MCU boost line seat blanking cap
By designing the MCU booster line seat plug cover, the inclined surface and guide groove structures are used to achieve rapid and unified port closure, solving the problems of time-consuming and labor-intensive and inconsistent pressure detection, and improving detection efficiency and accuracy.
Patent Information
- Application Number
- CN202422669625.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-11-04
AI Technical Summary
The sealing detection method of traditional MCU modules is time-consuming and labor-intensive. There are errors in manual glue making, which cannot ensure that the pressure under each port is consistent, which may lead to inaccurate detection or damage to the housing.
A MCU booster line seat plug cover is designed, including an inner cylindrical cage, a drive sleeve and a middle-layer positioner, which achieves rapid and unified port closure through beveled and guide groove structures, and provides consistent sealing pressure with springs.
Fast and standardized port closure is achieved, ensuring that the pressure on each port is consistent, improving detection efficiency and accuracy, and reducing the impact of operation-dependent manual proficiency.
Smart Images

Figure CN223260952U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of automobile production, in particular to an MCU boost line socket plugging cover. Background Art
[0002] The MCU module, also known as a microcontroller, consists of a central processing unit (CPU), RAM, ROM, peripheral devices, and circuits. MCU modules are widely used in vehicles. Before leaving the factory, MCU modules need to be tested for leaks. The traditional testing method is to apply glue to each port on the MCU module housing and then conduct an airtightness test. After applying the glue, you need to wait for the glue to solidify, which takes a certain amount of time. After discovering a leak during pressurization, you need to first test each seal for leaks, which is time-consuming and labor-intensive. Furthermore, manual gluing methods are subject to errors, and there is no guarantee that the pressure that each port can withstand is consistent, nor can it guarantee that the pressure that each port can withstand meets the test pressure value. Therefore, when testing the MCU module, a port may leak before reaching the test pressure, or it may exceed the test pressure but all ports remain closed, causing the MCU housing to be damaged due to excessive pressure.
[0003] Therefore, a method or device that can solve the above problems is needed. Summary of the Invention
[0004] The utility model aims to solve the above-mentioned deficiencies in the prior art and proposes an MCU boost line socket plugging cover which has a simple structure, ingenious design, reasonable layout, convenient and quick operation and can ensure uniform sealing pressure.
[0005] The technical solution of the present utility model is: a MCU boost line seat plug cover, characterized in that: the plug cover includes an inner cylindrical retainer 1, the cylindrical retainer 1 is movably sleeved with a drive sleeve 2, two middle-layer positioning members 3 are arranged between the cylindrical retainer 1 and the drive sleeve 2, the cross-section of the middle-layer positioning member 3 is semicircular, and an arc-shaped protrusion 4 is arranged at the bottom of the inner side of the middle-layer positioning member 3, and the arc-shaped protrusion 4 is movably connected to the annular groove opened on the side wall of the cylindrical retainer 1, a pair of first drive shafts 5 and a pair of second drive shafts 6 are arranged on the inner wall of the drive sleeve 3, a first guide groove 7 and a second guide groove 8 are opened on the side wall of the middle-layer positioning member 3, the first drive shaft 5 is located in the first guide groove 7, and the second drive shaft 6 is located in the second guide groove 8,
[0006] The bottom opening of the driving sleeve 2 is provided with a first annular inclined surface 9, and the outer wall of the middle positioning member 3 is provided with a second annular inclined surface 10 that matches the first annular inclined surface 9. The bottom end of the outer wall of the middle positioning member 3 is also provided with a limiting step 11 that matches the bottom end surface of the driving sleeve 2.
[0007] The top opening of the cylindrical retainer 1 is threadedly connected to a rotating body 12, and a bolt 13 is provided at the axis of the rotating body 12. The light rod part at the bottom of the bolt 13 is movably connected to the center hole of the sealing plug 14. A spring 15 located outside the bolt 13 is also provided in the inner cavity of the rotating body 12, and the bottom end of the spring 15 is in contact with the top surface of the sealing plug 14. The sealing plug 14 is movably connected in the cylindrical retainer 1.
[0008] When the two middle-layer positioning members 3 are joined together, the two first guide grooves 7 and the two second guide grooves 8 thereon will be joined together to form a long groove with arc-shaped ends.
[0009] Compared with the prior art, the utility model has the following advantages:
[0010] This type of MCU boost line socket plug has a simple structure, ingenious design, and reasonable layout. It addresses the problems of the traditional method of sealing the ports on the MCU housing by applying glue. A special structure has been designed, which can be quickly plugged into the ports opened on the MCU housing and effectively seal them. It is completely unaffected by the operator's proficiency and level of skill, and can achieve standardized and unified sealing. In other words, it can achieve a unified sealing effect while achieving efficient and rapid sealing. Furthermore, its manufacturing process is simple and its manufacturing cost is low. Therefore, it can be said that it has multiple advantages and is particularly suitable for promotion and application in this field, and its market prospects are very broad. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a three-dimensional structural diagram of an embodiment of the present utility model.
[0012] Figure 2 It is a cross-sectional view of an embodiment of the present utility model.
[0013] Figure 3 This is a cross-sectional view of an embodiment of the present invention (with Figure 2 forming a 90° angle).
[0014] Figure 4 yes Figure 3 Enlarged view of part A in .
[0015] Figure 5 It is a schematic diagram (sectional view) of the working state of an embodiment of the present utility model.
[0016] Figure 6 Schematic diagram (perspective) of the working state of an embodiment of the present invention. DETAILED DESCRIPTION
[0017] The specific implementation of the present invention will be described below with reference to the accompanying drawings. Figures 1 to 6 As shown: An MCU boost line seat plug cover, which includes an inner cylindrical retainer 1, a drive sleeve 2 is movably sleeved on the outer side of the cylindrical retainer 1, and two middle-layer positioning members 3 are arranged between the cylindrical retainer 1 and the drive sleeve 2. The cross-section of the middle-layer positioning member 3 is semicircular, and an arc-shaped protrusion 4 is arranged at the bottom of the inner side of the middle-layer positioning member 3. The arc-shaped protrusion 4 is movably connected to the annular groove opened on the side wall of the cylindrical retainer 1, and a pair of first drive shafts 5 and a pair of second drive shafts 6 are arranged on the inner wall of the drive sleeve 3. A first guide groove 7 and a second guide groove 8 are opened on the side wall of the middle-layer positioning member 3. The first drive shaft 5 is located in the first guide groove 7, and the second drive shaft 6 is located in the second guide groove 8.
[0018] The bottom opening of the driving sleeve 2 is provided with a first annular inclined surface 9, and the outer wall of the middle positioning member 3 is provided with a second annular inclined surface 10 that matches the first annular inclined surface 9. The bottom end of the outer wall of the middle positioning member 3 is also provided with a limiting step 11 that matches the bottom end surface of the driving sleeve 2.
[0019] The top opening of the cylindrical retainer 1 is threadedly connected to a rotating body 12, and a bolt 13 is provided at the axis of the rotating body 12. The light rod part at the bottom of the bolt 13 is movably connected to the center hole of the sealing plug 14. A spring 15 located outside the bolt 13 is also provided in the inner cavity of the rotating body 12, and the bottom end of the spring 15 is in contact with the top surface of the sealing plug 14. The sealing plug 14 is movably connected in the cylindrical retainer 1.
[0020] When the two middle-layer positioning members 3 are joined together, the two first guide grooves 7 and the two second guide grooves 8 thereon will be joined together to form a long groove with arc-shaped ends.
[0021] The working process of the MCU boost line seat plug cover of the embodiment of the utility model is as follows: the plug cover is sleeved on the port that needs to be sealed on the MCU housing 16, specifically, the bottom opening of the cylindrical holder 1 is sleeved on the port on the MCU housing 16. After being inserted into place, the drive sleeve 2 is held and moved downward. During the movement of the drive sleeve 2, the first annular inclined surface 9 provided at the bottom opening thereof will contact the second annular inclined surface 10 provided on the middle-layer positioning member 3. Under the action of the inclined surfaces, the two middle-layer positioning members 3 simultaneously and synchronously move radially toward the central axis of the cylindrical holder 1, and the annular protrusion 4 passes through the annular groove on the cylindrical holder 1 and is stuck on the outer wall of the port that needs to be sealed on the MCU housing 16 (generally speaking, a positioning groove is provided there, and the annular protrusion 4 is stuck in the groove).
[0022] At this time, the first annular bevel 9 and the second annular bevel 10 are out of contact, and the inner wall of the driving sleeve 2 is in contact with the outer wall of the straight portion of the middle-layer positioning piece 3. Therefore, the inner wall of the driving sleeve 3 can maintain pressure on the middle-layer positioning piece 3, ensuring the connection between the plug cover and the port pipeline;
[0023] Then manually drive the rotating body 12 to rotate. During the rotation, the rotating body 12 moves downward, driving the bolt 13 and the sealing plug 14 to move downward together. The sealing plug 14 closes the top opening of the port pipeline. The pressure of the sealing plug 14 to close the port pipeline comes from the spring 15. In different plugging covers, as long as the specifications of the selected spring 15 are the same, then when the rotating body 12 is rotated into place, the sealing pressure of the sealing plug 14 on the port can be consistent;
[0024] After the air tightness test is completed, when the device needs to be disassembled, first rotate the rotating body 12 in the opposite direction to allow the sealing plug 14 to move upward and leave the blocked port, and then push the drive sleeve 2 upward. When the drive sleeve 2 moves upward, a pair of first drive shafts 5 and a pair of second drive shafts 6 arranged on its inner wall move upward together, and the first drive shaft 5 moves relative to the first guide groove 7, and the second drive shaft 6 moves relative to the second guide groove 8. Under the action of the guide groove, the above movement will expand the gap between the two middle-layer positioning parts 3, allowing them to change from mutual contact (spliced state) to two independent parts, so that the arc-shaped protrusion 4 can be pulled out of the slot opened on the outer wall of the port on the MCU shell 16, and then the device can be pulled out from the port pipeline.
Claims
1. A MCU boost line socket plug cover, characterized by: The blocking cover comprises an inner cylindrical retainer (1), the outer surface of the cylindrical retainer (1) is movably connected to a drive sleeve (2), two middle-layer positioning members (3) are provided between the cylindrical retainer (1) and the drive sleeve (2), the cross section of the middle-layer positioning member (3) is semicircular, an arc-shaped protrusion (4) is provided at the bottom of the inner side of the middle-layer positioning member (3), the arc-shaped protrusion (4) is movably connected in an annular groove opened on the side wall of the cylindrical retainer (1), a pair of first drive shafts (5) and a pair of second drive shafts (6) are provided on the inner wall of the drive sleeve (2), a first guide groove (7) and a second guide groove (8) are provided on the side wall of the middle-layer positioning member (3), the first drive shaft (5) is located in the first guide groove (7), and the second drive shaft (6) is located in the second guide groove (8). A first annular bevel (9) is provided at the bottom opening of the driving sleeve (2), a second annular bevel (10) matching the first annular bevel (9) is provided on the outer wall of the middle positioning member (3), and a limiting step (11) matching the bottom end surface of the driving sleeve (2) is also provided at the bottom end of the outer wall of the middle positioning member (3). The top opening of the cylindrical retainer (1) is threadedly connected to a rotating body (12), a bolt (13) is provided at the axis of the rotating body (12), the light rod portion at the bottom of the bolt (13) is movably connected to the center hole of the sealing plug (14), and a spring (15) is further provided in the inner cavity of the rotating body (12) and is located outside the bolt (13), the bottom end of the spring (15) is in contact with the top end surface of the sealing plug (14), and the sealing plug (14) is movably connected in the cylindrical retainer (1).
2. The MCU boost line socket plug cover according to claim 1, characterized in that: When the two middle-layer positioning members (3) are assembled, the two first guide grooves (7) and the two second guide grooves (8) thereon are respectively assembled into long grooves with arc-shaped ends.