Low-power-consumption anti-condensation EMU circuit board protection shell

Abstract

The utility model relates to a circuit board protective shell, in particular to a low-power-consumption anti-condensation EMU circuit board protective shell which comprises a shell body, a heat insulation layer is arranged on the inner wall of the shell body, an anti-corrosion layer and a hydrophobic layer are sequentially arranged on the outer wall of the shell body in an overlaid mode, a connecting and inserting opening is formed in the side wall of the shell body, a connector is arranged in the connecting and inserting opening, and an annular sealing layer is arranged between the connecting and inserting opening and the connector. The low-power-consumption anti-condensation EMU circuit board protective shell provided by the utility model has good sealing performance and anti-aging performance, ensures the working environment of the control circuit board, and can effectively improve the reliability and prolong the service life of an EMU unit.

Description

Technical Field

[0001] The utility model relates to a circuit board protective shell, in particular to a low-power consumption and condensation-proof EMU circuit board protective shell. Background Art

[0002] In recent years, with booming economies and increasing environmental awareness, countries around the world have been vigorously developing new energy sources. Energy storage containers are also becoming increasingly widespread. For information on the circuit board protective shell structure of energy storage containers, please refer to the Chinese utility model patent application number CN202121725158.7, entitled "Circuit Board Protective Shell and Hydrophobic Controller." Condensation, formed by the combined effects of humidity and temperature, is a major cause of equipment failure. Liquid water from condensation combines with surface dust to form conductive pathways, disrupting electrical insulation and turning previously non-conductive areas conductive. Condensation on control circuit boards can create conductive pathways, causing logical signal distortion, electronic component failure, and power short circuits and malfunctions. Eliminating condensation requires disrupting the conditions for its formation: humidity and temperature differentials. Condensation can be prevented by eliminating either of the two conditions that cause condensation. Currently, two main approaches are used: temperature control, or relative humidity control, uses heating resistors to directly raise the internal temperature, maintaining a suitable temperature difference between the equipment surface and the surrounding environment. This reduces the relative humidity near the electrical equipment, thus eliminating the condensation-forming conditions. Humidity control, or absolute humidity control, reduces the ingress of water vapor by increasing the sealing of the equipment. Desiccant or ventilation devices are used to remove moisture from the equipment. By lowering absolute humidity, relative humidity is controlled, reducing the water vapor content in the air and thus preventing condensation. Traditional approaches have the following drawbacks: 1) Heating resistors must be evenly distributed within the EMU unit to uniformly heat the entire space, preventing temperature differences caused by uneven heating that could worsen condensation. However, the limited space within the EMU unit prevents the uniform placement of multiple heating resistors, and heating resistors consume a lot of energy. 2) Ventilation fans also take up considerable space, and the filtration in the vents can affect the IP rating of the protective housing. And the energy consumption is high; 3) The EMU unit has many plug-in interfaces and they are relatively dense, which is not conducive to the IP protection level of the protective shell; 4) If a desiccant is used to remove moisture inside the EMU equipment, it needs to be replaced regularly, which increases maintenance costs, and each time the shell is opened for replacement, new unreliable factors may be introduced. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a low-power consumption anti-condensation EMU circuit board protective shell to ensure the working environment of the control circuit board and effectively improve the reliability and service life of the EMU unit.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a low-power anti-condensation EMU circuit board protective shell, including a shell, the inner wall of the shell is provided with a heat insulation layer, the outer wall of the shell is sequentially stacked with an anti-corrosion layer and a hydrophobic layer, the side wall of the shell is provided with a socket, a joint is provided in the socket, and an annular sealing layer is provided between the socket and the joint.

[0005] Furthermore, the thermal insulation layer is aerogel thermal insulation paint.

[0006] Furthermore, the anti-corrosion layer is epoxy zinc-rich paint.

[0007] Furthermore, the hydrophobic layer is a hydrophobic coating.

[0008] Furthermore, the annular sealing layer is a silicone rubber annular sealing layer.

[0009] Furthermore, the inner wall of the socket has a flange sealing surface.

[0010] Furthermore, a silicone structural adhesive is provided between the joint and the annular sealing layer.

[0011] Furthermore, an integrated heat dissipation fin is provided in the shell.

[0012] Furthermore, the shell is an aluminum protective shell.

[0013] Furthermore, the top surface of the shell is a sloped surface.

[0014] The beneficial effects of the present utility model are: a low-power anti-condensation EMU circuit board protective shell, when the ambient temperature is high, condensation is easy to form on the surface of the protective shell, and the hydrophobic layer outside the shell can effectively reduce the condensation of water vapor on the protective shell. When the ambient temperature is low, due to the heat release of the circuit board components during operation, the ambient temperature inside the EMU unit may be higher than the ambient temperature outside the EMU unit. The thermal insulation layer can effectively reduce the temperature difference between the air inside the EMU unit and the inner surface of the protective shell, avoiding the occurrence of condensation within a certain range. The interface part is designed with an annular sealing layer structure, which can resist the intrusion of external water vapor and salt spray to the greatest extent, so that the circuit board protective shell has good sealing performance and anti-aging performance, ensuring the working environment of the control circuit board, and can effectively improve the reliability and service life of the EMU unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of a low-power, anti-condensation EMU circuit board protective case;

[0016] Figure 2 is a structural schematic diagram of the shell;

[0017] Figure 3 It is a structural diagram of the socket;

[0018] Figure 4 is another structural diagram of the socket;

[0019] Figure 5 is another structural diagram of the socket;

[0020] Description of labels:

[0021] 1. Shell; 2. Thermal insulation layer; 3. Anti-corrosion layer; 4. Hydrophobic layer; 5. Connector; 51. Flange sealing surface; 6. Joint; 7. Annular sealing layer; 8. Integrated heat sink fins. DETAILED DESCRIPTION

[0022] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

[0023] Please refer to Figures 1 to 5 As shown, the utility model is a low-power anti-condensation EMU circuit board protective shell, including a shell 1, the inner wall of the shell 1 is provided with a heat insulation layer 2, the outer wall of the shell 1 is stacked with an anti-corrosion layer 3 and a hydrophobic layer 4 in sequence, the side wall of the shell 1 is provided with a socket 5, a joint 6 is provided in the socket 5, and an annular sealing layer 7 is provided between the socket 5 and the joint 6.

[0024] From the above description, it can be seen that the beneficial effects of the present invention are: a low-power anti-condensation EMU circuit board protective shell, when the ambient temperature is high, condensation is easy to form on the surface of the protective shell, and the hydrophobic layer 4 outside the shell 1 can effectively reduce the condensation of water vapor on the protective shell. When the ambient temperature is low, due to the heat release of the circuit board components, the internal ambient temperature of the EMU unit may be higher than the ambient temperature outside the EMU unit. The thermal insulation layer 2 can effectively reduce the temperature difference between the air inside the EMU unit and the inner surface of the protective shell, and avoid the occurrence of condensation within a certain range. The interface part is designed with an annular sealing layer 7 structure, which can resist the intrusion of external water vapor and salt spray to the greatest extent, so that the circuit board protective shell has good sealing performance and anti-aging performance, ensuring the working environment of the control circuit board, and can effectively improve the reliability and service life of the EMU unit.

[0025] In an optional embodiment, the thermal insulation layer 2 is aerogel thermal insulation paint.

[0026] From the above description, it can be seen that aerogel thermal insulation coating can effectively reduce the temperature difference between the air inside the EMU unit and the inner surface of the protective shell due to its low thermal conductivity and excellent thermal insulation function, and avoid the occurrence of condensation within a certain range.

[0027] In an optional embodiment, the anti-corrosion layer 3 is epoxy zinc-rich paint.

[0028] It can be seen from the above description that the epoxy zinc-rich paint improves the ability of the shell 1 to resist salt spray corrosion.

[0029] In an optional embodiment, the hydrophobic layer 4 is a hydrophobic coating.

[0030] From the above description, it can be seen that the hydrophobic coating is a coating commonly used on the market, which can effectively reduce the condensation of water vapor on the protective shell.

[0031] In an optional embodiment, the annular sealing layer 7 is a silicone rubber annular sealing layer 7 .

[0032] In an optional embodiment, the inner wall of the socket 5 has a flange sealing surface 51 .

[0033] In an optional embodiment, a silicone structural adhesive is provided between the joint 6 and the annular sealing layer 7 .

[0034] As can be seen from the above description, the socket adopts a combination of the flange sealing surface 51, the silicone rubber annular sealing layer 7 and the silicone structural adhesive to resist the intrusion of external water vapor and salt spray to the greatest extent.

[0035] In an optional embodiment, an integrated heat dissipation fin 8 is provided in the housing 1 .

[0036] In an optional embodiment, the housing 1 is an aluminum protective shell.

[0037] In an optional embodiment, the top surface of the housing 1 is a sloped surface.

[0038] From the above description, it can be seen that the inclined design of the top of the shell 1 can effectively reduce the condensation of water vapor on the protective shell.

[0039] Please refer to Figures 1 to 5 As shown, embodiment 1 of the present utility model is: a low-power anti-condensation EMU circuit board protective shell, comprising a shell 1, the inner wall of the shell 1 is provided with a heat insulation layer 2, the outer wall of the shell 1 is sequentially stacked with an anti-corrosion layer 3 and a hydrophobic layer 4, the side wall of the shell 1 is provided with a connector 5, a joint 6 is provided in the connector 5, and an annular sealing layer 7 is provided between the connector 5 and the joint 6.

[0040] The thermal insulation layer 2 is aerogel insulation paint. The anti-corrosion layer 3 is epoxy zinc-rich paint. The hydrophobic layer 4 is a hydrophobic coating. The annular sealing layer 7 is a silicone rubber annular sealing layer 7. The inner wall of the connector 5 has a flange sealing surface 51. Silicone structural adhesive is provided between the connector 6 and the annular sealing layer 7. The housing 1 is equipped with integrated heat dissipation fins 8. The housing 1 is an aluminum protective shell. The top surface of the housing 1 is sloped.

[0041] In summary, the low-power anti-condensation EMU circuit board protective shell of the utility model is prone to condensation on the surface of the protective shell when the ambient temperature is high. The hydrophobic layer outside the shell can effectively reduce the condensation of water vapor on the protective shell. When the ambient temperature is low, due to the heat release of the circuit board components during operation, the ambient temperature inside the EMU unit may be higher than the ambient temperature outside the EMU unit. The thermal insulation layer can effectively reduce the temperature difference between the air inside the EMU unit and the inner surface of the protective shell, avoiding the occurrence of condensation within a certain range. The interface part is designed with an annular sealing layer structure to maximize the resistance to the intrusion of external water vapor and salt spray, so that the circuit board protective shell has good sealing performance and anti-aging performance, ensuring the working environment of the control circuit board, and can effectively improve the reliability and service life of the EMU unit.

[0042] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A low-power anti-condensation EMU circuit board protective shell, characterized in that: The invention comprises a shell, the inner wall of the shell is provided with a heat insulation layer, the outer wall of the shell is provided with an anti-corrosion layer and a hydrophobic layer in sequence, the side wall of the shell is provided with a socket, a joint is provided in the socket, and an annular sealing layer is provided between the socket and the joint.

2. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The thermal insulation layer is aerogel thermal insulation paint.

3. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The anti-corrosion layer is epoxy zinc-rich paint.

4. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The hydrophobic layer is a hydrophobic coating.

5. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The annular sealing layer is a silicone rubber annular sealing layer.

6. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The inner wall of the socket is provided with a flange sealing surface.

7. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: Silicone structural adhesive is provided between the joint and the annular sealing layer.

8. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: An integrated heat dissipation fin is provided in the shell.

9. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The shell is an aluminum protective shell.

10. The low-power anti-condensation EMU circuit board protective case according to claim 1, characterized in that: The top surface of the shell is a slope.

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