Uniform temperature plate air cooling integrated system radiator
Through the combined structure of copper plate, VC temperature uniform plate and heat dissipation fins, combined with micro fans, the problems of low heat transfer efficiency and poor fan integration of the air-cooled radiator are solved, and more efficient heat dissipation and system integration are achieved.
Patent Information
- Application Number
- CN202422456482.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-11
AI Technical Summary
The existing air-cooled radiators have low heat transfer efficiency, poor fan integration, and large volume, which is not conducive to miniaturization.
The combined structure of copper plate, VC temperature uniform plate and heat dissipation fin is adopted, combined with a micro fan, bidirectional heat transfer is achieved through thermally conductive silicone and fan, and the fan is integrated on the heat dissipation fin to optimize the heat transfer path.
It improves heat transfer efficiency, enhances heat dissipation effect, achieves higher system integration and space utilization, and is suitable for miniaturized designs.
Smart Images
Figure CN223261826U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a radiator of a temperature homogenizing plate air-cooling integrated system. Background Art
[0002] Types of radiators include air-cooled radiators, water-cooled radiators, and passive radiators. Air-cooled radiators are the most common type, and they work through a combination of heat sinks and fans, using fans to blow air through the fins to remove heat. Water-cooled radiators use liquid circulation to remove heat, and are usually divided into integrated and split types. The former is easy to install and requires little maintenance, while the latter requires users to build it themselves and is suitable for occasions that require the ultimate heat dissipation effect. Passive radiators do not use fans, but rely on natural convection to dissipate heat, and are suitable for systems with low power consumption or fanless environments. When existing air-cooled radiators are in use, their copper sheets are mostly in direct contact with the heat sink fins. Due to the limited contact area between the copper sheets and the heat sink fins, the heat transfer efficiency is low, and the heat dissipation effect needs to be improved. In addition, the fan and the heat sink fins are not well combined, and the overall volume is large, which is not conducive to miniaturization. Utility Model Content
[0003] The utility model aims to solve the shortcomings of low heat transfer efficiency and poor fan integration in the prior art, and proposes a heat sink with an integrated system of temperature vapor chamber and air cooling.
[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0005] A heat spreader air-cooled integrated system radiator is designed, comprising a copper plate with a chip positioning groove running through the copper plate, a VC heat spreader fixed tightly to the upper surface of the copper plate, and heat dissipation fins fixed tightly to the upper surface of the VC heat spreader, an upper surface of the heat dissipation fin close to the copper plate has an installation position downwardly provided on the upper surface, a fan cover is installed in the installation position, the top of the fan cover is kept flush with the top of the heat dissipation fin, a fan is installed in the fan cover, and a fan cover is installed on the top of the fan cover.
[0006] Preferably, the copper plate is made of oxygen-free copper.
[0007] Preferably, the VC temperature homogenizing plate is an ultra-thin temperature homogenizing plate, and the thickness of the VC temperature homogenizing plate is controlled to be less than 2 mm.
[0008] Preferably, a plurality of pillars are fixed on the lower surface of the VC temperature equalizing plate.
[0009] Preferably, the heat dissipation fins are buckle fins.
[0010] The utility model proposes a heat sink with a temperature-vaporizing plate and air-cooling integrated system, which has the following beneficial effects:
[0011] (1) The heat of the chip can be conducted in two directions. The first way is to conduct it to the bottom of the VC temperature spreader through the thermal conductive silicone, and then conduct it to the heat sink through the VC temperature spreader, and then dissipate the heat through the fan. The second way of heat transfer is to conduct the heat to the copper plate in the form of thermal conduction. The copper plate and the VC temperature spreader are in close contact, and the heat of the copper plate is conducted to the heat sink, achieving more efficient heat transfer.
[0012] (2) A temperature spreader (VC) is installed at the bottom of the radiator substrate. This effectively improves the system's heat dissipation efficiency, making the chip temperature more uniform and maximizing the use of heat dissipation area within a limited space. Fin-shaped fins are combined with micro fans for heat dissipation. The micro fans are small in size and, combined with the fin structure, can effectively dissipate heat.
[0013] (3) A fan is installed on the top of the radiator, and the whole system is integrated, which makes the system space utilization higher. The system fan improves the heat dissipation efficiency, allowing the system to dissipate heat faster and more effectively. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of a heat sink with air cooling integrated system proposed by this utility model. Figure 1 ;
[0015] Figure 2 This is a schematic diagram of the structure of a heat sink with air cooling integrated system proposed by this utility model. Figure 2 ;
[0016] Figure 3 This is a schematic diagram of the structure of a heat sink with air cooling integrated system proposed by this utility model. Figure 3 .
[0017] In the figure: 101, copper plate; 102, VC temperature plate; 103, heat dissipation fin; 104, fan cover; 105, support; 106, fan cover. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0019] Example 1: Reference Figure 1-3, a heat spreader air-cooled integrated system radiator, including a copper plate 101, which is made of oxygen-free copper. A chip positioning groove is penetrated through the copper plate 101, and a VC heat spreader 102 is tightly fixed to the upper surface of the copper plate 101. The VC heat spreader 102 is an ultra-thin heat spreader, and the thickness of the VC heat spreader 102 is controlled below 2mm. The ultra-thin heat spreader has a better thermal conductivity, and a number of pillars 105 are fixed to the lower surface of the VC heat spreader 102. The interior of the VC heat spreader 102 has a micro-structured vacuum cavity, and its working principle is similar to that of a heat pipe, which includes four steps of conduction, evaporation, convection, and solidification. However, the heat dissipation performance of the VC heat spreader 102 is 20%-30% higher than that of the heat pipe, and the temperature equalization effect is better and the heat diffusion is faster. This is because, unlike the single linear heat conduction of the heat pipe, the VC heat spreader 102 with a larger contact area can conduct heat from multiple directions;
[0020] Fins 103 are tightly secured to the upper surface of the VC vapor chamber 102. Fins 103 are buckle-fin fins. Fin-fin technology involves combining individual fins stamped from aluminum alloy or copper into a densely packed parallel fin structure, which is then welded to the base. During stamping, the fins retain a specially designed protrusion at the edges. The fins are secured in a specific mold, bent at the buckle points, and locked together, creating a densely packed parallel fin structure. Fin-fin technology offers advantages such as a simple structure and minimal processing steps, making it suitable for high-volume production. The surface of the VC vapor chamber 102 contacts the fins, resulting in a simple structure and minimal processing steps. Fin-fin fins can compensate for the interface impedance generated by the subsequent connection between the fins and the heat-absorbing base, resulting in relatively stable manufacturing quality. The thin, parallel fins have a small connection area with the heat-absorbing base. Furthermore, considering the actual adhesion and interface impedance of the connection surface, heat conduction between the heat-absorbing base and the fins can become a bottleneck in the heat transfer path of the heat sink. Therefore, the fin buckling process creates a folded edge on the side that contacts the heat. After bending and locking, it forms a relatively flat surface, giving each fin a wider bottom surface. Heat is transferred from the bottom connection surface of the heat source to the "bottom surface" of the individual fins. Then, it is conducted internally to the upright portion that actually dissipates heat.
[0021] The upper surface of the heat sink 103, near the copper plate 101, has a mounting position downwardly defined. A fan cover 104 is mounted in the mounting position. The top of the fan cover 104 is flush with the top of the heat sink 103. A fan is mounted within the fan cover 104, and a fan cap 106 is mounted on top of the fan cover 104. By integrating the entire fan assembly into the heat sink 103, the surface of the entire radiator becomes more regular.
[0022] This utility model attaches the chip to the chip positioning slot in the center of the copper plate 101, secures the chip to the copper plate 101 at the bottom of the VC temperature plate 102, and applies thermally conductive silicone between the chip and the VC temperature plate 102. Heat from the chip is then transferred in two directions: first, through the thermally conductive silicone to the bottom of the VC temperature plate 102, from which it is transferred to the heat sink 103, where it is then dissipated by a fan. The second heat transfer path is through thermal conduction to the copper plate 101, where the copper plate 101 and the VC temperature plate 102 are in close contact, transferring heat from the copper plate 101 to the heat sink 103.
[0023] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A heat sink for an integrated system of a temperature homogenizing plate and air cooling, comprising a copper plate (101), characterized in that: A chip positioning groove is provided through the copper plate (101); a VC temperature averaging plate (102) is fixed tightly to the upper surface of the copper plate (101); a heat dissipation fin (103) is fixed tightly to the upper surface of the VC temperature averaging plate (102); a mounting position is provided downward on the upper surface of the heat dissipation fin (103) close to the copper plate (101); a fan cover (104) is installed in the mounting position; the top of the fan cover (104) is kept flush with the top of the heat dissipation fin (103); a fan is installed in the fan cover (104); and a fan cover (106) is installed on the top of the fan cover (104).
2. The heat sink of the integrated system of temperature vapor chamber and air cooling according to claim 1, characterized in that: The copper plate (101) is made of oxygen-free copper.
3. The heat sink of the integrated system of temperature vapor chamber and air cooling according to claim 1, characterized in that: The VC temperature averaging plate (102) is an ultra-thin temperature averaging plate, and the thickness of the VC temperature averaging plate (102) is controlled to be less than 2 mm.
4. The heat sink of the integrated system of temperature vapor chamber and air cooling according to claim 1, characterized in that: A plurality of pillars (105) are fixed on the lower surface of the VC temperature equalizing plate (102).
5. The heat sink of the integrated system of temperature vapor chamber and air cooling according to claim 1, characterized in that: The heat dissipation fins (103) are buckle fins.