Regarding the preparation of the package shell 102, it should be noted that:

[0058] The packaging shell 102 and its internal structure can be integrally formed by 3D printing, or can be formed by stacking and combining multiple parts. Those skilled in the art can make the choice according to their needs.

[0059] Exemplarily, the packaging shell 102 consists of two parts. The first part structure with a hollow area 105 and a bionic heat dissipation structure 106 is obtained by etching, machining, laser cutting or 3D printing, and the second part structure is connected to the first part structure to form an integral packaging shell 102.

[0060] The packaging shell 102 of the embodiment of the present application is provided with a liquid inlet 107 and a liquid outlet 108 on opposite sides of the surface facing away from the substrate 100; the bionic heat dissipation structure 106 has a bionic microchannel with one end connected to the liquid inlet 107 and the other end connected to the liquid outlet 108.

[0061] It should be noted that the liquid inlet 107 can be connected to a coolant supply assembly via a liquid inlet pipe, which can supply coolant into the hollow area 105 of the package housing 102. Similarly, a drain pipe can be provided at the liquid discharge port to drain the coolant from the package housing 102 and return it to the coolant supply assembly.

[0062] The type of coolant provided by the coolant supply assembly is not limited in this embodiment of the application, and those skilled in the art can select it according to their needs.

[0063] Description of bionic microchannel:

[0064] Bionic microchannels are microchannel structures designed using biomimetic principles. Drawing on microscopic fractal structures found in nature, they create a highly branched, evenly distributed microchannel network. This design not only significantly increases the contact area between the fluid and the wall, but also significantly increases fluid turbulence, improving heat exchange efficiency and enhancing the uniformity of fluid flow.

[0065] The biomimetic microchannels can break up the fluid boundary layer, causing the fluid to form vortices or turbulence, accelerating the heat transfer process. This disturbance effect of the biomimetic microchannels makes it easier for heat to transfer from the fluid to the solid wall.

[0066] In the structure provided by the embodiment of the present application, the surface of chip 101 facing away from substrate 100 directly contacts package housing 102 corresponding to hollow region 105. Therefore, heat generated by chip 101 is directly transferred to package housing 102 at hollow region 105, where it is then dissipated through the flow of coolant within the biomimetic microchannels. Compared to existing technologies, the embodiment of the present application significantly shortens the heat conduction path, reduces thermal resistance, achieves efficient heat transfer, and effectively improves the heat dissipation effect on chip 101.

[0067] Reference Figure 4 As shown, as an optional embodiment, the bionic heat dissipation structure 106 includes a plurality of hexagonal prisms 109 uniformly arranged in an array in the hollow area 105 and forming a honeycomb structure, and a first gap serving as a bionic microchannel is provided between adjacent hexagonal prisms 109 .

[0068] in, Figure 9 This is the pressure contour obtained by simulating the bionic microchannel of the honeycomb structure; Figure 10 This is the velocity cloud obtained by simulating the bionic microchannel of honeycomb structure. Figure 15 、 Figure 16 The pressure cloud map and velocity cloud map obtained by conventional microchannel simulation are compared.

[0069] The embodiment of the present application can form more small flow channels in a limited space, thereby greatly increasing the contact area between the fluid and the wall surface, thereby improving the heat exchange efficiency.

[0070] Reference Figure 5 、 Figure 6 As shown, as an optional embodiment, the bionic heat dissipation structure 106 includes two groups of axisymmetrically arranged partition assemblies 110; each partition assembly 110 includes a plurality of parallel and spaced partitions 111, and a second gap is provided between adjacent partitions 111.

[0071] Reference Figure 6 、 Figure 7As shown, a middle flow channel 112 extending along the axis of symmetry is provided between the two groups of baffle assemblies 110 of the embodiment of the present application, and a side flow channel 113 is provided on the side of the baffle assembly 110 away from the middle flow channel 112; the second gap forms a leaf vein branch flow channel 114 which is connected to the middle flow channel 112 at one end and to the side flow channel 113 at the other end; the middle flow channel 112, the side flow channel 113 and the leaf vein branch flow channel 114 together serve as a bionic microchannel.

[0072] Unlike the aforementioned embodiments, this embodiment provides a leaf-vein-shaped biomimetic microchannel. The leaf-vein-shaped biomimetic microchannel has multiple levels of branching flow channels 114, allowing the fluid to be more evenly distributed throughout the microchannel, avoiding local overheating or overcooling, thereby improving overall heat exchange performance.

[0073] The embodiment of the present application imitates the fluid flow path in the leaf veins, which can reduce local pressure loss through multiple leaf vein branch flow channels 114 while maintaining sufficient flow, thereby effectively reducing flow resistance and increasing flow rate.

[0074] Furthermore, the side channels 113 and the central channel 112 are parallel to each other, and the extension direction of the vein branch channel 114 is preset at an angle to the extension direction of the central channel 112. The intersection of the vein branch channel 114 and the central channel 112 is located near the water inlet, and the opening direction of the preset angle is toward the water outlet. The range of the preset angle can be set by those skilled in the art as needed and is not particularly limited. For example, the preset angle is 30-60°.

[0075] It should be noted that the vein branch flow channel 114 can be a straight flow channel or a curved flow channel, which can be set according to needs.

[0076] The mutations and bends formed in the bionic microchannel can promote the turbulent effect inside the fluid, increase the heat exchange between the fluid and the wall, and improve the heat transfer coefficient.

[0077] in, Figure 11 This is the pressure cloud obtained by simulating the vein-shaped bionic microchannel; Figure 12 This is the velocity cloud obtained by simulating the vein-shaped bionic microchannel. Figure 15 、 Figure 16 The pressure cloud map and velocity cloud map obtained by conventional microchannel simulation are compared.

[0078] Reference Figure 5 、 Figure 6 As shown, as an optional embodiment, the bionic heat dissipation structure 106 includes two groups of axisymmetrically arranged partition assemblies 110; each partition assembly 110 includes a plurality of parallel and spaced partitions 111, and a second gap is provided between adjacent partitions 111.

[0079] Reference Figure 8 As shown, two groups of baffle assemblies 110 are surrounded by baffles 111 to form a plurality of evenly spaced hexagonal rings 115; the second gap between adjacent hexagonal rings 115 forms a circulation channel; a column 116 is set in the center of the hexagonal ring 115, and the corresponding two sides of the hexagonal ring 115 are hollowed out to form a main flow channel 117 located on both sides of the column 116 and connected in series to the circulation channel; the circulation channel and the main flow channel 117 together serve as a bionic microchannel.

[0080] The two main channels 117 extend along a diagonal line of the hexagonal ring 115 .

[0081] Different from the above-mentioned embodiment, the embodiment of the present application provides a micro-bionic channel similar to a spider web.

[0082] in, Figure 13 This is the pressure cloud obtained by simulating a spider-web-like bionic microchannel; Figure 14 This is the velocity cloud obtained by simulating a spider web-like bionic microchannel. Figure 15 、 Figure 16 The pressure cloud map and velocity cloud map obtained by conventional microchannel simulation are compared.

[0083] Reference Figure 5 As shown, as an optional embodiment, the bionic heat dissipation structure 106 includes at least two sub-units 119 arranged at intervals along the axis of symmetry, and the sub-units 119 overlap with the projection of the chip 101 on the substrate 100; the bionic microchannels of adjacent sub-units 119 are connected in series to form a series bionic heat dissipation structure 120 whose two ends are respectively connected to the liquid inlet 107 and the liquid outlet 108.

[0084] It should be noted that each subunit 119 independently forms the above-mentioned bionic microchannel, or a bionic microchannel with other structures.

[0085] Furthermore, there are at least two serially connected bionic heat dissipation structures 120 , which are arranged at intervals along a direction perpendicular to the symmetry axis.

[0086] Reference Figure 1 、 Figure 5 As shown, for example, four chips 101 are provided on a substrate 100. There are two serially connected bionic heat dissipation structures 120, each of which has two subunits 119. This means that four micro-bionic channels are formed within the package 102, and the areas covered by the four micro-bionic channels correspond to the four chips 101, respectively.

[0087] For example, the width of the bionic microchannel is 0.1-0.25 mm; the height of the bionic microchannel is 3-5 mm.

[0088] Reference Figure 1 As shown, as an optional embodiment, an adhesive layer 121 is laid on the substrate 100, and the bonding portion 103 is connected to the substrate 100 through the adhesive layer 121. In this embodiment of the application, the substrate 100 and the packaging shell 102 are connected through the adhesive layer 121, so that the substrate 100 and the packaging shell 102 are sealed.

[0089] In addition, the substrate 100 of the present embodiment has an underfill layer at a position corresponding to the chip 101, and the chip 101 is electrically connected and fixed to the substrate 100 through the underfill layer. The substrate 100 has a solder ball structure on the surface facing away from the package housing 102 for electrical connection to the motherboard.

[0090] Reference Figure 1 As shown, as an optional embodiment, the surface of the chip 101 facing away from the substrate 100 is covered with a thermal interface layer 122 ; the chip 101 is in contact with the package housing 102 through the thermal interface layer 122 .

[0091] It should be noted that there are often tiny unevenness and gaps between the chip 101 and the package 102, which can hinder the effective conduction of heat. The thermal interface layer 122 can fill these tiny gaps, ensuring close contact between the chip 101 and the package 102, thereby improving the heat conduction efficiency.

[0092] The thermal interface layer 122 reduces thermal resistance by improving the flatness of the contact surface and increasing the heat conduction path, thereby enabling heat to be transferred more smoothly and reducing heat accumulation on the surface of the chip 101 .

[0093] In addition, the thermal interface layer 122 has a high thermal conductivity, and can effectively transfer the heat generated by the chip 101 from the surface of the chip 101 to the package shell 102, and then be taken away by the cooling liquid in the bionic microchannel.

[0094] The specific material of the thermal interface layer 122 can be selected by those skilled in the art as needed. For example, the thermal interface layer 122 can be made of silicone grease, graphene, or liquid metal.

[0095] Better, refer to Figure 7 As shown, the inner wall of the bionic microchannel of the embodiment of the present application is coated with a nano coating 123.

[0096] The nanocoating 123 applied to the inner wall of the biomimetic microchannel in the present embodiment can reduce fluid flow resistance and prevent wall corrosion. It can be a superhydrophobic coating, such as a fluorinated silane-based coating, or a self-lubricating coating such as graphene or a polymer-based nanocomposite material.

[0097] By coating the inner wall of the biomimetic microchannel with a nanocoating 123, the embodiment of the present application not only effectively reduces fluid resistance and pressure drop in the liquid cooling system, lowering pump drive power and thus reducing energy consumption in the liquid cooling system, but also effectively prevents fluid corrosion on the inner wall of the microchannel, reducing the risk of fluid leakage.

[0098] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A liquid-cooled packaging module, characterized in that: The invention comprises a substrate (100), a chip (101) and a packaging shell (102); the chip (101) is attached to the substrate (100); the packaging shell (102) has a bonding portion (103) circumferentially arranged around the chip (101); the bonding portion (103) is sealed and connected to the substrate (100); a receiving cavity (104) for accommodating the chip (101) is formed between the packaging shell (102) and the substrate (100); the surface of the chip (101) facing away from the substrate (100) is in contact with the substrate (100); The packaging shell (102) is bonded; the packaging shell (102) forms a hollow area (105) within the surrounding range of the bonding portion (103), and a bionic heat dissipation structure (106) is provided in the hollow area (105); a liquid inlet (107) and a liquid outlet (108) are provided on opposite sides of a surface of the packaging shell (102) facing away from the substrate (100); and the bionic heat dissipation structure (106) has a bionic microchannel with one end connected to the liquid inlet (107) and the other end connected to the liquid outlet (108).

2. The liquid-cooled packaging module according to claim 1, characterized in that: The bionic heat dissipation structure (106) comprises a plurality of hexagonal prisms (109) uniformly arranged in an array in the hollow area (105) and forming a honeycomb structure, and a first gap serving as the bionic microchannel is provided between adjacent hexagonal prisms (109).

3. The liquid-cooled packaging module according to claim 1, characterized in that The bionic heat dissipation structure (106) comprises two groups of axially symmetrically arranged partition assemblies (110); each of the partition assemblies (110) comprises a plurality of partitions (111) arranged in parallel and spaced apart, with a second gap between adjacent partitions (111).

4. The liquid-cooling package module according to claim 3, characterized in that: A central flow channel (112) extending along a symmetry axis is provided between the two groups of the partition assembly (110), and a side flow channel (113) is provided on the side of the partition assembly (110) facing away from the central flow channel (112); the second gap forms a leaf vein branch flow channel (114) with one end connected to the central flow channel (112) and the other end connected to the side flow channel (113); the central flow channel (112), the side flow channel (113) and the leaf vein branch flow channel (114) together serve as the bionic microchannel.

5. The liquid-cooling package module according to claim 4, characterized in that: The side flow channel (113) and the middle flow channel (112) are parallel to each other, and the extension direction of the leaf vein branch flow channel (114) and the extension direction of the middle flow channel (112) are preset at an angle.

6. The liquid-cooling package module according to claim 3, characterized in that: Two groups of the baffle assemblies (110) are surrounded by the baffles (111) to form a plurality of evenly spaced hexagonal rings (115); a circulation channel is formed between adjacent hexagonal rings (115); a column (116) is provided at the center of the hexagonal ring (115), and two corresponding sides of the hexagonal ring (115) are hollowed out to form a main flow channel (117) located on both sides of the column (116) and connected in series with the circulation channel; the circulation channel and the main flow channel (117) together serve as the bionic microchannel.

7. The liquid-cooling package module according to claim 6, characterized in that: The two main flow channels (117) extend along a diagonal line of the hexagonal ring (115).

8. The liquid-cooling package module according to claim 3, characterized in that: The bionic heat dissipation structure (106) comprises at least two subunits (119) spaced apart and arranged along a symmetry axis, wherein the subunits (119) overlap with the projection of the chip (101) on the substrate (100); the bionic microchannels of adjacent subunits (119) are connected in series to form a series bionic heat dissipation structure (120) whose two ends are respectively connected to the liquid inlet (107) and the liquid outlet (108).

9. The liquid-cooling package module according to claim 8, characterized in that: There are at least two serially connected bionic heat dissipation structures (120), which are arranged at intervals in a direction perpendicular to the symmetry axis.

10. The liquid-cooled packaging module according to any one of claims 1 to 9, characterized in that: The width of the bionic microchannel is 0.1-0.25 mm; the height of the bionic microchannel is 3-5 mm.

11. The liquid-cooling package module according to any one of claims 1 to 9, characterized in that: An adhesive layer (121) is laid on the substrate (100), and the bonding portion (103) is connected to the substrate (100) via the adhesive layer (121).

12. The liquid-cooled packaging module according to any one of claims 1 to 9, characterized in that: The surface of the chip (101) facing away from the substrate (100) is covered with a heat-conducting interface layer (122); the chip (101) is in contact with the packaging shell (102) through the heat-conducting interface layer (122).

13. The liquid-cooled packaging module according to any one of claims 1 to 9, characterized in that: The inner wall of the bionic microchannel is coated with a nano coating (123).

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