Wafer box pollutant cleaning device and equipment

Abstract

The utility model discloses a wafer box pollutant cleaning device and equipment, and the device comprises a pedestal, a first rotating support, a second rotating support, a fixed support, a first rotating driving part, a second rotating driving part, and a third rotating driving part. The first rotation driving part drives the first rotation support to rotate around a first horizontal direction, and the second rotation driving part drives the second rotation support to rotate around a second horizontal direction perpendicular to the first horizontal direction. The third rotary driving part drives the fixed bracket to rotate around a vertical direction which is vertical to the first horizontal direction and the second horizontal direction; the wafer box can be driven to rotate around three mutually perpendicular directions at the same time, so that an extracting solution in the wafer box can make contact with six inner wall faces of the wafer box in an equal progress mode, all-directional and dead-corner-free contact is achieved, pollutants on the inner surface of the wafer box are fully extracted, and standard, automatic and comprehensive extraction and cleaning of the inner surface of the wafer box are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of cleaning contaminants from wafer boxes, and in particular to a device and equipment for cleaning contaminants from wafer boxes. Background Art

[0002] A wafer cassette is a container used to store and transport wafers. It is typically made of high-purity materials to ensure the wafers remain contaminated during transportation and storage. To protect the wafers from contamination from both the external environment and the internal environment of the cassette, the cassette must be cleaned and inspected before use.

[0003] Existing wafer box cleaning mainly adopts fully manual or semi-manual extraction cleaning, which cannot achieve standard automated cleaning. Manual real-time detection of the contaminant level of the extraction liquid is required to ensure that the contaminants in the wafer box are reduced to an acceptable level. The cleaning process is complicated and inefficient. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application provides a wafer cassette contamination cleaning device and equipment to solve the problem in the prior art that extraction cleaning wafer cassettes cannot achieve standard automated cleaning, requiring manual real-time detection of the contamination level of the extraction liquid to ensure that the contamination in the wafer cassette is reduced to an acceptable level, resulting in a complicated cleaning process and low efficiency.

[0005] The purpose of this application can be achieved through the following technical solutions:

[0006] In a first aspect, the present application provides a wafer cassette contaminant cleaning device, comprising a base, a first rotating bracket, a second rotating bracket, a fixed bracket, a first rotating drive member, a second rotating drive member, and a third rotating drive member, wherein a receiving cavity for receiving the wafer cassette is provided in the fixed bracket, the first rotating bracket is rotatably mounted on the base via a first rotating drive member, the first rotating drive member is configured to drive the first rotating bracket to rotate relative to the base, the second rotating bracket is rotatably mounted on the first rotating bracket via a second rotating drive member, the second rotating drive member is configured to drive the second rotating bracket to rotate relative to the first rotating bracket, the fixed bracket is rotatably mounted on the second rotating bracket via a third rotating drive member, the third rotating drive member is configured to drive the fixed bracket to rotate relative to the second rotating bracket;

[0007] The first rotating bracket rotates around a first horizontal direction, the second rotating bracket rotates around a second horizontal direction perpendicular to the first horizontal direction, and the fixed bracket rotates around a vertical direction perpendicular to both the first and second horizontal directions.

[0008] Optionally, the base includes a first bottom plate and a pair of first support plates vertically arranged on the first bottom plate, and the first rotating bracket is arranged inside the base, wherein one first support plate is rotationally connected to the first rotating bracket through a first rotating shaft, and the other first support plate is rotationally connected to the first rotating bracket through a first rotating drive member.

[0009] Optionally, the first rotating bracket includes a second base plate and a pair of second support plates and a pair of third support plates vertically arranged around the second base plate, the pair of second support plates corresponding one-to-one to the pair of first support plates, wherein one second support plate is rotatably connected to the corresponding first support plate via a first rotating shaft, and the other second support plate is rotatably connected to the corresponding first support plate via a first rotating driving member, the second rotating bracket is arranged inside the first rotating bracket, and one of the third support plates is rotatably connected to the second rotating bracket via a second rotating shaft, and the other third support plate is rotatably connected to the second rotating bracket via a second rotating driving member.

[0010] Optionally, the second rotating bracket includes a third base plate and a pair of fourth support plates vertically arranged on the third base plate, the fixed bracket is arranged inside the second rotating bracket, the pair of fourth support plates corresponds one-to-one to the pair of third support plates, one of the fourth support plates is rotatably connected to the corresponding third support plate through a second rotating shaft, and the other fourth support plate is rotatably connected to the corresponding third support plate through a second rotating drive member.

[0011] Optionally, the fixed bracket includes a top plate, a fourth bottom plate and a side plate, the top plate and the fourth bottom plate are arranged opposite to each other up and down, the side plate is arranged between the fourth bottom plate and the top plate, a accommodating cavity is formed between the fourth bottom plate, the top plate and the side plates, and the fourth bottom plate and the third bottom plate are rotatably connected through a third rotating drive member.

[0012] Optionally, a heating jacket is provided on the fixing bracket, and the heating jacket is configured to provide a set ambient temperature for the accommodating cavity.

[0013] Optionally, a pfa bracket is used as the fixing bracket.

[0014] Optionally, the first rotary drive member is a rotary cylinder;

[0015] and / or,

[0016] The second rotary drive member is a rotary cylinder;

[0017] and / or,

[0018] The third rotary drive member is a rotary cylinder.

[0019] Optionally, the rotational speeds of the first rotary driving member, the second rotary driving member, and the third rotary driving member are all between 1.0 r / m and 100 r / m.

[0020] In the second aspect, the present application provides a wafer box contaminant cleaning device, including an ultra-clean workbench and a wafer box contaminant cleaning device as described above, the ultra-clean workbench has an operating chamber for accommodating the wafer box contaminant cleaning device, and an FFU ultrafiltration membrane is provided outside the ultra-clean workbench to seal the opening of the working chamber.

[0021] Beneficial effects:

[0022] In the present application, the first rotating bracket is rotated around a first horizontal direction, the second rotating bracket is rotated around a second horizontal direction perpendicular to the first horizontal direction, and the fixed bracket is rotated around a vertical direction perpendicular to both the first horizontal direction and the second horizontal direction. After the wafer box is fixedly installed in the accommodating cavity, it can be driven to rotate around three mutually perpendicular directions at the same time, so that the extraction liquid in the wafer box can contact the 6 inner wall surfaces of the wafer box in an equal progress manner, and can achieve all-round and dead-angle-free contact, thereby fully extracting the contaminants in the wafer box, effectively performing comprehensive extraction and cleaning on the inner surface of the wafer box, and realizing standard automation of wafer box extraction and cleaning, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present application will be further described below with reference to the accompanying drawings.

[0024] Figure 1 This is a three-dimensional diagram of a wafer box contaminant cleaning device in one embodiment of the present application;

[0025] Figure 2 This is a front view of a wafer box contaminant cleaning device in one embodiment of the present application;

[0026] Figure 3 This is a perspective view of a portion of the first rotating bracket, the second rotating bracket, and the fixed bracket in one embodiment of the present application;

[0027] Figure 4 It is a front view of part of the first rotating bracket, the second rotating bracket and the fixed bracket in one embodiment of the present application.

[0028] Description of reference numerals:

[0029] 1. Base; 11. First bottom plate; 12. First support plate; 2. First rotating bracket; 21. Second bottom plate; 22. Second support plate; 23. Third support plate; 3. Second rotating bracket; 31. Third bottom plate; 32. Fourth support plate; 4. Fixed bracket; 41. Accommodating cavity; 42. Top plate; 43. Fourth bottom plate; 44. Side plate; 5. First rotary drive member; 6. Second rotary drive member; 7. Third rotary drive member; 8. First rotating shaft; 9. Second rotating shaft. DETAILED DESCRIPTION

[0030] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] See also Figure 1-3 As shown, in some embodiments, the present application provides a wafer box contaminant cleaning device, which includes a base 1, a first rotating bracket 2, a second rotating bracket 3, a fixed bracket 4, a first rotating drive member 5, a second rotating drive member 6 and a third rotating drive member 7.

[0032] The fixed support 4 is provided with a receiving cavity 41, into which the wafer cassette is placed during cleaning operations. The first rotating support 2 is rotatably mounted on the base 1 via a first rotating drive 5, which is configured to drive the first rotating support 2 to rotate relative to the base 1. The second rotating support 3 is rotatably mounted on the first rotating support 2 via a second rotating drive 6, which is configured to drive the second rotating support 3 to rotate relative to the first rotating support 2. The fixed support 4 is rotatably mounted on the second rotating support 3 via a third rotating drive 7, which is configured to drive the fixed support 4 to rotate relative to the second rotating support 3.

[0033] Among them, the first rotating bracket 2 rotates around a first horizontal direction, the second rotating bracket 3 rotates around a second horizontal direction perpendicular to the first horizontal direction, and the fixed bracket 4 rotates around a vertical direction perpendicular to both the first horizontal direction and the second horizontal direction, so that after the wafer box is fixedly installed in the accommodating cavity 41, it can be driven to rotate around three mutually perpendicular directions, so that the extraction liquid in the wafer box can contact the inner wall of the wafer box in all directions without dead angles, thereby fully extracting the contaminants in the wafer box, effectively extracting and cleaning the wafer box, and making the cleanliness of the wafer box meet the requirements.

[0034] It should be understood that there is no specific limitation on the specific directions of the first horizontal direction, the second horizontal direction and the vertical direction, and it only requires that the three directions are perpendicular to each other.

[0035] See also Figure 1 and Figure 2 As shown, in some embodiments, the base 1 includes a horizontally arranged first bottom plate 11 and a pair of first support plates 12 vertically arranged on the first bottom plate 11, and a reinforcing rib plate is arranged between the outer sides of the first bottom plate 11 and each first support plate 12 to improve the connection strength between the first bottom plate 11 and the first support plate 12.

[0036] The first rotating bracket 2 is arranged inside the base 1 , wherein one first support plate 12 is rotationally connected to the first rotating bracket 2 via a first rotating shaft 8 , and the other first support plate 12 is rotationally connected to the first rotating bracket 2 via a first rotating driving member 5 .

[0037] Specifically, the first rotating bracket 2 includes a second base plate 21 and a pair of second support plates 22 and a pair of third support plates 23 vertically arranged around the second base plate 21. The pair of second support plates 22 are arranged opposite each other, and the pair of third support plates 23 are arranged opposite each other. When the wafer box contamination cleaning device is not in operation, the second base plate 21 is spaced apart and arranged above the first base plate 11 and parallel to the first base plate 11. The second support plates are parallel to the first support plates 12, and the pair of second support plates 22 correspond one-to-one with the pair of first support plates 12. One of the second support plates is rotationally connected to the corresponding first support plate 12 via the first rotating shaft 8, and the other second support plate is rotationally connected to the corresponding first support plate 12 via the first rotating drive member 5, so that the first rotating drive member 5 can drive the first rotating bracket 2 to rotate about the first rotating shaft 8 relative to the base 1.

[0038] The second rotating bracket 3 is arranged inside the first rotating bracket 2 , and one of the third support plates 23 is rotationally connected to the second rotating bracket 3 via a second rotating shaft 9 , and the other third support plate 23 is rotationally connected to the second rotating bracket 3 via a second rotating driving member 6 .

[0039] See also Figure 2-4 As shown, specifically, the second rotating bracket 3 includes a third base plate 31 and a pair of fourth support plates 32 vertically arranged on the third base plate 31. When the round box extraction and cleaning device is not working, the third base plate 31 is spaced apart and arranged above the second base plate 21 and parallel to the second base plate 21. The pair of fourth support plates 32 corresponds to the pair of third support plates 23 one by one, wherein one fourth support plate 32 is rotatably connected to the corresponding third support plate 23 through the second rotating shaft 9, and the other fourth support plate 32 is rotatably connected to the corresponding third support plate 23 through the second rotating drive member 6, so that the second rotating drive member 6 can drive the second rotating bracket 3 to rotate around the first rotating shaft 8 relative to the first rotating bracket 2.

[0040] The fixed bracket 4 is disposed within the second rotating bracket 3 and includes a top plate 42, a fourth bottom plate 43, and side plates 44. The top plate 42 and the fourth bottom plate 43 are disposed vertically opposite each other, and the side plates 44 are disposed between the fourth bottom plate 43 and the top plate 42. Three side plates 44 are provided, distributed along three perpendicular directions, and spaced apart from each other. A receiving cavity 41 is formed between the fourth bottom plate 43, the top plate 42, and the side plates 44. The side of the fixed bracket 4 where the side plates 44 are not disposed forms an opening to the receiving cavity 41, through which a wafer cassette can be placed into the receiving cavity 41. The fourth bottom plate 43 and the third bottom plate 31 are rotatably connected via a third rotary drive member 7, enabling the third rotary drive member 7 to drive the fixed bracket 4 to rotate about its own axis relative to the second rotating bracket 3.

[0041] The fixing bracket 4 is equipped with a fixing member (not shown) for fixing the wafer box in the accommodating chamber 41. The fixing bracket 4 is also provided with a heating jacket (not shown). The heating jacket is used to heat the temperature in the accommodating chamber 41 to a set temperature during the cleaning and extraction process of the wafer box so that the extraction liquid can more effectively extract the contaminants in the wafer box.

[0042] Furthermore, the fixing bracket 4 is made of a PFA bracket to prevent contaminants from growing on the fixing bracket 4 and contaminating the wafer box.

[0043] The first rotary drive member 5 and / or the second rotary drive member 6 and / or the third rotary drive member 7 are / is a rotary cylinder.

[0044] The rotational speeds of the first rotary driving member 5, the second rotary driving member 6 and the third rotary driving member 7 are all between 1.0r / m and 100r / m, such as 10r / m, 20r / m, 30r / m, 40r / m, 50r / m, 50r / m, 50r / m, 50r / m and 90r / m, so that the extraction liquid can fully contact the inner wall of the wafer box.

[0045] In this application, the extraction process of contaminants in the wafer box:

[0046] The extraction liquid is placed in the wafer cassette, which is then sealed with a lid. The cassette is then fixed in the accommodating cavity 41 of the fixed bracket 4. The second and third rotary drive members 6 and 7 are first used to synchronously drive the wafer cassette to rotate in a manner similar to "revolution + rotation," thereby allowing the extraction liquid to flow along and fully contact the inner wall surface of the wafer cassette. The first rotary drive member 5 is then used to drive the wafer cassette to "revolve" further, further ensuring that the extraction liquid fully contacts the inner wall surface of the wafer cassette, thereby ensuring that the extraction liquid fully contacts the inner wall surface of the wafer cassette in all directions without blind spots, thereby collecting / extracting the contaminants on the inner wall surface of the wafer cassette.

[0047] In this application, 2% nitric acid is used as an extracting solution for cationic pollutants, and high-purity water is used as an extracting solution for anionic pollutants. The volume of the extracting solution accounts for 5% to 25% of the total volume of the wafer box.

[0048] The present application also provides a wafer box contaminant cleaning device, which includes an ultra-clean workbench (not shown) and the above-mentioned wafer box contaminant cleaning device. The ultra-clean workbench is provided with an operating chamber for accommodating the wafer box contaminant cleaning device. During the cleaning operation, the wafer box contaminant cleaning device is placed in the operating chamber of the ultra-clean workbench for operation, and an FFU ultrafiltration membrane is provided outside the ultra-clean workbench to seal the opening of the working chamber. The environment outside the wafer box contaminant cleaning device reaches ISOclass 4 or above, thereby preventing the extract from being contaminated by the environment during the process of pouring or pouring out the extract, thereby affecting the measurement results of the extract.

[0049] The above is a detailed description of an embodiment of the present application. However, the content is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent application.

[0050] It should be noted that the terms "first", "second" and similar terms used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. The descriptions of the directions of "left", "right", "left side", "right side", "upper", "lower", "top", "bottom" and so on in this application are all defined based on the relationship between the orientations or positions shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the structure must be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. In the description of this application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0051] In the description of this application, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

Claims

1. A wafer box contaminant cleaning device, characterized in that: The invention comprises a base, a first rotating bracket, a second rotating bracket, a fixed bracket, a first rotating driving member, a second rotating driving member and a third rotating driving member, wherein the fixed bracket is provided with an accommodating cavity for accommodating a wafer box, the first rotating bracket is rotatably mounted on the base via the first rotating driving member, the first rotating driving member is configured to drive the first rotating bracket to rotate relative to the base, the second rotating bracket is rotatably mounted on the first rotating bracket via the second rotating driving member, the second rotating driving member is configured to drive the second rotating bracket to rotate relative to the first rotating bracket, the fixed bracket is rotatably mounted on the second rotating bracket via the third rotating driving member, and the third rotating driving member is configured to drive the fixed bracket to rotate relative to the second rotating bracket; The first rotating bracket rotates around a first horizontal direction, the second rotating bracket rotates around a second horizontal direction perpendicular to the first horizontal direction, and the fixed bracket rotates around a vertical direction perpendicular to both the first horizontal direction and the second horizontal direction.

2. The wafer box contaminant cleaning device according to claim 1, characterized in that: The base includes a first bottom plate and a pair of first support plates vertically arranged on the first bottom plate. The first rotating bracket is arranged inside the base, wherein one of the first support plates is rotatably connected to the first rotating bracket via a first rotating shaft, and the other first support plate is rotatably connected to the first rotating bracket via the first rotating driving member.

3. The wafer box contaminant cleaning device according to claim 2, characterized in that: The first rotating bracket includes a second base plate and a pair of second support plates and a pair of third support plates vertically arranged around the second base plate, the pair of second support plates corresponding to the pair of first support plates respectively, wherein one of the second support plates is rotatably connected to the corresponding first support plate via the first rotating shaft, and the other second support plates are rotatably connected to the corresponding first support plate via the first rotating driving member, the second rotating bracket is arranged inside the first rotating bracket, and one of the third support plates is rotatably connected to the second rotating bracket via the second rotating shaft, and the other third support plate is rotatably connected to the second rotating bracket via the second rotating driving member.

4. The wafer box contaminant cleaning device according to claim 3, characterized in that: The second rotating bracket includes a third base plate and a pair of fourth support plates vertically arranged on the third base plate. The fixed bracket is arranged inside the second rotating bracket. The pair of fourth support plates corresponds to the pair of third support plates one by one. One of the fourth support plates is rotatably connected to the corresponding third support plate through a second rotating shaft, and the other fourth support plate is rotatably connected to the corresponding third support plate through the second rotating drive member.

5. The wafer box contaminant cleaning device according to claim 4, characterized in that: The fixed bracket includes a top plate, a fourth bottom plate and a side plate, the top plate and the fourth bottom plate are arranged opposite to each other up and down, the side plate is arranged between the fourth bottom plate and the top plate, the accommodating cavity is formed between the fourth bottom plate, the top plate and the side plates, and the fourth bottom plate and the third bottom plate are rotatably connected via the third rotating drive member.

6. The wafer box contaminant cleaning device according to claim 1, characterized in that: A heating jacket is provided on the fixing bracket, and the heating jacket is configured to provide a set ambient temperature for the accommodating cavity.

7. The wafer box contaminant cleaning device according to claim 1, characterized in that: The fixing bracket is a pfa bracket.

8. The wafer box contaminant cleaning device according to claim 1, characterized in that: The first rotary drive member is a rotary cylinder; and / or, The second rotary drive member is a rotary cylinder; and / or, The third rotary driving member is a rotary cylinder.

9. The wafer box contaminant cleaning device according to claim 1, characterized in that: The rotation speeds of the first rotation driving member, the second rotation driving member and the third rotation driving member are all between 1.0 r / m and 100 r / m.

10. A wafer box contaminant cleaning device, characterized in that: It comprises an ultra-clean workbench and a wafer box contaminant cleaning device as described in any one of claims 1 to 9, wherein the ultra-clean workbench is provided with an operating chamber for accommodating the wafer box contaminant cleaning device, and an FFU ultrafiltration membrane is provided outside the ultra-clean workbench to seal the opening of the operating chamber.

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