Cleaning device of semiconductor device and semiconductor device system

Abstract

The utility model discloses a cleaning device of semiconductor equipment and a semiconductor equipment system. The cleaning device comprises a body part, a filtering device, a vacuum generating device, a pipeline and a brush part, a base of the body part comprises a cleaning channel for the semiconductor equipment, and the cleaning channel is connected with a pipeline through a cleaning air inlet; one port of the filtering device is connected with the cleaning channel through a pipeline, the other port of the filtering device is connected with an air suction port of the vacuum generating device through a pipeline, and an air outlet of the vacuum generating device is suitable for being communicated with the outside of the body part; the brush part is located below the base and can move along with the body part so as to drive a cleaned object on the semiconductor equipment to enter the cleaning channel and enter the filtering device through the cleaning air inlet. According to the utility model, the semiconductor production environment is improved, the cleaning efficiency of semiconductor equipment is improved, and the labor cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a cleaning device for semiconductor equipment and a semiconductor equipment system. Background Art

[0002] During the semiconductor manufacturing process, semiconductor products (such as wafer cassettes) inevitably need to be transported between equipment. However, during this process, both the transport and handling operations generate a large number of dust particles. These dust particles not only affect the entire dust-free production environment but can also seriously affect product quality. To reduce the adverse effects of these dust particles, manual cleaning is generally relied upon, which is not only inefficient but also increases labor costs. Utility Model Content

[0003] Based on this, the purpose of the present invention is to provide a semiconductor equipment cleaning device and a semiconductor equipment system to solve at least one of the above technical problems. The technical solution is as follows:

[0004] In one aspect, the present invention provides a cleaning device for semiconductor equipment, comprising a main body, a filter device, a vacuum generating device, a pipe, and a brush portion;

[0005] The base of the main body includes a cleaning channel for semiconductor equipment, and the cleaning channel is connected to the pipeline through a clean air inlet;

[0006] One port of the filter device is connected to the cleaning channel via the pipe, the other port of the filter device is connected to the air intake port of the vacuum generator via the pipe, and the air outlet of the vacuum generator is adapted to communicate with the outside of the main body;

[0007] The brush portion is located below the base and can move along with the main body to drive the object to be cleaned on the semiconductor device into the cleaning channel and into the filter device through the clean air inlet.

[0008] In some embodiments, the clean air inlet includes a first air inlet and a second air inlet, the pipeline includes a first pipeline and a second pipeline, the first pipeline includes a first pipeline branch, a second pipeline branch and a third pipeline branch;

[0009] Wherein, the first end of the first pipeline branch is connected to the filtering device, the first air inlet is connected to the second end of the first pipeline branch through the second pipeline branch, and the second air inlet is connected to the second end of the first pipeline branch through the third pipeline branch;

[0010] Both ends of the second pipeline are respectively communicated with the other port of the filter device and the air suction port of the vacuum generating device.

[0011] In some embodiments, the cleaning device further comprises at least one camera located on the body portion;

[0012] The at least one camera is suitable for collecting photos or videos of the semiconductor device before and / or after cleaning; and / or, the at least one camera monitors the working status of the cleaning device and sends abnormal reminders of the cleaning device during the cleaning process.

[0013] In some embodiments, the cleaning device further comprises a display screen and a controller located on the body portion;

[0014] Wherein, the display screen is electrically connected to the controller, and the display screen is suitable for obtaining operating parameters for the vacuum generating device;

[0015] The controller is electrically connected to the vacuum generating device, and the controller is at least suitable for controlling the vacuum generating device to generate negative air pressure according to the operating parameters.

[0016] In some embodiments, the cleaning device further includes a speed regulator, which is electrically connected to the vacuum generating device and is suitable for adjusting the magnitude of the gas negative pressure value provided by the vacuum generating device.

[0017] In some embodiments, the filter device includes a detachable filter element, and the object to be cleaned of the semiconductor device is blocked by the filter element and accommodated inside the filter device.

[0018] In some embodiments, the brush portion is detachably mounted below the base and is located on the opposite side of the forward direction of the cleaning device.

[0019] In some embodiments, the cleaning device further comprises at least one handle member located on the body portion, wherein the at least one handle member is suitable for moving the position of the cleaning device.

[0020] In some embodiments, the cleaning device further includes one or more of a heat dissipation device, a power supply device, and a start-stop device located on the main body.

[0021] In some embodiments, the cleaning device is located at a target tool position on the semiconductor equipment;

[0022] Furthermore, during the operation of the semiconductor device, the cleaning device can automatically clean the objects to be cleaned attached to the semiconductor device.

[0023] On the other hand, the present invention provides a semiconductor equipment system, comprising any one of the cleaning devices for semiconductor equipment.

[0024] The semiconductor equipment cleaning device and semiconductor equipment system provided by the present invention have at least the following beneficial effects:

[0025] A cleaning device for semiconductor equipment includes a main body, a filter, a vacuum generator, a pipe, and a brush. The base of the main body includes a cleaning channel for the semiconductor equipment, which is connected to the pipe via a clean air inlet. One port of the filter is connected to the cleaning channel via a pipe, and another port of the filter is connected to the air intake of the vacuum generator via a pipe. The air outlet of the vacuum generator is adapted to communicate with the exterior of the main body. The brush is located below the base and can move with the main body to drive objects to be cleaned on the semiconductor equipment into the cleaning channel and then into the filter through the clean air inlet. Thus, the cleaning device for semiconductor equipment automatically cleans objects on the semiconductor equipment, eliminating the need for full human involvement in the cleaning process. This improves the semiconductor production environment, enhances the cleaning efficiency of the semiconductor equipment, and reduces labor costs. Furthermore, the combination of the vacuum generator, filter, and brush enables dual cleaning of the semiconductor equipment, further improving cleaning effectiveness and efficiency while also reducing the number of rework operations.

[0026] It should be understood that the above general description and the following detailed description are merely illustrative and do not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present invention or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a perspective view of a cleaning device for semiconductor equipment according to an embodiment of the present invention;

[0029] Figure 2 This is a front view of a cleaning device for semiconductor equipment according to an embodiment of the present invention;

[0030] Figure 3 This is a rear view of a cleaning device for semiconductor equipment according to an embodiment of the present invention.

[0031] Among them, 11. Main body, 111. Base, 112. Cleaning channel, 12. Filtering device, 13. Vacuum generating device, 14. First pipeline, 141. First pipeline branch, 142. Second pipeline branch, 143. Third pipeline branch, 15. Second pipeline, 16. Brush part, 17. Camera, 18. Display screen, 19. Controller, 21. Handle part, 22. Heat dissipation device, 23. Power supply device, 24. Start-stop device.

[0032] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. DETAILED DESCRIPTION

[0033] To make the purpose, technical solutions, and advantages of the present invention more clearly apparent, the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the embodiment described is merely one embodiment of the present invention, and not all embodiments. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0034] The term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Furthermore, the terms "first," "second," etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than that illustrated or described herein.

[0036] Furthermore, the term "at least one" refers to one or more, and the term "more than one" refers to two or more. The term "and / or" describes an association between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0037] During the semiconductor manufacturing process, it is inevitable to transfer semiconductor products (such as wafer cassettes) between equipment. However, during this process, both the transmission and handling operations generate a large amount of dust particles. These dust particles not only affect the entire dust-free production environment but can also have a serious impact on product quality.

[0038] For example, automated material handling systems are an essential component of the semiconductor industry. These systems can include overhead cranes, rails, stackers, and conveyors. Wafer cassettes are transported along the conveyor belts. When they reach their destination, they are grabbed by the stacker's arm and loaded onto the overhead crane for transport.

[0039] The inventors discovered that during the entire handling process, a large amount of dust particles are generated between the wafer cassette and the conveyor belt. Analysis revealed that friction between the bottom of the wafer cassette and the conveyor belt provides the cassette's forward propulsion. This friction causes the two to rub against each other, generating a large number of dust particles. These dust particles not only affect the entire production environment, but the wafer cassette also carries some of these dust particles onto other equipment, potentially seriously impacting product quality.

[0040] In addition, the inventors also found that when the wafer box is transported by the stacker, the stacker's arm grabs the wafer box and moves it to the designated position. During this movement, the wafer box will rub against the shelf position, generating dust particles. These dust particles will also interfere with the clean room environment and affect product quality.

[0041] In the related art, in order to reduce the adverse effects of these dust particles, manual cleaning is generally relied on, which not only has low cleaning efficiency but also increases labor costs.

[0042] In view of this, the utility model provides a cleaning device for semiconductor equipment and a semiconductor equipment system having the cleaning device, so as to improve the semiconductor production environment while increasing cleaning efficiency and saving labor costs.

[0043] like Figures 1 to 3 As shown, the utility model provides a cleaning device for semiconductor equipment, which includes a main body 11 , a filter device 12 , a vacuum generating device 13 , a pipeline and a brush part 16 .

[0044] The base 111 of the main body 11 includes a cleaning channel 112 for semiconductor equipment. The base 111 may be provided with at least one clean air inlet (not shown) connected to the cleaning channel 112, and the cleaning channel 112 is connected to the pipeline through the clean air inlet. The cleaning channel 112 may have a channel entrance and a channel exit. The channel entrance may be provided at the bottom of the base 111 to accommodate the entry of the cleaned object on the semiconductor equipment. The channel entrance may be provided at the top of the base 111, and the channel entrance may match the number of clean air inlets, and each channel entrance may be connected to a corresponding clean air inlet.

[0045] One port of the filter device 12 is connected to the cleaning channel 112 via a pipe, and the other port of the filter device 12 is connected to the air intake port of the vacuum generating device 13 via a pipe. The air outlet of the vacuum generating device 13 is adapted to communicate with the outside of the main body 11. Optionally, the pipe may include a first pipe 14 and a second pipe 15. Specifically, illustratively, one port of the filter device 12 may be connected to the cleaning channel 112 via at least one clean air inlet and the first pipe 14, and the other port of the filter device 12 may be connected to the vacuum generating device 13 via the second pipe 15, i.e., the two ends of the second pipe 15 are respectively connected to the other port of the filter device 12 and the air intake port of the vacuum generating device 13. The filter device 12 is used to filter out objects to be cleaned on semiconductor equipment. The vacuum generating device 13 is used to generate negative pressure in the cleaning channel 112 of the cleaning device during operation to provide the main power source for the operation of the cleaning device.

[0046] The brush portion 16 is located below the base 111, and the brush portion 16 can move with the main body 11 to drive the cleaned object on the semiconductor device into the cleaning channel 112 and enter the filter device through the clean air inlet. The semiconductor device can be a device in the semiconductor field that generates cleaned objects (such as dust particles) during production and / or transportation. Exemplarily, the semiconductor device can include but is not limited to transmission equipment, stackers, etc. in automatic material handling systems. During the automatic or passive movement of the cleaning device, the brush portion 16 installed below the base 111 of the main body 11 can move with the cleaning device, so that the brush portion 16 can act on the cleaned object on the semiconductor device, and then drive the cleaned object into the cleaning channel 112 through the brush portion 16.

[0047] In practical applications, the vacuum generating device 13 may include a small vacuum pump, the motor in which drives the blades to rotate at high speed, thereby generating negative air pressure inside the cleaning device. This negative air pressure is used to draw in mixed air containing objects to be cleaned (e.g., dust particles) on the semiconductor device. The mixed air enters the cleaning channel 112 in the base 111 through the channel inlet, and then passes through the channel outlet of the cleaning channel 112, the clean air inlet, and the first pipeline 14 in sequence to enter the filter device 12. The mixed air is then filtered by the filter device 12, and the filtered air is sent to the vacuum generating device 13 through the second pipeline 15. Finally, the filtered air is discharged to the outside of the main body 11 through the air outlet of the vacuum generating device 13, thereby completing a single cleaning process for the semiconductor device. In addition, the brush portion 16 under the base 111 of the cleaning device can move with the cleaning device, so that the brush portion 16 can act on the object to be cleaned on the semiconductor device, and through the cooperative vacuum generating device 13, it can drive the remaining or more cleaned objects to further enter the cleaning channel 112, and then enter the filtering device 12 through various pipes to realize further cleaning processing.

[0048] The above embodiment utilizes a cleaning device suitable for semiconductor equipment to automatically clean objects on the equipment, eliminating the need for full human involvement. This improves the semiconductor production environment while increasing cleaning efficiency and saving labor costs. Furthermore, the combination of vacuum generator 13, filter 12, and brush 16 enables dual cleaning of the semiconductor equipment, further enhancing cleaning effectiveness and efficiency while reducing rework.

[0049] In some embodiments, the clean air inlet includes a first air inlet and a second air inlet. The first pipeline 14 includes a first pipeline branch 141, a second pipeline branch 142, and a third pipeline branch 143. The first end of the first pipeline branch 141 is connected to the filter device 12, the first air inlet is connected to the second end of the first pipeline branch 141 through the second pipeline branch 142, and the second air inlet is connected to the second end of the first pipeline branch 141 through the third pipeline branch 143.

[0050] Specifically, the first air inlet and the second air inlet can be arranged on different sides of the base 111. In the present embodiment, the first air inlet and the second air inlet can be arranged on the front side and the rear side of the base 111, respectively. Of course, in some other embodiments, the first air inlet and the second air inlet can be arranged on the left side or the right side of the base 111, or the first air inlet and the second air inlet can also be arranged on the same side of the base 111. The first pipeline 14 includes a first pipeline branch 141, a second pipeline branch 142 and a third pipeline branch 143, each of which is respectively connected to the filter device 12, the first air inlet and the second air inlet. The first pipeline branch 141 includes a first end and a second end, wherein the first end is connected to the filter device 12, and the second end is connected to the second pipeline branch 142 and the third pipeline branch 143, respectively, and the second pipeline branch 142 and the third pipeline branch 143 are respectively connected to the first air inlet and the second air inlet. As an example only, the first branch pipe 141, the second branch pipe 142, and the third branch pipe 143 can be integrally formed. As another example only, the first branch pipe 141, the second branch pipe 142, and the third branch pipe 143 can be independently formed, and the first branch pipe 141, the second branch pipe 142, and the third branch pipe 143 can be interconnected via a connecting element such as a three-way valve or a connecting pipe.

[0051] In actual application, the objects to be cleaned on the semiconductor equipment can enter the second pipeline branch 142 from the first air inlet, and enter the filtering device 12 through the first pipeline branch 141 connected to the second pipeline branch 142. The objects to be cleaned can also enter the third pipeline branch 143 from the second air inlet, and enter the filtering device 12 through the first pipeline branch 141 connected to the third pipeline branch 143.

[0052] The above embodiment increases the pipeline space size for the cleaned objects on the semiconductor equipment to enter the filtering device by setting two cleaning air inlets, namely the first air inlet and the second air inlet, and combining them with a matching number of three pipeline branches in the pipeline, thereby accelerating the collection of more cleaned objects, and helping to improve the cleaning efficiency and cleaning effect of the cleaning device.

[0053] It should be noted that the number of air inlets of the at least one cleaning air inlet is not limited to the two mentioned above, and may include a greater or lesser number. Accordingly, the first pipeline 14 may also include pipeline branches that match the number of air inlets to assist in quickly collecting more objects to be cleaned on the semiconductor device.

[0054] In some embodiments, the cleaning device further includes at least one camera 17 located on the main body 11. The at least one camera 17 is adapted to capture photos or videos of the semiconductor device before and / or after cleaning; and / or the at least one camera 17 monitors the operating status of the cleaning device and issues alerts regarding abnormalities during the cleaning process.

[0055] Specifically, the cleaning device is further provided with n cameras 17 located on the main body 11, where n is a positive integer. These n cameras 17 can capture photos or videos of the semiconductor device before and / or after cleaning. Furthermore, these n cameras 17 can monitor the operating status of the cleaning device and issue notifications if any abnormalities occur during the cleaning process.

[0056] In this embodiment, the number of cameras 17 provided is four, and each camera 17 may be a wide-angle camera 17, and the four wide-angle cameras 17 may be located at the four vertex positions of the main body 11, respectively. Of course, in some other embodiments, the camera 17 may be an ordinary camera 17 or another type of camera 17, and the installation position of the camera 17 may be other suitable positions on the cleaning device. By providing the camera 17, it is possible to observe which specific position has more objects to be cleaned (such as dust particles), and to check the effects before and after cleaning. In addition, while the cleaning device is cleaning the object to be cleaned, it can send an abnormal reminder through the camera 17 to remind relevant staff to promptly discover online problems.

[0057] In the above embodiment, by providing at least one camera on the cleaning device, the camera can be used to observe the number of objects being cleaned at different locations on the semiconductor equipment, and by recording photos or videos before and after the cleaning, the cleaning results can be easily viewed. In addition, the monitoring function of the additional camera allows the camera to monitor the operating status of the cleaning device in real time. If an abnormal operating state is detected, the camera can send an abnormality reminder during the cleaning process to alert relevant personnel of the abnormal situation at a specific location, thereby helping to promptly detect online problems, improve environmental cleaning effects, and further prevent defects in semiconductor products caused by environmental factors during transportation and storage.

[0058] In some embodiments, the cleaning device further includes a display screen 18 and a controller 19 located on the main body 11. Display screen 18 is electrically connected to controller 19 and is adapted to obtain operating parameters of vacuum generating device 13. Controller 19 is electrically connected to vacuum generating device 13 and is adapted to control vacuum generating device 13 to operate under negative pressure based on the operating parameters.

[0059] Specifically, the display screen 18 can display various functions or parameter configuration interfaces, and the user can configure parameters through the display screen 18 to obtain the operating parameters for the vacuum generating device 13. Among them, the operating parameters may include but are not limited to the operating time, the negative pressure level, etc. The display screen 18 interacts with the controller 19, and the controller 19 obtains the operating parameters of the vacuum generating device 13 configured on the display screen 18 for logical processing, and controls the vacuum generating device 13 to perform negative pressure operation according to the operating parameters. In this embodiment, the display screen 18 can be a touch screen, and the controller 19 can be a programmable logic controller 19 (PLC). Of course, in other embodiments, the display screen 18 can be an ordinary display screen 18, and the operating parameters of the vacuum generating device 13 can be configured by using, for example, a mouse, keyboard, etc. The model of the controller 19 PLC can be some universal adapter models, and the specific model of the controller 19 is not specifically limited here.

[0060] In the above embodiment, the display screen and the controller are configured to jointly control the operation of the vacuum generating device, thereby improving the flexibility and controllability of the cleaning device.

[0061] In some embodiments, the cleaning device further includes a speed regulator (not shown), which is electrically connected to the vacuum generating device 13 and is suitable for adjusting the gas negative pressure value provided by the vacuum generating device 13 .

[0062] Specifically, the speed regulator can be located on the main body 11. The speed regulator may include an operating knob for adjusting the vacuum suction force of the vacuum generating device 13. The regulator is electrically connected to the vacuum generating device 13. By adjusting the operating knob on the regulator, the user can adjust the negative pressure of the gas provided by the vacuum generating device 13, thereby adjusting the vacuum suction force of the vacuum generating device 13 acting on the object being cleaned to meet the requirements of online cleaning.

[0063] In the above embodiment, a speed regulator is configured to adjust the size of the gas negative pressure value provided by the vacuum generating device, so that the vacuum suction of the vacuum generating device is controllable, and the suction can be flexibly adjusted according to different online cleaning requirements to adapt to different cleaning needs.

[0064] In some embodiments, the filter device 12 includes a detachable filter element, and the cleaned object of the semiconductor device is blocked by the filter element and contained inside the filter device 12. Specifically, the filter device 12 filters out the cleaned object in the mixed air entering the filter device 12 through the detachable filter element, so as to contain the blocked cleaned object inside the filter device 12, and sends the unblocked gas into the vacuum generating device 13 to be discharged through the air outlet of the vacuum generating device 13. Exemplarily, the detachable manner may be snap-fitting, hinged, etc., which are other conventional manners and will not be elaborated here. In this way, by providing a detachable filter element, it is convenient to replace the filter element regularly, thereby ensuring the filtering effect and efficiency of the filter device 12.

[0065] In some embodiments, the brush portion 16 is removably mounted below the base 111 and is located on the side opposite to the forward direction of the cleaning device. In this embodiment, if the first side of the base 111 is one side of the forward direction and the second side of the base 111 is the side opposite to the forward direction, then the brush portion 16 is removably mounted on the second side below the base 111, i.e., the brush portion 16 is mounted on the side away from the forward direction of the cleaning device. Exemplary detachable arrangements may include snap-fitting, hinged connections, etc., which are other conventional arrangements and are not described here. This reduces the forward resistance of the brush portion 16 on the opposite side during the forward movement of the cleaning device, thereby improving the cleaning efficiency of the cleaning device. Furthermore, the brush portion 16 on the opposite side can contact the remaining object being cleaned after the vacuum generator 13 performs a single adsorption cleaning process, thereby further cleaning the object through the brush portion, further improving cleaning efficiency and reducing brush portion wear. Furthermore, the provision of a removable brush portion facilitates regular replacement of the brush portion, ensuring the cleaning effectiveness of the cleaning device.

[0066] In some embodiments, the cleaning device further includes at least one handle 21 located on the main body 11, adapted to move the cleaning device. In this embodiment, there are two handles 21, one located on the left and one on the right side of the miniaturized cleaning device. These handles facilitate user movement of the cleaning device, enabling cleaning of different semiconductor devices or cleaning areas, thereby improving the device's ease of operation.

[0067] In some embodiments, the cleaning device further includes one or more of a heat dissipation device 22, a power supply device 23, and a start-stop device 24 located on the main body 11. Specifically, the heat dissipation device 22 can be an exhaust fan, which can be provided on the main body 11 of the cleaning device to achieve heat dissipation of the cleaning device. The power supply device 23 can be, for example, a 24V DC power supply to provide power support for the entire cleaning device. The start-stop device 24 can be a one-button start / emergency stop device, which can include a start button and an emergency stop button. In abnormal circumstances, the operation of the cleaning device can be directly suspended by operating the emergency stop button, thereby improving the safety and flexibility of the device operation.

[0068] In some embodiments, the cleaning device is located at a target machine position on the semiconductor equipment; and during the operation of the semiconductor equipment, the cleaning device can automatically clean objects to be cleaned attached to the semiconductor equipment. Optionally, the target machine position can include, but is not limited to, a conveyor belt of a conveyor or a shelf of a stocker. During use, the cleaning device can automatically perform cleaning operations in accordance with the operation of the semiconductor equipment to automatically clean objects to be cleaned (such as dust particles) attached to the semiconductor equipment, thereby achieving an automatic cleaning effect, further saving manpower and improving cleaning efficiency.

[0069] The following briefly describes the working process of the cleaning device involved in some embodiments, taking the semiconductor equipment used in the transmission equipment and stacker in the automatic material handling system as an example:

[0070] Using the handle 21 on the cleaning device, the cleaning device is placed on the conveyor belt of the conveying equipment or on the shelf of the stacker, and the side with the brush portion 16 is placed on the opposite side of the running direction of the cleaning device. The size of the cleaning device matches the size of the semiconductor product (such as a wafer box). After that, the power supply device 23 is turned on, and the cleaning device automatically runs on the conveyor belt or shelf position. The vacuum generating device 13 is turned on through the display 18, and the vacuum suction of the vacuum generating device 13 can be adjusted by the speed regulator. The negative air pressure generated by the vacuum generating device 13 and the brush portion 16 are used to jointly perform the cleaning work on the cleaned objects on the semiconductor equipment. After the cleaning work is completed, the cleaning device is removed from the semiconductor equipment, the housing of the cleaning device is opened, and the filter element in the filter device 12 is replaced. In addition, during the cleaning work, the camera 17 on the cleaning device will collect video before and after cleaning. The user can check the past video footage captured by the camera 17 and verify the cleaning work status.

[0071] The present invention further provides a semiconductor equipment system, including any of the above-described semiconductor equipment cleaning devices. By way of example only, the semiconductor equipment system may include, but is not limited to, equipment systems in the semiconductor field that generate objects to be cleaned (e.g., dust particles) during production and / or transportation, for example, automated material handling systems.

[0072] It should be noted that the specific implementation details and beneficial effects of the cleaning device in the semiconductor equipment system can be found in the above embodiments and will not be repeated here.

[0073] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A cleaning device for semiconductor equipment, characterized in that: It includes a main body, a filter device, a vacuum generating device, a pipeline and a brush part; The base of the main body includes a cleaning channel for semiconductor equipment, and the cleaning channel is connected to the pipeline through a clean air inlet; One port of the filter device is connected to the cleaning channel via the pipe, the other port of the filter device is connected to the air intake port of the vacuum generator via the pipe, and the air outlet of the vacuum generator is adapted to communicate with the outside of the main body; The brush portion is located below the base and can move along with the main body to drive the object to be cleaned on the semiconductor device into the cleaning channel and into the filter device through the clean air inlet.

2. The device according to claim 1, characterized in that The clean air inlet includes a first air inlet and a second air inlet, the pipeline includes a first pipeline and a second pipeline, the first pipeline includes a first pipeline branch, a second pipeline branch and a third pipeline branch; Wherein, the first end of the first pipeline branch is connected to the filtering device, the first air inlet is connected to the second end of the first pipeline branch through the second pipeline branch, and the second air inlet is connected to the second end of the first pipeline branch through the third pipeline branch; Both ends of the second pipeline are respectively communicated with the other port of the filter device and the air suction port of the vacuum generating device.

3. The device according to claim 1, characterized in that The cleaning device further includes at least one camera located on the body portion; The at least one camera is adapted to capture photos or videos of the semiconductor device before and / or after cleaning; And / or, the at least one camera monitors the working status of the cleaning device and sends an abnormal reminder of the cleaning device during the cleaning process.

4. The device according to claim 1, characterized in that The cleaning device further includes a display screen and a controller located on the main body; Wherein, the display screen is electrically connected to the controller, and the display screen is suitable for obtaining operating parameters for the vacuum generating device; The controller is electrically connected to the vacuum generating device, and the controller is at least suitable for controlling the vacuum generating device to generate negative air pressure according to the operating parameters.

5. The device according to claim 1, characterized in that The cleaning device further includes a speed regulator, which is electrically connected to the vacuum generating device and is suitable for adjusting the magnitude of the air negative pressure value provided by the vacuum generating device.

6. The device according to any one of claims 1 to 5, characterized in that: The filter device includes a detachable filter core, and the object to be cleaned of the semiconductor device is blocked by the filter core and accommodated inside the filter device.

7. The device according to any one of claims 1 to 5, characterized in that: The brush portion is detachably mounted below the base and is located on the opposite side of the forward direction of the cleaning device.

8. The device according to any one of claims 1 to 5, characterized in that: The cleaning device further comprises at least one handle member located on the body portion, wherein the at least one handle member is adapted to move the position of the cleaning device; And / or, the cleaning device further includes one or more of a heat dissipation device, a power supply device, and a start-stop device located on the main body.

9. The device according to any one of claims 1 to 5, characterized in that: The cleaning device is located at a target tool position on the semiconductor device; Furthermore, during the operation of the semiconductor device, the cleaning device can automatically clean the objects to be cleaned attached to the semiconductor device.

10. A semiconductor equipment system, characterized in that: A cleaning device for semiconductor equipment comprising the device described in any one of claims 1 to 9.

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