Base island, sensor chip packaging frame and electronic equipment

Abstract

The utility model relates to the field of electronic packaging, and discloses a base island, a sensor chip packaging frame and electronic equipment. The base island comprises a liner and two base island grooves formed in the liner; a preset safe distance is arranged between the first base island groove and the second base island groove; the first base island groove and the second base island groove are used for placing different components, and each component is connected with the first ends of the plurality of groups of pins on the pad; and the second ends of the plurality of groups of pins are led out from the base island and are distributed on the two sides of the base island in a seagull wing shape. According to the utility model, the sensor chip is obtained by packaging in an SOP packaging mode, and the packaged sensor chip can be attached to a corresponding position of a circuit board of a device to be integrated in an SMT mode based on the packaging mode, so that manual plug-in operation does not need to be executed, and the manual production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of electronic packaging, in particular to a base island, a sensor chip packaging frame and an electronic device. Background Art

[0002] Existing optical sensors primarily use DIP (Dual Inline Package) packaging. These optical sensors require manual insertion into designated locations on a circuit board. This manual process not only reduces production efficiency and hinders the optimization of automated production processes, but also increases production costs. Utility Model Content

[0003] In view of this, in order to solve the problems existing in the prior art, the utility model provides a base island, a sensor chip packaging frame and an electronic device.

[0004] In a first aspect, the present invention provides a base island, comprising a liner and two base island grooves provided on the liner; wherein a preset safety distance is provided between the first base island groove and the second base island groove;

[0005] The first base island groove and the second base island groove are used to place different components, and each of the components is connected to the first end of the plurality of groups of pins on the pad;

[0006] The second ends of the plurality of pin groups are led out from the base island and distributed on both sides of the base island in a seagull-wing shape.

[0007] In an optional embodiment, it further includes a plastic sealing layer;

[0008] The plastic packaging layer wraps the first base island groove, the second base island groove and the multiple groups of pins to fix the first base island groove, the second base island groove and the multiple groups of pins;

[0009] And / or, the plastic sealing material used in the plastic sealing layer is epoxy plastic sealing compound.

[0010] In an optional embodiment, a glue layer is further provided in the second base island groove;

[0011] The glue layer is used to tightly protect the components in the second base island groove.

[0012] In an optional embodiment, the first base island groove is used to support a sensor wafer, and one or more of a capacitor and a resistor;

[0013] The second base island groove is used to support the light emitting device.

[0014] In an optional embodiment, the area of ​​the first base island groove is greater than the area of ​​the second base island groove.

[0015] In an optional embodiment, each of the components is adhered to a target position in the first base island groove or the second base island groove by SMT mounting or die bonding.

[0016] In a second aspect, the present invention provides a sensor chip packaging frame, comprising a packaging unit or a plurality of packaging units arranged in a matrix, each of the packaging units having the same structure, and each of the packaging units is packaged in an SOP packaging manner;

[0017] The packaging unit includes the aforementioned base island.

[0018] In an optional embodiment, the packaging unit further includes a cover; the cover is used to cover the first base island groove.

[0019] In an optional embodiment, the cover body is provided with an opening, and the opening is used to expose the target component in the first base island groove.

[0020] In a third aspect, the present invention provides an electronic device comprising the sensor chip packaging frame as described above.

[0021] The embodiments of the present invention have the following beneficial effects:

[0022] The utility model provides a base island, including a pad and two base island grooves arranged on the pad; wherein the first base island groove and the second base island groove are separated by a preset safety distance; the first base island groove and the second base island groove are used to place different components, each component is connected to the first end of multiple groups of pins on the pad; the second ends of the multiple groups of pins are drawn out from the base island and distributed on both sides of the base island in a seagull wing shape. The utility model adopts the SOP surface mount packaging method to package the sensor chip. Based on this packaging method, the packaged sensor chip can be directly attached to the corresponding position of the circuit board of the device to be integrated through the SMT patch method, thereby eliminating the need for manual plug-in operations and reducing manual production costs. In addition, this embodiment can also optimize the wafer packaging layout by setting the placement positions of different types of components in each base island groove while integrating multiple components, thereby achieving a more compact package and saving packaging space. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram showing the external structure of a sensor chip packaging frame in the prior art from a first perspective is shown;

[0025] Figure 2 A second perspective schematic diagram of the external structure of a sensor chip packaging frame in the prior art is shown;

[0026] Figure 3 A schematic diagram of the structure of a sensor chip packaging frame in the prior art is shown;

[0027] Figure 4 A schematic diagram of a first structure of a sensor chip packaging frame in an embodiment of the present application is shown;

[0028] Figure 5 A schematic diagram of the first structure of the base island in an embodiment of the present application is shown;

[0029] Figure 6 A schematic structural diagram of the first base island groove in an embodiment of the present application is shown;

[0030] Figure 7 A schematic structural diagram of the second base island groove in an embodiment of the present application is shown;

[0031] Figure 8 A second structural diagram of the base island in an embodiment of the present application is shown;

[0032] Figure 9 A schematic structural diagram of a packaging unit provided with a cover body in an embodiment of the present application is shown;

[0033] Figure 10 A schematic diagram of the appearance structure of a single cover body in an embodiment of the present application is shown;

[0034] Figure 11 A second structural diagram of the sensor chip packaging frame in an embodiment of the present application is shown;

[0035] Figure 12 The figure shows a schematic diagram of the appearance structure of a product obtained after packaging of any packaging unit of the sensor chip packaging frame in the embodiment of the present application.

[0036] Explanation of the main component symbols: 100 - packaging unit; 110 - base island; 111 - first base island groove; 1111 - sensor wafer; 112 - second base island groove; 1121 - light-emitting device; 113 - pad; 1131 - pin; 114 - cover; 1141 - opening. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0040] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the utility model product is usually placed when in use, or are the orientation or position relationship commonly understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] Furthermore, the terms “first,” “second,” “third,” etc., are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0042] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0043] The SOP (Small Outline Package) is a common integrated circuit package. Its small size and relatively low cost make it widely used in consumer electronics and industrial applications. This package can accommodate multiple transistors and other components to form a complete integrated circuit chip.

[0044] SMT (Surface Mount Technology) is an advanced electronic component assembly method primarily used to directly assemble electronic components such as resistors, capacitors, transistors, and IC chips onto PCBs (Printed Circuit Boards). Compared to traditional plug-in technology, SMT offers higher production efficiency and reliability, smaller package sizes, and lower costs.

[0045] Epoxy Molding Compound (EMC) is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, fillers such as silica powder, and a variety of additives.

[0046] like Figure 1 and Figure 2 As shown, currently, the conventional optical sensor packaging is a DIP dual in-line package, and the packaging frame used in this type of packaging is as follows Figure 3 As shown, this packaging form obtains the sensor chip, which needs to be manually inserted into the corresponding position of the circuit board of the device to be integrated, which is not conducive to the subsequent automated production of the printed circuit board (PCBA) of the device to be integrated and reduces production efficiency.

[0047] Based on this, this embodiment provides a sensor chip packaging frame. When used in small-form-factor packaging scenarios, this packaging frame can be packaged using the SOP packaging method to obtain a sensor chip. The packaged sensor chip can then be attached to the corresponding position of the circuit board of the device to be integrated using the SMT patch method. This eliminates the need for manual insertion, facilitates the subsequent automated production of PCBAs, and reduces labor production costs. Furthermore, this sensor chip packaging frame can be applied to various electronic packaging scenarios for components, such as optical sensors. Optionally, the device to be integrated includes, but is not limited to, a mouse or other device or component.

[0048] like Figure 4 As shown, the sensor chip packaging frame in this embodiment includes a packaging unit 100 or a plurality of packaging units 100 arranged in a matrix, wherein each packaging unit 100 has the same structure and size, and the packaging unit 100 includes a base island 110 .

[0049] It can be understood that this embodiment realizes highly integrated SOP packaging through the sensor chip packaging frame, and each packaging unit 100 can be integrated into an independent chip or other electronic device, and can be applied in various integrated circuits.

[0050] Among them, the number of packaging units 100 in the sensor chip packaging frame can be adaptively set according to actual needs, and the size of the sensor chip packaging frame and the arrangement of each packaging unit 100 are adaptively set according to the number of packaging units 100, and this embodiment is not limited; for example, the sensor chip packaging frame can be set to include 1, 2, 6, 8, 30 or 60 packaging units 100, and then the packaging units 100 in the sensor chip packaging frame can be divided into one row, two rows, three rows or five rows, etc., and aligned and placed in a matrix shape as a whole; for example, if the packaging frame is set to include 30 packaging units 100, the size of the entire packaging frame can be set to 185mm x 40mm.

[0051] Based on the structure of the sensor chip packaging frame, this embodiment can integrate components such as, but not limited to, sensor wafer 1111, LED lights, capacitors, or resistors, according to actual needs. Subsequently, a cutting machine can be used to cut the sensor chip packaging frame product into individual units (ICs), forming a highly integrated electronic device (i.e., sensor chip) that can be used in different application scenarios. Optionally, the sensor wafer 1111 can be a different type of sensor wafer, such as an optical sensor wafer. Furthermore, this embodiment can package different types of sensor chips, such as optical sensor chips, based on the sensor chip packaging frame.

[0052] Furthermore, if Figure 5 As shown, the embodiment of the present application further provides a base island 110, which includes two base island grooves (i.e., a first base island groove 111 and a second base island groove 112) and a pad 113; the pad 113 can be a circuit board, etc.

[0053] In this embodiment, the base island 110 is used to provide a stable platform to reduce the vibration and stress effects of chips or circuit elements during the packaging process. By setting the first base island groove 111 and the second base island groove 112, the stress dispersion of the base island 110 can be further optimized and the stability of the entire packaging process can be improved.

[0054] In one example, a multi-circle groove structure is formed on the front surface of the base island 110 through a series of closed loops, thereby obtaining a base island groove. The shapes and sizes of the first base island groove 111 and the second base island groove 112 can be adaptively set according to actual needs, and are not limited in this embodiment. This ensures that the contact area with the chip is maximized while providing an adequate heat dissipation path. In some examples, the area of ​​the first base island groove 111 can be set to be larger than the area of ​​the second base island groove 112.

[0055] The types of components carried in the first base island groove 111 and the second base island groove 112 can also be set accordingly according to requirements, and this embodiment does not limit this.

[0056] In addition, the arrangement of the two base island grooves can also be adaptively set according to actual needs. For example, the two base island grooves can be set in the same layer or in different layers, so as to increase additional stability and heat dissipation effects. Specifically, it can be adaptively set according to actual needs, and this embodiment is not limited to this. For example, the second base island groove 112 can be set in the same layer as the first base island groove 111.

[0057] In order to avoid stress concentration generated during the packaging process, especially in the case of mismatched thermal expansion coefficients, and to prevent the connection part between the two base island grooves from cracking or deforming due to uneven force, this embodiment sets a preset safety distance to separate the first base island groove 111 and the second base island groove 112, that is, the first base island groove 111 and the second base island groove 112 are separated by a preset safety distance to ensure electrical isolation between the two base island grooves.

[0058] The specific value of the preset safety distance is determined according to the size of the wafer to be packaged, the characteristics of the packaging material, and the requirements of the packaging process, and is usually between a few microns and tens of microns. The specific determination process is not limited in this embodiment.

[0059] Furthermore, the first base island groove 111 and the second base island groove 112 are arranged on the pad 113, and each base island groove is used to place different components; in addition, in the process of placing the components to be packaged through two base island grooves in this embodiment, a rational packaging layout of different types of components can be achieved, that is, different types of components can be placed in different base island grooves, and the placement position and placement form of each component in the base island groove can also be adaptively set according to actual conditions, avoiding mixed interference between different types of components, and the chip structure to be packaged can be arranged more compactly to save space.

[0060] For example, see also Figure 6 and Figure 8 As shown, a first base island groove 111 may be provided for carrying a sensor wafer 1111 and components 1112 such as capacitors and / or resistors; see also Figure 7 and Figure 8 As shown, the second base island groove 112 is used to carry a light-emitting device 1121, such as an LED lamp.

[0061] Among them, each component can be adhered to the target position in the first base island groove 111 or the second base island groove 112 by SMT patch method or solid crystal method. The specific setting position relationship of each component in the corresponding base island groove can be adaptively set according to actual needs, and this embodiment does not limit this.

[0062] It can be understood that in this embodiment, the base island 110 is used to specifically place the electronic devices to be packaged (i.e., the aforementioned components), and the SOP packaging method is used to package the multiple sensor chip packaging frames corresponding to each base island 110 to obtain the sensor chip; subsequently, the sensor chip can be directly attached to the corresponding position of the circuit board of the device to be integrated in the form of an SMT patch, thereby obtaining the integrated device, thereby eliminating the need for manual plug-in operations during the device integration process, facilitating the subsequent automated production of the PCBA of the integrated device and reducing labor production costs. In addition, in the process of integrating multiple components through the base island groove in this embodiment, the wafer packaging layout can be optimized within the base island groove, facilitating the subsequent realization of a more compact package.

[0063] In one example, this embodiment can also mount the components to be packaged in the base island groove on the front side of the base island 110 by means of a mounting adhesive, wherein the mounting adhesive is embedded in the groove to improve the adhesion between the components and the base island groove, thereby facilitating the subsequent packaging of the chip.

[0064] In another example, in certain specific scenarios, a layer of transparent glue can be added to the base island groove where the target component is placed to form an additional protective layer for the target component to prevent the target component from being damaged during packaging, production and use.

[0065] Optionally, the target component may be a light-emitting device such as an LED lamp or other types of devices, wherein the type of the target component and the material of the transparent glue layer may be set accordingly according to actual needs, and this embodiment does not limit this.

[0066] For example, if target components such as LED lights are placed in the second base island groove 112 , a glue layer is further provided in the second base island groove 112 ; the glue layer tightly protects the components in the second base island groove 112 .

[0067] It can be understood that by applying transparent glue in the second base island groove 112 where components such as LED lamps are located, a physical protection layer for components such as LED lamps is formed, which can effectively prevent LED lamps and other components from being damaged due to direct exposure during production and use, thereby enhancing the durability and reliability of the product.

[0068] In addition, in this embodiment, the process of applying glue in the corresponding base island groove to form a glue layer can be achieved by using a dispensing machine, etc., thereby ensuring that the glue layer is evenly covered on the target components such as LED lights to effectively protect the target components.

[0069] Furthermore, if Figure 8 As shown, the pad 113 is further provided with a plurality of pins 1131 , and each component placed in the first base island groove 111 and the second base island groove 112 is connected to a first end of the plurality of pins 1131 on the pad 113 .

[0070] It can be understood that the sensor wafer 1111, capacitors and / or resistors, LED lights and other devices placed in the first base island groove 111 and the second base island groove 112 are directly adhered to the pad 113, and can be connected to the first end of the multiple groups of pins 1131 on the pad 113 through welding wires; that is, one end of each welding wire is connected to the corresponding component, and the other end of each welding wire is connected to the corresponding pin 1131 on the pad.

[0071] Furthermore, the second ends of each group of pins 1131 are led out from both sides of the base island 110 and are in a seagull-wing shape (e.g. Figure 9The L-shaped pins (shown in FIG. 1 ) are evenly distributed on both sides of the base island 110. Specifically, the multiple groups of pins 1131 extend outward from the base island 110 in a seagull-wing shape. Inside the base island 110, the multiple groups of pins 1131 connect to various components disposed on the pads 113 through the pads 113. Furthermore, the multiple groups of pins 1131 extend outward in a seagull-wing shape, making it easier to connect to a circuit board.

[0072] The present embodiment does not limit the number of the plurality of pin groups 1131 on the pad, and the number can be adaptively set according to actual needs, so that the sensor chip packaging frame forms a SOP packaging structure with a plurality of pins.

[0073] For example, the number of pins can be set to 8, 12, 14 or 16, etc., thereby forming an SOP package structure with 8 pins (SOP8) or an SOP package structure with 12 pins (SOP12) or an SOP package structure with 14 pins (SOP14), etc.

[0074] In one embodiment, the base island 110 further includes a plastic encapsulation layer, wherein the plastic encapsulation layer wraps the first base island groove 111, the second base island groove 112 and the multiple groups of pins 1131 on the pad 113 to fix the first base island groove 111, the second base island groove 112 and the multiple groups of pins 1131 on the pad 113.

[0075] Optionally, the plastic sealing material used in the plastic sealing layer can be any one of materials such as epoxy plastic sealing compound, etc., and can be adaptively set according to actual needs, and this embodiment does not limit this.

[0076] That is, this embodiment can use a plastic encapsulation technique to secure the two island recesses and the groups of pins 1131 on the pad 113. For example, melted epoxy resin is used as the plastic encapsulation material in the island 110 to form a specific shape on the pad 113 to secure the groups of pins 1131 and the two island recesses. Furthermore, this embodiment can heat the plastic encapsulation material, such as melted epoxy resin, to secure the encapsulated components and the island 110, ensuring the stability and protection of the entire packaging framework.

[0077] Furthermore, if Figure 9 and Figure 10 As shown, the packaging unit 100 further includes a cover 114, which is used to cover the first base island groove 111, that is, the cover 114 and the substrate are combined to form a closed area, wherein the first base island groove 111 is located in the closed area.

[0078] In another example, the cover 114 is provided with an opening 1141 for exposing the target component within the first base island recess 111. It should be noted that if the sensor wafer 1111 placed within the first base island recess 111 is an optical sensor wafer, the position of the opening 1141 can be aligned with the light-sensing position of the optical sensor wafer, facilitating the optical sensor wafer's ability to sense external image changes during subsequent use.

[0079] Furthermore, the positions of the cover 114 and the opening 1141 can be adaptively set according to actual needs, and this embodiment is not limited to this. If the sensor wafer 1111 is placed in the second base island recess 112, the cover 114 is used to cover the second base island recess 112, and the opening 1141 is positioned to align with the light-sensing position of the sensor wafer 1111 in the second base island recess 112. Alternatively, the cover 114 can cover both the first base island recess 111 and the second base island recess 112, and the presence and position of the opening 1141 can be adaptively set according to actual needs.

[0080] It can be understood that the cover 114 is fixed at a target position of the base island 110 to protect components such as the sensor wafer 1111 and capacitors and resistors placed in the corresponding base island groove.

[0081] Furthermore, if Figure 11 As shown, this embodiment expands a single packaging unit 100 into a sensor chip packaging frame for large-scale applications. The packaging frame is composed of multiple packaging units 100 with the same structure. These units can integrate various electronic components and are designed to protect and access the electronic components through a cover 114 and an opening 1141.

[0082] In addition, if Figure 12 As shown, each packaging unit 100 in the sensor chip packaging frame can be cut to obtain a single product after packaging is completed, and thus, in this embodiment, the sensor chip packaging frame can be used to obtain a plurality of highly integrated small electronic devices.

[0083] In this embodiment, the efficient packaging technology corresponding to the sensor chip packaging frame can be applied to practical electronic devices, such as smart sensors and miniaturized electronic instruments. The sensor chip packaging frame can be used to integrate components with multiple functions, thereby achieving higher performance and smaller size. Through automated placement, special layout, and packaging techniques, the packaging frame of this embodiment not only improves production efficiency and reduces costs, but also optimizes the performance and appearance of electronic devices. It is suitable for a wide range of electronic applications and has good practicality.

[0084] An embodiment of the present utility model further provides an electronic device, which includes the sensor chip packaging frame in the above embodiment.

[0085] It can be understood that the options of the sensor chip packaging frame in the above embodiment are also applicable to this embodiment, so they will not be described again here.

[0086] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

[0087] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A base island, characterized in that: It comprises a liner and two base island grooves provided on the liner; wherein the first base island groove and the second base island groove are spaced apart by a preset safety distance; The first base island groove and the second base island groove are used to place different components, and each of the components is connected to the first end of the plurality of groups of pins on the pad; The second ends of the plurality of pin groups are led out from the base island and distributed on both sides of the base island in a seagull-wing shape.

2. The base island according to claim 1, characterized in that Also includes a plastic layer; The plastic packaging layer wraps the first base island groove, the second base island groove and the multiple groups of pins to fix the first base island groove, the second base island groove and the multiple groups of pins; And / or, the plastic sealing material used in the plastic sealing layer is epoxy plastic sealing compound.

3. The base island according to claim 1, wherein: A glue layer is also provided in the groove of the second base island; The glue layer is used to tightly protect the components in the second base island groove.

4. The base island according to claim 1, wherein: The first base island groove is used to carry a sensor wafer and one or more of a capacitor and a resistor; The second base island groove is used to support the light emitting device.

5. The base island according to claim 1 or 4, characterized in that: An area of ​​the first base island groove is greater than an area of ​​the second base island groove.

6. The base island according to claim 1, characterized in that Each of the components is adhered to a target position in the first base island groove or the second base island groove by SMT patch method or die bonding method.

7. A sensor chip packaging frame, characterized in that: It includes one packaging unit or a plurality of packaging units arranged in a matrix shape, each of the packaging units has the same structure, and each of the packaging units is packaged in an SOP packaging manner; The encapsulation unit includes the base island according to any one of claims 1 to 6.

8. The sensor chip packaging frame according to claim 7, characterized in that: The packaging unit further includes a cover body; the cover body is used to cover the first base island groove.

9. The sensor chip packaging frame according to claim 8, characterized in that: The cover body is provided with an opening, and the opening is used to expose the target component in the first base island groove.

10. An electronic device, characterized in that: The sensor chip packaging frame comprises the sensor chip packaging frame according to any one of claims 7 to 9.

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