Liquid cooling heat dissipation system and server

Abstract

The utility model relates to the technical field of server heat dissipation, and discloses a liquid cooling heat dissipation system and a server, so as to improve the operation and maintenance convenience of the server and reduce the use amount of cooling liquid. The liquid cooling heat dissipation system comprises a rack, a server and a heat dissipation module. The rack is provided with a plurality of stations, and the servers are horizontally placed on the stations. The server comprises a shell and baffles arranged in the shell, the baffles are used for dividing the space in the shell into at least two independent areas, the at least two independent areas comprise computing power areas, and the baffles of the computing power areas are matched with the shell to form a sealed cavity used for being filled with cooling liquid. The rack is provided with a first opening and a second opening which are opposite, and the at least two independent areas are arranged in the arrangement direction of the first opening and the second opening. The heat dissipation module is connected with the server and used for conducting heat exchange on the cooling liquid in the sealing cavity.

Description

Technical Field

[0001] The utility model relates to the technical field of server heat dissipation, in particular to a liquid cooling heat dissipation system and a server. Background Art

[0002] Immersion liquid cooling technology is increasingly being used in server cooling due to its high heat dissipation efficiency. Current immersion liquid cooling involves placing servers vertically in a horizontal cabinet and filling the cabinet with coolant. The coolant circulates to dissipate heat generated by the servers. However, since the servers are placed vertically in the cabinet, maintenance requires lifting them out of the coolant, significantly inconvenient for server operations.

[0003] In addition, since immersion liquid cooling technology requires the entire horizontal cabinet to be filled with coolant, and in order to meet the simultaneous heat dissipation of multiple servers, the cabinet is often large in size, resulting in a large amount of coolant required. This not only places high demands on the floor's load-bearing capacity, but also causes an increase in operating costs. Utility Model Content

[0004] The utility model provides a liquid cooling and heat dissipation system and a server, which can not only improve the convenience of server operation and maintenance, but also reduce the amount of coolant used, thereby reducing the load-bearing requirements for the floor and reducing operating costs.

[0005] In a first aspect, the present invention provides a liquid cooling system, comprising a rack, a server, and a cooling module;

[0006] The rack is provided with a plurality of workstations for accommodating servers, the plurality of workstations being arranged along the arrangement direction of the top and bottom of the rack, and the servers being placed horizontally at the workstations;

[0007] The frame has a first opening and a second opening opposite to each other, the orthographic projection of the first opening on a first plane covers each of the workstations, and the orthographic projection of the second opening on the first plane covers each of the workstations, and the first plane is a plane parallel to the arrangement direction of the plurality of workstations;

[0008] The server includes a housing and a baffle disposed within the housing, the baffle being used to separate the space within the housing into at least two independent areas, the at least two independent areas being arranged along the arrangement direction of the first opening and the second opening, the at least two independent areas including a computing area for arranging heating elements, the baffle of the computing area cooperating with the housing to form a sealed cavity, the sealed cavity being used to be filled with a coolant so that the heating elements are immersed in the coolant;

[0009] The heat dissipation module is connected to the server and is used to exchange heat with the cooling liquid in the sealed cavity.

[0010] The liquid cooling and heat dissipation system provided by the present invention is provided with a rack so that the server can be placed horizontally inside the rack. A baffle is provided inside the server to divide the inside of the server into at least two areas, one of which is a computing power area where heating elements are arranged. The computing power area has a sealed cavity for filling with coolant, so that the heating elements are immersed in the coolant, and the coolant exchanges heat with the heating elements to reduce the temperature of the heating elements. The heat dissipation module exchanges heat with the coolant, thereby ensuring that the coolant in the sealed cavity is always in a low-temperature state to normally exchange heat with the heating elements. Since the coolant circulates only in the computing power area, the amount of coolant used can be reduced, thereby reducing the load-bearing requirements for the floor and reducing operating costs. The rack has a first opening and a second opening, which makes it convenient for operators to directly maintain the server. Compared with the existing immersion liquid cooling technology solution in which the server is lifted from the coolant, the liquid cooling and heat dissipation system in this application has significantly improved the convenience of server operation and maintenance.

[0011] In some possible embodiments, the heat dissipation module includes a cooling liquid distribution unit and a circulation pipeline assembly, the sealed cavity is provided with a liquid inlet hole and a liquid return hole, the circulation pipeline assembly is respectively connected to the liquid inlet hole and the liquid return hole, and the circulation pipeline assembly is also connected to the cooling liquid distribution unit so that the cooling liquid distribution unit can exchange heat with the cooling liquid in the sealed cavity.

[0012] In some possible implementation schemes, the circulation pipeline assembly includes a liquid inlet main pipe, a liquid return main pipe, a first liquid distribution pipe, a second liquid distribution pipe, and liquid inlet branches and liquid return branches corresponding to the servers one by one;

[0013] The first end of the liquid inlet main pipe is connected to the coolant distribution unit, the second end of the liquid inlet main pipe is connected to the first liquid distribution pipe, the first end of the liquid inlet branch pipe is connected to the first liquid distribution pipe, and the other end of the liquid inlet branch pipe is connected to the liquid inlet hole;

[0014] The first end of the liquid return main pipe is connected to the coolant distribution unit, the second end of the liquid return main pipe is connected to the second liquid distribution pipe, the first end of the liquid return branch pipe is connected to the second liquid distribution pipe, and the second end of the liquid return branch pipe is connected to the liquid return hole.

[0015] In some possible implementation schemes, the liquid inlet branch pipe is connected to the first liquid dispensing pipe via a quick connector, and / or the liquid return branch pipe is connected to the second liquid dispensing pipe via a quick connector.

[0016] In some possible embodiments, the frame includes a bottom plate, a top plate, and side plates, and the top plate, the bottom plate, and the side plates are sequentially connected to form an accommodating space for accommodating a plurality of the workstations;

[0017] The side panel includes a front panel and a rear panel that are arranged opposite to each other, the front panel is located on a side of the rack where the first opening is arranged, and the rear panel is located on a side of the rack where the second opening is arranged;

[0018] The front panel can be opened or closed relative to the accommodation space so that the first opening is open or the front panel covers the first opening;

[0019] The rear panel can be opened or closed relative to the accommodation space so that the second opening is open or the rear panel covers the second opening.

[0020] In some possible embodiments, the side panel further includes two opposite side panels, the side panels are located between the front panel and the rear panel, and opposite sides of the side panels are respectively connected to the front panel and the rear panel;

[0021] The first dispensing tube and the second dispensing tube are both located in the accommodating space. The first dispensing tube is arranged near one of the side panels or on one of the side panels, and the second dispensing tube is arranged near the other side panel or on the other side panel.

[0022] In some possible implementation schemes, the heat dissipation module further includes a fluid replenishing tank, which is disposed on a side of the top plate facing the bottom plate, and is connected to the first liquid dispensing tube or the second liquid dispensing tube via a quick connector.

[0023] In some possible implementation schemes, the liquid inlet hole and the liquid return hole are arranged on the baffle of the computing power area, the liquid inlet branch pipe passes through the area adjacent to the computing power area and is connected to the first liquid distribution pipe, and the liquid return branch pipe passes through the area adjacent to the computing power area and is connected to the second liquid distribution pipe.

[0024] In some possible implementations, the server includes two baffles, which divide the interior of the housing into three independent areas. The two baffles and the housing cooperate to form a sealed cavity for the computing power area.

[0025] The two areas located on both sides of the computing power area are respectively a storage area for arranging storage devices and an input / output area for setting connection ports;

[0026] The liquid inlet branch pipe and the liquid return branch pipe are respectively arranged through the input / output area.

[0027] In some possible implementations, the circulation pipeline assembly further includes a coolant guide assembly, and the coolant guide assembly is disposed in the sealed cavity;

[0028] The coolant guide assembly includes a guide main pipe and at least one guide branch pipe, the guide main pipe is connected to the liquid inlet hole, the first end of the guide branch pipe is connected to the guide main pipe, and the second end of the guide branch pipe is opposite to the heating element.

[0029] In some possible implementations, the baffle is provided with a wiring hole, and cables connecting elements in two adjacent areas are passed through the wiring hole;

[0030] An airtight connector is provided in the wiring hole on the baffle of the computing power area, and the cable is fixed in the wiring hole through the airtight connector.

[0031] In some possible implementation schemes, along the arrangement direction of the top and bottom of the frame, the liquid inlet hole is located between the liquid return hole and the bottom of the frame.

[0032] In a second aspect, the present invention provides a server for use in a liquid cooling system, the server comprising a housing and a baffle disposed inside the housing, the baffle being used to separate the space inside the housing into at least two independent areas;

[0033] The at least two independent areas include a computing area and a functional area. The baffle of the computing area cooperates with the housing to form a sealed cavity. The sealed cavity is used to arrange a heating element and is used to fill the sealed cavity with a coolant. The functional area is provided with a communication port communicating with the outside of the housing.

[0034] The baffle of the sealed cavity is provided with a liquid inlet hole and a liquid return hole, and the liquid inlet hole and the liquid return hole are respectively used to connect the liquid inlet pipeline and the liquid return pipeline, so that the coolant circulates in the sealed cavity through the liquid inlet pipeline and the liquid return pipeline.

[0035] The server provided by the present invention utilizes a baffle to separate the interior of the server shell into at least two areas, one of which is a computing power area for arranging heating elements. The computing power area is a sealed cavity, and the sealed cavity is connected by a liquid inlet pipe and a liquid return pipe, so that the coolant circulates in the sealed cavity, thereby enabling the coolant to exchange heat with the heating element and reduce the temperature of the heating element. The functional area is provided with a connecting port, that is, the functional area is a non-enclosed area, so that the functional area can be connected to the external element through the connecting port, thereby improving the convenience of server maintenance. Alternatively, the functional area can also be cooled by air circulation to achieve the purpose of cooling the functional area. Compared with the traditional solution of immersing the server in coolant, in the present application, when cooling the server, it is only necessary to inject coolant into the computing power area inside the server to achieve the purpose of cooling the server, reducing the amount of coolant used, which not only reduces the load-bearing requirements for the floor, but also reduces the operating costs.

[0036] In some possible implementations, there are two baffles, which divide the interior of the shell into three independent areas, and the two baffles and the shell cooperate to form the sealed cavity;

[0037] The functional area includes a storage area and an input / output area located on both sides of the sealed cavity, the storage area is used to arrange storage devices, and the input / output area is used to set connection ports;

[0038] The liquid inlet hole and the liquid return hole are arranged on the baffle close to the input / output area, so that the liquid inlet pipeline and the liquid return pipeline pass through the input / output area.

[0039] In some possible implementation schemes, the baffle is provided with a wiring hole, and the wiring hole is used to pass the cable connecting the computing power area and the functional area. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a structural diagram of a frame in an embodiment of the utility model;

[0041] Figure 2 This is a structural diagram of a liquid cooling and heat dissipation system in an embodiment of the present utility model;

[0042] Figure 3 This is a structural diagram of an embodiment of the present invention when the front panel and the rear panel of the rack are both opened;

[0043] Figure 4 A schematic diagram of the structure of server partitions in an embodiment of the present utility model;

[0044] Figure 5This is a schematic diagram of a top view of the server in an embodiment of the present utility model;

[0045] Figure 6 This is a front view of a baffle between the computing area and the input / output area of ​​a server in an embodiment of the present invention;

[0046] Figure 7 This is a front view of a partition between a computing area and a storage area in a server according to an embodiment of the present invention;

[0047] Figure 8 This is a structural diagram of a server in an embodiment of the present utility model.

[0048] In the picture:

[0049] 100 - rack; 101 - partition; 102 - first opening; 103 - second opening; 110 - bottom plate; 120 - top plate; 130 - side plate; 131 - front panel; 132 - rear panel; 133 - side panel; 200 - server; 201 - computing area; 202 - input / output area; 203 - storage area; 204 - sealed cavity; 205 - heating element; 206 - cable; 210 - housing; 220 - baffle; 230 - liquid inlet; 240 - liquid return; 250 - wiring hole; 300 - cooling module; 310 - cooling liquid distribution unit; 311 - plate heat exchanger; 312 - circulating pump; 321 - liquid inlet manifold; 322 - liquid return manifold; 323 - cooling module; 324 - cooling liquid distribution unit; 325 - cooling liquid distribution unit; 326 - cooling liquid distribution unit; 327 - cooling liquid distribution unit; 328 - cooling liquid distribution unit; 329 - cooling liquid distribution unit; 330 - cooling liquid distribution unit; 331 - cooling liquid distribution unit; 332 - cooling liquid distribution unit; 333 - cooling liquid distribution unit; 334 - cooling liquid distribution unit; 335 - cooling liquid distribution unit; 336 - cooling liquid distribution unit; 337 - cooling liquid distribution unit; 338 - cooling liquid distribution unit; 339 - cooling liquid distribution unit; 340 - cooling liquid distribution unit; 341 - cooling liquid distribution unit; 342 - cooling liquid distribution unit; 343 - cooling liquid distribution unit; 344 - cooling liquid distribution unit; 345 - cooling liquid distribution unit; 346 - cooling liquid distribution unit; 347 - cooling liquid distribution unit; 348 - cooling liquid distribution unit; 349 - cooling liquid distribution unit; 350 - cooling liquid distribution unit; -First liquid distribution pipe; 324-Second liquid distribution pipe; 325-Liquid inlet branch pipe; 326-Liquid return branch pipe; 327-Liquid replenishment tank; 328-Coolant guide assembly; 3281-Guide main pipe; 3282-Guide branch pipe; 329-Quick connector; 330-Cold source; 340-Return pipe; 350-Inlet pipe; 1000-Server; 1010-Casing; 1020-Baffle; 1021-Liquid inlet hole; 1022-Return hole; 1023-Wiring hole; 1030-Computing power area; 1040-Storage area; 1050-Input / Output area; 1060-Heating element; 1070-Ventilation port; 1080-Cable; 2001-Liquid inlet pipeline; 2002-Liquid outlet pipeline. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0051] refer to Figure 1 and Figure 2The liquid cooling system in the embodiment of the present invention includes a rack 100 , a server 200 and a heat dissipation module 300 , wherein the server 200 is arranged in the rack 100 , and the heat dissipation module 300 is used to dissipate heat for the server 200 .

[0052] like Figure 1 As shown, the rack 100 in this embodiment may be in the form of a frame structure. Specifically, the rack 100 may include multiple support rods that cooperate to form a framework structure for accommodating the server 200. Furthermore, the rack 100 is provided with multiple partitions 101. Between adjacent partitions 101, workstations for accommodating the server 200 are formed. The multiple workstations are arranged along the top and bottom of the rack 100. The server 200 can be placed horizontally on the partitions 101 and fixed relative to the partitions 101, thereby ensuring that the server 200 maintains structural stability within the rack 100.

[0053] In this case, the rack 100 has a first opening 102 and a second opening 103 facing each other. The orthographic projection of the first opening 102 on the first plane covers all workstations, and the orthographic projection of the second opening 103 on the first plane covers all workstations. The first plane can be understood as a plane parallel to the arrangement direction of the multiple workstations. It can be understood that due to the presence of the first opening 102 and the second opening 103, when the server 200 is placed at a workstation, both sides of the server 200 along the arrangement direction of the first opening 102 and the second opening 103 can be exposed to the first opening 102 and the second opening 103, respectively, so that operators can directly maintain the server 200.

[0054] In some embodiments, reference Figure 3 , the rack 100 can also be in the form of a cabinet structure. Specifically, the rack 100 may include a bottom plate 110, a top plate 120 and a side plate 130, and the bottom plate 110, the side plate 130 and the top plate 120 are connected in sequence to form a storage space for accommodating the server 200. For example, a plurality of partitions (not shown in the figure) may be provided in the storage space, and the plurality of partitions are arranged at intervals along the arrangement direction of the bottom plate 110 and the top plate 120. At this time, the space between two adjacent partitions, the space between the partition and the bottom plate 110, and the space between the partition and the top plate 120 can all form a workstation for accommodating the server 200. Each workstation can be used to accommodate one server 200, and the server 200 can be placed horizontally at the workstation.

[0055] It should be noted that in the aforementioned embodiment and this embodiment, the server 200 is placed horizontally, which can be understood as the large surface of the server 200 being perpendicular to the height direction of the rack 100 .

[0056] In this embodiment, the rack 100 may also have a first opening 102 and a second opening 103. In this case, the side panels 130 may include a front panel 131 and a rear panel 132, which are opposed to each other, and two side panels 133 connected between the front panel 131 and the rear panel 132. The front panel 131 is located on the side of the rack 100 where the first opening 102 is located, and the rear panel 132 is located on the side of the rack 100 where the second opening 103 is located. The front panel 131 can be opened or closed relative to the first opening 102. When the front panel 131 is open, the first opening 102 is open. When the front panel 131 is closed, the front panel 131 can be considered to cover the first opening 102. Similarly, the rear panel 132 can be opened or closed relative to the second opening 103. When the rear panel 132 is open, the second opening 103 is open. When the rear panel 132 is closed, the rear panel 132 can be considered to cover the second opening 103.

[0057] The inner walls of the two side panels 133 can also be provided with guide rail structures (not shown in the figure). When the server 200 is placed at the workstation, the guide rail structures on both sides can be used to insert the server 200 into the workstation and fix the server 200 at the workstation.

[0058] Alternatively, in some other embodiments, the side panel 130 may also include only two side panels 133 , which are respectively connected between the top panel 120 and the bottom panel 110 , so that the first opening 102 and the second opening 103 are always in an open state.

[0059] To facilitate understanding of the solution, the following embodiments all take the rack 100 as an example. Figure 3 The cabinet structure shown in FIG is used as an example for explanation.

[0060] For reference Figure 4 and Figure 5 The server 200 includes a housing 210 and a baffle 220 disposed inside the housing 210. The baffle 220 can be used to separate the space inside the housing 210 into at least two independent areas, each of which is provided with corresponding components, so that the interior of the server 200 has a modular design. The area formed by the baffle 220 inside the housing 210 includes a computing power area 201 for arranging the heating element 205. The baffle 220 of the computing power area 201 cooperates with the housing 210 to form a sealed cavity 204, and the heating element 205 is located in the sealed cavity 204. The sealed cavity 204 can be filled with coolant so that the heating element 205 can be immersed in the coolant, so that the coolant can be used to exchange heat with the heating element 205, thereby reducing the temperature of the heating element 205.

[0061] It is worth noting that the heat generating components 205 arranged in the computing power area 201 can be understood as components with relatively high heat generation. Components in other areas also generate heat when the server 200 is running, but the heat generated by these components is less than that generated by the components in the computing power area 201. In actual applications, the heat generating components 205 may be, for example, a central processing unit (CPU), a graphics processing unit (GPU), a memory module, etc.

[0062] In addition, the other areas can be enclosed spaces, or they can be open spaces. As an optional embodiment, the other areas are provided with a communication port for communicating with the outside of the housing 210, so that the other areas are open spaces. When the server needs to be connected to external components, the other areas can be connected to the external components through the communication port, which can improve the maintenance convenience of the server. Alternatively, since the components in the other areas generate less heat, air can be allowed to flow through the communication port to dissipate heat, thereby improving the overall heat dissipation effect of the server.

[0063] As an optional implementation scheme, Figure 4 As shown, two baffles 220 are provided inside the housing 210. The two baffles 220 are spaced apart, thereby dividing the space inside the housing 210 into three independent areas. The area between the two baffles 220 is the computing area 201, the area on one side of the computing area 201 can be the input / output area 202, and the area on the other side of the computing area 201 can be the storage area 203. The input / output area 202 can be used to arrange power modules and connection ports so that the server 200 can be plugged into other electronic devices through the connection ports. The storage area 203 can be used to arrange storage devices, which can be, for example, solid-state drives or mechanical hard drives.

[0064] Of the three zones, only computing zone 201 is supplied with coolant. This coolant, a non-dielectric liquid such as a fluorinated liquid or oil, prevents system leakage without catastrophic consequences. Compared to existing solutions that submerge servers 200 in coolant, the liquid cooling system in this embodiment effectively reduces coolant usage, contributing to floor load-bearing performance and lower operating costs.

[0065] For reference Figure 3 and Figure 5When the server 200 is placed horizontally at a workstation, the input / output area 202, computing area 201, and storage area 203 are arranged along the alignment of the rear panel 132 and the front panel 131, with the input / output panel closer to the rear panel 132 and the storage area 203 closer to the front panel 131. When the front panel 131 is opened, the storage area 203 of the server 200 is exposed, allowing operators to directly access and maintain the storage area 203. When the rear panel 132 is opened, the input / output area 202 of the server 200 is exposed, allowing operators to directly access and maintain the input / output area 202. When maintenance is required on the computing area 201, operators can pull the server 200 out of the rack 100 to access the computing area 201.

[0066] It should be understood that when maintenance on server 200 is required, the front panel 131 or rear panel 132 can be opened to inspect and maintain server 200. After maintenance on server 200 is complete, the front panel 131 or rear panel 132 can be closed, ensuring that server 200 operates in a relatively stable environment. Compared to solutions that submerge servers in coolant, the liquid cooling system in this embodiment allows maintenance on server 200 to be performed directly without moving the server 200, improving operational convenience.

[0067] It should be noted that, in some other embodiments, when the interior of the server 200 is divided into at least two independent areas, when the server 200 is placed horizontally in the rack 100, each independent area can be arranged along the arrangement direction of the front panel 131 and the rear panel 132. This can improve the convenience of operation and maintenance of the server 200.

[0068] For reference Figure 2 and Figure 4 The heat dissipation module 300 includes a cooling liquid distribution unit 310 and a circulation piping assembly. The sealed cavity 204 of each server 200 is provided with a liquid inlet hole 230 and a liquid return hole 240. The circulation piping assembly is in communication with the liquid inlet hole 230 and the liquid return hole 240, respectively. The circulation piping assembly is also in communication with the cooling liquid distribution unit 310, so that the cooling liquid in the sealed cavity 204, which has been heated after heat exchange with the heating element 205, can enter the cooling liquid distribution unit 310 through the circulation piping. After heat exchange in the cooling liquid distribution unit 310, the low-temperature cooling liquid returns to the sealed cavity 204 through the circulation piping assembly, thereby achieving a circulating flow of the cooling liquid in the sealed cavity 204.

[0069] In some embodiments, as Figures 2 to 5As shown, the circulation pipeline assembly may include a liquid inlet main pipe 321, a liquid return main pipe 322, a first liquid branch pipe 323, a second liquid branch pipe 324, and liquid inlet branch pipes 325 and liquid return branch pipes 326 corresponding to each server 200. The coolant distribution unit 310 may include a plate heat exchanger 311 and a circulation pump 312. The first end of the liquid inlet main pipe 321 is connected to the plate heat exchanger 311, the second end of the liquid inlet main pipe 321 is connected to the first liquid branch pipe 323, the first end of the liquid inlet branch pipe 325 is connected to the liquid inlet main pipe 321, and the second end of the liquid inlet branch pipe 325 is connected to the liquid inlet hole 230. The first end of the liquid return main pipe 322 is connected to the plate heat exchanger 311, the second end of the liquid return main pipe 322 is connected to the second liquid branch pipe 324, the first end of the liquid return branch pipe 326 is connected to the second liquid branch pipe 324, and the second end of the liquid return branch pipe 326 is connected to the liquid return hole 240. The circulation pump 312 is provided on the liquid inlet manifold 321 or the liquid return manifold 322 to drive the circulation of the coolant in the circulation pipeline assembly.

[0070] In this embodiment, after the coolant in the sealed cavity 204 is heated through heat exchange with the heating element 205, it enters the second liquid distribution pipe 324 through the return hole 240 and then enters the return liquid main pipe 322 through the second liquid distribution pipe 324. The high-temperature coolant in the return liquid main pipe 322 enters the plate heat exchanger 311 for heat exchange. The coolant, which has been cooled after heat exchange in the plate heat exchanger 311, enters the liquid inlet main pipe 321. The low-temperature coolant in the liquid inlet main pipe 321 returns to the sealed cavity 204 through the first liquid distribution pipe 323 and the liquid inlet branch pipe 325, and again exchanges heat with the heating element 205.

[0071] Reference again Figure 2 The heat dissipation module 300 also includes a cold source 330, which is connected to the plate heat exchanger 311 via an inlet pipe 350 and a return pipe 340. Cooling water is stored in the cold source 330. After exchanging heat with the high-temperature coolant in the plate heat exchanger 311, the cooling water returns to the cold source 330 via the return pipe 340. The cold source 330 then provides low-temperature cooling water to the plate heat exchanger 311 via the inlet pipe 350, ensuring that the plate heat exchanger 311 maintains normal operation.

[0072] As an optional implementation scheme, the liquid inlet branch 325 and the first liquid distributing pipe 323 can be connected via a quick connector 329, and the liquid return branch 326 and the second liquid distributing pipe 324 can also be connected via a quick connector 329. The quick connector 329 has a liquid check function. When one of the servers 200 needs maintenance, the quick connector 329 corresponding to the server 200 can be disconnected to ensure that coolant does not continue to flow into the server 200, thereby facilitating maintenance of the server 200. At this time, the other servers 200 can operate normally and will not be disconnected from the first liquid distributing pipe 323 and the second liquid distributing pipe 324 because of the server 200 that needs maintenance. Therefore, by providing the quick connector 329, the convenience of operation and maintenance of the server 200 is further improved.

[0073] For reference Figure 2 and Figure 3 The first liquid distributing pipe 323 and the second liquid distributing pipe 324 can both be disposed within the accommodation space so as to be connected to each liquid inlet branch pipe 325 and the liquid return branch pipe 326. The first liquid distributing pipe 323 and the second liquid distributing pipe 324 both extend along the height direction of the rack 100, and the first liquid distributing pipe 323 and the second liquid distributing pipe 324 can cover all servers 200 in the height direction of the rack 100. When each server 200 is connected to the first liquid distributing pipe 323 and the second liquid distributing pipe 324 through the liquid inlet branch pipe 325 and the liquid return branch pipe 326, respectively, the liquid inlet branch pipe 325 and the liquid return branch pipe 326 can be extended as horizontally as possible, thereby avoiding a chaotic arrangement of the upper and lower adjacent liquid inlet branches 325 and liquid return branches 326, which is not conducive to subsequent maintenance.

[0074] Reference again Figure 4 and Figure 5 When the liquid inlet hole 230 and the liquid return hole 240 are provided, both can be provided on the baffle 220 of the sealed cavity 204. This avoids the problem of the liquid inlet hole 230 and the liquid return hole 240 being provided in the housing 210 and affecting the fixation between the server 200 and the rack 100. In this case, the liquid inlet branch pipe 325 connected to the liquid inlet hole 230 and the liquid return branch pipe 326 connected to the liquid return hole 240 can pass through the area adjacent to the computing power area 201 and respectively connect to the first liquid distribution pipe 323 and the second liquid distribution pipe 324.

[0075] As mentioned above, the interior of the server 200 can be divided into three independent areas, with the computing power area 201 located in the middle. The liquid inlet branch pipe 325 and the liquid return branch pipe 326 can be passed through the input / output area 202. Since there is a large space in the input / output area 202 for the pipeline to pass through, it is not only convenient for the liquid inlet branch pipe 325 and the liquid return branch pipe 326 to pass through, but also does not require additional increase in the volume of the server 200 shell 210.

[0076] Based on this, refer again Figure 3 The first liquid distributing pipe 323 can be arranged near the rear panel 132, and can also be arranged near one of the side panels 133, or can be arranged on one of the side panels 133. Similarly, the second liquid distributing pipe 324 can be arranged near the rear panel 132, and can also be arranged near another panel, or can be arranged on another side panel 133. In this case, the liquid inlet branch pipe 325 and the liquid return branch pipe 326 can be directly connected to the first liquid distributing pipe 323 and the second liquid distributing pipe 324 respectively after passing through the input / output area 202, so as to reduce the length of the liquid inlet branch pipe 325 and the liquid return branch pipe 326, reduce costs, and avoid the confusion caused by the simultaneous arrangement of multiple pipelines due to excessive length of the pipelines.

[0077] For example, when the first dispensing tube 323 is disposed on the side panel 133, the first dispensing tube 323 can be secured to the side panel 133 by welding. When the first dispensing tube 323 is disposed near the side panel 133, the ends of the first dispensing tube 323 can be secured to the bottom plate 110 and the top plate 120, respectively, to ensure that the first dispensing tube 323 remains stable within the rack 100. The second dispensing tube 324 can also be secured to the side panel 133, for example, by welding. Alternatively, the ends of the second dispensing tube 324 can be secured to the bottom plate 110 and the top plate 120, respectively, to ensure that the second dispensing tube 324 remains stable within the rack 100.

[0078] By arranging the first dispensing tube 323 and the second dispensing tube 324 near the side panel 133 or directly fixing them on the side panel 133, the first dispensing tube 323 and the second dispensing tube 324 can be prevented from interfering with the operation of the input / output area 202 of the server 200, thereby ensuring the normal operation of the server 200.

[0079] Further, refer to Figure 2 and Figure 3, the heat dissipation module 300 also includes a refill tank 327, which is arranged inside the accommodating space. Specifically, the refill tank 327 can be located on the side of the top plate 120 facing the bottom plate 110. In this case, the refill tank 327 can be regarded as being located above all servers 200. The refill tank 327 can be used to replenish the first liquid distribution pipe 323 or the second liquid distribution pipe 324 with coolant to ensure that the amount of circulating coolant is sufficient. For example, when the number of servers 200 needs to be increased, the total coolant consumption of the newly added servers 200 and the original servers 200 increases. At this time, the circulating coolant can be replenished by the refill tank 327 to ensure that each server 200 can be filled with enough coolant. Alternatively, in the process of the coolant circulating, the coolant is lost. In this case, the circulating coolant can also be replenished by the refill tank 327 to ensure the heat dissipation effect of each server 200.

[0080] The refill tank 327 can be connected to the first dispensing tube 323 or the second dispensing tube 324 via a quick connector 329, for example. When refilling is needed, the quick connector 329 can be opened to allow some of the coolant in the refill tank 327 to enter the circulation line. When refilling is no longer needed, the quick connector 329 can be disconnected to disconnect the refill tank 327 from the first dispensing tube 323 or the second dispensing tube 324.

[0081] The refill tank 327 may also be provided with an indicator line, which may indicate, for example, the minimum amount of coolant required in the refill tank 327 for normal system operation. After each server 200 is placed in its corresponding workstation, coolant is added to the refill tank 327 until the liquid level stabilizes above the indicator line, indicating that the system has reached the required amount of coolant for normal operation.

[0082] refer to Figure 5 The circulation piping assembly also includes a coolant guide assembly 328, which is located within the sealed cavity 204 and is used to guide the flow of the coolant. Specifically, the coolant guide assembly 328 may include a guide main pipe 3281 and at least one guide branch pipe 3282. The guide main pipe 3281 is connected to the liquid inlet 230. The first end of the guide branch pipe 3282 is connected to the guide main pipe 3281, and the second end of the guide branch pipe 3282 is directly opposite the heating element 205. It can be understood that when the coolant flows to the liquid inlet 230, it can enter the guide main pipe 3281, then flow into the guide branch pipe 3282 connected to the guide main pipe 3281, and finally flow from the guide branch pipe 3282 to the corresponding heating element 205. Through this arrangement, the low-temperature coolant can flow directly to the heating element 205 after entering the sealed cavity 204, exchanging heat with the heating element 205, thereby improving heat exchange efficiency.

[0083] In actual applications, the heat-generating components 205 within the computing power area 201 may include, for example, a CPU and a GPU, which generate relatively high amounts of heat, as well as memory modules, which generate relatively low amounts of heat. To improve the heat dissipation of the heat-generating components 205, the ends of the guide branch pipes 3282 can be aligned directly with the CPU and GPU, allowing low-temperature coolant to be directly and precisely delivered to the CPU and GPU. The memory modules can then be immersed in the coolant for heat dissipation. This effectively avoids local hotspot issues within the server 200.

[0084] Of course, the arrangement of the guide branch pipes 3282 can also be designed according to actual needs. For example, when precise heat dissipation is required for the central processing unit, graphics processing unit and memory stick, three guide branch pipes 3282 can be set, and the three guide branch pipes 3282 are respectively facing the central processing unit, graphics processing unit and memory stick.

[0085] For reference Figures 4 to 6 The baffle 220 between two adjacent areas is also provided with a wiring hole 250. When the components in the two adjacent areas are connected via a cable 206, the cable 206 can pass through the wiring hole 250, so that the two ends of the cable 206 are connected to the components in the two areas respectively. In addition, the wiring hole 250 provided on the baffle 220 of the computing power area 201 is also provided with an airtight connector (not shown in the figure). The cable 206 can be fixed in the wiring hole 250 through the airtight connector. The airtight connector can be used to ensure that the sealed cavity 204 of the computing power area 201 can maintain its airtightness and prevent the coolant in the sealed cavity 204 from leaking.

[0086] In order to further improve the sealing performance of the sealing cavity 204 , the baffle 220 may be made of metal material to reduce the presence of leak points and lower the risk of coolant leakage.

[0087] For reference Figure 5 and Figure 7 In some embodiments, along the arrangement direction of the bottom plate 110 and the top plate 120, the liquid inlet hole 230 is located between the liquid return hole 240 and the bottom plate 110. In other words, the liquid inlet hole 230 is arranged lower than the liquid return hole 240. Furthermore, the horizontal position of the liquid return hole 240 can also be higher than the highest point of all heating elements 205. In this way, when the coolant enters the sealed cavity 204 through the liquid inlet hole 230 and then flows out of the liquid return hole 240, it can ensure that each heating element 205 is immersed in the coolant, thereby increasing the contact area between the heating element 205 and the coolant, and improving the heat exchange efficiency between the coolant and the heating element 205.

[0088] It should be understood that when liquid inlet hole 230 is positioned lower than liquid return hole 240, a significant vertical drop exists between liquid inlet hole 230 and liquid return hole 240. After the low-temperature coolant enters sealed cavity 204 through the lower-positioned liquid inlet hole 230, it exchanges heat with heating element 205, causing the coolant temperature to rise and its density to decrease, allowing the high-temperature coolant to flow upward. At this point, the high-temperature coolant can exit sealed cavity 204 through liquid return hole 240 before the low-temperature coolant, thereby lowering the coolant temperature within sealed cavity 204 to a certain extent and enhancing the heat dissipation effect.

[0089] Of course, in some other embodiments, there may not be an obvious vertical drop between the liquid inlet hole 230 and the liquid return hole 240. The liquid inlet hole 230 and the liquid return hole 240 are roughly located on the same horizontal line, or the liquid inlet hole 230 may also be higher than the liquid return hole 240, as long as it can meet the circulation flow of the coolant.

[0090] In addition, the cooling liquid distribution unit 310 in this embodiment can be configured to perform heat exchange for the servers 200 in one rack 100, or can be configured to perform heat exchange for the servers 200 in multiple racks 100. Alternatively, the cooling liquid distribution units 310 can be in the form of N+X, where N is the number of cooling liquid distribution units 310 enabled during normal operation, and X is the number of standby cooling liquid distribution units 310, thereby ensuring high system reliability.

[0091] As described in the aforementioned embodiment, the rack 100 can be in the form of an air-cooled rack. By adding a first liquid distribution pipe 323 and a second liquid distribution pipe 324 to the interior of the air-cooled rack, the liquid cooling requirements can be met, so there is no need to customize the rack separately. Based on this, the liquid cooling and heat dissipation system in the embodiment of the present invention is highly compatible with the existing air-cooled machine room, so that the existing air-cooled machine room can be modified to meet the use requirements of the liquid cooling and heat dissipation system in the embodiment of the present invention. Moreover, during the modification, the original power distribution, HVAC and other infrastructure of the existing air-cooled machine room can be efficiently reused, thereby further reducing costs.

[0092] It is worth noting that when an air-cooled rack is used as the rack 100 in the embodiment of the present invention, the specifications of the first and second liquid distributing pipes 323 and 324 can be designed to correspond to the specifications of the air-cooled rack. For example, when a 42U standard rack is used, the height of the first and second liquid distributing pipes 323 and 324 are approximately the same as the height of the 42U standard rack. When a 47U standard rack is used, the height of the first and second liquid distributing pipes 323 and 324 are approximately the same as the height of the 47U standard rack.

[0093] Based on the same invention concept, Figure 8, an embodiment of the present invention may also provide a server 1000, which may include a housing 1010 and a partition 1020 disposed in the housing 1010, the partition 1020 may separate the space inside the housing 1010 into at least two independent areas, one of which is a computing power area 1030, and the remaining area is a functional area. The baffle 1020 of the computing power area 1030 cooperates with the housing 1010 to form a sealed cavity, which is used to arrange a heating element 1060, which may be, for example, a central processing unit, a graphics processing unit, a memory stick, and the like. In addition, the sealed cavity can also be used to fill with coolant so that the heating element 1060 can be immersed in the coolant, and the coolant exchanges heat with the heating element 1060, thereby reducing the temperature of the heating element 1060.

[0094] As an optional implementation scheme, Figure 8 As shown, there can be two baffles 1020, which divide the space inside the housing 1010 into three sequentially arranged areas. The computing area 1030 is located in the middle, and the functional areas located on opposite sides of the computing area 1030 are respectively the storage area 1040 and the input / output area 1050. The storage area 1040 is used to arrange storage devices, and the input / output area 1050 can be used to set up connection ports.

[0095] The input / output area 1050 may be provided with a communication port 1070 that communicates with the exterior of the housing 1010. This communication port can, for example, facilitate connection between the connection port of the input / output area 1050 and an external component. The storage area 1040 may also have a communication port (not shown) to allow connection between the storage device within the storage area and an external component. It will be appreciated that providing the communication port 1070 facilitates connection between the server 1000 and external components and facilitates subsequent maintenance of the server 1000.

[0096] The sealed cavity's baffle 1020 is provided with a liquid inlet hole 1021 and a liquid return hole 1022. The liquid inlet hole is connected to the liquid inlet line 2001, and the liquid return hole 1022 is connected to the liquid return line 1022. Coolant outside the server 1000 can enter the sealed cavity through the liquid inlet line 2001, exchange heat with the heating element 1060, and then flow out of the sealed cavity through the liquid return line 2002, thereby achieving circulation of the coolant within the sealed cavity.

[0097] The liquid inlet 1021 and the liquid return 1022 can be provided on the baffle 1020 between the computing power area 1030 and the input / output cavity 1050. In this case, the liquid inlet pipeline 2001 and the liquid return pipeline 2002 can be provided through the input / output area 1050 and connected to the outside through the communication port 1070. This facilitates the layout of the pipelines and improves the maintenance convenience of the server 1000.

[0098] In addition, continue to refer to Figure 8 Baffle 1020 also has wiring holes 1023. When heating elements 1060 in computing area 1030 are connected to components in input / output area 1050 via cables 1080, cables 1080 can pass through wiring holes 1023, thereby establishing a connection between the two adjacent areas. Similarly, cables 1080 connecting heating elements 1060 in computing area 1030 to components in storage area 1040 can also be placed through wiring holes 1023 in baffle 1020.

[0099] To ensure the sealing of the sealed cavity, an airtight connector may be provided in the wiring hole 1023 so that the cable 1080 can be fixed to the wiring hole 1023 through the airtight connector to prevent leakage of the coolant in the sealed cavity.

[0100] During normal operation, the server in this embodiment can be designed so that the return hole 1022 is higher than the inlet hole 1021. After the low-temperature coolant enters the sealed cavity through the lower-positioned inlet hole 1021, it exchanges heat with the heating element 1060, increasing the coolant temperature and decreasing its density, allowing the high-temperature coolant to flow upward. In this case, the high-temperature coolant can exit the sealed cavity through the return hole 1022 before the low-temperature coolant, thereby lowering the coolant temperature within the sealed cavity to a certain extent and enhancing the heat dissipation effect.

[0101] It is worth noting that since the components in the functional area generate less heat during operation, providing ventilation holes 1070 in the functional area can also facilitate air circulation, thereby achieving a heat dissipation effect on the server 1000 to a certain extent.

[0102] In addition, it should be noted that Figures 1 to 8 The internal structure of the server involved is for illustration only and does not represent the actual structure of the server.

[0103] In summary, the liquid cooling system and server in the embodiments of the present invention, by partitioning the server interior so that coolant flows only in the computing area to exchange heat with the heating elements, can effectively reduce coolant usage, thereby lowering floor load requirements and operating costs. By horizontally placing the server in a rack with a first opening and a second opening, the server can be directly accessed for maintenance, improving the convenience of server operation and maintenance.

[0104] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A liquid cooling system, characterized in that: Including racks, servers and cooling modules; The rack is provided with a plurality of workstations for accommodating servers, the plurality of workstations being arranged along the arrangement direction of the top and bottom of the rack, and the servers being placed horizontally at the workstations; The frame has a first opening and a second opening opposite to each other, the orthographic projection of the first opening on a first plane covers each of the workstations, and the orthographic projection of the second opening on the first plane covers each of the workstations, and the first plane is a plane parallel to the arrangement direction of the plurality of workstations; The server includes a housing and a baffle disposed within the housing, the baffle being used to separate the space within the housing into at least two independent areas, the at least two independent areas being arranged along the arrangement direction of the first opening and the second opening, the at least two independent areas including a computing area for arranging heating elements, the baffle of the computing area cooperating with the housing to form a sealed cavity, the sealed cavity being used to be filled with a coolant so that the heating elements are immersed in the coolant; The heat dissipation module is connected to the server and is used to exchange heat with the cooling liquid in the sealed cavity.

2. The liquid cooling system according to claim 1, characterized in that: The heat dissipation module includes a coolant distribution unit and a circulation pipeline assembly. The sealed cavity is provided with a liquid inlet hole and a liquid return hole. The circulation pipeline assembly is respectively connected to the liquid inlet hole and the liquid return hole. The circulation pipeline assembly is also connected to the coolant distribution unit so that the coolant distribution unit exchanges heat with the coolant in the sealed cavity.

3. The liquid cooling system according to claim 2, characterized in that: The circulation pipeline assembly includes a liquid inlet main pipe, a liquid return main pipe, a first liquid distribution pipe, a second liquid distribution pipe, and liquid inlet branches and liquid return branches corresponding to the servers one by one; The first end of the liquid inlet main pipe is connected to the coolant distribution unit, the second end of the liquid inlet main pipe is connected to the first liquid distribution pipe, the first end of the liquid inlet branch pipe is connected to the first liquid distribution pipe, and the other end of the liquid inlet branch pipe is connected to the liquid inlet hole; The first end of the liquid return main pipe is connected to the coolant distribution unit, the second end of the liquid return main pipe is connected to the second liquid distribution pipe, the first end of the liquid return branch pipe is connected to the second liquid distribution pipe, and the second end of the liquid return branch pipe is connected to the liquid return hole.

4. The liquid cooling system according to claim 3, characterized in that: The liquid inlet branch pipe is connected to the first liquid distributing pipe via a quick connector, and / or the liquid return branch pipe is connected to the second liquid distributing pipe via a quick connector.

5. The liquid cooling system according to claim 3, characterized in that: The frame includes a bottom plate, a top plate and side plates, wherein the top plate, the bottom plate and the side plates are connected in sequence to form an accommodating space for accommodating a plurality of the workstations; The side panel includes a front panel and a rear panel that are arranged opposite to each other, the front panel is located on a side of the rack where the first opening is arranged, and the rear panel is located on a side of the rack where the second opening is arranged; The front panel can be opened or closed relative to the accommodation space so that the first opening is open or the front panel covers the first opening; The rear panel can be opened or closed relative to the accommodation space so that the second opening is open or the rear panel covers the second opening.

6. The liquid cooling system according to claim 5, characterized in that: The side panel further includes two opposite side panels, the side panels are located between the front panel and the rear panel, and opposite sides of the side panels are respectively connected to the front panel and the rear panel; The first dispensing tube and the second dispensing tube are both located in the accommodating space. The first dispensing tube is arranged near one of the side panels or on one of the side panels, and the second dispensing tube is arranged near the other side panel or on the other side panel.

7. The liquid cooling system according to claim 5, characterized in that: The heat dissipation module further includes a liquid replenishing tank, which is arranged on a side of the top plate facing the bottom plate, and is connected to the first liquid distributing pipe or the second liquid distributing pipe via a quick connector.

8. The liquid cooling system according to claim 3, characterized in that: The liquid inlet hole and the liquid return hole are arranged on the baffle of the computing power area. The liquid inlet branch pipe passes through the area adjacent to the computing power area and is connected to the first liquid distribution pipe. The liquid return branch pipe passes through the area adjacent to the computing power area and is connected to the second liquid distribution pipe.

9. The liquid cooling system according to claim 7, characterized in that: The server includes two baffles, which divide the interior of the shell into three independent areas. The two baffles and the shell cooperate to form a sealed cavity of the computing power area; The two areas located on both sides of the computing power area are respectively a storage area for arranging storage devices and an input / output area for setting connection ports; The liquid inlet branch pipe and the liquid return branch pipe are respectively arranged through the input / output area.

10. The liquid cooling system according to claim 3, characterized in that: The circulation pipeline assembly further includes a coolant guide assembly, and the coolant guide assembly is disposed in the sealed cavity; The coolant guide assembly includes a guide main pipe and at least one guide branch pipe, the guide main pipe is connected to the liquid inlet hole, the first end of the guide branch pipe is connected to the guide main pipe, and the second end of the guide branch pipe is opposite to the heating element.

11. The liquid cooling system according to claim 1, characterized in that: The baffle is provided with a wiring hole, and the cables connecting the components in two adjacent areas are passed through the wiring hole; An airtight connector is provided in the wiring hole on the baffle of the computing power area, and the cable is fixed in the wiring hole through the airtight connector.

12. The liquid cooling system according to claim 2, characterized in that: Along the arrangement direction of the top and bottom of the frame, the liquid inlet hole is located between the liquid return hole and the bottom of the frame.

13. A server, applied to a liquid cooling system, characterized in that: The server includes a housing and a baffle disposed inside the housing, wherein the baffle is used to separate the space inside the housing into at least two independent areas; The at least two independent areas include a computing area and a functional area. The baffle of the computing area cooperates with the housing to form a sealed cavity. The sealed cavity is used to arrange a heating element and is used to fill the sealed cavity with a coolant. The functional area is provided with a communication port communicating with the outside of the housing. The baffle of the sealed cavity is provided with a liquid inlet hole and a liquid return hole, and the liquid inlet hole and the liquid return hole are respectively used to connect the liquid inlet pipeline and the liquid return pipeline, so that the coolant circulates in the sealed cavity through the liquid inlet pipeline and the liquid return pipeline.

14. The server according to claim 13, wherein: There are two baffles, which divide the interior of the shell into three independent areas. The two baffles and the shell cooperate to form the sealed cavity. The functional area includes a storage area and an input / output area located on both sides of the sealed cavity, the storage area is used to arrange storage devices, and the input / output area is used to set connection ports; The liquid inlet hole and the liquid return hole are arranged on the baffle close to the input / output area, so that the liquid inlet pipeline and the liquid return pipeline pass through the input / output area.

15. The server according to claim 13, wherein: The baffle is provided with a wiring hole, and the wiring hole is used to pass the cables connecting the computing power area and the functional area.

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