Anti-bending circuit board
By setting connection blocks, protection blocks and reinforcement layers on the substrate, the problem of easy bending of the graphics card substrate during long-term use is solved, stable support and protection of the substrate is achieved, and resource utilization is improved.
Patent Information
- Application Number
- CN202422488358.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-15
AI Technical Summary
During long-term use of the graphics card substrate, the side away from the connecting block is prone to bending, and the lack of effective support leads to structural instability.
The connecting block and the protection block are arranged on the substrate. The connecting block can be detached. The substrate is provided with a protrusion on the side wall away from the connecting block. A square groove is provided on the protection block. When the protrusion is embedded in the square groove, the protective block is perpendicular to the substrate. The bottom surface of the substrate is provided with a reinforcement layer, including a honeycomb layer and an insulating layer. The card block is embedded in the honeycomb layer to provide additional support.
Effectively prevent damage to the substrate during transportation, provide multi-point support during installation, improve the bending performance of the substrate, and continue to support the substrate after the protection block is completed, thereby improving resource utilization.
Smart Images

Figure CN223261700U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit boards, and more particularly to a bending-resistant circuit board. Background Art
[0002] Circuit boards are important components in electronic devices that support and connect various electronic components. These components are electrically connected through wires on the circuit boards to achieve the intended functions of the device.
[0003] For example, the motherboard, memory, and graphics card components used in a desktop computer are made of circuit boards. The graphics card is composed of a processing chip, capacitors, memory, and other electrical components welded on a substrate. The processing chip generates a large amount of heat when in use. Therefore, in the prior art, a heat dissipation component is installed on the substrate to transfer the heat from the processing chip.
[0004] Usually, the base plate of a graphics card is connected to the motherboard through a connecting block, commonly known as a gold finger. The circuit board of a graphics card is generally rectangular, and the heat dissipation components will increase the load on the base plate. During long-term use, the side of the base plate away from the connecting block is prone to bending due to lack of support.
[0005] Therefore, new solutions need to be proposed to solve this problem. Utility Model Content
[0006] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a bending-resistant circuit board.
[0007] The above technical purpose of the present utility model is achieved through the following technical solutions: a bending-resistant circuit board, including a substrate, a connecting block is provided on the side wall of the substrate, a protective block for wrapping the connecting block is detachably connected to the connecting block, two protrusions are formed on the side wall of the substrate away from the connecting block, the two protrusions are respectively arranged near the two ends of the substrate, and a square groove for the protrusion to be embedded is opened on the protective block. When the protrusion is embedded in the square groove, the protective block and the substrate are perpendicular to each other.
[0008] The utility model is further configured as follows: the length of the protrusion is greater than the thickness of the protection block, and a clamping block for preventing the protection block from falling off the substrate is formed on the side of the protrusion away from the substrate.
[0009] The present invention is further configured as follows: a reinforcement layer is provided on the bottom surface of the substrate, and the reinforcement layer includes a honeycomb layer and an insulating layer coated on both sides of the honeycomb layer.
[0010] The utility model is further configured as follows: the clamping block is made of elastic metal sheet, the number of the clamping block is one, and the clamping block is arranged on a side close to the reinforcement layer.
[0011] The utility model is further configured as follows: both ends of the clamping block are embedded in the honeycomb layer, and the cross section of the clamping block exposed outside the protrusion is hemispherical.
[0012] The utility model is further configured as follows: the base plate is made of epoxy resin, and the protection block is made of PVC.
[0013] In summary, the utility model has the following beneficial effects: during the transportation of the substrate, the protective block wrapped on the connecting block can better prevent external objects from colliding with the connecting block, thereby better protecting the connecting block. When the substrate is installed on the mainboard, the protective block needs to be removed from the connecting block and the connecting block is inserted into the interface on the mainboard. Then the square groove on the protective block can be aligned with the protrusion on the substrate and inserted. At this time, the protective block and the substrate are perpendicular to each other. The connection between the substrate and the mainboard is supported by the connecting block for the substrate to share the load of the heat dissipation component, while the side of the substrate away from the mainboard is supported by the protective block for the substrate to share the load of the heat dissipation component. The above arrangement enables the substrate to be better supported in its length direction, so that the substrate is not easily bent due to the load of the heat dissipation component. In addition, the above arrangement also enables the protective block to continue to support the substrate after completing its protective function on the connecting block, so that one component can achieve multiple uses and effectively improve resource utilization. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;
[0015] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 , used to show when the protrusion is embedded in the square groove;
[0016] Figure 3 for Figure 2 A magnified schematic diagram of part A in the middle;
[0017] Figure 4 This is a cross-sectional view of the base plate and the reinforcement layer in the present invention.
[0018] In the figure: 1. Base plate; 2. Connecting block; 3. Protective block; 4. Protrusion; 5. Square groove; 6. Card block; 7. Reinforcement layer; 8. Honeycomb layer; 9. Insulation layer. DETAILED DESCRIPTION
[0019] The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0020] Bending PCB, such as Figure 1 and Figure 2As shown, it includes a substrate 1, a connecting block 2 is provided on the side wall of the substrate 1, and a protective block 3 for wrapping the connecting block 2 is detachably connected to the connecting block 2. Two protrusions 4 are formed on the side wall of the substrate 1 away from the connecting block 2. The two protrusions 4 are respectively arranged near the two ends of the substrate 1, and a square groove 5 for being embedded by the protrusion 4 is opened on the protective block 3. When the protrusion 4 is embedded in the square groove 5, the protective block 3 and the substrate 1 are perpendicular to each other. During the transportation of the substrate 1, the protective block 3 wrapped on the connecting block 2 can better prevent external objects from colliding with the connecting block 2, thereby better protecting the connecting block 2. When the substrate 1 is installed on the mainboard, the protective block 3 needs to be removed from the connecting block 2 and the connecting block 2 is inserted into the interface on the mainboard. , and then the square groove 5 on the protection block 3 can be aligned with the protrusion 4 on the substrate 1 and inserted. At this time, the protection block 3 and the substrate 1 are perpendicular to each other, and the connection between the substrate 1 and the mainboard is supported by the connection block 2 for the substrate 1 to share the load of the heat dissipation component, while the side of the substrate 1 away from the mainboard is supported by the protection block 3 for the substrate 1 to share the load of the heat dissipation component. The above arrangement enables the substrate 1 to be well supported in its length direction, so that the substrate 1 is not easily bent due to the load of the heat dissipation component. In addition, the above arrangement also enables the protection block 3 to continue to support the substrate 1 after completing the protection of the connection block 2, so that one component can achieve multiple uses, effectively improving the utilization rate of resources.
[0021] like Figures 2 to 4As shown, the length of the protrusion 4 is greater than the thickness of the protective block 3. A card block 6 is formed on the side of the protrusion 4 away from the substrate 1 to prevent the protective block 3 from falling off from the substrate 1. After the protrusion 4 is aligned with the square groove 5 and embedded, the card block 6 conflicts with the protective block 3. During use, the protective block 3 is not easy to fall off from the protrusion 4 by itself, thereby better ensuring the supporting effect of the protective block 3 on the substrate 1. The bottom surface of the substrate 1 is provided with a reinforcement layer 7, which includes a honeycomb layer 8 and an insulating layer 9 coated on both sides of the honeycomb layer 8. When the substrate 1 is subjected to pressure, the honeycomb structure in the honeycomb layer 8 can withstand The support of each other during pressure distribution can evenly distribute the load in the entire reinforcement layer 7, further improving the bending resistance of the substrate 1 itself. The card block 6 is made of elastic metal sheet. The number of the card block 6 is one. The card block 6 is arranged on the side close to the reinforcement layer 7. The card block 6 made of elastic metal can be deformed well when it conflicts with the inner wall of the square groove 5, so that the protrusion 4 can pass through the square groove 5 well. When the inner wall of the square groove 5 no longer conflicts with the card block 6, the card block 6 recovers its original shape under the action of its own material and conflicts with the protection block 3, so that the protection block 3 is not easy to move out of the square groove 5 by itself. The protrusion 4 falls off, and the card block 6 is arranged on the side close to the reinforcement layer 7 so that the reaction force of the card block 6 on the substrate 1 when the card block 6 is deformed can be better blocked by the reinforcement layer 7, thereby better protecting the substrate 1. The two ends of the card block 6 are embedded in the honeycomb layer 8, and the cross-section of the card block 6 exposed outside the protrusion 4 is hemispherical. Specifically, after the metal sheet is stamped and shaped, the two ends of the metal sheet pass through the outermost insulating layer 9 and are inserted into the honeycomb layer 8, and the hemispherical protrusion 4 formed by stamping is exposed on the insulating layer 9. When the inner wall of the square groove 5 conflicts with the protrusion 4, the relatively smooth surface of the protrusion 4 It can be squeezed relatively smoothly along the inner wall of the square groove 5, so that the process of the protrusion 4 inserting into the square groove 5 is relatively smooth. At the same time, the hemispherical block 6 is not easy to cause damage to the inner wall of the square groove 5. The substrate 1 is made of epoxy resin, and the protective block 3 is made of PVC. The excellent insulation performance of epoxy resin can effectively prevent short circuits between various circuits on the substrate 1. PVC has good mechanical properties. The protective block 3 made of PVC has good toughness, so that the protective block 3 can continue to provide support for the substrate 1 during long-term use.
[0022] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, certain improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.
Claims
1. A bending-resistant circuit board, characterized by: The invention comprises a base plate (1), a connecting block (2) is provided on the side wall of the base plate (1), a protective block (3) for wrapping the connecting block (2) is detachably connected to the connecting block (2), two protrusions (4) are formed on the side wall of the base plate (1) away from the connecting block (2), the two protrusions (4) are respectively arranged near the two ends of the base plate (1), and a square groove (5) for the protrusion (4) to be embedded is formed on the protective block (3), and when the protrusion (4) is embedded in the square groove (5), the protective block (3) and the base plate (1) are perpendicular to each other.
2. The bending-resistant circuit board according to claim 1, characterized in that: The length of the protrusion (4) is greater than the thickness of the protection block (3), and a clamping block (6) for preventing the protection block (3) from falling off the substrate (1) is formed on a side of the protrusion (4) away from the substrate (1).
3. The bending-resistant circuit board according to claim 2, characterized in that: A reinforcement layer (7) is provided on the bottom surface of the substrate (1), and the reinforcement layer (7) comprises a honeycomb layer (8) and an insulating layer (9) coated on both sides of the honeycomb layer (8).
4. The bending-resistant circuit board according to claim 3, characterized in that: The clamping block (6) is made of an elastic metal sheet, the number of the clamping block (6) is one, and the clamping block (6) is arranged on a side close to the reinforcement layer (7).
5. The bending-resistant circuit board according to claim 4, characterized in that: Both ends of the card block (6) are embedded in the honeycomb layer (8), and the cross-section of the card block (6) exposed outside the protrusion (4) is hemispherical.
6. The bending-resistant circuit board according to claim 5, characterized in that: The substrate (1) is made of epoxy resin, and the protection block (3) is made of PVC.