Intelligent control semiconductor sensor

Abstract

The utility model relates to the technical field of semiconductor sensors, and discloses an intelligent control semiconductor sensor which comprises a structure identifier, the outer surface of the upper end of the structure identifier is in sliding connection with a fastening device, the outer surface of the lower end of the structure identifier is fixedly connected with a pin, the outer surface of the upper end of the structure identifier is provided with a sliding groove, and the sliding groove is provided with a clamping device. The outer surface of the upper end of the structure identification is fixedly connected with a protection device, when the device is used, through the cooperation between a fixing disc and a cylinder in a fastening device, when a round cover in a semiconductor sensor needs to be detached from an air chamber, the protection device can be used for protecting the round cover. The round cover can be taken down from the air chamber only by rotating the round cover in the fastening device left and right, the round cover cannot be damaged and is convenient and fast, then the outer wall of the air chamber in the semiconductor sensor is wrapped with a layer of protective pad, and when the semiconductor sensor falls off or shakes, the protective pad can be taken down from the air chamber. And the situation that some small parts in the semiconductor sensor fall off due to vibration is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor sensors, in particular to an intelligent control semiconductor sensor. Background Art

[0002] Semiconductor sensor is a new type of semiconductor device, which can realize the mutual conversion between physical quantities such as electricity, light, temperature, sound, displacement, pressure, etc., and is easy to realize integration and multifunctionality, which is more suitable for computer requirements, so it is widely used in automatic detection systems. Since most of the actual measured quantities are non-electrical quantities, the main function of the sensor is to convert non-electrical signals into electrical signals. The advantages are high sensitivity, fast response speed, small size, light weight, easy integration, intelligence, and the integration of detection and conversion. The main application areas of semiconductor sensors are industrial automation, telemetry, industrial robots, household appliances, environmental pollution monitoring, health care, medical engineering and bioengineering. Physical sensitive devices commonly use physical effects to convert physical quantities into electrical signals. According to the sensitive objects, they are divided into different types such as light sensitive, thermal sensitive, force sensitive, and magnetic sensitive. They have functions similar to human vision, hearing and touch. This type of device is mainly based on the electronic action process, the mechanism is relatively simple, and the application is relatively common. The contactless switch of semiconductor sensors should be used They are particularly widely used. When combined with microprocessors, they can form remote controls, light controls, voice controls, industrial robots, and fully automated devices. Here is a list of commonly used physical effects: chemically sensitive devices that convert chemical quantities into electrical signals. According to the sensitive objects, they can be divided into types that are sensitive to gas, humidity, ions, etc., and have functions similar to human sense of smell and taste. This type of device is mainly based on the ion action process, with a relatively complex mechanism and difficult to develop, but has broad application prospects. Commonly used chemical effects include redox reactions, photochemical reactions, ion exchange reactions, catalytic reactions, and electrochemical reactions. Biosensitive devices that convert biomass into electrical signals often utilize the selective effects of membranes, biochemical reactions of enzymes, and immune reactions to achieve the purpose of detection by measuring the number of reaction products or consumers. The sensitive functional material used in biosensitive sensors is protein, and protein molecules can only react chemically with specific substances. Commonly used biological effects include antigen-antibody reactions, oxidation reactions under the action of enzymes, and the respiratory function of living microbial tissues and cells.

[0003] However, it still has some disadvantages. For example, when the internal air chamber of the semiconductor sensor needs to be replaced and checked during use, the outer shell protecting the air chamber is not very convenient to remove during the disassembly process. If too much force is used, the outer shell will be damaged. In addition, during the disassembly and installation of the air chamber, if the user accidentally drops the semiconductor sensor from his hand, and there is no protective device inside the semiconductor sensor, this situation will cause the semiconductor sensor to fall to the ground and be damaged.

[0004] To solve the above problems, this application proposes an intelligent control semiconductor sensor. Utility Model Content

[0005] The purpose of the present invention is to provide an intelligently controlled semiconductor sensor to solve the problems of troublesome removal of the outer shell of the semiconductor sensor gas chamber and gas chamber protection in the prior art mentioned in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: an intelligent controlled semiconductor sensor, comprising a structural marker, wherein the upper outer surface of the structural marker is slidably connected to a fastening device, and the lower outer surface of the structural marker is fixedly connected to a pin.

[0007] Preferably, a sliding groove is provided on the outer surface of the upper end of the structural marker, and a protective device is fixedly connected to the outer surface of the upper end of the structural marker.

[0008] Preferably, the fastening device includes a clamping plate, a fixing plate, an air inlet net, a circular hole, a circular cover and a cylinder. The outer surface of the upper end of the structural marker is provided with a sliding groove, and the inner wall of the sliding groove is slidably connected to the cylinder.

[0009] Preferably, the outer wall of the cylinder is fixedly connected to a clamping plate, the outer surface of the upper end of the cylinder is fixedly connected to a fixed disk, the outer surface of the upper end of the fixed disk is fixedly connected to a round cover, the outer surface of the upper end of the round cover is provided with a round hole, and the inner wall of the round hole is fixedly connected to an air intake net.

[0010] Preferably, the protective device includes a protective pad, a baffle, a hole, an air chamber, a support frame and a shell, and the outer surface of the upper end of the structural marker is fixedly connected to the shell.

[0011] Preferably, the inner wall of the shell is fixedly connected to a support frame, the lower outer surface of the support frame is fixedly connected to a protective pad, the inner wall of the shell is movably sleeved with an air chamber, the upper outer surface of the air chamber is fixedly connected to a baffle, and the upper outer surface of the baffle is provided with a hole.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] The utility model provides a fastening device provided with cooperation between the fixing disk and the cylinder. When the round cover of the semiconductor sensor needs to be removed from the air chamber, the round cover can be removed from the air chamber by simply rotating the round cover in the fastening device left and right without being damaged. The utility model is convenient and quick.

[0014] The utility model cooperates with the outer shell and the protective pad in the protective device, and wraps the outer wall of the air chamber in the semiconductor sensor with a protective pad, which can prevent some small parts inside the semiconductor sensor from falling off due to vibration when the semiconductor sensor falls or shakes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of an intelligent control semiconductor sensor of the present invention;

[0016] Figure 2 This is a schematic diagram of the internal structure of an intelligent control semiconductor sensor of the present invention;

[0017] Figure 3 This is a structural diagram of a fastening device in an intelligent control semiconductor sensor of the present utility model;

[0018] Figure 4 The utility model is a structural schematic diagram of a protective device in an intelligent control semiconductor sensor.

[0019] In the figure: 1. Structural identification; 2. Pin; 3. Fastening device; 4. Protective device; 5. Slide groove; 6. Clamping plate; 7. Fixing plate; 8. Air intake net; 9. Round hole; 10. Round cover; 11. Cylinder; 12. Protective pad; 13. Baffle; 14. Hole; 15. Air chamber; 16. Support frame; 17. Outer shell. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] See also Figure 1-Figure 2 The utility model provides a technical solution: an intelligent control semiconductor sensor, including a structural identifier 1, characterized in that: the upper outer surface of the structural identifier 1 is slidably connected to a fastening device 3, the lower outer surface of the structural identifier 1 is fixedly connected to a pin 2, the upper outer surface of the structural identifier 1 is provided with a slide groove 5, and the upper outer surface of the structural identifier 1 is fixedly connected to a protective device 4. The slide groove 5 is provided to facilitate the quick installation or disassembly of the fastening device 3.

[0022] In this embodiment, Figure 3As shown, the fastening device 3 includes a card plate 6, a fixed disk 7, an air intake net 8, a circular hole 9, a circular cover 10 and a cylinder 11. The upper outer surface of the structural identifier 1 is provided with a slide groove 5, the inner wall of the slide groove 5 is slidably connected to the cylinder 11, the outer wall of the cylinder 11 is fixedly connected to the card plate 6, the upper outer surface of the cylinder 11 is fixedly connected to the fixed disk 7, the upper outer surface of the fixed disk 7 is fixedly connected to the circular cover 10, the upper outer surface of the circular cover 10 is provided with a circular hole 9, the inner wall of the circular hole 9 is fixedly connected to the air intake net 8, the circular hole 9 is provided on the upper outer surface of the circular cover 10, and the air intake net 8 is installed on the upper end of the circular hole 9, and the gas enters the semiconductor sensor gas chamber 15 from the air intake net 8.

[0023] In this embodiment, Figure 4 As shown, the protective device 4 includes a protective pad 12, a baffle 13, a hole 14, an air chamber 15, a support frame 16 and a shell 17. The upper outer surface of the structural identifier 1 is fixedly connected to the shell 17, the inner wall of the shell 17 is fixedly connected to the support frame 16, the lower outer surface of the support frame 16 is fixedly connected to the protective pad 12, the inner wall of the shell 17 is movably connected to the air chamber 15, the upper outer surface of the air chamber 15 is fixedly connected to the baffle 13, and the upper outer surface of the baffle 13 is provided with a hole 14. The support frame 16 is fixedly installed on the inner wall of the shell 17, and the support frame 16 is fixed to the inner wall of the shell 17. When the air chamber 15 is lowered, the air chamber 15 can be prevented from sliding out from the bottom plate of the shell 17 and falling due to the lack of a baffle at the lower end of the shell 17. Installing the protective pad 12 at the lower end of the support frame 16 can effectively provide a protective effect for the air chamber 15.

[0024] Working principle:

[0025] Before using the semiconductor sensor, first place the protective pad 12 on the inner wall of the shell 17 in the protective device 4, and then place the air chamber 15 on the support frame 16 installed on the inner wall of the shell 17 through the baffle 13. The fastening device 3 cooperates between the fixing plate 7 installed on the outer surface of the lower end of the circular cover 10 in the fastening device 3 and the card plate 6 on the outer wall of the cylinder 11. The card plate 6 on the outer wall of the cylinder 11 is placed in the slide groove 5 opened on the outer surface of the upper end of the structural mark 1 and then rotated left and right to achieve the fastening effect. After using the semiconductor sensor, it is necessary to give the semiconductor sensor When replacing the device and checking the air chamber 15 inside the semiconductor sensor, you can first rotate the round cover 10 installed on the outer surface of the upper end of the structural identifier 1. After rotating the round cover 10 left and right, the card plate 6 installed on the lower end of the round cover 10 will be separated from the slide groove 5 opened on the outer surface of the upper end of the structural identifier 1. When the round cover 10 is removed, the situation inside the air chamber 15 can be checked. The protective pad 12 installed on the outside of the air chamber 15 can prevent some small parts inside the semiconductor sensor from falling off due to vibration when the semiconductor sensor falls or shakes.

[0026] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

Claims

1. An intelligently controlled semiconductor sensor, comprising a structure marker (1), characterized in that: The upper outer surface of the structural marker (1) is slidably connected to a fastening device (3), and the lower outer surface of the structural marker (1) is fixedly connected to a pin (2).

2. The intelligent control semiconductor sensor according to claim 1, characterized in that: A sliding groove (5) is provided on the outer surface of the upper end of the structural marker (1), and a protective device (4) is fixedly connected to the outer surface of the upper end of the structural marker (1).

3. The intelligent control semiconductor sensor according to claim 1, characterized in that: The fastening device (3) includes a clamping plate (6), a fixing plate (7), an air inlet net (8), a circular hole (9), a circular cover (10) and a cylinder (11); a sliding groove (5) is provided on the outer surface of the upper end of the structural marker (1); and the inner wall of the sliding groove (5) is slidably connected to the cylinder (11).

4. The intelligent control semiconductor sensor according to claim 3, characterized in that: The outer wall of the cylinder (11) is fixedly connected to a clamping plate (6), the outer surface of the upper end of the cylinder (11) is fixedly connected to a fixed disk (7), the outer surface of the upper end of the fixed disk (7) is fixedly connected to a round cover (10), the outer surface of the upper end of the round cover (10) is provided with a round hole (9), and the inner wall of the round hole (9) is fixedly connected to an air intake net (8).

5. The intelligent control semiconductor sensor according to claim 2, characterized in that: The protective device (4) comprises a protective pad (12), a baffle (13), a hole (14), an air chamber (15), a support frame (16) and a shell (17); the outer surface of the upper end of the structural marker (1) is fixedly connected to the shell (17).

6. The intelligent control semiconductor sensor according to claim 5, characterized in that: The inner wall of the shell (17) is fixedly connected to a support frame (16), the outer surface of the lower end of the support frame (16) is fixedly connected to a protective pad (12), the inner wall of the shell (17) is movably sleeved with an air chamber (15), the outer surface of the upper end of the air chamber (15) is fixedly connected to a baffle (13), and the outer surface of the upper end of the baffle (13) is provided with a hole (14).

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