Multi-step overflow groove
Through the multi-step overflow tank design, the problem of sequential confusion and large deionized water consumption during the wafer cleaning process is solved, and the accuracy of wafer cleaning and efficient utilization of water resources are achieved.
Patent Information
- Application Number
- CN202422477917.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-14
AI Technical Summary
During the cleaning process of existing wafers after polishing, the order of the wafers is easily confused, resulting in insufficient cleaning or corrosion, and the consumption of deionized water is large.
A multi-step overflow tank is designed to allow deionized water to flow from left to right through the setting of multiple overflow boxes, and the wafers to overflow from right to left in sequence to avoid sequential confusion, and to control the water flow direction through the partition to improve water utilization.
The accuracy of wafer sequence and cleaning are achieved, while reducing the consumption of deionized water and improving the reliability of wafer appearance quality.
Smart Images
Figure CN223264467U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer cleaning, and in particular relates to a multi-step overflow trough. Background Art
[0002] Wafers are one of the most important raw materials for LEDs. They are not only the core component for LED light generation but also play a vital role in other electronic devices and systems. Their performance and composition directly impact the functionality and efficiency of the final product. With the continuous advancement of semiconductor technology, the requirements for wafer surface quality are becoming increasingly stringent. To prevent residual chemical residue on the wafer surface after polishing, which could cause corrosion, wafers must be rinsed with deionized water overflow after polishing.
[0003] Currently, after polishing, wafers are cleaned using an overflow system in a rectangular container. This overflow tank has a simple structure, is easy to clean internally, and can accommodate multiple drying racks simultaneously, meaning that many wafers can be washed simultaneously through overflow. However, when multiple drying racks are in the same container, it can easily lead to incorrect ordering of the drying racks when they are removed. In mild cases, this results in inadequate overflow cleaning of the wafers, leaving residual chemical residue on the wafer surface, which can corrode the wafer surface. In more severe cases, the order of the wafers can be incorrectly adjusted. In even more serious cases, wafers with different crystal orientations or different doping levels can overflow simultaneously, confusing the wafer order and causing unforeseen consequences. Furthermore, this overflow method consumes more deionized water.
[0004] Therefore, how to provide a multi-step overflow tank that can avoid confusion in the order of wafer cleaning has become a problem that technicians in this field need to consider. Utility Model Content
[0005] In view of this, the utility model provides a multi-step overflow trough. The utility model sets up multiple overflow boxes so that the entire overflow process is carried out in sequence from right to left, avoiding the risk of confusion in the order of chips. Deionized water flows from left to right, improving the utilization rate of deionized water and reducing water consumption.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A multi-step overflow trough comprises a first overflow box, a second overflow box, a third overflow box and a fourth overflow box, wherein the first overflow box, the second overflow box, the third overflow box and the fourth overflow box are respectively connected by a first partition plate, a second partition plate and a third partition plate, the surfaces of the first partition plate, the second partition plate and the third partition plate are all provided with overflow holes, the height of the overflow holes decreases successively from the first partition plate to the third partition plate, the bottom of the side plates of the first overflow box and the second overflow box are both provided with deionized water pipes, which are connected to the main water inlet pipe through a tee, and the bottom of the side plate of the fourth overflow box is provided with a drainage hole.
[0008] Furthermore, the heights of the first overflow box and the second overflow box are higher than the third overflow box and the fourth overflow box.
[0009] Furthermore, two drainage holes are provided, each of which is connected to a water outlet pipe, and the water outlet pipe is connected to the main water outlet pipe through a tee.
[0010] Furthermore, the overflow hole of the first partition is 3 to 5 cm higher than the overflow hole of the second partition, and the overflow hole of the second partition is 3 to 5 cm higher than the overflow hole of the third partition.
[0011] Furthermore, the diameter of the overflow holes is 1.5 to 2 cm, and the hole spacing is 2 to 3 cm.
[0012] Furthermore, the main water inlet pipe and the main water outlet pipe are both provided with flow valves.
[0013] The beneficial effects of the present invention are as follows: by placing only one spin-drying rack in each overflow box slot, the entire overflow process is sequentially from right to left, thereby avoiding the risk of confusion in the order of wafers, and deionized water flows from left to right, thereby improving the utilization rate of deionized water, reducing water consumption, and improving the reliability of the wafer appearance quality through sufficient overflow cleaning of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of the utility model.
[0015] In the picture:
[0016] 1. First overflow box; 2. Second overflow box; 3. Third overflow box; 4. Fourth overflow box; 5. First baffle; 6. Second baffle; 7. Third baffle; 8. Overflow hole; 9. Deionized water pipe; 10. Main water inlet pipe; 11. Water outlet pipe; 12. Main water outlet pipe;
[0017] A. Wafer overflow cleaning direction;
[0018] B. Deionized water flow direction. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.
[0020] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "horizontal", "inner", "outer", "one side", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limiting the present invention. The terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or circuit connections; they can be direct connections, indirect connections through an intermediate medium, or internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] Example 1
[0022] like Figure 1 As shown, this embodiment discloses a multi-step overflow trough, including a first overflow box 1, a second overflow box 2, a third overflow box 3 and a fourth overflow box 4. In this embodiment, the first overflow box 1 and the second overflow box 2 have the same height, the third overflow box 3 and the fourth overflow box 4 have the same height, the first overflow box 1 and the second overflow box 2 have higher heights than the third overflow box 3 and the fourth overflow box 4, and their internal trough bodies are all rectangular structures.
[0023] Among them, the first overflow box 1, the second overflow box 2, the third overflow box 3 and the fourth overflow box 4 are respectively connected by the first partition 5, the second partition 6 and the third partition 7. The surfaces of the first partition 5, the second partition 6 and the third partition 7 are all provided with overflow holes 8. The overflow holes 8 in this embodiment are three circular overflow holes 8 of equal height located on each partition. The diameter of the overflow holes 8 is 1.5~2cm, the hole spacing is 2~3cm, and the height of the overflow holes 8 decreases from the first partition 5 to the third partition 7. Specifically, the overflow hole 8 of the first partition 5 is 3~5cm higher than the overflow hole of the second partition 6, and the overflow hole of the second partition 6 is 3~5cm higher than the overflow hole of the third partition 7.
[0024] The bottom of the side panels of the first overflow box 1 and the second overflow box 2 are both provided with a deionized water pipe 9, which is connected to the main water inlet pipe 10 through a tee. The bottom of the side panel of the fourth overflow box 4 is provided with a drainage hole. There are two drainage holes, which are respectively connected to the outlet pipe 11, and the outlet pipe 11 is connected to the main outlet pipe 12 through a tee.
[0025] As a preferred embodiment of the present utility model, both the main water inlet pipe 10 and the main water outlet pipe 12 are provided with flow valves.
[0026] The chip overflow process in the present invention is as follows: clean deionized water can flow into the first overflow box 1 and the second overflow box 2 through the deionized water pipe 9. When the liquid level in the first overflow box 1 is higher than the overflow hole 8, the deionized water overflows into the second overflow box 2. Similarly, the deionized water in the second overflow box 2 can flow into the third overflow box 3. The deionized water in the third overflow box 3 can flow to the fourth overflow box 4, and finally flow into the outlet pipe 11 from the drainage hole of the fourth overflow box 4.
[0027] Each overflow tank in this utility model contains only one spin-drying rack, meaning only 25 wafers overflow from each tank. Before the wafers overflow, the liquid level within each tank of the first overflow tank 1, the second overflow tank 2, and the third overflow tank 3 is at the same height as the overflow hole 8 on the right side of the tank cavity. The liquid level within the fourth overflow tank 4 is 2 to 3 centimeters higher than the spin-drying rack.
[0028] When the chips overflow, first soak the drying rack without chips in the fourth overflow box 4. The chips are placed in the corresponding positions of the drying rack in order of chip numbers. When the drying rack has the required number of chips, the drying rack with chips is immediately placed in the third overflow box 3 for overflow. The overflow time of the chips in the third overflow box 3 is 0.5 minutes to 1 minute. Then the drying rack with chips is placed in the second overflow box 2. The overflow time of the second overflow box 2 is 2 minutes to 3 minutes. Finally, it is placed in the first overflow box 1 for overflow for 1 minute to 2 minutes. After the chip overflow is completed, the drying rack with chips is placed in the dryer for drying. The first overflow box 1 can be selectively used according to the number of overflowing chips. It should be noted that during the overflow process of the multi-step overflow tank, deionized water flows from left to right, and the overflow process of the chips is from right to left.
[0029] Although the above description of the specific implementation methods of the present invention is combined with the accompanying drawings, it does not limit the scope of protection of the present invention. Technical personnel in the relevant field should understand that on the basis of the technical solution of the present invention, various modifications or deformations that can be made by technical personnel in this field without creative work are still within the scope of protection of the present invention.
Claims
1. A multi-step overflow trough, characterized in that: It includes a first overflow box, a second overflow box, a third overflow box and a fourth overflow box. The first overflow box, the second overflow box, the third overflow box and the fourth overflow box are connected by a first partition, a second partition and a third partition respectively. The surfaces of the first partition, the second partition and the third partition are all provided with overflow holes. The height of the overflow holes decreases successively from the first partition to the third partition. The bottom of the side plates of the first overflow box and the second overflow box are both provided with deionized water pipes, which are connected to the main water inlet pipe through a tee. The bottom of the side plate of the fourth overflow box is provided with a drainage hole.
2. A multi-step overflow trough according to claim 1, characterized in that: The first overflow box and the second overflow box are higher than the third overflow box and the fourth overflow box.
3. The multi-step overflow trough according to claim 1, characterized in that: There are two drainage holes, each of which is connected to a water outlet pipe. The water outlet pipe is connected to the main water outlet pipe through a tee.
4. The multi-step overflow trough according to claim 1, characterized in that: The overflow hole of the first partition is 3 to 5 cm higher than the overflow hole of the second partition, and the overflow hole of the second partition is 3 to 5 cm higher than the overflow hole of the third partition.
5. The multi-step overflow trough according to claim 1, characterized in that: The diameter of the overflow holes is 1.5 to 2 cm, and the hole spacing is 2 to 3 cm.
6. The multi-step overflow trough according to claim 3, characterized in that: The main water inlet pipe and the main water outlet pipe are both provided with flow valves.