Laser processing device and equipment
By designing two sets of laser processing components and grasping components in the laser processing equipment to slide on the stage mechanism in different directions, the problem of low processing efficiency of laser cutting equipment is solved, efficient laser processing and dust management are achieved, and the adaptability and stability of the equipment are improved.
Patent Information
- Application Number
- CN202422495837.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-16
AI Technical Summary
At this stage, laser cutting equipment has low processing efficiency when cutting boards, mainly due to the limitations of a single laser head.
Two sets of laser processing components are used to slide on the stage mechanism in different directions, and combined with the collaborative work of the two sets of grasping components, the efficient loading and unloading of the workpieces is achieved, ensuring the matching of the working rhythm of the laser processing components.
It improves the processing efficiency of laser processing equipment, reduces the space occupied by the equipment, enhances the adaptability and stability of the equipment, and reduces the impact of dust.
Smart Images
Figure CN223264987U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device and equipment. Background Art
[0002] Laser processing has the characteristics of high processing precision, low environmental pollution, high degree of automation, and non-contact processing. It is widely used in industries such as automobile manufacturing, mechanical engineering, and shipbuilding.
[0003] Laser cutting equipment uses laser processing technology to cut workpieces. At present, when cutting plates, laser cutting equipment generally uses a single laser head to cut the plate, so the processing efficiency of laser cutting equipment is low. Utility Model Content
[0004] The embodiments of the present application provide a laser processing device and equipment, which can improve the processing efficiency of laser processing equipment.
[0005] In a first aspect, an embodiment of the present application provides a laser processing device, comprising:
[0006] stage mechanism;
[0007] Two sets of laser processing components, both of which are slidably mounted on the stage mechanism along a first direction;
[0008] a support frame, the support frame spanning above the stage mechanism along the second direction;
[0009] Two groups of grabbing assemblies, both groups of grabbing assemblies are slidably arranged on the support frame along the second direction;
[0010] The first direction and the second direction are perpendicular to each other in the processing plane of the stage mechanism.
[0011] In some possible implementations of the first aspect, the two groups of laser processing components are slidably disposed on the same slide rail, and the two gripping components are slidably disposed on the same slide rail.
[0012] In some possible implementations of the first aspect, the stage mechanism includes:
[0013] A bed, wherein the bed forms a setting space, and the laser processing assembly is slidably mounted on the bed;
[0014] A workbench is placed in the setting space.
[0015] In some possible implementations of the first aspect, the laser processing device further includes:
[0016] A scrap cart is arranged at the bottom of the bed, the workbench includes a support frame and a plurality of support bars, the support frame is placed in the setting space, and the support bars are arranged on the support frame at intervals along the first direction.
[0017] In some possible implementations of the first aspect, a plurality of dust extraction holes are provided on the inner side of the bed.
[0018] In some possible implementations of the first aspect, the laser processing assembly includes:
[0019] a crossbeam, the crossbeam being slidably disposed on the platform mechanism along the first direction;
[0020] a first driving unit, the first driving unit being slidably disposed on the beam along the second direction;
[0021] A laser head is arranged at the output end of the first driving unit, and the first driving unit is used to drive the laser head to rise and fall.
[0022] In some possible implementations of the first aspect, the grabbing component includes:
[0023] a second driving unit, the second driving unit being slidably disposed on the supporting frame along the second direction;
[0024] The grabbing unit is detachably arranged at the output end of the second driving unit, and the second driving unit is used to drive the grabbing unit to rise and fall.
[0025] In some possible implementations of the first aspect, the grabbing unit includes:
[0026] a mounting bracket, the mounting bracket being detachably disposed at an output end of the second driving unit;
[0027] A plurality of suction cups are provided on the mounting frame, and positions of the suction cups are adjustable.
[0028] In some possible implementations of the first aspect, the laser processing device further includes:
[0029] two sets of conveying guide rails, the conveying guide rails being arranged on two opposite sides of the platform mechanism along the second direction;
[0030] A conveying unit is movably arranged on the conveying guide rail.
[0031] In a second aspect, an embodiment of the present application provides a laser processing device, which includes a laser processing device as described in any one of the above technical solutions.
[0032] The laser processing device and equipment provided in the embodiments of the present application, the stage mechanism is used to carry the workpiece, and the two groups of laser processing components are slidably arranged on the stage mechanism along the first direction, which can improve the efficiency of the laser processing of the workpiece by the laser processing components; the support frame spans above the stage mechanism along the second direction, and the two groups of grabbing components are slidably arranged on the support frame along the second direction, so that the grabbing components can move above the stage mechanism to load the workpiece onto the stage mechanism or unload the workpiece from the stage mechanism; since there are two groups of laser processing components that can perform laser processing on the workpiece respectively, and one group of grabbing components can load the workpiece onto the stage mechanism, and the other group of grabbing components can unload the workpiece from the stage mechanism; so that the working rhythm of the grabbing components and the laser processing components are matched, thereby improving the processing efficiency of the laser processing device. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0034] Figure 1 This is a schematic structural diagram of an embodiment of the laser processing device of the present application;
[0035] Figure 2 for Figure 1 Schematic diagram of some structures in Figure 1 ;
[0036] Figure 3 for Figure 2 Exploded diagram;
[0037] Figure 4 for Figure 1 Schematic diagram of some structures in Figure 2 .
[0038] Description of Figure Numbers:
[0039] 1. Carrier mechanism; 11. Bed; 111. Dust extraction hole; 12. Workbench; 121. Support frame; 122. Support bar; 13. Setting space; 2. Laser processing component; 21. Crossbeam; 22. First drive unit; 23. Laser head; 3. Support frame; 4. Grabbing component; 41. Second drive unit; 42. Grabbing unit; 421. Mounting frame; 422. Suction cup; 5. Scrap cart; 6. Conveyor rail; 7. Conveyor unit.
[0040] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0042] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0043] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0044] It should be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0046] The embodiments of the present application provide a laser processing device and equipment for solving the technical problem of low processing efficiency of laser processing equipment.
[0047] In the embodiments of this application, Figure 1 As shown, the laser processing device includes a stage mechanism 1, a support frame 3, two sets of laser processing components 2, and two sets of gripping components 4. The two sets of laser processing components 2 are slidably mounted on the stage mechanism 1 along a first direction. The support frame 3 spans above the stage mechanism 1 along a second direction, and the two sets of gripping components 4 are slidably mounted on the support frame 3 along the second direction.
[0048] The first direction and the second direction are perpendicular to each other in the processing plane of the stage mechanism 1 .
[0049] In this embodiment, if Figure 1 As shown, the first direction is parallel to the X direction, and the second direction is parallel to the Y direction.
[0050] The stage mechanism 1 is used to carry a workpiece, and the laser processing assembly 2 is used to emit a laser beam to perform laser processing on the workpiece on the stage mechanism 1. In this embodiment, the workpiece can be a plate.
[0051] In one embodiment, a set of gripping assemblies 4 is used to grasp workpieces and place them on the stage mechanism 1. Once the gripping assemblies 4 have placed two workpieces on the stage mechanism 1, the two sets of laser processing assemblies 2 move simultaneously to laser process the workpieces on the stage mechanism 1. After laser processing is completed on the workpieces, another set of gripping assemblies 4 grabs the completed workpieces from the stage mechanism 1 and places them at the unloading position. This facilitates control of the laser processing device to laser process the workpieces.
[0052] The carrier mechanism 1 of the embodiment of the present application is used to carry the workpiece, and the two groups of laser processing components 2 are slidably arranged on the carrier mechanism 1 along the first direction, which can improve the efficiency of laser processing of the workpiece by the laser processing component 2; the support frame 3 spans above the carrier mechanism 1 along the second direction, and the two groups of grabbing components 4 are slidably arranged on the support frame 3 along the second direction, so that the grabbing components 4 can move above the carrier mechanism 1 to load the workpiece onto the carrier mechanism 1 or unload the workpiece from the carrier mechanism 1; since there are two groups of laser processing components 2 that can perform laser processing on the workpiece respectively, and one group of grabbing components 4 can load the workpiece onto the carrier mechanism 1, and the other group of grabbing components 4 can unload the workpiece from the carrier mechanism 1; so that the grabbing components 4 match the working rhythm of the laser processing components 2, thereby improving the processing efficiency of the laser processing device.
[0053] In one embodiment, if Figure 2 and Figure 4 As shown, two laser processing assemblies 2 slide on the same slide rail, and two gripping assemblies 4 slide on the same slide rail. Sharing a slide rail with the laser processing assemblies 2 improves their spatial compactness. Sharing a slide rail with the gripping assemblies 4 also improves their spatial compactness, thereby reducing the space occupied by the laser processing apparatus.
[0054] In one embodiment, if Figure 2 and Figure 3As shown, the platform mechanism 1 includes a bed 11 and a workbench 12. The bed 11 defines a setting space 13, and the laser processing assembly 2 is slidably mounted on the bed 11; the workbench 12 is placed in the setting space 13. The workbench 12 is used to carry the workpiece, and the bed 11 is used to carry the laser processing assembly 2. Since the workbench 12 is placed in the setting space 13, there is no connection between the workbench 12 and the bed 11. When the laser processing assembly 2 processes the workpiece on the workbench 12, the workbench 12 is affected by the heat generated by the laser processing and may deform. Since the workbench 12 is not connected to the bed 11, deformation of the workbench 12 can be avoided.
[0055] In one embodiment, if Figure 2 and Figure 3 As shown, the laser processing apparatus further includes a scrap cart 5, which is disposed at the bottom of the bed 11. The worktable 12 includes a support frame 121 and a plurality of support bars 122. The support frame 121 is placed within the installation space 13, and the support bars 122 are spaced apart from the support frame 121 along a first direction. Because the support bars 122 are spaced apart, waste generated by the laser processing assembly 2 processing a workpiece falls through the gaps between the support bars 122 and is collected by the scrap cart 5 disposed at the bottom of the bed 11. The support frame 121 is used to mount the support bars 122, which are used to support the workpiece.
[0056] In one embodiment, if Figure 3 As shown, a plurality of dust extraction holes 111 are provided on the inner side of the bed 11. Negative pressure can be generated in the dust extraction holes 111 to absorb dust generated by the laser processing assembly 2 when processing the workpiece, thereby reducing the impact of dust on the laser processing.
[0057] In one embodiment, if Figure 2 As shown, the laser processing assembly 2 includes a crossbeam 21, a first drive unit 22, and a laser head 23. The crossbeam 21 is slidably mounted on the stage mechanism 1 along a first direction. The first drive unit 22 is slidably mounted on the crossbeam 21 along a second direction. The laser head 23 is disposed at the output end of the first drive unit 22, and the first drive unit 22 is used to drive the laser head 23 up and down.
[0058] The crossbeam 21 slides along the first direction on the stage mechanism 1, and the first driving unit 22 slides along the second direction on the crossbeam 21. The first driving unit 22 drives the laser head 23 to move in the up and down directions, so that the laser head 23 can move freely in three-dimensional space, so that the laser beam emitted by the laser head 23 can process the workpiece on the stage mechanism 1.
[0059] In one embodiment, if Figure 1 and Figure 4As shown, the gripping assembly 4 includes a second drive unit 41 and a gripping unit 42. The second drive unit 41 is slidably mounted on the support frame 3 along the second direction. The gripping unit 42 is detachably mounted on the output end of the second drive unit 41 and is used to drive the gripping unit 42 upward and downward. Different gripping units 42 can be replaced according to actual needs, allowing the gripping unit 42 to grip the corresponding workpiece, thereby improving the adaptability of the laser processing device.
[0060] In one embodiment, if Figure 4 As shown, the gripping unit 42 includes a mounting frame 421 and a plurality of suction cups 422. The mounting frame 421 is detachably mounted on the output end of the second drive unit 41. The suction cups 422 are mounted on the mounting frame 421 and are adjustable in position. The position of the suction cups 422 on the mounting frame 421 can be adjusted according to actual needs to improve the stability of the suction cups 422 in adsorbing the workpiece.
[0061] In one embodiment, if Figure 1 and Figure 4 As shown, the laser processing apparatus further includes a conveying unit 7 and two sets of conveying guide rails 6. The conveying guide rails 6 are disposed on opposite sides of the stage mechanism 1 along the second direction. The conveying unit 7 is movably disposed on the conveying guide rails 6. The conveying unit 7 is used to place the workpiece and slides on the conveying guide rails 6 to load and unload the workpiece.
[0062] In this embodiment, the user can place a workpiece on one of the conveyor units 7, causing the conveyor unit 7 to slide on the conveyor guide rails 6 toward the stage mechanism 1, allowing the gripping assembly 4 to grab the workpiece from the conveyor unit 7 and place it on the stage mechanism 1. After the laser processing assembly 2 completes processing the workpiece on the stage mechanism 1, the other gripping assembly 4 grabs the workpiece from the stage mechanism 1 and places it on the other conveyor unit 7. The other conveyor unit 7 then slides on the other conveyor guide rails 6 away from the stage mechanism 1 to unload the workpiece.
[0063] In addition, an embodiment of the present application also provides a laser processing equipment, which includes a laser processing device. The specific structure of the laser processing device refers to the above embodiment. Since the laser processing equipment adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments.
[0064] The above description is only a preferred embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application description and drawings under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.
Claims
1. A laser processing device, characterized in that: The laser processing device comprises: stage mechanism; Two sets of laser processing components, both of which are slidably mounted on the stage mechanism along a first direction; a support frame, the support frame spanning above the stage mechanism along the second direction; Two groups of grabbing assemblies, both groups of grabbing assemblies are slidably arranged on the support frame along the second direction; The first direction and the second direction are perpendicular to each other in the processing plane of the stage mechanism.
2. The laser processing device according to claim 1, wherein The two groups of laser processing components are slidably arranged on the same slide rail, and the two grabbing components are slidably arranged on the same slide rail.
3. The laser processing device according to claim 1, wherein The platform mechanism includes: A bed, wherein the bed forms a setting space, and the laser processing assembly is slidably mounted on the bed; A workbench is placed in the setting space.
4. The laser processing device according to claim 3, wherein The laser processing device further includes: A scrap cart is arranged at the bottom of the bed, the workbench includes a support frame and a plurality of support bars, the support frame is placed in the setting space, and the support bars are arranged on the support frame at intervals along the first direction.
5. The laser processing device according to claim 3, wherein: A plurality of dust extraction holes are arranged on the inner side of the bed.
6. The laser processing device according to claim 1, wherein The laser processing assembly includes: a crossbeam, the crossbeam being slidably disposed on the platform mechanism along the first direction; a first driving unit, the first driving unit being slidably disposed on the beam along the second direction; A laser head is arranged at the output end of the first driving unit, and the first driving unit is used to drive the laser head to rise and fall.
7. The laser processing device according to claim 1, wherein The grabbing component includes: a second driving unit, the second driving unit being slidably disposed on the supporting frame along the second direction; The grabbing unit is detachably arranged at the output end of the second driving unit, and the second driving unit is used to drive the grabbing unit to rise and fall.
8. The laser processing device according to claim 7, wherein: The grabbing unit comprises: a mounting bracket, the mounting bracket being detachably disposed at an output end of the second driving unit; A plurality of suction cups are provided on the mounting frame, and positions of the suction cups are adjustable.
9. The laser processing device according to claim 1, wherein The laser processing device further includes: two sets of conveying guide rails, the conveying guide rails being arranged on two opposite sides of the platform mechanism along the second direction; A conveying unit is movably arranged on the conveying guide rail.
10. A laser processing device, characterized in that: The laser processing equipment includes the laser processing device according to any one of claims 1 to 9.