Magnetic attraction radiator

Abstract

The utility model provides a magnetic attraction radiator. The magnetic attraction radiator comprises a bottom shell and a top shell which are connected together, the heat dissipation piece is positioned between the bottom shell and the top shell and is exposed; the display screen is fixed on the top shell; and the magnet is connected to the bottom shell. The heat dissipation piece is not completely wrapped and is exposed out of the bottom shell and the top shell, so that heat generated by the mobile electronic device can be dissipated.

Description

Technical Field

[0001] The utility model relates to a radiator for a mobile electronic device, in particular to a magnetic radiator. Background Art

[0002] When a mobile electronic device (such as a mobile phone) is operating at excessive power, such as when running a large gaming application, its surface temperature often rises. This not only makes it difficult for users to hold the device for extended periods of time, but can also affect the device's normal functionality. To avoid this, additional heat dissipation devices are often used to cool the device in specific scenarios.

[0003] Although conventional heat sinks for mobile electronic devices can meet basic requirements, it is always useful and necessary to provide a new magnetic heat sink, especially a magnetic heat sink that can provide good heat dissipation effect. Utility Model Content

[0004] Therefore, the present invention provides a magnetic heat sink to solve the above problems.

[0005] In order to solve the above technical problems, the utility model provides a magnetic radiator, which includes: a bottom shell and a top shell connected together; a heat dissipation component located between the bottom shell and the top shell and exposed to the outside; a display screen, which is fixed to the top shell; and a magnet, which is connected to the bottom shell.

[0006] Optionally, the bottom shell includes a hollow body and a cover plate connected to the body, and the magnet is accommodated in the body and sandwiched between the body and the cover plate.

[0007] Optionally, a wireless charging module is also included, which is accommodated in the main body and clamped between the main body and the cover.

[0008] Optionally, a semiconductor refrigeration plate is further included, and the body of the bottom shell is provided with a receiving cavity for receiving the semiconductor refrigeration plate, the cold end of the semiconductor refrigeration plate faces the cover plate, and the hot end of the semiconductor refrigeration plate faces the heat sink.

[0009] Optionally, a fan is further included, the heat sink includes an end portion in contact with the hot end of the semiconductor refrigeration plate, and the fan is fixed on a side of the end portion away from the hot end of the semiconductor refrigeration plate.

[0010] Optionally, a hollow connecting base is further included, the bottom shell is connected to a first side of the connecting base, the heat sink is clamped between the connecting base and a top shell, and the top shell is connected to a second side of the connecting base opposite to the first side.

[0011] Optionally, the heat sink includes an end and a plurality of heat dissipation fins arranged along the end, an unobstructed annular groove is formed between the top shell and the connecting seat, and the plurality of heat dissipation fins are accommodated in the annular groove and exposed unobstructed through the annular groove.

[0012] Optionally, a guide plate is provided at the hot end of the semiconductor refrigeration plate, and the hot end of the semiconductor refrigeration plate is indirectly in contact with the end of the heat sink through the guide plate.

[0013] Optionally, the display screen is positioned in a central area of ​​the top shell relative to the top shell.

[0014] Optionally, the top housing includes an air intake channel surrounding the display screen.

[0015] This utility model has the following advantages: the heat sink is not completely enclosed but exposed to the bottom and top shells, which further facilitates the dissipation of heat generated by the mobile electronic device. The display screen is used to display the temperature of the mobile electronic device. The user can simply flip the mobile electronic device to see the display screen fixed to the top shell, making it easy to read the content displayed on the screen and timely understand the real-time temperature of the mobile electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A three-dimensional diagram of a magnetic heat sink provided in an embodiment of the present invention.

[0018] Figure 2 This is an exploded view of the magnetic heat sink provided in an embodiment of the present invention.

[0019] Figure 3 This is an exploded view of the magnetic heat sink provided by an embodiment of the present invention from another angle, in which some components are omitted.

[0020] Figure 4 This is an exploded view of the magnetic heat sink provided by an embodiment of the present invention from another angle, in which some components are omitted.

[0021] Figure 5 This is an exploded view of the magnetic heat sink provided by an embodiment of the present invention from another angle, in which some components are omitted.

[0022] Figure 6A three-dimensional cross-sectional view of a magnetic heat sink provided in an embodiment of the present invention.

[0023] Figure 7 This is a planar cross-sectional view of a magnetic heat sink provided by an embodiment of the present invention, wherein the heat dissipation element is omitted. DETAILED DESCRIPTION

[0024] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0025] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] Figures 1 to 3 A magnetic heat sink 100 in one embodiment is shown. The magnetic heat sink 100 is used in conjunction with a mobile electronic device (such as a mobile phone or a tablet computer). It can be adsorbed on the back of the mobile electronic device and can quickly conduct away the heat generated by the mobile electronic device when it is working.

[0027] In one embodiment, a magnetic heat sink 100 includes a bottom shell 10 and a top shell 20 connected together, a heat sink 30, a display screen 40, and a magnet 50. The heat sink 30 is located between the bottom shell 10 and the top shell 20 and is exposed. The display screen 40 is fixed to the top shell 20. The magnet 50 is connected to the bottom shell 10.

[0028] With such a structure, the magnetic heat sink 100 can be adsorbed on the back of the mobile electronic device through the magnetic force generated by the magnet 50, and the heat sink 30 is not completely wrapped, but exposed between the bottom shell 10 and the top shell 20, which is more conducive to dissipating the heat generated by the mobile electronic device. The display screen 40 is used to display the real-time temperature of the mobile electronic device. When the magnetic heat sink 100 is adsorbed on the back of the mobile electronic device, the bottom shell 10 fits with the back of the mobile electronic device. The user only needs to flip the mobile electronic device to see the display screen 40 fixed to the top shell 20. It is very convenient to see the content displayed on the display screen 40 and to understand the temperature of the mobile electronic device in a timely manner.

[0029] refer to Figures 4 to 7In one embodiment, the bottom shell 10 includes a hollow body 11 and a cover plate 12 connected to the body 11. The magnet 50 is housed in the body 11 and sandwiched between the body 11 and the cover plate 12. Specifically, the body 11 is a substantially flat cylinder, comprising an end 111 and a side wall 112 extending along the edge of the end 111. In one embodiment, the magnet 50 is substantially annular, and an inner wall 113 protrudes from the inner surface of the end 111. The side wall 112 and the inner wall 113 form an annular groove 114 that can just accommodate the magnet 50. After the cover plate 12 is connected to the open end of the body 11 facing away from the heat sink 30, the magnet 50 is sandwiched between the body 11 and the cover plate 12 and cannot move, thereby connecting the magnet 50 to the bottom shell 10. When the magnetic heat sink 100 needs to be attached to the back of a mobile electronic device, it is only necessary to fit the cover 12 to the back of the mobile electronic device. The magnet 50 is separated from the back of the mobile electronic device only by the cover 12. The magnetic attraction force generated by the magnet 50 can connect the magnetic heat sink 100 to the back of the mobile electronic device.

[0030] In one embodiment, the magnetic heat sink 100 further includes a wireless charging module 60, which is housed in the body 11 and sandwiched between the body 11 and the cover 12. For example, the inner wall 113 surrounds and forms a receiving cavity 115, and the wireless charging module 60 is housed in the receiving cavity 115. The wireless charging module 60 is used to wirelessly charge mobile electronic devices.

[0031] refer to Figure 6 In one embodiment, the magnetic heat sink 100 further includes a hollow connecting base 70, through which the bottom shell 10 and the top shell 20 are indirectly connected. The bottom shell 10 is connected to a first side (i.e., the bottom end) of the connecting base 70, the heat sink 30 is sandwiched between the connecting base 70 and the top shell 20, and the top shell 20 is connected to a second side (i.e., the top end) of the connecting base 70 opposite to the first side.

[0032] In one embodiment, the connecting seat 70 is roughly a flat cylinder, which includes an end 71 and a side wall 72 extending along the edge of the end 71. In one embodiment, the magnetic heat sink 100 also includes a semiconductor refrigeration plate 80, and the body 11 of the bottom shell 10 is provided with a receiving cavity for receiving the semiconductor refrigeration plate 80. Specifically, the inner wall 113 is surrounded by the inner wall forming the receiving cavity 115 and has a plurality of support ribs 116 protruding roughly along the radial direction. The ends of the plurality of support ribs 116 are connected to a plurality of side walls 117 connected to each other, and the plurality of side walls 117 form a receiving cavity 118 that just receives the semiconductor refrigeration plate 80. The cold end ( Figure 7 The bottom end 81 in the middle faces the cover plate 12, and the hot end ( Figure 7The top 82 in the magnetic radiator 100 faces the heat sink 30. It should be noted that when a wireless charging module 60 is present, the cold end of the semiconductor refrigeration sheet 80 is not directly facing the cover plate 12, but directly facing the wireless charging module 60. When the magnetic radiator 100 does not include a wireless charging module 60, the cold end of the semiconductor refrigeration sheet 80 can directly face the cover plate 12. The cold end of the semiconductor refrigeration sheet 80 can be in contact with the wireless charging module 60, or there can be a small gap between the two, which can achieve a good heat dissipation effect.

[0033] In one embodiment, in order for the wireless charging module 60 and the semiconductor cooling plate 80 to work properly, the magnetic heat sink 100 also includes a first circuit board 61 electrically connected to the wireless charging module 60 and the semiconductor cooling plate 80. The first circuit board 61 is accommodated in the receiving space formed by the end 71 and the side wall 72 of the connecting seat 70, and the first circuit board 61 is located between the body 11 of the bottom shell 10 and the end 71 of the connecting seat 70. The first circuit board 61 is provided with through holes 611 for the multiple side walls 117 of the body 11 to pass through. Through holes for fasteners (such as screws 62) to pass through are provided on the first circuit board 61 and the two support ribs 116 of the body 11. A plurality of first fixing columns 73 are provided on the end 71 of the connecting seat 70, and the bottom end of the first fixing column 73 is provided with a threaded hole. The screw 62 is screwed into the threaded hole at the bottom end of the first fixing column 73, thereby connecting the first circuit board 61 and the body 11 to the end 71 of the connecting seat 70.

[0034] In one embodiment, the heat sink 30 is a hollow structure with one end open. It includes an end 31 and a plurality of heat dissipating fins 32 arranged along the edge of the end 31. Each heat dissipating fin 32 extends generally radially from the end 31. Any two adjacent heat dissipating fins 32 are spaced a certain distance apart, thereby forming air outlets 33. In this embodiment, the aforementioned "heat sink 30 is located between the bottom case 10 and the top case 20 and is exposed" refers to the radially outer ends of the heat dissipating fins 32 being exposed.

[0035] In one embodiment, reference Figure 7 An unobstructed annular groove 74 is formed between the top housing 20 and the connecting base 70. The plurality of heat dissipating fins 32 are housed within the annular groove 74 and are exposed to the outside through the annular groove 74. In one embodiment, the annular groove 74 is a complete 360-degree circular groove. The open end of the annular groove 74 is free of any components that would obstruct the heat dissipating fins 32, allowing each heat dissipating fin 32 and air outlet 33 to be unobstructed and exposed to the outside air. This structure facilitates better heat dissipation.

[0036] In one embodiment, the end 31 of the heat sink 30 contacts the hot end of the semiconductor cooling plate 80 , and the contact can be direct or indirect. For example, the magnetic heat sink 100 further includes a guide plate 83 disposed at the hot end of the semiconductor cooling plate 80 . The guide plate 83 has good thermal conductivity, and the hot end of the semiconductor cooling plate 80 indirectly contacts the end 31 of the heat sink 30 through the guide plate 83 . That is, the guide plate 83 is sandwiched between the hot end of the semiconductor cooling plate 80 and the end 31 of the heat sink 30 , and contacts both.

[0037] In one embodiment, the magnetic heat sink 100 further includes a fan 90, which is disposed in a cavity formed between the end 31 of the heat sink 30 and the heat dissipation fins 32. The fan 90 is fixed to the side of the end 31 of the heat sink 30 that is away from the hot end of the semiconductor refrigeration plate 80. The heat from the hot end of the semiconductor refrigeration plate 80 is transferred to the end 31 and the heat dissipation fins 32 of the heat sink 30 via the guide plate 83. When the fan 90 is working, it drives the air flow from the air inlet channel (described in detail later) into the cavity formed between the end 31 and the heat dissipation fins 32, and flows out from the air outlet 33. This structure facilitates the rapid dissipation of heat to the outside air.

[0038] In one embodiment, a threaded hole is provided at the top of the first fixing column 73, and the bottom end of the fan 90 includes a plurality of fixing plates 91, each fixing plate 91 is provided with a through hole 93 for a screw 92 to pass through, and the screw 92 is screwed into the threaded hole at the top of the first fixing column 73 passing through the end 31 of the heat sink 30, thereby fixing the fan 90 to the end 31 of the heat sink 30.

[0039] In one embodiment, a plurality of second fixing posts 75 protrude from the end 71 of the connection base 70 on a side facing away from the bottom case 10. The top ends of the second fixing posts 75 are provided with threaded holes. The end 31 of the heat sink 30 is provided with through holes 34 for the second fixing posts 75 to pass through. With this structure, the heat sink 30 is restricted from horizontal movement relative to the connection base 70. That is, the heat sink 30 cannot move horizontally relative to the connection base 70.

[0040] refer to Figure 2 and Figure 3In one embodiment, the display screen 40 is positioned in the central area of ​​the top shell 20 relative to the top shell 20. Such a central setting is conducive to the user to see the content displayed on the display screen 40 more intuitively and conveniently, and to be able to understand the temperature of the mobile electronic device in a timely manner. Specifically, in one embodiment, the top shell 20 includes a frame 21 and a cover 22, and the cover 22 is detachably connected to the frame 21. The frame 21 is roughly in the shape of a hollow flat cone, and the frame 21 is provided with a through hole 211 for a screw (not shown) to pass through. The screw is screwed into the threaded hole at the top end of the second fixing column 75 passing through the end 31 of the heat sink 30. At this time, the bottom end of the heat sink 30 contacts the top surface of the end 71 of the connecting seat 70, and the top end of the heat sink 30 contacts the bottom end of the frame 21 of the top shell 20. With this structure, after the screws are screwed into the threaded holes at the top ends of the second fixing posts 75, the frame 21 is connected to the connection base 70, and the heat sink 30 is tightly clamped between the connection base 70 and the top case 20, preventing it from moving. The cover 22 fits against the outer surface of the frame 21, covering the various holes provided on the outer surface of the frame 21 for connection functions, thereby enhancing the aesthetics of the magnetic heat sink.

[0041] In one embodiment, the display screen 40 is an LED digital tube, which is generally in the shape of a cube. In order to position the display screen 40 relative to the top shell 20 in the central area of ​​the top shell 20, the frame 21 is provided with a square through hole 212, and a plurality of support ribs 213 protrude from the inner surface of the through hole 212. The ends of the plurality of support ribs 213 are connected with a positioning portion 214. The positioning portion 214 is provided with a through hole 215 located in the central area of ​​the frame 21. The display screen 40 is accommodated in the through hole 215 and exposed. In this way, relying on the through hole 215 located in the central area of ​​the frame 21, the display screen 40 can be positioned in the central area of ​​the frame 21 (also the central area of ​​the top shell 20) relative to the top shell 20. In order to protect the display screen 40 and for aesthetic reasons, the magnetic heat sink 100 also includes a protective cover 23 detachably connected to the positioning portion 214. At least a portion of the protective cover 23 is light-transmissive to allow the content displayed on the display screen 40 to be observed by the user.

[0042] In one embodiment, in order to ensure the normal operation of the display screen 40, the magnetic heat sink 100 further includes a second circuit board 63, and the display screen 40 is electrically connected to the second circuit board 63. The second circuit board 63 can be electrically connected to the first circuit board 61 by a cable 64 passing through the heat sink 30 and the connecting seat 70. The second circuit board 63 is housed in the frame 21. In one embodiment, the second circuit board 63 can be fixed to the inner surface of the frame 21 by fasteners (such as screws). Corresponding to the multiple through holes 216 formed by the support ribs 213, the inner side of the through hole 212 and the outer side of the positioning portion 214, a plurality of through holes 631 are formed on the second circuit board 63, and the multiple through holes 631 correspond one-to-one to the multiple through holes 216 and have approximately the same shape and size. The multiple through holes 631 and the multiple through holes 216 constitute a plurality of air intake channels 24 (see Figure 1 When the fan 90 is working, air flows from the outside into the heat sink 30 through the air inlet channel 24 and finally flows out of the heat sink 30 through the air outlet 33 of the heat sink 30 .

[0043] In one embodiment, a plurality of ambient light beads 632 are disposed on the second circuit board 63. The plurality of ambient light beads 632 can be disposed on a side of the second circuit board 63 opposite to the display screen 40.

[0044] In one embodiment, the second circuit board 63 is provided with a plurality of switches 633. A plurality of buttons 25 are movably connected to the frame 21 in correspondence with the switches 633. When pressed by a user, each button 25 moves downward a short distance until it triggers the switch 633 below it. Each switch 633 can be used to activate or deactivate a different function, such as turning on and off the ambient light beads 632, turning the display screen 40 on and off, or turning the fan 90 on and off.

[0045] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of this utility model.

Claims

1. A magnetic heat sink, characterized in that: The magnetic heat sink includes: a bottom shell and a top shell joined together; a heat sink located between the bottom shell and the top shell and exposed to the outside; a display screen fixed to the top shell; a magnet connected to the bottom shell; Semiconductor cooling chips; and fan; The bottom shell includes a hollow body and a cover plate connected to the body, and the magnet is accommodated in the body and sandwiched between the body and the cover plate; The body of the bottom shell is provided with a receiving cavity for receiving the semiconductor refrigeration chip, the cold end of the semiconductor refrigeration chip faces the cover plate, and the hot end of the semiconductor refrigeration chip faces the heat sink; The heat sink comprises an end portion contacting the hot end of the semiconductor refrigeration fin, and the fan is fixed on a side of the end portion facing away from the hot end of the semiconductor refrigeration fin.

2. The magnetic heat sink according to claim 1, characterized in that: It also includes a wireless charging module, which is accommodated in the body and clamped between the body and the cover.

3. The magnetic heat sink according to claim 1, characterized in that: It also includes a hollow connecting base, the bottom shell is connected to a first side of the connecting base, the heat sink is clamped between the connecting base and the top shell, and the top shell is connected to a second side of the connecting base opposite to the first side.

4. The magnetic heat sink according to claim 3, characterized in that: The heat sink includes an end and a plurality of heat dissipation fins arranged along the end. An unobstructed annular groove is formed between the top shell and the connecting seat. The plurality of heat dissipation fins are accommodated in the annular groove and are exposed to the outside through the annular groove without obstruction.

5. The magnetic heat sink according to claim 1, characterized in that: It also includes a guide plate arranged at the hot end of the semiconductor refrigeration plate, and the hot end of the semiconductor refrigeration plate is indirectly in contact with the end of the heat sink through the guide plate.

6. The magnetic heat sink according to claim 1, characterized in that: The display screen is positioned relative to the top case at a central area of ​​the top case.

7. The magnetic heat sink according to claim 6, characterized in that: The top housing includes an air intake channel surrounding the display screen.

Images