Tin connection prevention PCB (Printed Circuit Board)

Abstract

The utility model relates to a tin connection prevention PCB circuit board comprising a substrate; the welding holes penetrate through the substrate and are arranged at intervals in the first direction; the plurality of bonding pads are arranged on the substrate and are in one-to-one correspondence with the welding holes, the welding holes are formed in the end parts of the bonding pads, and a barrier piece is arranged between every two adjacent bonding pads; wherein the two adjacent bonding pads are arranged in a reverse extending mode in the second direction, the first direction is perpendicular to the second direction, so that the physical interval between the two adjacent bonding pads is increased, and the flowing path of the welding fluid on the bonding pads can be changed due to the fact that the two adjacent bonding pads are arranged in a reverse extending mode, so that the welding fluid on the bonding pads tends to flow in the opposite direction. In the flowing process of the welding fluid, the kinetic energy of the welding fluid is gradually reduced, the surface tension effect of the welding fluid is relatively enhanced until the surface tension of the welding fluid can resist the flowing trend of the welding fluid, separation of liquid level tension is achieved, and therefore the welding fluid is prevented from excessively spreading between the two adjacent bonding pads.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic information components, in particular to an anti-soldering PCB circuit board. Background Art

[0002] With the rapid development of electronic technology, PCB (Printed Circuit Board) circuit boards (PCBs), as core components of electronic devices, have a significant impact on their reliability and stability. Soldering is a crucial step in the PCB production process. However, traditional PCB designs often face the problem of solder bridging during the soldering process, significantly impacting product quality and production efficiency.

[0003] At present, in PCB circuit board welding, when the soldering liquid contacts the pads, the soldering liquid easily flows between adjacent pads due to the close distance between the pads and the low surface tension of the soldering liquid, resulting in the occurrence of bridging. This not only affects the normal operation of the circuit, but may also cause serious electrical faults such as short circuits, posing a huge hidden danger to the safety of electronic equipment.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. Utility Model Content

[0005] In view of this, the present invention provides an embodiment of the present invention to solve at least one problem existing in the background technology and the purpose of the present invention is to achieve the following technical solution: an anti-soldering PCB circuit board, comprising:

[0006] substrate;

[0007] a plurality of welding holes, which are provided through the substrate and are arranged at intervals along a first direction; and

[0008] A plurality of solder pads are provided on the substrate and correspond one to one with the solder holes, the solder holes are provided at the ends of the solder pads, and a barrier is provided between two adjacent solder pads;

[0009] Wherein, two adjacent pads are extended in opposite directions in the second direction, and the first direction is perpendicular to the second direction.

[0010] Optionally, in the above-mentioned anti-soldering PCB circuit board, the barrier is arranged in a serpentine shape between a plurality of solder pads to separate two adjacent solder pads.

[0011] Optionally, in the aforementioned anti-tinning PCB circuit board, each of the pads includes a first side and a second side;

[0012] The barrier member includes a first connecting section and a second connecting section connected to each other, the first connecting section is arranged on one side of the first side, the second connecting section is arranged between the second sides of two adjacent pads, and the total length of the first connecting section is greater than or equal to the length of several pads in the first direction.

[0013] Optionally, in the above-mentioned anti-tinning PCB circuit board, the barrier is silk-screened with white ink.

[0014] Optionally, in the above-mentioned anti-tinning PCB circuit board, the width of the white ink silk screen is 0.15 mm.

[0015] Optionally, in the above-mentioned anti-soldering PCB circuit board, the increase range of the pad length is 0.5-2 mm.

[0016] Compared with the prior art, the present application has the following beneficial effects: by arranging a plurality of welding holes at intervals along a first direction, all the welding holes are set at the ends of corresponding welding pads, an insulating barrier is set between two adjacent welding pads, and the two adjacent welding pads are extended in opposite directions in a second direction perpendicular to the first direction, thereby increasing the physical spacing between the two adjacent welding pads, and the reverse extension of the adjacent welding pads can change the flow path of the welding liquid on the welding pad, so that the welding liquid on the welding pad tends to flow in opposite directions. During the flow of the welding liquid, its kinetic energy gradually decreases, and the surface tension of the welding liquid is relatively enhanced until the surface tension of the welding liquid can resist the flow trend of the welding liquid, thereby achieving separation of the liquid surface tension, thereby preventing the welding liquid from excessively spreading between the two adjacent welding pads. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the anti-tinning PCB circuit board structure shown in this application;

[0018] Figure 2 yes Figure 1 The schematic diagram of the anti-soldering PCB circuit board in another direction is shown.

[0019] Among them: 1-substrate, 2-welding hole, 3-welding pad, 31-first side, 32-second side, 4-blocking member, 41-first connecting section, 42-second connecting section. DETAILED DESCRIPTION

[0020] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0021] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0022] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one element or feature to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations depicted in the figures.

[0023] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0024] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0025] Please refer to Figure 1 and Figure 2 As shown, the anti-soldering PCB circuit board shown in a preferred embodiment of the present application is suitable for packaging components. In this embodiment, the PCB circuit board is suitable for plug-in Hall current sensor chips.

[0026] Specifically, Hall effect high-speed current sensor chips are primarily designed for inverter / converter applications. However, due to the small distance between adjacent pins (approximately 1.27mm), the spacing between the edges of two adjacent pads 3 on the corresponding PCB circuit board is even smaller (approximately 0.27mm). As a result, soldering can cause soldering errors due to the small pin spacing. This can cause short circuits and circuit board failures.

[0027] To address the aforementioned issues, in this embodiment, an anti-bridging PCB circuit board includes a substrate 1, a plurality of solder holes 2 extending through the substrate 1, and a plurality of solder pads 3 disposed on the substrate 1 and corresponding one-to-one with the solder holes 2. The solder holes 2 are used to insert the pins of the Hall effect high-speed current sensor chip, and the solder pads 3 are used to solder the Hall effect high-speed current sensor chip to the substrate 1 using soldering fluid.

[0028] Specifically, a plurality of solder holes 2 are spaced apart along a first direction on the substrate 1, and the solder holes 2 are disposed at the ends of the solder pads 3. A barrier 4 is disposed between two adjacent solder pads 3 to prevent the solder liquid from flowing freely between the two adjacent solder pads 3, thereby significantly reducing the probability of solder bridging. Furthermore, in this embodiment, the two adjacent solder pads 3 extend in opposite directions in the second direction, thereby altering the solder liquid's flow path on the solder pads 3, causing the solder liquid on the solder pads 3 to flow in opposite directions. As the solder liquid flows, its kinetic energy gradually decreases, and the effect of the solder liquid's surface tension increases. This occurs until the solder liquid's surface tension is able to resist the solder liquid's flow, achieving separation of the liquid surface tension and preventing excessive spread of the solder liquid between the two adjacent solder pads 3.

[0029] Moreover, on the other hand, for components other than the Hall high-speed current sensor chip, this setting method can achieve the anti-soldering phenomenon without increasing the spacing between adjacent pads 3, reducing the problem of increased PCB circuit board area and increased cost due to increased spacing, especially avoiding the problem of increased PCB circuit board cost when there are a large number of solder holes 2.

[0030] It should be noted that, in this embodiment, the length of the pad 3 is increased by 0.5-2 mm. During welding, the soldering liquid flows on the pad 3 from the end away from the welding hole 2 toward the end of the welding hole 2.

[0031] Furthermore, the barrier 4 is arranged in a serpentine shape between the plurality of pads 3 so as to separate two adjacent pads 3. Furthermore, each pad 3 includes a first side 31 and a second side 32; the barrier 4 includes a first connecting section 41 and a second connecting section 42 connected to each other, wherein the first connecting section 41 is arranged on one side of the first side 31, and the second connecting section 42 is arranged between the second sides 32 of two adjacent pads 3, and the total length of the first connecting section 41 is greater than or equal to the length of the plurality of pads 3 in the first direction. The advantage of this arrangement is that the serpentine barrier 4 can more comprehensively realize the flow of solder liquid across the pads 3. In this embodiment, the barrier 4 is silk-screened with white ink, and the width of the white ink silk-screen is 0.15 mm.

[0032] The above is only a specific implementation of the present application. Any other improvements made based on the concept of the present application are considered to be within the scope of protection of the present application.

Claims

1. A PCB circuit board with anti-tinning properties, characterized in that: include: substrate; A plurality of welding holes are provided through the substrate and are arranged at intervals along the first direction; as well as A plurality of solder pads are provided on the substrate and correspond one to one with the solder holes, the solder holes are provided at the ends of the solder pads, and a barrier is provided between two adjacent solder pads; Wherein, two adjacent pads are extended in opposite directions in the second direction, and the first direction is perpendicular to the second direction.

2. The anti-tinning PCB circuit board according to claim 1, characterized in that: The barrier is arranged in a serpentine shape between a plurality of pads so as to separate two adjacent pads.

3. The anti-tinning PCB circuit board according to claim 2, characterized in that: Each of the pads includes a first side and a second side; The barrier member includes a first connecting section and a second connecting section connected to each other, the first connecting section is arranged on one side of the first side, the second connecting section is arranged between the second sides of two adjacent pads, and the total length of the first connecting section is greater than or equal to the length of several pads in the first direction.

4. The anti-tinning PCB circuit board according to claim 1, characterized in that: The barrier is silk-screened with white ink.

5. The anti-tinning PCB circuit board according to claim 4, characterized in that: The width of the white ink silk screen is 0.15 mm.

6. The anti-tinning PCB circuit board according to claim 1, characterized in that: The pad length increases in the range of 0.5-2 mm.

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